CN101412577A - Laser cutting device - Google Patents
Laser cutting device Download PDFInfo
- Publication number
- CN101412577A CN101412577A CNA2008102109126A CN200810210912A CN101412577A CN 101412577 A CN101412577 A CN 101412577A CN A2008102109126 A CNA2008102109126 A CN A2008102109126A CN 200810210912 A CN200810210912 A CN 200810210912A CN 101412577 A CN101412577 A CN 101412577A
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- CN
- China
- Prior art keywords
- laser
- brittle material
- hard brittle
- cutting device
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The inventive laser cutting device (1) is provided with a collector lens (12) for collecting laser (L) and irradiating friable materials (2); the collector lens (12) is constituted by a cylindrical lens, with upside (12B) provided with a linear trough (12C) at center. The trough (12C) is taken as a diffusion region for the diffusion of the laser (L) the cross sectional shape of which is formed into an approximately U-shaped; and the laser (L) imitating the cross sectional shape to slenderly extend is irradiated on a layout trough (S) made of the fragile materials (2). Consequentially the laser cutting device has a simplified structure and a function of effectively restraining chippings generation in the cutting process of the fragile materials (2).
Description
Technical field
The present invention relates to laser cutting device, specifically, relate to the hard brittle material irradiating laser and along the laser cutting device of predetermined cuts line cutting brittle material.
Background technology
The laser cutting device that the hard brittle material irradiating laser is cut known in the state of the art.In the existing laser cutting device like this, slenderly form along the predetermined cuts line, can improve process velocity by the point of irradiation that makes the laser that hard brittle material is shone.
And, in existing laser cutting device, on the surface of hard brittle material, form small groove, with laser radiation to described groove, but can produce a large amount of small chips (processing is considered to be worth doing) to laser radiation during to above-mentioned small groove.Thereby proposed a kind of as far as possible not to the laser cutting device (for example patent documentation 1) of above-mentioned small groove irradiating laser.
Yet, in the device of above-mentioned patent documentation 1,, therefore, need the optics of dual system owing to be laser to be divided into two shine again on the hard brittle material.Therefore, there is the expensive shortcoming of complex structure in the device of above-mentioned patent documentation 1.
In addition, in the existing laser cutting device, in order to be easy to form small groove, and on machinery knives, apply a spot of kerosene on the surface of hard brittle material.And, form the words of small groove on the surface of hard brittle material with the machinery knives that applied kerosene like this, the kerosene that brittle material surface will adhered in the operation after cutting processing is removed, and need carry out clean-out operation and need cleaning equipment hard brittle material after processing for this reason.
On the other hand, such scheme has been proposed in patent documentation 2, promptly, by the technology that the part of laser is covered with elongated tinted shade, laser radiation to hard brittle material the time, can remove attached to the kerosene on the surface of described hard brittle material by the laser handle, so, need after cutting processing, not carry out clean-out operation to hard brittle material.
Patent documentation 1: TOHKEMY 2001-151525 communique
Patent documentation 2: TOHKEMY 2001-212683 communique
But, in the cutting unit of patent documentation 2,, need make top vertically consistent of the convex surface on this cylindrical lens with the installation direction of above-mentioned tinted shade if make elongated that the point of irradiation of laser becomes as condensing lens with cylindrical lens.Therefore, in the cutting unit of patent documentation 2, it is very miscellaneous when adjustment is installed operation to be adjusted in the position of cylindrical lens and tinted shade.
Summary of the invention
The present invention proposes in view of above-mentioned truth, laser cutting device of the present invention is provided with the cross-sectional shape of laser is formed the shape of regulation and the laser radiation mechanism that hard brittle material is shone, with the point of irradiation that laser and hard brittle material is relatively moved and make laser along being set in the travel mechanism that the predetermined cuts line on this hard brittle material moves, along described predetermined cuts line cutting brittle material; Described laser radiation mechanism is provided with the condensing lens through laser, and described condensing lens is provided with the diffusion zone that makes the laser diffusion; Described laser cutting device constitutes, and when described predetermined cuts line moved, moved on the predetermined cuts line of described hard brittle material at the position corresponding with described diffusion zone on this point of irradiation at the point of irradiation that makes laser by described travel mechanism.
According to above-mentioned formation, can use laser cutting device simple in structure compared with prior art, when being carried out cutting processing, can suppress the hard brittle material irradiating laser generation of chip.And, when the component parts of assembling laser cutting device, adjust operation easily.
Description of drawings
Fig. 1 is the vertical view of expression one embodiment of the invention.
Fig. 2 is the figure of the structure of expression first processing head 4 shown in Figure 1.
The axonometric drawing of Fig. 3 manufacturing procedure that to be schematic representation undertaken by first processing head 4 shown in Figure 2.
Fig. 4 is the axonometric drawing of condensing lens 12 shown in Figure 2.
Fig. 5 is the sectional view of condensing lens 12 shown in Figure 4.
Fig. 6 is the vertical view that is illustrated in machinery knives 11 and the position relation of laser L in the cutting processing of 4 pairs of hard brittle materials 2 of first processing head.
Fig. 7 is the sectional view of the relation of hard brittle material in the presentation graphs 6 and laser L.
Fig. 8 is the sectional view of the condensing lens 12 of another embodiment of the present invention.
Fig. 9 is the sectional view of the condensing lens 12 of further embodiment of this invention.
Embodiment
Embodiments of the invention are described below with reference to the accompanying drawings, and among Fig. 1 and Fig. 2,1 is laser cutting device, and described laser cutting device 1 is for example made the substrate of the display panel that liquid-crystal display uses by the hard brittle material that sheet glass is such 2 cutting.
Laser cutting device 1 is provided with the machine table 3 that is used for keeping above-mentioned hard brittle material 2, to hard brittle material 2 irradiating laser L with its first, second processing head 4,5 that cuts off, travel mechanism 6 that these first, second processing heads 4,5 are relatively moved with respect to the hard brittle material 2 on the above-mentioned machine table 3, with the vibration generator 7 that makes laser L starting of oscillation, and they are controlled by not shown controlling organization.
In following explanation, with the above-below direction among Fig. 1 as directions X, with the orthogonal left and right directions of directions X as the Y direction.
Above-mentioned hard brittle material 2 is roughly rectangle, is positioned on the above-mentioned machine table 3 under the state of Y direction towards directions X, minor face on long limit.In the present embodiment,, thereby be separated into rectangular product section 2a and be positioned at the not part 2b of this product section 2a periphery along directions X predetermined cuts line Bx that is set in directions X and the Y direction predetermined cuts line By cutting brittle material 2 that is set in the Y direction.
Worn a plurality of not shown holes on the surface of above-mentioned machine table 3, not shown air is connected in each hole for row mechanism.Attract air from these holes for row mechanism by this air, thereby hard brittle material 2 absorption are remained on the surface of machine table 3.
Above-mentioned travel mechanism 6 is provided with and clips two rail parts 6a, the 6a that above-mentioned machine table 3 is being provided with, with two moving rail 6b, the 6b that can move on directions X along these rail parts 6a, 6a, above-mentioned first, second processing head 4,5 is arranged to and can be moved on the Y direction along above-mentioned moving rail 6b, 6b respectively.
Thus, first, second processing head 4,5 can relatively move on directions X and Y direction with respect to hard brittle material 2.And, move by make above-mentioned first, second processing head 4,5 by above-mentioned travel mechanism 6, and hard brittle material 2 is cut along directions X predetermined cuts line Bx and Y direction predetermined cuts line By.
Fig. 2 represents above-mentioned first processing head 4, the following describes the structure of first processing head 4.The structure of the opposing party's second processing head 5 is identical with first processing head 4, therefore omits the detailed description to second processing head 5.
Promptly, first processing head 4 be provided with as the groove of the marking groove S that is used for forming linearity on the surface of hard brittle material 2 form mechanism machinery knives 11, be used for that the point of irradiation of laser L formed elongated roughly horseshoe-shaped condensing lens 12 and be used for machinery knives 11 are pressed to crowding mechanism 13 on the hard brittle material 2 from the top.
And, above-mentioned machinery knives 11 are configured in by travel mechanism 6 make first processing head 4 travel direction front side when mobile on directions X, condensing lens 12 is configured in the travel direction rear side.
Machinery knives 11 form disc, and the cross-sectional shape of its outer peripheral portion is V font roughly.The peripheral part of described machinery knives 11 is connected on the surface of hard brittle material 2, is urged mechanism's 13 pushings simultaneously.And, make first processing head 4 on directions X when mobile under this state, machinery knives 11 rotate and form small marking groove S towards directions X on the surfaces of hard brittle material 2.
Above-mentioned cylinder 13a is keeping machinery knives 11 and machinery knives 11 can be moved at above-below direction, and by the air pressure of supplying with by above-mentioned regulator 13c machinery knives 11 is pressed against on the surface of hard brittle material 2 according to needed pushing pressure.
Below, be reflected mirror 14 reflection backs by condensing lens 12 optically focused by the laser L of laser oscillator 7 starting of oscillations, shine then on the marking groove S of above-mentioned hard brittle material 2.Thus, constitute laser radiation mechanism by laser oscillator 7, speculum 14 and condensing lens 12.
In the present embodiment, when first processing head 4 by travel mechanism 6 on directions X when mobile, above-mentioned machinery knives 11 are moved along directions X predetermined cuts line Bx and form small marking groove S on the surface of hard brittle material 2, then, make and follow laser L that machinery knives 11 move and shine above-mentioned marking groove S and go up (with reference to Fig. 2, Fig. 3).
Like this laser L is shone on the marking groove S of hard brittle material 2, produce in the inside of hard brittle material 2 and clip the symmetric thermal stresses of marking groove S.Thus, hard brittle material 2 produces thermal expansions and begins to crack from the bottom of the roughly V font of marking groove S, and described crackle is stretched over the lower end of hard brittle material 2, thus hard brittle material 2 is cut off (with reference to Fig. 7) along directions X predetermined cuts line Bx.
And in the present embodiment, structure and configuration status thereof as the condensing lens 12 of laser radiation mechanism are improved in the following manner, thus, can when being cut off, the generation to small chip be suppressed hard brittle material 2.
Promptly, as shown in Figure 4 and Figure 5, condensing lens 12 is made of discoid cylindrical lens, and this cylindrical lens forms elongated oval shape to the cross-sectional shape of circular laser L, the following 12A of condensing lens 12 is a tabular surface, above 12B be the convex surface that the central part of breaded fish stick shape is higher than both sides.
The central part of 12B on condensing lens 12 passes axle center C forms linearity in vertical (diametric(al)) at the top of convex surface groove 12C.Described groove 12C forms the V shaped sections of upper side opening, and the width d of the peristome of top sets 1～3mm for, and degree of depth h sets 0.1～Imm for.
The end 12C ' of groove 12C arrives periphery 12D, but the other end 12C of groove 12C " do not arrive periphery 12D, and be positioned at the position that is adjacent.
The whole surface that constitutes the bottom of groove 12C is to form countless small concavo-convex uneven surfaces.Groove 12C constitutes the diffusion zone that makes laser L diffusion.
In addition, by forming above-mentioned groove 12C, the top 12B of condensing lens 12 is divided into the regional transmission 12E of left of semicircular in shape and right-hand regional transmission 12F, and between two regional transmission 12E, 12F with the other end 12C of groove 12C " the adjacent connection section 12G in the outside.
The zone beyond the groove 12C of top 12B and the following 12A of condensing lens 12 are ground smooth, and these positions can make the complete transmission of laser L.
The above-mentioned groove 12C of condensing lens 12 becomes diffusion zone, and, the zone beyond the groove 12C, promptly two regional transmission 12E, 12F and connection section 12G become the regional transmission that makes complete transmission of laser L and optically focused.Condensing lens 12 as above constitutes like that, thereby the laser L of rounded section is reflected mirror 14 from top guiding condensing lens 12, and transmission is crossed after the condensing lens 12, and the cross-sectional shape of laser L forms the elongated roughly shape of a hoof.
And the condensing lens 12 that as above constitutes like that flatly is installed on above-mentioned first processing head 4.And described condensing lens 12 is installed into, and makes the vertically parallel with directions X predetermined cuts line Bx of above-mentioned groove 12C, and makes above-mentioned connection section 12G be positioned at the travel direction front side of first processing head 4.
In addition, made first processing head 4 when directions X predetermined cuts line Bx moves by travel mechanism 6, the connection section 12G of condensing lens 12 and groove 12C move in the top position that overlaps with it along directions X predetermined cuts line Bx.
Therefore, laser L mirror 14 guiding condensing lenses 12 backs that are reflected see through condensing lenses, so the cross-sectional shape of laser L forms roughly behind the shape of a hoof so that the part corresponding with connection section 12G is positioned at the mode of travel direction front side shines on the hard brittle material.
And, becoming the point of irradiation of described roughly horseshoe-shaped laser L, the position corresponding with above-mentioned connection section 12G and groove 12C overlaps with marking groove S, and the part corresponding with both sides' regional transmission 12E, 12F clips marking groove S and is positioned at both sides (with reference to Fig. 3, Fig. 6).
Under this state, first processing head 4 moves at directions X by travel mechanism 6, thereby, on directions X predetermined cuts line Bx, form marking groove S by machinery knives 11, simultaneously, following the formation irradiating laser L of described marking groove S.Thus, to thickness direction crackle is trailed, thereby hard brittle material 2 is cut off along directions X predetermined cuts line Bx from marking groove S.
The structure of second processing head 5 is identical with the situation of above-mentioned first processing head 4 with configuration status, therefore omits the detailed description to second processing head 5.
Method to laser cutting device 1 cutting brittle material 2 with said structure describes below.
At first, laser cutting device 1 by above-mentioned first processing head 4 along the directions X predetermined cuts line Bx cutting brittle material 2 that does not intersect with line of cut B.
That is, at first machinery knives 11 stop on the extended line of directions X predetermined cuts line Bx of hard brittle material 2 from the position that hard brittle material 2 leaves, and at this moment, the lower end of machinery knives 11 is in the below slightly on the surface of hard brittle material 2.And the groove 12C of the condensing lens 12 of first processing head 4 and connection section 12G are positioned at the top position of the extended line of directions X predetermined cuts line Bx.
From this state, travel mechanism 6 moves first processing head 4 on directions X.Thus, under the lower-speed state before first processing head 4 arrives fixing speeds, machinery knives 11 contact with hard brittle material 2, begin to form marking groove S by these machinery knives 11 from the end on the surface of hard brittle material 2.Form marking groove S for easy, and applied kerosene in advance at the peripheral part of machinery knives 11.
Before hard brittle material 2 is approached in the position of the point of irradiation of the laser L that follows machinery knives 11, from laser oscillator 7 with laser L starting of oscillation, thereby this laser L mirror 14 reflection back that is reflected forms roughly shape of a hoof cross section by condensing lens 12, begins to shine from the end of hard brittle material 2.Then, travel mechanism 6 makes first processing head 4 acceleration in accordance with regulations quicken at directions X, keep this speed after arriving fixing speed then, near the terminal part that moves to directions X predetermined cuts line Bx under this state with constant speed (with reference to Fig. 2, Fig. 3).
And first processing head 4 slows down near the terminal part of directions X predetermined cuts line Bx, stops after hard brittle material 2 leaves at the point of irradiation of laser L.
At this moment, above-mentioned machine table 3 is kept the generation of negative pressure, by cut off product section 2a that hard brittle material 2 obtains and not part 2b under the adjacent state of former state, be maintained on the machine table 3.And at adjacent product section 2a with do not form by above-mentioned crackle between the part 2b and cut off line B.
Directions X predetermined cuts line Bx along with a side carries out the cutting of hard brittle material 2 like this, then first processing head 4 similarly carries out the cutting of hard brittle material 2 then by the top portion that above-mentioned travel mechanism 6 moves to the predetermined cuts line that will cut subsequently with above-mentioned action.
On the other hand, also carry out the identical cutting of cutting carried out with first processing head 4, carry out cutting respectively in all fronts of predetermined cuts line Bx, the By of two directions Xs and Y direction hard brittle material 2 to hard brittle material 2 by second processing head 5.
As above such, respectively after directions X and Y direction are over to the cutting of hard brittle material 2, machine table 3 is removed product section 2a and the not absorption maintenance of part 2b, to not want part 2b by not shown recovering mechanism and reclaim, product section 2a is transported to follow-up operation by not shown carrying mechanism then.
Such as mentioned above, in the present embodiment, constitute condensing lens 12 as described above, and be configured, therefore compared with prior art can simplify laser radiation mechanism.And, when hard brittle material 2 irradiating laser L cut, and on marking groove S, move, therefore as the corresponding part of the groove 12C of the diffusion zone of condensing lens 12, the line slot part can be by excessive heat, and the situation that can partly produce chip to the marking groove S of hard brittle material 2 is suppressed.And, need not outside condensing lens 12, to be used for laser is carried out separately the light-blocking member of shading, so just do not need as described in the above-mentioned patent documentation 2, to carry out the position adjustment operation of light-blocking member and condensing lens.Therefore, simplified the assembling laser cutting device 1 structure unit the time the adjustment operation.
And then even if be coated on the surface of kerosene attached to hard brittle material 2 on the machinery knives 11, the position that the point of irradiation of laser L is corresponding with connection section 12G also is irradiated on the marking groove S.Therefore, the kerosene attached to the surface of hard brittle material 2 can be evaporated by laser L and be removed.That is, after hard brittle material 2 is carried out cutting processing, do not need product section 2a is carried out surface cleaning, can omit matting of the prior art and cleaning equipment.
In the foregoing description, the cross section of groove 12C forms the V font, and still, as shown in Figure 8, the cross-sectional shape of groove 12C also can form semicircle.And then, can not form groove so as shown in Figure 9 yet, but form by a plurality of small concavo-convex uneven surfaces that constitute at the position corresponding with above-mentioned groove 12C on the 12B above the condensing lens 12.And then, also can be at metals such as position evaporation nickel corresponding or chromium with above-mentioned groove 12C on the top 12B, this place form will irradiation the laser reflection and the diffusion zone of diffusion.
Claims (4)
1. laser cutting device, described laser cutting device is provided with the cross-sectional shape of laser is formed the shape of regulation and the laser radiation mechanism that hard brittle material is shone, with the point of irradiation that laser and hard brittle material is relatively moved and make laser along being set in the travel mechanism that the predetermined cuts line on this hard brittle material moves, along described predetermined cuts line cutting brittle material, it is characterized in that:
Described laser radiation mechanism is provided with the condensing lens through laser, and described condensing lens is provided with the diffusion zone that makes the laser diffusion;
Described laser cutting device constitutes, and when described predetermined cuts line moved, moved on the predetermined cuts line of described hard brittle material at the position corresponding with described diffusion zone on this point of irradiation at the point of irradiation that makes laser by described travel mechanism.
2. laser cutting device as claimed in claim 1 is characterized in that described condensing lens is made of cylindrical lens, and the central part on the surface of this cylindrical lens forms described diffusion zone, and thus, the cross-sectional shape of laser forms the roughly shape of a hoof.
3. laser cutting device as claimed in claim 1 or 2 is characterized in that, the groove or the uneven surface of the linearity that forms on the surface of described diffusion zone by described condensing lens constitute.
4. as each the described laser cutting device in the claim 1～3, it is characterized in that, be provided with the groove formation mechanism that moves and have machinery knives by described travel mechanism, form mechanism by described groove and form small groove along the predetermined cuts line on the surface of hard brittle material, and, move along described small groove by the point of irradiation that makes described laser, crackle is developed and cutting brittle material to thickness direction from described small groove.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007273068 | 2007-10-19 | ||
| JP2007273068A JP5187556B2 (en) | 2007-10-19 | 2007-10-19 | Laser cleaving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101412577A true CN101412577A (en) | 2009-04-22 |
Family
ID=40593348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102109126A Pending CN101412577A (en) | 2007-10-19 | 2008-08-12 | Laser cutting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5187556B2 (en) |
| KR (1) | KR20090040204A (en) |
| CN (1) | CN101412577A (en) |
| TW (1) | TWI418434B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674242A (en) * | 2016-03-10 | 2016-06-15 | 雍自威 | Boiler device having laser punching function and used for turboset |
| CN106344198A (en) * | 2016-10-19 | 2017-01-25 | 深圳市博世乐科技有限公司 | Laser beak cutting device |
| CN106881770A (en) * | 2017-01-05 | 2017-06-23 | 苏州大道激光应用科技有限公司 | A kind of sliver technique for sheet glass punching |
| CN112759245A (en) * | 2021-01-04 | 2021-05-07 | 李云明 | Device for circularly cutting glass curtain wall |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6014490B2 (en) | 2012-12-27 | 2016-10-25 | 三星ダイヤモンド工業株式会社 | Cutting method and device |
| DE102015104801A1 (en) * | 2015-03-27 | 2016-09-29 | Schott Ag | Method and apparatus for continuous separation of glass |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
| CN101043992B (en) * | 2004-10-01 | 2011-03-23 | 三星钻石工业股份有限公司 | Brittle material scribing method and scribing apparatus |
| TW200724276A (en) * | 2005-12-26 | 2007-07-01 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus |
| JP2007246298A (en) * | 2006-03-13 | 2007-09-27 | Shibuya Kogyo Co Ltd | Method and apparatus for cutting brittle material |
-
2007
- 2007-10-19 JP JP2007273068A patent/JP5187556B2/en active Active
-
2008
- 2008-07-08 TW TW097125656A patent/TWI418434B/en not_active IP Right Cessation
- 2008-07-28 KR KR1020080073380A patent/KR20090040204A/en not_active Application Discontinuation
- 2008-08-12 CN CNA2008102109126A patent/CN101412577A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674242A (en) * | 2016-03-10 | 2016-06-15 | 雍自威 | Boiler device having laser punching function and used for turboset |
| CN105674242B (en) * | 2016-03-10 | 2018-06-05 | 福建省合茂网络科技有限公司 | There is the Steam Turbine boiler plant of laser boring |
| CN106344198A (en) * | 2016-10-19 | 2017-01-25 | 深圳市博世乐科技有限公司 | Laser beak cutting device |
| CN106881770A (en) * | 2017-01-05 | 2017-06-23 | 苏州大道激光应用科技有限公司 | A kind of sliver technique for sheet glass punching |
| CN112759245A (en) * | 2021-01-04 | 2021-05-07 | 李云明 | Device for circularly cutting glass curtain wall |
| CN112759245B (en) * | 2021-01-04 | 2023-06-09 | 陕西中科圣邦建设工程有限公司 | Device for carrying out circular cutting on glass curtain wall |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5187556B2 (en) | 2013-04-24 |
| TWI418434B (en) | 2013-12-11 |
| JP2009102178A (en) | 2009-05-14 |
| KR20090040204A (en) | 2009-04-23 |
| TW200918225A (en) | 2009-05-01 |
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Application publication date: 20090422 |