CN106881770A - A kind of sliver technique for sheet glass punching - Google Patents
A kind of sliver technique for sheet glass punching Download PDFInfo
- Publication number
- CN106881770A CN106881770A CN201710008081.3A CN201710008081A CN106881770A CN 106881770 A CN106881770 A CN 106881770A CN 201710008081 A CN201710008081 A CN 201710008081A CN 106881770 A CN106881770 A CN 106881770A
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- CN
- China
- Prior art keywords
- sheet glass
- sliver
- punching
- carrier
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/14—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by boring or drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a kind of sliver technique for sheet glass punching, including following steps：(1) some sheet glass carriers are got out, the operation that sheet glass preparation is punched is placed in each carrier；(2) the sheet glass carrier that will place sheet glass is positioned on the slide assemblies of perforating device and is transmitted one by one；(3) wherein first specified location of the sheet glass carrier arrival punching component of transmission, laser cutting head starts to carry out drilling process to sheet glass；(4) laser cutting head carries out the circular cutting of a circle along the product space for needing to cut to the specified location on sheet glass；(5) laser cutting head is carried out to outer and interior spiral-shaped path cutting, until stopping to the center of outer ring inside outer ring；(6) sheet glass carrier is moved forward, and the hole that sliver component is finished against cutting carries out sliver；(7) after drilling process is completed, this sheet glass carrier removes perforating device by slide assemblies.
Description
Technical field
The present invention relates to glass-cutting technical field, specially a kind of sliver technique for sheet glass punching.
Background technology
Glass is fused together by sand and other chemical substances and is formed.Contiguous network structure is formed in melting,
Viscosity gradually increases and hardens the silicates nonmetallic materials for causing it to crystallize in cooling procedure.At present, glass extensive use
Every field in life, such as building, electronic product.
Glass is used as screen, display screen etc. in electronic product, generally when screen is processed, is cut using glass
Cutting mill to be cut to sheet glass then carry out sliver operation glass is processed, the work then punched to screen again
Sequence, in present drilling method, directly carries out the cutting of a circle circle, on line of cut directly then in glass screen mostly
Sliver is carried out, this mode makes glass cause the edge division of damage or line of cut imperfect when sliver, easily,
Situations such as there is breach, have impact on the quality of product, cause a large amount of substandard products, increased the purchase of raw material, improves and is produced into
This.
The content of the invention
In order to overcome above mentioned problem, the present invention to provide a kind of sliver technique for sheet glass punching.
The technical scheme is that provide it is a kind of for sheet glass punching sliver technique, it is characterised in that including with
Under several steps：
(1) some sheet glass carriers are got out, the sheet glass preparation for cutting is placed in each carrier to be carried out
The operation of punching, then places sheet glass carrier stacking；
(2) the sheet glass carrier that will place sheet glass is positioned on the slide assemblies of perforating device and is transmitted one by one,
A sheet glass carrier is placed at interval of 15cm on slide assemblies, sheet glass carrier is transmitted to punching component by slide assemblies
The preparation of position bottom carries out the drilling process of sheet glass；
(3) wherein first specified location of the sheet glass carrier arrival punching component of transmission, then slide assemblies stopping
The transmission of sheet glass carrier, the laser cutting head on punching component starts to carry out punching work to the sheet glass on sheet glass carrier
Sequence；
(4) first, laser cutting head carries out a circle along the product space for needing to cut to the specified location on sheet glass
Circular cutting, it would be desirable to the hole beaten outer loop-shaped cutting finish；
(5) then, laser cutting head is carried out to outer and interior spiral-shaped path cutting, until outside inside outer ring
The center of circle stops；
(6) subsequently, sheet glass carrier moves forward to the lower section of sliver component, the hole that sliver component is finished against cutting
Sliver operation is carried out, sliver component does the defragmentation in hole against outer ring and spiral-shaped cutting path device to hole sliver
Only, punching is completed；
(7) after drilling process is completed, this sheet glass carrier removes perforating device by slide assemblies, and perforating device is again
Carry out the movement of next sheet glass carrier and the punching of sheet glass.
Preferably, distance of the bottom of the laser cutting head in cutting apart from glass-cutting face is 43mm ± 5mm.
Preferably, when each sheet glass carries out drilling process via punching component, laser cutting head cut glass sheet is entered
The time of row punching is 4-5 seconds/piece.
The beneficial effects of the invention are as follows：Punching sliver of the invention is simple for process, and treatment is convenient, and running stabilization is cut
Isolate that piece glass orifice edge out is more smooth, reduce the generation of substandard products；Glass to be processed has stepped through feeding, cuts, splits
Piece, the operation of transfer, the screen of the electronic products such as mobile phone, panel computer is carried out the punching of bellmouth orifice, shooting head bore, whole work
Skill is more accurate compared with for prior art, and carrying out spiral-shaped path by the glass to glass orifice cuts, and makes the mistake of sliver
Easily, sliver finished product rate out is higher for Cheng Gengwei, so as to save raw material, reduces production cost, improves profit.
Brief description of the drawings
Fig. 1 is the spiral cutting schematic diagram of the perforate of glass screen of the present invention；
Fig. 2 is the structural representation of perforating device of the invention.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to understand, tie below
Specific embodiment is closed, the present invention is expanded on further.
As depicted in figs. 1 and 2, it is of the invention it is a kind of for sheet glass punching sliver technique, it is characterised in that including with
Under several steps：
(1) some sheet glass carriers 1 are got out, the sheet glass preparation for cutting is placed in each carrier to be carried out
The operation of punching, then places the stacking of sheet glass carrier 1；
(2) the sheet glass carrier 1 that will place sheet glass is positioned on the slide assemblies 2 of perforating device and is passed one by one
It is defeated, a sheet glass carrier 1 is placed at interval of 15cm on slide assemblies 2, sheet glass carrier 1 is transmitted to beating by slide assemblies 2
The position bottom preparation of aperture member 3 carries out the drilling process of sheet glass；
(3) wherein first transmission sheet glass carrier 1 reach punching component 3 specified location, then slide assemblies 2 stop
The only transmission of sheet glass carrier 1, the laser cutting head 4 on punching component 3 starts to break the sheet glass on sheet glass carrier 1
Hole operation；
(4) first, laser cutting head 4 carries out a circle along the product space for needing to cut to the specified location on sheet glass
Circular cutting, it would be desirable to the hole beaten outer loop-shaped cutting finish；
(5) then, laser cutting head 4 is carried out to outer and interior spiral-shaped path cutting, until arriving inside outer ring
The center of outer ring stops；
(6) subsequently, sheet glass carrier 1 moves forward to the lower section of sliver component, and sliver component is finished against cutting
Hole carries out sliver operation, sliver component against outer ring and spiral-shaped cutting path device to hole sliver, by the defragmentation in hole
Totally, punching is completed；
(7) after drilling process is completed, this sheet glass carrier 1 removes perforating device by slide assemblies 2, and perforating device is again
The punching of the secondary movement and sheet glass for carrying out next sheet glass carrier 1.
Preferably, distance of the bottom of the laser cutting head 4 in cutting apart from glass-cutting face is 43mm ± 5mm.
Preferably, when each sheet glass carries out drilling process via punching component 3, the cut glass sheet of laser cutting head 4 is come
The time punched is 4-5 seconds/piece.
The present invention in the punching sliver technique for carrying out sheet glass, get out some sheet glass carriers 1 for place wait beat
The glass screen 5 in hole, places the operation that the preparation of glass screen 5 for cutting is punched, then in each carrier
Being positioned over sheet glass carrier 1 on the slide assemblies 2 of perforating device one by one is transmitted, equidistant every on slide assemblies 2
A sheet glass carrier 1 is placed every 15cm, after the specified location that first sheet glass carrier 1 reaches punching component 3, punching group
Part 3 proceeds by drilling process.
First, the laser cutting head 4 that punching component 3 includes carries out the circular cutting of a circle along the position that needs punch,
In existing process, be generally then herein cutting finish after, just carry out the operation of sliver, be so easy to during sliver,
The problems such as edge to the hole of product causes breakage, breach, influences the quality of product, increases the generation of substandard products, and the present invention is then
Carried out to outer and interior spiral-shaped path cutting at the position of punching, until stop to the center of outer ring, now, the portion in hole
Then there is spiral-shaped line of cut in position, and in follow-up sliver operation, the hole that sliver component is finished against cutting carries out sliver
Operation, perforate 6 is easier cracking when sliver, and the edge line of perforate 6 is more smooth, reduces breach, the probability for damaging, and carries
The yield rate of product high.
Punching sliver of the invention is simple for process, and treatment is convenient, running stabilization, cutting splitting glass hole edge out
Edge is more smooth, reduces the generation of substandard products；Glass to be processed have stepped through feeding, cutting, sliver, transfer operation, by mobile phone,
The screen of the electronic products such as panel computer carry out bellmouth orifice, shooting head bore punching, whole technique compared with for prior art more
Precision, carries out spiral-shaped path and cuts by the glass to glass orifice, make the process of sliver more easy, and sliver is out
Finished product rate is higher, so as to save raw material, reduces production cost, improves profit.
Above example is only a kind of present invention implementation method therein, and its description is more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
Enclose.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (3)
1. it is a kind of for sheet glass punching sliver technique, it is characterised in that including following steps：
(1) some sheet glass carriers are got out, the sheet glass preparation for cutting is placed in each carrier and is punched
Operation, then by sheet glass carrier stacking place；
(2) the sheet glass carrier that will place sheet glass is positioned on the slide assemblies of perforating device and is transmitted one by one, slideway
A sheet glass carrier is placed at interval of 15cm on component, sheet glass carrier is transmitted to the position of punching component by slide assemblies
Bottom preparation carries out the drilling process of sheet glass；
(3) wherein first specified location of the sheet glass carrier arrival punching component of transmission, then slide assemblies stopping glass
The transmission of piece carrier, the laser cutting head on punching component starts to carry out drilling process to the sheet glass on sheet glass carrier；
(4) first, laser cutting head carries out the ring of a circle along the product space for needing to cut to the specified location on sheet glass
Around cutting, it would be desirable to which the outer loop-shaped cutting in the hole beaten is finished；
(5) then, laser cutting head is carried out to outer and interior spiral-shaped path cutting, until arriving outer ring inside outer ring
Center stops；
(6) subsequently, sheet glass carrier moves forward to the lower section of sliver component, and the hole that sliver component is finished against cutting is carried out
Sliver operation, sliver component is clean by the defragmentation in hole against outer ring and spiral-shaped cutting path device to hole sliver, complete
Into punching；
(7) after drilling process is completed, this sheet glass carrier removes perforating device by slide assemblies, and perforating device is carried out again
The movement of next sheet glass carrier and the punching of sheet glass.
2. it is according to claim 1 it is a kind of for sheet glass punching sliver technique, it is characterised in that：The laser cutting
Distance of the bottom of head in cutting apart from glass-cutting face is 43mm ± 5mm.
3. it is according to claim 1 it is a kind of for sheet glass punching sliver technique, it is characterised in that：Each sheet glass is passed through
When carrying out drilling process by punching component, laser cutting head cut glass sheet is 4-5 seconds/piece come the time punched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710008081.3A CN106881770A (en) | 2017-01-05 | 2017-01-05 | A kind of sliver technique for sheet glass punching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710008081.3A CN106881770A (en) | 2017-01-05 | 2017-01-05 | A kind of sliver technique for sheet glass punching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106881770A true CN106881770A (en) | 2017-06-23 |
Family
ID=59176439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710008081.3A Pending CN106881770A (en) | 2017-01-05 | 2017-01-05 | A kind of sliver technique for sheet glass punching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106881770A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107672065A (en) * | 2017-10-10 | 2018-02-09 | 覃其伦 | The sliver apparatus of silicon chip |
| CN110877160A (en) * | 2019-12-20 | 2020-03-13 | 华中科技大学 | Quartz glass laser three-dimensional cutting and material removing method and device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412577A (en) * | 2007-10-19 | 2009-04-22 | 涩谷工业株式会社 | Laser cutting device |
| CN102248305A (en) * | 2011-04-02 | 2011-11-23 | 周明 | Equipment and process method for high speed precision laser drilling on crystalline silicon |
| JP2012109341A (en) * | 2010-11-16 | 2012-06-07 | Shibuya Kogyo Co Ltd | Slicing method and slicing device of semiconductor material |
| CN103551743A (en) * | 2013-11-04 | 2014-02-05 | 苏州德龙激光股份有限公司 | Glass drilling device for production line |
| CN103862581A (en) * | 2014-03-19 | 2014-06-18 | 湖南三星磊洋玻璃机械有限公司 | Horizontal glass drilling machine |
| CN105618936A (en) * | 2014-11-21 | 2016-06-01 | 大族激光科技产业集团股份有限公司 | Machining method for etching glass through lasers |
| US20160368086A1 (en) * | 2015-06-16 | 2016-12-22 | Electro Scientific Industries, Inc. | Methods and apparatus for processing transparent materials |
-
2017
- 2017-01-05 CN CN201710008081.3A patent/CN106881770A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412577A (en) * | 2007-10-19 | 2009-04-22 | 涩谷工业株式会社 | Laser cutting device |
| JP2012109341A (en) * | 2010-11-16 | 2012-06-07 | Shibuya Kogyo Co Ltd | Slicing method and slicing device of semiconductor material |
| CN102248305A (en) * | 2011-04-02 | 2011-11-23 | 周明 | Equipment and process method for high speed precision laser drilling on crystalline silicon |
| CN103551743A (en) * | 2013-11-04 | 2014-02-05 | 苏州德龙激光股份有限公司 | Glass drilling device for production line |
| CN103862581A (en) * | 2014-03-19 | 2014-06-18 | 湖南三星磊洋玻璃机械有限公司 | Horizontal glass drilling machine |
| CN105618936A (en) * | 2014-11-21 | 2016-06-01 | 大族激光科技产业集团股份有限公司 | Machining method for etching glass through lasers |
| US20160368086A1 (en) * | 2015-06-16 | 2016-12-22 | Electro Scientific Industries, Inc. | Methods and apparatus for processing transparent materials |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107672065A (en) * | 2017-10-10 | 2018-02-09 | 覃其伦 | The sliver apparatus of silicon chip |
| CN110877160A (en) * | 2019-12-20 | 2020-03-13 | 华中科技大学 | Quartz glass laser three-dimensional cutting and material removing method and device |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170623 |
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| WD01 | Invention patent application deemed withdrawn after publication |