TW200927822A - Thermosetting resin composition - Google Patents

Thermosetting resin composition Download PDF

Info

Publication number
TW200927822A
TW200927822A TW96151537A TW96151537A TW200927822A TW 200927822 A TW200927822 A TW 200927822A TW 96151537 A TW96151537 A TW 96151537A TW 96151537 A TW96151537 A TW 96151537A TW 200927822 A TW200927822 A TW 200927822A
Authority
TW
Taiwan
Prior art keywords
composition
weight
thermosetting resin
resin composition
amount
Prior art date
Application number
TW96151537A
Other languages
English (en)
Chinese (zh)
Other versions
TWI359844B (enrdf_load_stackoverflow
Inventor
yu-fang He
Li-Jiun Su
Original Assignee
Dong Guang Ite Corp
Iteq Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dong Guang Ite Corp, Iteq Corp filed Critical Dong Guang Ite Corp
Priority to TW96151537A priority Critical patent/TW200927822A/zh
Publication of TW200927822A publication Critical patent/TW200927822A/zh
Application granted granted Critical
Publication of TWI359844B publication Critical patent/TWI359844B/zh

Links

Landscapes

  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW96151537A 2007-12-31 2007-12-31 Thermosetting resin composition TW200927822A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96151537A TW200927822A (en) 2007-12-31 2007-12-31 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96151537A TW200927822A (en) 2007-12-31 2007-12-31 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
TW200927822A true TW200927822A (en) 2009-07-01
TWI359844B TWI359844B (enrdf_load_stackoverflow) 2012-03-11

Family

ID=44863743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96151537A TW200927822A (en) 2007-12-31 2007-12-31 Thermosetting resin composition

Country Status (1)

Country Link
TW (1) TW200927822A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9496461B2 (en) 2014-05-07 2016-11-15 Genesis Photonics Inc. Light emitting diode package structure
TWI621284B (zh) * 2014-05-07 2018-04-11 新世紀光電股份有限公司 發光二極體封裝結構

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9496461B2 (en) 2014-05-07 2016-11-15 Genesis Photonics Inc. Light emitting diode package structure
TWI575778B (zh) * 2014-05-07 2017-03-21 新世紀光電股份有限公司 發光二極體封裝結構
TWI621284B (zh) * 2014-05-07 2018-04-11 新世紀光電股份有限公司 發光二極體封裝結構

Also Published As

Publication number Publication date
TWI359844B (enrdf_load_stackoverflow) 2012-03-11

Similar Documents

Publication Publication Date Title
US10689512B2 (en) Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
TWI278481B (en) Thermosetting resin composition, prepreg and laminate using the same
TWI673280B (zh) 一種含磷化合物、含磷阻燃劑及其製備方法與製品
TW200930739A (en) Resin composition, prepreg and laminate using the same
TW202016216A (zh) 熱固性樹脂組合物,使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板
TW201546181A (zh) 低介電之樹脂組成物及應用其之樹脂膜、半固化膠片及電路板
CN107868399A (zh) 一种树脂组合物及含有该树脂组合物的制品及其制备方法
CN104341766A (zh) 低介电树脂组合物及应用其的铜箔基板及印刷电路板
CN101215405A (zh) 一种热固性树脂组合物
TW202219116A (zh) 異氰酸酯改質聚醯亞胺樹脂、樹脂組成物及其硬化物
KR20120079986A (ko) 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판
US8217099B2 (en) Thermosetting resin composition
TWI725956B (zh) 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板
JP6090684B1 (ja) プリント配線板用樹脂組成物、プリプレグ、樹脂複合シート及び金属箔張積層板
TW201817797A (zh) 樹脂組成物、預浸體、附有樹脂之金屬箔、積層板、印刷線路板、及樹脂組成物的製造方法
CN109467888A (zh) 树脂组成物、以及使用该组成物所制得的预浸渍片、金属箔积层板及印刷电路板
TWI740204B (zh) 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
TW202000768A (zh) 樹脂組合物,以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板
JP2017088745A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP6819921B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP2019089929A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
CN101215358B (zh) 一种预聚物以及利用该预聚物制成的热固性树脂组合物
CN111560098A (zh) 树脂组合物及由其制成的制品
US9006377B2 (en) Resin composition and uses of the same
TW200927822A (en) Thermosetting resin composition

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees