CN211757882U - Etching cutting die of two-way location - Google Patents
Etching cutting die of two-way location Download PDFInfo
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- CN211757882U CN211757882U CN201922308937.6U CN201922308937U CN211757882U CN 211757882 U CN211757882 U CN 211757882U CN 201922308937 U CN201922308937 U CN 201922308937U CN 211757882 U CN211757882 U CN 211757882U
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Abstract
The utility model relates to a bidirectional positioning etching cutting die, the upper plate of the cutting die is provided with a product die-cutting rule and a positioning mechanism, the positioning mechanism comprises a first punching die-cutting rule, a positioning guide pillar and a second punching die-cutting rule which are sequentially arranged along the feeding direction and the same interval of a material belt to be punched; the lower plate of the cutting die is provided with a positioning opening matched with the positioning guide pillar; the lower plate of the cutting die is provided with an avoidance step at the position corresponding to the first punching die-cutting knife; in the positioning and punching processes of the material belt to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening on a lower plate of a cutting die, and a positioning guide pillar of an upper plate of the cutting die penetrates through the positioning hole to enter the positioning opening; and the second punching die-cutting rule punches and cuts the material belt to be punched to obtain a new hole structure. Compared with the prior art, the utility model has the advantages of two-way location, need not to repeat division mould, simple process, machining efficiency height, product yield height, die-cut effect are stable.
Description
Technical Field
The utility model relates to a cutting die especially relates to an etching cutting die of two-way location.
Background
For a product which needs to be subjected to die cutting on the material belt and then subjected to slitting, the advancing direction of the product material belt needs to be strictly controlled, otherwise, the distance between products obtained by die cutting is inconsistent, and the precision processing requirement is not met. In order to position the material belt, in the prior art, positioning holes with the same distance are usually machined in the material belt, and the positioning holes are used for positioning the material belt and a product die-cutting rule, so that the machined product is positioned accurately. For example, chinese patent CN 109794990 a discloses a die cutting process with die cutting positioning holes reserved, which is to set the die cutting positioning holes at the beginning of die cutting and always reserve the die cutting positioning holes by cutting during the die cutting process, so as to ensure that the product is always positioned during the processing process and ensure the processing precision of the product.
Generally, the processing flow of the product is punching and waste discharge, some asymmetric products have requirements on punching directions, the punching directions do not cause waste discharge difficulty, and as for the double-sided adhesive tape product in fig. 1, it cannot be judged from which direction punching is beneficial to subsequent waste discharge before punching; after the cutting die has been made, the cutting die can only be punched along one direction, if the specific work effect of the waste discharge process is found, the waste discharge is not easy to occur in the punching direction of the current cutting die, because the positioning mechanism on the cutter and the product cutting die are made and cannot be changed, the material belt after punching is finished can only be firstly rolled and then discharged, but the method not only increases the rolling process, the material is easy to be sticky back, the outer frame waste material and the product can be sticky back after rolling, the waste discharge is difficult, and the sheets are easy to fall.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a two-way positioning etching cutting die for overcoming the above-mentioned drawbacks of the prior art.
The purpose of the utility model can be realized through the following technical scheme:
a bidirectional positioning etching cutting die comprises a cutting die upper plate and a cutting die lower plate, wherein a product die cutter is arranged on the cutting die upper plate, a material belt to be punched is arranged between the cutting die upper plate and the cutting die lower plate, a positioning mechanism is further arranged on the cutting die upper plate, and the positioning mechanism comprises a first punching die cutter, a positioning guide pillar and a second punching die cutter which are sequentially arranged at the same interval along the feeding direction of the material belt to be punched; the lower plate of the cutting die is provided with a positioning opening matched with the positioning guide pillar; the lower plate of the cutting die is provided with an avoidance step at the position corresponding to the first punching die cutter; the first punching die-cutting knife or the second punching die-cutting knife punches a hole structure on the material belt to be punched; in the positioning and punching processes of the material belt to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening on the lower plate of the cutting die, and a positioning guide pillar of the upper plate of the cutting die penetrates through the positioning hole to enter the positioning opening; and the second punching die-cutting rule punches and cuts the material belt to be punched to obtain a new hole structure.
The utility model discloses at first accomplished the location process through location guide pillar and punching die-cutting rule, the utility model discloses add punching die-cutting rule and location guide pillar on the cutting die upper plate, adopt punching die-cutting rule to wait that punching die-cutting material takes the first die-cut pore structure that obtains on the material area, regard as the locating hole with this pore structure, fix a position the die-cut position on next step in material area, the location opening of cutting die hypoplastron is aimed at to the pore structure who will most recently cut out, the location guide pillar and the location open position of cutting die upper plate correspond, consequently the die-cut position interval on the material area of the die-cut in-process product die-cutting rule of adjacent twice keeps unanimous, this interval is actually for punching die-cutting rule and the interval.
On the basis of accomplishing locate function, the utility model discloses a set up two die-cutting rule that punch a hole, first die-cutting rule and the second die-cutting rule that punches a hole promptly, the step of dodging of cooperation cutting die hypoplastron, can realize that the etching cutting die all can be die-cut product as far as possible in two directions, in the use, if the discovery is difficult to when wasting discharge according to current die-cut direction, can transfer the rotatory 180 of cutting die upper plate, punch a hole die-cutting rule and second die-cutting rule change position with first, thereby realize changing the direction of waiting the product that die-cut material area goes up the cutting, conveniently arrange waste.
Two positioning guide columns in the positioning mechanism are respectively a first positioning guide column and a second positioning guide column; the first punching die-cutting rule, the first positioning guide pillar, the second positioning guide pillar and the second punching die-cutting rule are arranged at equal intervals.
Two positioning guide columns are arranged in each positioning mechanism, and during positioning, the two positioning guide columns are inserted into the positioning openings, so that the positioning effect and the accuracy degree are improved.
The height of the upward convex step of the avoidance step is at least 1 mm.
The function of dodging the step is when dodging the punching die cutter of step top and being used in waiting to die-cut material area, can not die-cut material area, avoids the die-cut material area of repetition.
The width direction of the material belt to be punched is taken as a symmetry axis, and the product die-cutting rule is of an asymmetric structure.
The wafer in the hole structure on the material belt to be punched is connected with the main body of the material belt to be punched through a connecting strip; the punching die-cutting knife comprises a hole structure die-cutting knife matched with the hole structure in shape and size and a connecting strip die-cutting knife matched with the connecting strip in shape and size.
Because the hole structures obtained by punching and cutting the material belt by the punching and die-cutting tool are only used as positioning structures, the material belt materials (namely wafers) in the hole structures are not required to be discharged as waste materials, and the process is increased because the waste materials in the discharge holes are additionally provided with the process; consequently the utility model discloses a punching die cutter is treating the disk that die-cut material area die-cut does not cut off with the material area main part, but keeps being connected with the material area main part through a connecting strip, and along with advancing of material area, downthehole disk keeps connecting on the material area like this, does not produce the waste material, does not relate to the waste discharge problem, has simplified the process. In the use process, the positioning guide post moves downwards, the wafer in the hole structure on the material belt is poked into the positioning opening, and the wafer and the connecting strip are attached to the inner wall of the positioning opening because the wafer is connected with the material belt main body through the connecting strip; after die cutting is completed, the positioning guide post is withdrawn from the positioning opening, the material belt moves forwards, the wafer is pulled out from the positioning opening, and the wafer moves forwards along with the material belt.
The axial direction of the connecting strip die cutter is vertical to the feeding direction of the material strip to be punched.
The axial direction of the connecting strip die-cutting knife is parallel to the feeding direction of the material strip to be punched, and the hole structure die-cutting knives of the first punching die-cutting knife and the second punching die-cutting knife are both far away from the positioning guide pillar.
Because the thickness of the sheet material is strictly ensured in the transportation and subsequent processing processes of the sheet material, the direction of the circular sheet obtained by punching relative to the connecting strip is opposite to the feeding direction of the material belt to be punched, and the arrangement is such that when the material belt moves forwards, the circular sheet generated by punching of the punching die cutter and the connecting strip structure can just return to the hollow position on the material belt main body instead of overlapping with the material belt main body, so that the local position on the material belt is thickened, and the next processing is influenced.
The width of the connecting strip obtained by punching is smaller than that of the wafer, and the circle center of the wafer is positioned in the axial direction of the connecting strip; and punching the connecting strip and the main body joint of the material belt to be punched to obtain a widened structure.
The structure is widened in the setting, can guarantee the stable connection of connecting strip in the material area main part, can not take place to drop with the material area main part, causes the production waste material, influences processing.
The positioning mechanisms are respectively arranged at the two sides of the upper plate of the cutting die to position the two sides of the material belt to be punched; the product die-cutting rule is arranged between the two positioning mechanisms.
The positioning opening is a through hole or a cylindrical deep groove.
Compared with the prior art, the utility model has the advantages of it is following:
(1) the utility model realizes the bidirectional punching of the cutting die, changes the mode that the original proposal can only punch in the same direction, and reduces the waiting time and cost of repeated die sinking;
(2) in the die cutting process, the cutting die is simultaneously processed with a hole structure to position the punching of the next group of products, so that the distance between two adjacent groups of products is strictly kept consistent, and the positioning precision is high;
(3) the positioning is convenient, the waste discharge of the wafer material in the positioning hole is not needed, the working procedures are reduced, the processing efficiency is improved, and the cost is saved;
(4) the direction of the circular sheet and the connecting strip generated by the punching die-cutting rule is designed to be opposite to the feeding direction of the material belt, and when the material belt advances, the circular sheet and the connecting strip are just recombined with the hollow structure generated by punching, so that the consistency of the thickness of the material belt is ensured.
Drawings
Fig. 1 is a schematic structural view of a product obtained by die cutting according to the present invention;
fig. 2 is a schematic front view of the upper plate of the cutting die in embodiment 1;
FIG. 3 is a schematic right-view structural view of the upper plate of the cutting die of embodiment 1;
FIG. 4 is a front sectional view in the direction of example 1 when the mold is opened;
FIG. 5 is a front sectional view in the direction of example 1 when the mold is closed;
fig. 6 is a schematic structural diagram of a material tape obtained by using the cutting die of embodiment 1 in the punching process;
fig. 7 is a front view schematically illustrating the structure of the upper plate of the cutting die according to embodiment 2;
FIG. 8 is a schematic front view showing the structure of the upper plate of the cutting die in the comparative example;
in the figure, 1 is a cutting die upper plate, 2 is a cutting die lower plate, 3 is a product die-cutting rule, 4 is a material belt to be punched, 41 is a product release film, 42 is a product double-sided adhesive tape, 5 is a first punching die-cutting rule, 6 is a second punching die-cutting rule, 7 is a first positioning guide pillar, 8 is a second positioning guide pillar, 9 is a positioning opening, 10 is a hole structure die-cutting rule, 11 is a connecting strip die-cutting rule, 12 is a wafer, 13 is a connecting strip, 14 is a widening structure, 15 is a feeding direction, and 16 is an avoiding step.
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
Example 1
A product processed by the etching cutting die has a shape shown in figure 1, the shape has directionality, the width direction of a material belt 4 to be punched is taken as a symmetry axis, and a product die-cutting knife 3 is of an asymmetric structure; the etching cutting die comprises a cutting die upper plate 1 and a cutting die lower plate 2, a material belt 4 to be punched is arranged between the cutting die upper plate 1 and the cutting die lower plate 2, as shown in fig. 2 and fig. 3, a product die cutter 3 and a positioning mechanism are arranged on the cutting die upper plate 1, and the positioning mechanism comprises a first punching die cutter 5, a first positioning guide pillar 7, a second positioning guide pillar 8 and a second punching die cutter 6 which are sequentially arranged at the same interval along the feeding direction 15 of the material belt 4 to be punched; a positioning opening 9 matched with the first positioning guide pillar 7 and the second positioning guide pillar 8 is formed in the lower cutting die plate 2, and the positioning opening 9 is a through hole; the lower cutting die plate 2 is provided with an avoiding step 16 at a position corresponding to the first punching die cutter 5, and as shown in fig. 4 and 5, the step height of the avoiding step 16 is 1 mm; the positions of two sides of the cutting die upper plate 1 are respectively provided with a positioning mechanism for positioning the positions of two sides of the material belt 4 to be punched; the product die-cutting rule 3 is arranged between the two positioning mechanisms. The first punching die-cutting rule 5 and the second punching die-cutting rule 6 punch and cut the material belt 4 to be punched to obtain a hole structure; in the positioning and punching processes of the material belt 4 to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening 9 on the lower cutting die plate 2, and a positioning guide pillar of the upper cutting die plate 1 penetrates through the positioning hole to enter the positioning opening 9; and the second punching die-cutting knife 6 punches and cuts the material belt 4 to be punched to obtain a new hole structure.
As shown in fig. 6, the material tape to be punched is composed of a product release film 41 and a product double-sided adhesive tape 42 attached to the product release film, and the etching knife mold with bidirectional positioning can punch hole structures on two sides of the product release film; the wafer 12 in the hole structure on the material belt 4 to be punched is connected with the main body of the material belt 4 to be punched through the connecting strip 13, the width of the connecting strip 13 obtained through punching is smaller than that of the wafer 12, and the circle center of the wafer 12 is located in the axial direction of the connecting strip 13; the widened configuration 14 is die cut at the junction of the connecting strip and the body of the strip 4 to be die cut. Matching the punched pattern, as shown in fig. 2, the punching die-cutting rule includes a hole structure die-cutting rule 10 matching the shape and size of the hole structure and a connecting bar die-cutting rule 11 matching the shape and size of the connecting bar 13, and the end of the connecting bar die-cutting rule 11 far from the hole structure die-cutting rule 10 is provided with a widening structure. The axial direction of the connecting strip die cutter 11 is perpendicular to the feed direction 15 of the strip of material 4 to be die-cut.
The using process of the embodiment is as follows:
as shown in fig. 4, the die is in the open position, the punched blanking strip 4 moves in the feeding direction 15, and two hole structures newly punched on the punched blanking strip 4 are respectively aligned with two positioning openings on the lower plate 2 of the cutting die, so that the positioning process is completed; then the upper plate 1 of the cutting die moves downwards, the die is closed, as shown in fig. 5, the positioning guide post moves downwards and enters the positioning opening, meanwhile, a wafer and a connecting sheet inside a hollow part obtained by punching and cutting the material belt are poked into the positioning opening, and the wafer and the connecting sheet are attached to the inner wall of the positioning opening because the connecting sheet is connected with the main body of the material belt; in the downward punching process, the shape and pattern of the product are punched on the material strip to be punched, and the second punching die-cutting rule 6 processes a new hole structure on the material strip to be punched to serve as a positioning hole for next punching positioning. After punching is finished, the die is opened, the upper plate 1 of the cutting die moves upwards and returns to the opening position of the die, then the material belt to be punched moves forwards, and the wafer and the connecting sheet are pulled out from the positioning opening and continue to move forwards; the die cut product orientation is shown in fig. 6.
If the punching direction shown in fig. 6 is not beneficial to the subsequent waste discharge operation, the upper plate 1 of the cutting die is rotated by 180 degrees, the shape and direction of the product are changed, and the subsequent punching processing is carried out. After the upper plate 1 of the rotary cutting die, the positions of the first punching die-cutting rule 5 and the second punching die-cutting rule 6 are exchanged, the first punching die-cutting rule 5 processes a hole structure on a material belt with punching, and the second punching die-cutting rule 6 is positioned above an avoiding step and does not act with the material belt with punching.
Example 2
The main structure of this embodiment is the same as that of embodiment 1, except that the direction of the punching die cutters disposed on the upper plate of the cutting die in this embodiment is different, and the punching die cutters in this embodiment can also punch and cut the disc 12 and the connecting strip 13 on the tape punched by the tape punching, and the tail of the connecting strip 13 is connected to the main body of the tape 4 punched by the tape punching, and is not cut. Unlike the embodiment 1 in which the axial direction of the connecting strip die-cutting rule 11 is perpendicular to the feeding direction 15 of the strip 4 to be die-cut, in this embodiment, the axial direction of the connecting strip die-cutting rule 11 is parallel to the feeding direction 15 of the strip 4 to be die-cut, and the hole structure die-cutting rules 10 of the first punching die-cutting rule 5 and the second punching die-cutting rule 6 are both arranged away from the positioning guide pillars; the positioning opening 9 in this embodiment is a cylindrical deep groove, as shown in fig. 7.
The cutting die of this embodiment punches the overall structure of the disk that the cutting obtained and the connector on waiting die-cut material area 4 and extends along the opposite direction of the direction of feed 15 of waiting die-cut material area 4, and when die-cut completion back, the material area continued to move forward to the direction of feed, disk and connection piece can get back to the hollow out construction on the material area, and the die-cut amalgamation of material area is a whole, and not like disk and connection piece paste other positions in material area in embodiment 1, cause the material area local thickening. The cutting die of this embodiment is applicable to the material area processing of sheet, because to the transportation of sheet and in the follow-up course of working, the thickness of guaranteeing the sheet material strictly, avoids local thickening as far as possible, otherwise can cause the pulling removal that can't accomplish the sheet product.
Comparative example
The comparative example is a cutting die for one-way punching, the structure of which is shown in fig. 8, a product die-cutting rule 3 and a positioning mechanism are arranged on an upper plate 1 of the cutting die, and the positioning mechanism comprises a second punching die-cutting rule 6, a first positioning guide post 7 and a second positioning guide post 8 which are sequentially arranged along the feeding direction 15 of a material belt 4 to be punched at the same interval; the product can be punched only along one direction to obtain a product with one orientation, and the punching direction cannot be changed.
The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by those skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (10)
1. A bidirectional positioning etching cutting die comprises a cutting die upper plate (1) and a cutting die lower plate (2), wherein a product die-cutting rule (3) is arranged on the cutting die upper plate (1), a material belt (4) to be punched is arranged between the cutting die upper plate (1) and the cutting die lower plate (2), and the bidirectional positioning etching cutting die is characterized in that,
the cutting die upper plate (1) is also provided with a positioning mechanism, and the positioning mechanism comprises a first punching die cutter (5), a positioning guide post and a second punching die cutter (6) which are sequentially arranged at the same interval along the feeding direction (15) of the material belt (4) to be punched; a positioning opening (9) matched with the positioning guide post is arranged on the lower cutting die plate (2); the lower cutting die plate (2) is provided with an avoidance step (16) at the position corresponding to the first punching die cutter (5); the first punching die cutter (5) or the second punching die cutter (6) punches and cuts the material belt (4) to be punched to obtain a hole structure;
in the positioning and punching process of the material belt (4) to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening (9) on the lower cutting die plate (2), and a positioning guide pillar of the upper cutting die plate (1) penetrates through the positioning hole to enter the positioning opening (9); and the second punching die cutter (6) punches the material belt (4) to be punched to obtain a new hole structure.
2. The etching cutting die with bidirectional positioning according to claim 1, wherein there are two positioning guide posts in the positioning mechanism, namely a first positioning guide post (7) and a second positioning guide post (8); the first punching die-cutting rule (5), the first positioning guide pillar (7), the second positioning guide pillar (8) and the second punching die-cutting rule (6) are arranged at equal intervals.
3. A bi-directionally positioned etching blade according to claim 1, wherein the upwardly projecting step height of said relief step (16) is at least 1 mm.
4. A bi-directionally positioned etching blade die according to claim 1, wherein said product cutting blade (3) is of an asymmetric configuration with the width direction of said strip (4) of material to be die cut as the axis of symmetry.
5. A bi-directionally positioned etching die as claimed in claim 1, wherein the discs (12) in the hole structure of the strip (4) of material to be die cut are connected to the main body of the strip (4) of material to be die cut by means of a connecting strip (13); the punching die-cutting knife comprises a hole structure die-cutting knife (10) matched with the shape and the size of the hole structure and a connecting strip die-cutting knife (11) matched with the shape and the size of the connecting strip (13).
6. A bidirectionally positioned etching blade die according to claim 5, characterized in that the axial direction of said connecting strip die-cutting blade (11) is perpendicular to the feeding direction (15) of said strip of material (4) to be die-cut.
7. A bidirectionally positioned etching knife die according to claim 5, characterized in that the axial direction of said connecting strip-die knife (11) is parallel to the feed direction (15) of said strip of material (4) to be punched, and that the hole-structure-die-knives (10) of said first (5) and second (6) punching-die-knives are arranged distant from said positioning guide.
8. A bidirectionally positioned etching blade according to claim 5, characterized in that the width of the punched connecting strip (13) is smaller than the width of said disc (12), and the centre of the disc (12) is located in the axial direction of the connecting strip (13); and punching the connecting strip and the main body connecting part of the material belt (4) to be punched to obtain a widened structure (14).
9. The etching cutting die with the bidirectional positioning function as recited in claim 1, wherein the positioning mechanisms are respectively arranged at two side positions of the cutting die upper plate (1) for positioning two side positions of the material strip (4) to be cut; the product die-cutting rule (3) is arranged between the two positioning mechanisms.
10. A bi-directionally positioned etching blade according to claim 1, characterized in that said positioning opening (9) is a through hole or a cylindrical deep groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922308937.6U CN211757882U (en) | 2019-12-20 | 2019-12-20 | Etching cutting die of two-way location |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922308937.6U CN211757882U (en) | 2019-12-20 | 2019-12-20 | Etching cutting die of two-way location |
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| CN211757882U true CN211757882U (en) | 2020-10-27 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112976159A (en) * | 2021-03-11 | 2021-06-18 | 文鑫 | Plastic light guide plate die-cutting machine and die-cutting processing method |
| CN113000668A (en) * | 2019-12-20 | 2021-06-22 | 昊佰电子科技（上海）有限公司 | Etching cutting die of two-way location |
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2019
- 2019-12-20 CN CN201922308937.6U patent/CN211757882U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113000668A (en) * | 2019-12-20 | 2021-06-22 | 昊佰电子科技（上海）有限公司 | Etching cutting die of two-way location |
| CN113000668B (en) * | 2019-12-20 | 2024-07-09 | 上海昊佰智造精密电子股份有限公司 | Etching cutting die with bidirectional positioning function |
| CN112976159A (en) * | 2021-03-11 | 2021-06-18 | 文鑫 | Plastic light guide plate die-cutting machine and die-cutting processing method |
| CN112976159B (en) * | 2021-03-11 | 2022-06-07 | 保定市欣海阳光板制造有限公司 | Plastic light guide plate die-cutting machine and die-cutting processing method |
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