200918225 九、發明說明： 【發明所屬之技術領域】 本發明係關於雷射切斷裝置 評言之 诔關於對脆性 材料照射雷射光並沿切斷預定線切斷脆性材料之兩 裝置。 田射切斷BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting device which is a device for irradiating a brittle material with laser light and cutting a brittle material along a line to cut. Field cut
I 70刖孜W J :往，對脆性材料照射雷射光並切斷之雷射切斷裝置 雷口。此種習知之雷射切斷裝置中，可使對脆 雷射光照射點沿切斷預定線形成為細長以加快加工速度 二習知之雷射切斷裳置中，雖於脆性材料之： 射先會大量產生微小加1 』價，、、、射田 對上述微小槽职射雷射，有提案盡可能不 1)〇 射田射先之#射切斷I置（例如專利文獻 :、二而，上述專利文獻丨之裝 割為二後才對脆性材料照射，故需要中2 2係將雷射光分 因此’上述專利文獻！之裝置有 …之71學零件° X，習知之雷射切斷裝置中=且高價之缺點。 於形成微小槽而於播Μ· 4使脆性材料之表面易 塗布有燈油之機找十’刀具塗布少量燈油。在以如上述 必須在切斷加=Γ於膽性材料表面形成微小槽後， 油，因此需要力 中除去附著於跪性材料表面之燈 另-：：性材科洗淨作業或洗淨設備。 如專利文獻2所提案，利用細長遮光板遮 200918225 敝雷射光之一部份之技術，由於在對脆性材料照射雷射光 時能以雷射光除去附著於該脆性材料之表面之燈油，故不 須切斷加工後之脆性材料洗淨作業。 專利文獻1 :曰本特開2001-151525號公報 專利文獻2:曰本特開2〇〇1_212683號公報 …、而專利文獻2之切斷裝置中，若使用圓柱透鏡做 為將田射光之照射點細長化之聚光透鏡，必須使該圓柱透 鏡之凸面之頂σ卩之長邊方向與上述遮光板之安裝方向一 致。因此專利文獻2之切斷裝置中，組裝調整時之圓柱透 鏡與遮光板之位置調整作業極煩雜。 【發明内容】 有鑑於上述狀況，本發明係於具備將雷射光之剖面形 狀成形為既定形狀後照射於脆性材料之雷射光照射手段、 使雷射光與脆性材料相對移動以使雷射光之照射點沿設定 於該脆性材料之切斷預定線移動之移動手段，沿上述切斷 預定線切斷脆性材料之雷射切斷裝置中，上述雷射光照射 手段具備雷射光可穿透之聚光透鏡’此聚光透鏡具備使雷 射光擴散之擴散區域’在上述移動手段使雷射光之照射點 …上述切斷預定線移動時，係使該照射點中之對應上述擴 散區域之位置在上述跪性材料之切斷狀線上移動。 利用上述構成’可使用比習知簡略之構成之雷射光昭 射手段，抑制對脆性材料照射雷射光進行切斷加工時之= 200918225 屑之產生。此外， 作業亦較容易。 組裝雷射士刀斷裝置之構成才冓#時之調整 【實施方式】 以下’基於圖式說明本發 +货月之實施例，於圖1及圖2 中，1為雷射切斷裝置，此 _ . _ 由对切斷裝置1係切斷例如玻 璃板等脆性材料2以劁抨油g _ 以製每液晶顯示用面板之基板。 雷射切斷裝置]且## & . 教罝1具備保持上述脆性材料2之加工”、 對脆性材料2昭射φ私出r ° 5你… 切斷之第卜第2加工頭4、 加工碩4、5相對於上述加工台3上 等2移動之移動手段6、振盡雷射光^雷射振 s"係受未圖示之控制手段控制。 以下說明t，以圖1中 閩1甲之上下方向為x方向，以直交 於此之左右方向為Y方向說明。 上述脆性材料2大致為長方形，在其長邊朝向X方向、 短朝向/方向之狀態下載置於上述加工台3。在本實施 例中& «^於X方向之χ方向切斷預定線&及設定於 Y方向之Y方向切斷預定線By切斷脆性材料而分離為方 开> 之製品部分2 a與位於μ _ σ %八1 %涿泉017 σ卩分2a之外周之不要部份 2b ° 於上述加工台3之表面穿設有未圖示之多數孔，於各 ^連接有未圖示之氣體送排手段。以該氣體送排手段從該 等孔吸引氣體將脆性材料2吸附保持於加工台3之表面。 上述移動手段6具備夾上述加工台3而設之2個軌構 200918225 件63、。、可沿該執構件6心在 動軌6b、6b，上述 °動之2個可 _ ^ 1第2加工頭4、s八η 可動軌的、…方向移動。 5刀别可沿上述 藉此’上述第】、第2加工頭[I 70刖孜W J : The laser cutting device that irradiates the laser beam with the brittle material and cuts it. In such a conventional laser cutting device, the point of exposure to the brittle laser light can be formed to be elongated along the line to be cut to speed up the processing speed. In the conventional laser cutting, the brittle material is: A large number of tiny plus 1 quot;, and,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, In the above-mentioned patent document, the brittle material is irradiated after being cut into two, so that the laser beam is required to be divided into two parts. Therefore, the device of the above-mentioned patent document has a 71-part part X, a conventional laser cutting device. Medium = and high price disadvantages. In the formation of tiny grooves and in the sowing · 4 make the surface of the brittle material easy to apply the lamp oil machine to find ten 'tools coated with a small amount of lamp oil. In the above, must be cut off = 胆 biliary After forming a micro-groove on the surface of the material, the oil needs to be removed from the surface of the material that is attached to the surface of the inert material. -:: Material cleaning or cleaning equipment. As proposed in Patent Document 2, using an elongated visor to cover 200918225 The technique of smashing part of the laser light Since the kerosene adhering to the surface of the brittle material can be removed by laser light when irradiating the brittle material with the laser light, it is not necessary to cut off the brittle material after the processing. Patent Document 1: Sakamoto Kaikai 2001-151525 In the cutting device of Patent Document 2, if a cylindrical lens is used as a collecting lens for elongating the irradiation spot of the field light, the cylinder must be made. The longitudinal direction of the top surface σ of the convex surface of the lens coincides with the mounting direction of the light shielding plate. Therefore, in the cutting device of Patent Document 2, the position adjustment operation of the cylindrical lens and the light shielding plate during assembly adjustment is extremely complicated. In view of the above circumstances, the present invention provides a laser beam irradiation means for irradiating a brittle material after forming a cross-sectional shape of a laser beam into a predetermined shape, and moving the laser light and the brittle material so that the irradiation point of the laser light is set to The moving means for moving the cutting line of the brittle material, the laser cutting device for cutting the brittle material along the cutting line, the laser light irradiation A condensing lens having a laser light permeable means, wherein the condensing lens includes a diffusion region for diffusing the laser light, and when the moving means moves the irradiation point of the laser light to the predetermined cutting line, the illuminating point is The position corresponding to the diffusion region is moved on the cutting line of the inert material. With the above configuration, it is possible to suppress the irradiation of the laser beam with the laser light by using a laser light source having a simple configuration. = 200918225 The generation of chips. In addition, the operation is also relatively easy. The assembly of the laser knife cutting device is adjusted to the time of the implementation of the [Embodiment] The following is based on the diagram to illustrate the implementation of the hair + the month of the month, in the figure In Fig. 2 and Fig. 2, 1 is a laser cutting device, and the cutting device 1 is used to cut a substrate such as a fragile material 2 such as a glass plate to produce a liquid crystal panel. Laser cutting device] and ## & . Teaching 1 has the processing of maintaining the above-mentioned brittle material 2, and for the brittle material 2, the radiant material 2 privately emits r ° 5... The second processing head of the cutting head 2 The processing means 6 and the moving laser light 6 for the processing of the processing 4, 5, and the above-mentioned processing table 3 are controlled by a control means not shown. The following description t is shown in Fig. 1 The upper and lower directions of the nail are in the x direction, and the left and right directions are orthogonal to the Y direction. The brittle material 2 is substantially rectangular, and is placed on the processing table 3 in a state where the long sides thereof are directed in the X direction and the short direction/direction. In the present embodiment, <^the product line portion 2a in the X direction and the Y-direction cutting planned line By setting the Y-direction cutting line to cut the brittle material and separating into the square opening> A plurality of holes (not shown) are placed on the surface of the processing table 3 at a position other than the outer portion of the processing table 3, and are not shown in the figure. a gas supply and discharge means for sucking gas from the holes by the gas supply and discharge means to adsorb and hold the brittle material 2 on the processing table 3 The moving means 6 includes two rail structures 200918225 63 which are provided by the processing table 3, and the movable rails 6b and 6b along the core of the supporting member 6, and the two movements of the above-mentioned movements can be _ ^ 1 2 The processing head 4, s 八 η movable rail, ... direction movement. 5 knives can be along the above, the above-mentioned first, the second processing head [
方向相對於跪性材料2移動。且，上述第卜X方向與Y 4、5藉由上述移動手 第2加工頭 厂仅0移動而沿X方向 及Y方向切斷預宏娃β 預疋線Βχ 刀岡·預夂線By切斷脆性材料2。 圖2為顯示上述第1加工頭4 之構成。由於笸凡乃弟1加工頭4 由於第2加工頭5具有與 成，故省略第2 & T c 加工碩4相同之構 ，唂弟2加工頭5之詳細說明。 亦即’第1加工頭4具備在脆性材料2之 線狀之劃線槽S之做為槽形成手段之機械式 ’成直 射光L之照射點形成為細長馬蹄形、、將雷 機械:T U從上方往跪性材料2按壓之㈣手段: 方向前方側配置有上述機械式刀具=動 配置有聚光透鏡12。 、多動方向後方側 機械式刀具丨丨係形成為圓盤狀，盆 妝夫奸1 V — / 〇外周部分之剖面形 狀大致為V子形。使此機械式刀且 η Μη ο ^ * 、 之外周部抵接於脆 性材枓2之表面並以按壓手段13按 若第1加工頭4於χ方向移動 此狀態下 m 機械式刀具u 而在脆性材料2之表面往χ方向 更會疋轉 W々成微小劃線槽S。 按壓手段13係由使上述機械式刀具u升降之氣壓缸 i3a、對此氣壓叙13a供給力σ壓氣 ： 至礼體之軋體供給手段nb、 200918225 設於該等氣壓缸13a與氣體供給手& 成。 〈凋即器13 C構 述It…係將機械式刀具U保持為可於上下方 向移動，且藉由透過上述調節器…供 按壓力將機械式刀具11按壓於脆性材料2之表面。 反射雷射錄器7振盪出之雷射Μ被反射鏡14 線样s 鏡12聚光再照射於上述脆性材料2之劃 稭此，由雷射振盈器7、反射鏡14、聚光透鏡12 構成雷射光照射手段。 本實施例中，在第！加工頭4藉由移動手段6在乂方 =移動時，上述機械式刀具u先沿χ方向切斷預定線如 矛夕動於上述脆性材料2形成微小劃線槽s，之後，追隨 幾械式刀具1 i移動之雷射光L被照射於上述微小劃線槽$ (參考圖2、圖3)。 如上述對脆性材料2之劃線槽S照射雷射光]l後，在 脆性材料2之内部夾劃線槽S發生對稱熱應力。藉此，脆 2材料2熱膨脹而從劃線槽s之大致v字形之底部發生龜 衣此龜裂延伸至脆性材料2之下端便使脆性材料2依χ 方向切斷預定線Βχ被切斷（參考圖7)。 如上述’本實施例可藉由將做為雷射照射手段之聚光 兄2之構成與其配置狀態如以下改良而能抑制切斷脆 生材料2時微小切屑之產生。 亦即’如圖4或圖5所示，聚光透鏡12係由將呈圓形 射光L之剖面形狀成形為細長橢圓狀之圓板狀圓柱透 200918225 上面12B為中央部高於兩 鏡構成，其下面12A為平坦面 側之半圓狀凸面。 於此聚光透鏡12之上面12B之中央部通過轴心c於 凸面之頂部之長邊方向（直徑方向）形成有直線狀之槽 12C。此槽12C為上方側開口之剖面v字形，上方之開口 邛之寬度d係被設定為㈠麵，深度被設定為 槽12C之一端i2C’雖到達外周面i2D，但槽μ之另 一端12C，，並未到達外周面12D，位於其鄰接位置。 構成槽12C之底部之表面全域為形成有無數微小凹凸 之粗面。此槽12C構成使雷射光L擴散之擴散區域。 又，藉由形成上述槽12C，聚光透鏡12之上面12B 被區分為呈半圓形之左方透過區域12E、右方透過區域 12F、在兩透過區域12E、12F間鄰接於槽12〇之另一端i2c，， 之外側之連接部12G。 上面12B之槽12C以外之區域與聚光透鏡12之下面 12A被研磨為光滑’使該等場所能讓雷射光l完全透過。 聚光透鏡12之上述槽12為擴散區域，且，槽12〇以 外之區域’即’兩透過區域12E、12F及連㈣i2G為能 讓雷射光L完全透過以聚光之透過區域。由於聚光透鏡i2 係構成為如上述，故剖面為圓形之雷射光l受反射鏡Μ 從上方被導向聚光透鏡12，在透過之後，雷射光l之剖面 形狀被成形為細長之大致馬蹄形。 又如上述構成之聚光透鏡12係水平安裝於上述第1 加工頭4。此外，此聚光透鏡12被安裝為上述槽i2c之長 10 200918225 邊方向與X方向切斷預定線Bx平行且上述連接部12(J位 於第1加工頭4之移動方向前方側。 又’在上述移動手段6使第1加工頭4沿X方向切斷 預定線BX移動時，聚光透鏡12之連接部12G與槽12C在 & X方向切斷預定線Βχ並重疊之上方位置移動。 口此在田射光L被反射鏡14導向聚光透鏡12並透 過後’雷射光L之剖面形狀形成為大致馬蹄形使對應於連 接部12G之部分位於銘叙古一义士/丨 、移動方向則方侧，之後被照射於脆性 材料。 之後，成為大致馬蹄形之雷射光L之照射點之對應於 上述連接部UG與槽12c之位置重合於劃線槽s，對應於 雙方之透過區域12E、12F夕办要人+古丨人 ρ之位置位於夾劃線槽s之兩側 考圖3、圖6)。 在此狀態下’由於係以移動手段6於X方向移動第i 加工頭4，故由機械式刀具11於X方向切斷敎線如上 形成劃線槽S ’並追隨該劃線槽s之形成照射雷射光L。 藉此’由於龜裂從劃線槽s往厚度方向延伸，故可依X方 向切斷預定線Bx切斷脆性材料2。 另外，由於第2加工通$ +操上、也 壙5之構成與配置狀態與上述之 第1加工頭4相同’故省略關於第2加工頭之詳細說明。 以下說明使用具有上述構成之雷射切斷裝置i之脆性 材料2之切斷方法。 首先，雷射切斷裝置1以卜祕势，丄 以上述第1加工頭4依不盥切 斷線B交差之X方向切斷預定線^切斷脆性材料2， 200918225 亦即丄機械式刀具n首先停止於脆性材料2之 °切斷預疋線BX之延長線上離開脆性材料2之位置 時機械式刀具U4竹2之位置，此 丁七 端指於比脆性材料2之表面_ 下方之位置。又，第丨 义衣面稍微 及連接部12G位Λ方m4之聚光透鏡12之槽咖 位置。 於X方向切斷預定線Bx之延長線之上方 從此狀態以移動手段6使第！加工頭4於 藉此，機械式刀具u在第〗加工頭4到達=:。 低速狀態下接觸隸材 魏&逮度則之 性材料2之表面1 以該機械式刀具11從脆 之表面之端部形成劃線槽^ 具U之外周部事先力夕卜於機械式刀 成。 事先塗有燈油(煤油)，以使劃線槽S容易形 由於係在追隨機械式刀4 U之 位置即將到達脆性材料 之照射點之 光，故該雷射光L在、A月1攸雷射振虚器7振盪雷射 在被反射鏡1 4反射後受臂古 ❹成形為大致馬蹄形後從跪性材料2==:將 :後：移動手段6以既定加速度使第丨加工頭於X方' 迷’並在到逹既定速度後在保持該速度之狀熊下一：J 移動至X方向切斷預 ：以疋速又 3)。 、、麵附近（參考圖2、圖 之後，第1加工頭4在X方向切斷預定 部附近減速，在杂射止τ 辦頂疋線ΒΧ之終端 止。 “射先[之照射點離開脆性材料2之後停 如上述使第1加工頭4於 Π移動後，雷射光L·之 12 200918225 照射點追隨上述機械式刀且u 受雷射光L照射而使龜裂射移動，沿劃線槽S 性材料2(參考圖3、圖6)。 胃之底部延伸，切斷脆 此時上述加工台3係 2所得之製品部分2a盘、1之發生’切斷脆性材料 持於加工台3上目、部分2b便維持鄰接狀態被保 丄 在相鄰之· 〇 間由上述龜裂形成切斷線B。 ” a與不要部分孔之 如上述依一方之γ卡 方向切斷預定線Βχ進行臃性姑祖 2之切斷後，第i加 進灯脆I·生材枓 .^ 上述移動手段2移動至次一 & 切斷之切斷預定^ # 人队 “心 後’以與前述同樣之動作進行 脆性材料2之切斷。 7 p适仃 另一方面’亦以第2加 切齡η κ 力工頭3進仃與以第1加工頭之 切斷同樣之脆性材料2 13 1 %谷4 5 6條之X方向及γ方 2 、如上述，本實施例中，由於將聚光透鏡構成、配置如 上述，故比起習知技術可簡化雷射光照射手段。又，由於 ，對脆性材料2照射雷射光L以切斷時，對應於聚光透鏡 12之做為擴散區域之槽i2C之部分係在劃線槽s上移動， 故劃線槽部不會被過度加熱，可抑制從脆性材料2之劃線 槽S產生切屑。且，由於不須使用聚光透鏡a以外之遮 3 _圖不之回收手段回收不要部分2b I，製品部分以未圖 不之搬送手段搬送至後製程。 4 向之切斷預定線Βχ、 5 y又王進仃脆性材料2之切斷。 6 女上述’ X方向及γ方向之脆性材料之切斷結束後， 工台3解除製品部分2a及不要部分孔之吸附保持以 200918225 蔽雷射光L之遮光構件，故 光構件與聚光透鏡之位置調整=如：述專利文 ：2之遮 裝置1之構成構件時之調整作業較簡單。此，组雷射切斷 此外，即使塗布於機 料2夕U 槭式刀具11之燈油附著於脆性材 之表面，雷射光L之昭射點 射點之對應於連接部12G之位 置被照射於劃線槽S。因 心伹 ^ ,, . m ^ 附者於脆性材料2之表面之 燈油會因雷射光而被幕發去 ,、、發去除。亦即，在脆性材料2之切The direction moves relative to the inert material 2. Further, the above-mentioned X-direction and Y 4, 5 are cut by the 0th direction and the Y-direction by the moving hand 2nd processing head factory, and the pre-macro-beta pre-twisting line is cut in the X direction and the Y direction. Broken brittle material 2. FIG. 2 shows the configuration of the above first processing head 4. Since the processing head 4 of the 笸凡乃弟1 has the same processing as the second processing head 5, the second structure of the second & T c processing master 4 is omitted, and the detailed description of the processing head 5 of the younger brother 2 is omitted. That is, the first processing head 4 is provided with a mechanical type of the linear groove groove S of the brittle material 2 as a groove forming means, and the irradiation point of the direct light L is formed into an elongated horseshoe shape, and the lightning machine: TU is (4) means for pressing the upper material 2 to the upper side: The mechanical tool is disposed on the front side of the direction. The collecting lens 12 is disposed. In the multi-moving direction, the mechanical cutter is formed into a disc shape, and the cross-sectional shape of the outer peripheral portion of the pot is roughly V-shaped. When the mechanical blade is η Μη ο ^ *, the outer peripheral portion is in contact with the surface of the brittle material 枓 2, and the pressing means 13 is moved in the state in which the first machining head 4 is moved in the m direction. The surface of the brittle material 2 will be twisted and twisted into a minute scribe groove S. The pressing means 13 is provided by the pneumatic cylinder i3a for raising and lowering the mechanical cutter u, and the supply pressure σ for the air pressure 13a: the rolling body supply means nb, 200918225 for the ceremony are provided in the pneumatic cylinder 13a and the gas supply hand &; to make. The device 13C is configured to hold the mechanical tool U so as to be movable in the upper and lower directions, and press the mechanical tool 11 against the surface of the brittle material 2 by the above-mentioned regulator. The laser beam oscillated by the reflective laser recorder 7 is mirrored by the mirror 14 s. The mirror 12 is condensed and irradiated onto the brittle material 2, and is irradiated by the laser vibrator 7, the mirror 14, and the collecting lens. 12 constitutes a means of irradiating laser light. In this embodiment, at the first! When the machining head 4 is moved by the moving means 6, the mechanical cutter u first cuts a predetermined line in the χ direction, such as a splined material 2 to form a micro scribe groove s, and then follows a few knives. The laser light L that the tool 1 i moves is irradiated to the above-described micro scribe groove $ (refer to Figs. 2 and 3). When the scribed groove S of the brittle material 2 is irradiated with the laser light as described above, symmetrical thermal stress is generated in the scribe groove S inside the brittle material 2. Thereby, the brittle material 2 thermally expands and the turtle coat is formed from the bottom of the substantially v-shaped groove of the scribe groove s, and the crack extends to the lower end of the brittle material 2, so that the brittle material 2 is cut in a predetermined direction by the direction of the brittle material. Refer to Figure 7). As described above, the present embodiment can suppress the generation of minute chips when the brittle material 2 is cut by modifying the configuration of the collecting brother 2 as a laser irradiation means and the arrangement thereof as follows. That is, as shown in FIG. 4 or FIG. 5, the condensing lens 12 is formed by forming a circular arc-shaped cross-sectional shape into a long and elliptical circular plate-shaped cylindrical through-hole 200918225, and the upper surface 12B is formed by a central portion higher than two mirrors. The lower surface 12A is a semicircular convex surface on the flat surface side. In the central portion of the upper surface 12B of the condensing lens 12, a linear groove 12C is formed by the axial center c in the longitudinal direction (diameter direction) of the top of the convex surface. The groove 12C is a cross-sectional v-shape of the upper side opening, and the width d of the upper opening 系 is set to a (one) plane, and the depth is set such that one end i2C' of the groove 12C reaches the outer peripheral surface i2D, but the other end 12C of the groove μ, It does not reach the outer peripheral surface 12D and is located at its adjacent position. The entire surface of the bottom portion constituting the groove 12C is a rough surface on which numerous minute irregularities are formed. This groove 12C constitutes a diffusion region for diffusing the laser light L. Further, by forming the groove 12C, the upper surface 12B of the condensing lens 12 is divided into a left circular transmission region 12E and a right transmission region 12F, and is adjacent to the groove 12 between the two transmission regions 12E and 12F. The other end i2c, the outer connecting portion 12G. The area other than the groove 12C of the upper surface 12B and the lower surface 12A of the condensing lens 12 are ground to be 'smooth' so that the laser light 1 can be completely transmitted. The groove 12 of the condensing lens 12 is a diffusion region, and the region outside the groove 12 即, that is, the two transmission regions 12E and 12F and the connection (4) i2G are transmission regions through which the laser light L can be completely transmitted to condense light. Since the condensing lens i2 is configured as described above, the laser light 1 having a circular cross section is guided to the condensing lens 12 from above by the mirror ,, and after transmission, the cross-sectional shape of the laser light 1 is formed into a slender substantially horseshoe shape. . Further, the condensing lens 12 having the above configuration is horizontally attached to the first processing head 4. Further, the condensing lens 12 is mounted such that the length of the groove i2c is 10, 200918225, and the side direction is parallel to the X-direction cutting planned line Bx, and the connecting portion 12 (J is located on the front side in the moving direction of the first processing head 4. When the moving means 6 moves the first processing head 4 in the X-direction cutting planned line BX, the connecting portion 12G of the collecting lens 12 and the groove 12C move in the upper position in which the predetermined line 切断 is cut and overlapped. When the field light L is guided by the mirror 14 to the collecting lens 12 and transmitted, the cross-sectional shape of the laser beam L is formed into a substantially horseshoe shape so that the portion corresponding to the connecting portion 12G is located in the direction of the inscription, the direction of movement, and the direction of movement. Then, it is irradiated with a brittle material. Then, the position of the irradiation point of the substantially horseshoe-shaped laser light L corresponds to the position of the connecting portion UG and the groove 12c in the scribe groove s, and corresponds to the transmission areas 12E and 12F of both sides. The position of the person + ancient ρ ρ is located on both sides of the scribe groove s. Figure 3, Figure 6). In this state, since the i-th machining head 4 is moved in the X direction by the moving means 6, the boring line S is cut by the mechanical cutter 11 in the X direction as described above and follows the formation of the scribe groove s. Irradiation of the laser light L. By this, since the crack extends from the scribe groove s in the thickness direction, the brittle material 2 can be cut in accordance with the X-direction cutting line Bx. In addition, since the configuration and arrangement state of the second machining-through $+ operation and the 圹5 are the same as those of the first machining head 4 described above, the detailed description of the second machining head will be omitted. Next, a cutting method using the brittle material 2 having the laser cutting device i having the above configuration will be described. First, the laser cutting device 1 cuts the predetermined line by cutting the predetermined line in the X direction in which the first processing head 4 is not intersected by the cutting line B, and cuts the brittle material 2, 200918225, that is, the mechanical cutting tool. n first stops at the position of the mechanical tool U4 bamboo 2 when the position of the brittle material 2 is separated from the position of the brittle material 2 on the extension line of the brittle material 2, which is the position below the surface _ below the brittle material 2 . Further, the second garment surface is slightly positioned and the groove portion of the condenser lens 12 of the connecting portion 12G is square m4. The upper side of the extension line of the predetermined line Bx is cut in the X direction. From this state, the moving means 6 makes the first! The machining head 4 is thereby used, and the mechanical cutter u reaches the = at the processing head 4. The surface of the material 2 is contacted at a low speed, and the surface of the material 2 is formed by the mechanical tool 11 to form a scribe groove from the end of the surface of the brittle surface. to make. The kerosene (kerosene) is applied in advance so that the scribe groove S is easily shaped, and the laser light is about to reach the irradiation point of the brittle material at the position following the mechanical knife 4 U. Therefore, the laser light L is at a laser of A month. The oscillating laser 7 oscillates the laser beam after being reflected by the mirror 14 and is formed into a substantially horseshoe shape by the arm ❹, and then from the 跪 material 2==: :: :: the moving means 6 makes the 丨 machining head to the X side with a predetermined acceleration 'Fabulous' and after the speed is reached, the bear is kept at the speed: J moves to the X direction to cut off: Idle at 3). In the vicinity of the surface, the first processing head 4 decelerates near the predetermined portion in the X direction, and stops at the end of the 疋 止 办 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 After the material 2 is stopped, the first processing head 4 is moved as described above, and the laser light L·12 is applied to the mechanical blade, and the laser beam is irradiated by the laser beam L to move the cracking motion along the scribe groove S. Material 2 (refer to Fig. 3, Fig. 6). The bottom of the stomach extends, and the brittle material is cut at the time of the processing table 3 system 2, and the product portion 2a, the disk 1 is produced, and the cutting brittle material is held on the processing table 3. The portion 2b is maintained in the abutting state and is secured between the adjacent ones. The cutting line B is formed by the above-mentioned cracks. ” a and the unselected holes are cut in a predetermined line according to the gamma card direction of the above-mentioned one. After the cutting of the ancestor 2, the i is added to the light fragile I·the raw material 枓.^ The above moving means 2 moves to the next & cut off the cut reservation ^ #人队 "after the heart" in the same action as described above The cutting of the brittle material 2 is carried out. 7 p is suitable for the other side, and the second plus age η κ In the X direction and the γ square 2 of the brittle material 2 13 1 % valleys and the like which are the same as the cutting of the first processing head, as described above, in the present embodiment, since the condensing lens is configured and arranged as described above, The laser light irradiation means can be simplified as compared with the conventional technique. Further, since the brittle material 2 is irradiated with the laser light L to be cut, the portion corresponding to the groove i2C of the condensing lens 12 as the diffusion region is scribed in the scribe groove. When s is moved up, the scribe groove portion is not excessively heated, and generation of chips from the scribe groove S of the brittle material 2 can be suppressed. Further, since it is not necessary to use the condensing lens a, it is not necessary to use the condensing lens a. Do not part 2b I, the part of the product is transported to the post-process by means of unillustrated transfer. 4 Cut the predetermined line Βχ, 5 y and Wang Jin's cutting of the brittle material 2. 6 The above-mentioned 'X-direction and γ-direction brittleness After the cutting of the material is completed, the worktable 3 releases the suction of the product portion 2a and the unnecessary portion of the hole to hold the light-shielding member of the laser light L at 200918225, so the position adjustment of the optical member and the condensing lens = as described in the patent: 2 When the components of the shielding device 1 are adjusted, the adjustment operation is more In addition, even if the kerosene of the U-Maple cutter 11 is applied to the surface of the brittle material, the position of the laser beam corresponding to the connection portion 12G is irradiated. In the scribe groove S. Because the heart 伹 ^ , , . m ^ The kerosene attached to the surface of the brittle material 2 will be emitted by the screen due to the laser light, and removed, that is, cut in the brittle material 2
斷加工後：必洗淨製品部分&之表面，可省略習知技術中 必要之洗淨流程或洗淨設備。After the breaking process: the surface of the product part & must be washed, and the washing process or washing equipment necessary in the prior art can be omitted.
1， ’上达實施例中，槽12C之剖面形狀雖形成為V 子^ ’但亦可如圖8所示，槽uc之剖面形狀為半圓形。 此外’亦可如圖9所示，於與聚光透鏡12之上面12B之 上述槽12C對應之位置形成由多數凹凸構成之粗面，以取 代形成上述槽。此外’亦可於與聚光透鏡η之上面KB 之上述槽12C對應之位置㈣或鉻等金屬蒸鑛，形成將照 射於該處之雷射光反射擴散之擴散區域。 【圖式簡單說明】 圖1為顯示本發明之一實施例之俯視圖。 圖2為顯示圖】所示之第ί加工頭4之構成之圖。 圖3為顯示以圖2所示之第丨加工頭4之加工流程之 概略立體圖。 圖4為圖2所示之聚光透鏡〗2之立體圖。 圖5為圖4所示之聚光透鏡】2之剖面圖。 14 200918225 圖6為顯示以第1加工頭4對脆性材料2之切斷加工 中之機械式刀具11與雷射光L之位置關係之俯視圖。 圖7為顯示圖6中之脆性材料與雷射光L之關係之别 面圖。 圖8為本發明之另一實施例之聚光透鏡12之剖面圖。 圖9為本發明之另一實施例之聚光透鏡12之剖面圖。 【主要元件符號說明】1, in the above embodiment, the cross-sectional shape of the groove 12C is formed as V sub-', but as shown in Fig. 8, the cross-sectional shape of the groove uc is semicircular. Further, as shown in Fig. 9, a rough surface composed of a plurality of concavities and convexities may be formed at a position corresponding to the groove 12C of the upper surface 12B of the condensing lens 12 to replace the groove. Further, it is also possible to form a diffusion region for reflecting and diffusing the laser light irradiated thereto at a position (4) corresponding to the groove 12C of the upper surface KB of the condensing lens η or a metal ore such as chromium. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an embodiment of the present invention. Fig. 2 is a view showing the configuration of the ith processing head 4 shown in Fig. 2; Fig. 3 is a schematic perspective view showing the processing flow of the second processing head 4 shown in Fig. 2. Fig. 4 is a perspective view of the collecting lens of Fig. 2; Fig. 5 is a cross-sectional view of the collecting lens of Fig. 4; 14 200918225 Fig. 6 is a plan view showing the positional relationship between the mechanical cutter 11 and the laser light L in the cutting process of the brittle material 2 by the first machining head 4. Fig. 7 is a side view showing the relationship between the brittle material and the laser light L in Fig. 6. Figure 8 is a cross-sectional view of a collecting lens 12 in accordance with another embodiment of the present invention. Figure 9 is a cross-sectional view of a collecting lens 12 in accordance with another embodiment of the present invention. [Main component symbol description]
1 2 2a 2b 3 4 5 6 6a 6b 7 11 12 12A 12B 12C /'1 2 2a 2b 3 4 5 6 6a 6b 7 11 12 12A 12B 12C /'
雷射切斷裝置 脆性材料 製品部分 不要部分 加工台 第1加工頭 第2加工頭 移動手段 軌構件 可動軌 雷射振盪器 機械式刀具 聚光透鏡 下面 上面 槽 15 200918225 12C? 一端 12C，， 另一端 12D 外周面 12E 穿透區域 12F 穿透區域 12G 連接部 13 按壓手段 13a 氣壓缸 13b 氣體供給手段 13c 調節器 14 反射鏡 B 切斷線 Bx X方向切斷預定線 By Y方向切斷預定線 C 轴心 d 寬度 h 深度 L 雷射光 S 劃線槽 16Laser cutting device brittle material product part part processing table first processing head second processing head moving means rail member movable rail laser oscillator mechanical tool collecting lens lower surface groove 15 200918225 12C? one end 12C,, the other end 12D outer peripheral surface 12E penetration area 12F penetration area 12G connection part 13 pressing means 13a pneumatic cylinder 13b gas supply means 13c regulator 14 mirror B cutting line Bx X direction cutting planned line By Y direction cutting line C axis Heart d width h depth L laser light S scribe groove 16