DE50009677D1 - FORMING AND DEVICE FOR SEPARATING FLAT WORKPIECES FROM SPRING-BROKEN MATERIAL - Google Patents

FORMING AND DEVICE FOR SEPARATING FLAT WORKPIECES FROM SPRING-BROKEN MATERIAL

Info

Publication number
DE50009677D1
DE50009677D1 DE50009677T DE50009677T DE50009677D1 DE 50009677 D1 DE50009677 D1 DE 50009677D1 DE 50009677 T DE50009677 T DE 50009677T DE 50009677 T DE50009677 T DE 50009677T DE 50009677 D1 DE50009677 D1 DE 50009677D1
Authority
DE
Germany
Prior art keywords
focal point
dividing line
curved dividing
curvilinear focal
curvilinear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50009677T
Other languages
German (de)
Inventor
Dirk Hauer
Berndt Hoetzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Priority to DE50009677T priority Critical patent/DE50009677D1/en
Application granted granted Critical
Publication of DE50009677D1 publication Critical patent/DE50009677D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The apparatus for cutting a flat glass work piece along a curved dividing line includes a laser generating a laser beam having a linear beam profile and an optical system with a scanner for producing a curvilinear focal point from the laser beam. The apparatus also moves a cold spot along the curved dividing line following the curvilinear focal point. A trajectory control device controls the position of the curvilinear focal point on the curved dividing line via actuators. A profile control device controls the contour of the curvilinear focal point according to trajectory data from the curved dividing line, so that all points of the curvilinear focal point lie on or coincide with the curved dividing line. The apparatus adjusts the length of the curvilinear focal point by adjusting scanning amplitude of the scanning motion.
DE50009677T 1999-12-31 2000-12-09 FORMING AND DEVICE FOR SEPARATING FLAT WORKPIECES FROM SPRING-BROKEN MATERIAL Expired - Lifetime DE50009677D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50009677T DE50009677D1 (en) 1999-12-31 2000-12-09 FORMING AND DEVICE FOR SEPARATING FLAT WORKPIECES FROM SPRING-BROKEN MATERIAL

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1999163939 DE19963939B4 (en) 1999-12-31 1999-12-31 Method and device for cutting flat workpieces made of brittle material
PCT/EP2000/012460 WO2001049444A2 (en) 1999-12-31 2000-12-09 Method and device for the separation of flat workpieces made from a brittle material
DE50009677T DE50009677D1 (en) 1999-12-31 2000-12-09 FORMING AND DEVICE FOR SEPARATING FLAT WORKPIECES FROM SPRING-BROKEN MATERIAL

Publications (1)

Publication Number Publication Date
DE50009677D1 true DE50009677D1 (en) 2005-04-07

Family

ID=7935104

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1999163939 Expired - Fee Related DE19963939B4 (en) 1999-12-31 1999-12-31 Method and device for cutting flat workpieces made of brittle material
DE50009677T Expired - Lifetime DE50009677D1 (en) 1999-12-31 2000-12-09 FORMING AND DEVICE FOR SEPARATING FLAT WORKPIECES FROM SPRING-BROKEN MATERIAL

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1999163939 Expired - Fee Related DE19963939B4 (en) 1999-12-31 1999-12-31 Method and device for cutting flat workpieces made of brittle material

Country Status (7)

Country Link
US (2) US6811069B2 (en)
EP (1) EP1242210B1 (en)
JP (1) JP4731082B2 (en)
AT (1) ATE289891T1 (en)
DE (2) DE19963939B4 (en)
ES (1) ES2236037T3 (en)
WO (1) WO2001049444A2 (en)

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* Cited by examiner, † Cited by third party
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DE19963939B4 (en) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Method and device for cutting flat workpieces made of brittle material
DE10001292C1 (en) * 2000-01-14 2001-11-29 Schott Spezialglas Gmbh Process for cutting flat glass comprises producing a temperature difference between the areas on both sides of the separating line for exposing the completely cut contour by applying a mechanical force
WO2003076150A1 (en) * 2002-03-12 2003-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
DE10330179A1 (en) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Method for separating flat workpieces made of ceramic
DE102004014277A1 (en) 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Process for the laser-thermal separation of flat glass
EP1806202B1 (en) * 2004-10-25 2011-08-17 Mitsuboshi Diamond Industrial Co., Ltd. Method and device for forming crack
GB0519111D0 (en) * 2005-09-20 2005-10-26 Pilkington Deutschland Ag Glass cutting
DE202006020154U1 (en) * 2006-06-02 2007-11-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. pane
EP1990168B1 (en) * 2007-05-10 2012-06-27 Grenzebach Maschinenbau GmbH Method for laser thermal separation of ceramic or other brittle flat materials
US8258427B2 (en) * 2008-05-30 2012-09-04 Corning Incorporated Laser cutting of glass along a predetermined line
JP5533668B2 (en) * 2008-12-25 2014-06-25 旭硝子株式会社 Fragile material substrate cleaving method, apparatus and vehicle window glass
US8350187B2 (en) * 2009-03-28 2013-01-08 Electro Scientific Industries, Inc. Method and apparatus for laser machining
US8269138B2 (en) * 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
WO2011002089A1 (en) * 2009-07-03 2011-01-06 旭硝子株式会社 Cutting method and cutting device for brittle material substrate, and vehicle window glass obtained by the cutting method
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8171753B2 (en) * 2009-11-18 2012-05-08 Corning Incorporated Method for cutting a brittle material
KR20120101460A (en) * 2009-11-19 2012-09-13 오리콘 솔라 아게, 트루바흐 Method and device for ablation of thin-films from a substrate
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) * 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8584490B2 (en) 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
US9034458B2 (en) 2011-05-27 2015-05-19 Corning Incorporated Edge-protected product and finishing method
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
JP2015120604A (en) * 2012-04-06 2015-07-02 旭硝子株式会社 Method and system for cutting tempered glass plate
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
DE102012110971A1 (en) 2012-11-14 2014-05-15 Schott Ag Separating transparent workpieces
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
DE102015109593B4 (en) * 2015-06-16 2022-02-10 Erlas Erlanger Lasertechnik Gmbh Scanner device for a laser beam for laser material processing, machine tool with the scanner device and method for controlling the machine tool with the scanner device
JP7528454B2 (en) * 2020-02-03 2024-08-06 日本電気硝子株式会社 Glass plate manufacturing method
CN114193635B (en) * 2021-12-23 2024-03-12 国泰新点软件股份有限公司 Method and device for cutting middle beam of constructional engineering

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
US4725709A (en) 1984-09-25 1988-02-16 Siemens Aktiengesellschaft Apparatus having a sweep arrangement for non-contacting modification of an article
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
US5120926A (en) * 1990-11-26 1992-06-09 General Motors Corporation Method and apparatus for high speed laser cutting
RU2024441C1 (en) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Process of cutting of nonmetal materials
DE4305107C2 (en) * 1993-02-19 1995-02-23 Fraunhofer Ges Forschung Method and device for cutting a brittle body with laser radiation
WO1996020062A1 (en) * 1994-12-23 1996-07-04 Kondratenko Vladimir Stepanovi Method of cutting non-metallic materials and a device for carrying out said method
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP3498895B2 (en) * 1997-09-25 2004-02-23 シャープ株式会社 Substrate cutting method and display panel manufacturing method
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
DE19952331C1 (en) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Method and device for quickly cutting a workpiece from brittle material using laser beams
US6501047B1 (en) * 1999-11-19 2002-12-31 Seagate Technology Llc Laser-scribing brittle substrates
TR200201402T2 (en) * 1999-11-24 2003-03-21 Applied Photonics, Inc. Method and device for the separation of non-metallic materials.
DE19959921C1 (en) * 1999-12-11 2001-10-18 Schott Spezialglas Gmbh Method and device for cutting flat workpieces made of brittle material
DE19963939B4 (en) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Method and device for cutting flat workpieces made of brittle material
US6812430B2 (en) * 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
KR100794284B1 (en) * 2001-09-29 2008-01-11 삼성전자주식회사 Method for cutting non-metal substrate

Also Published As

Publication number Publication date
US20020179667A1 (en) 2002-12-05
JP2003520682A (en) 2003-07-08
EP1242210B1 (en) 2005-03-02
US6811069B2 (en) 2004-11-02
DE19963939B4 (en) 2004-11-04
DE19963939A1 (en) 2001-07-19
ES2236037T3 (en) 2005-07-16
EP1242210A2 (en) 2002-09-25
US20050029321A1 (en) 2005-02-10
JP4731082B2 (en) 2011-07-20
US7014082B2 (en) 2006-03-21
WO2001049444A2 (en) 2001-07-12
ATE289891T1 (en) 2005-03-15
WO2001049444A3 (en) 2001-12-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition