CN113000668B - Etching cutting die with bidirectional positioning function - Google Patents

Etching cutting die with bidirectional positioning function

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Publication number
CN113000668B
CN113000668B CN201911324982.9A CN201911324982A CN113000668B CN 113000668 B CN113000668 B CN 113000668B CN 201911324982 A CN201911324982 A CN 201911324982A CN 113000668 B CN113000668 B CN 113000668B
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China
Prior art keywords
die
positioning
punching
punched
cutting
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Application number
CN201911324982.9A
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Chinese (zh)
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CN113000668A (en
Inventor
周姿
杜月华
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Shanghai Haobai Zhizao Precision Electronics Co ltd
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Shanghai Haobai Zhizao Precision Electronics Co ltd
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Application filed by Shanghai Haobai Zhizao Precision Electronics Co ltd filed Critical Shanghai Haobai Zhizao Precision Electronics Co ltd
Priority to CN201911324982.9A priority Critical patent/CN113000668B/en
Publication of CN113000668A publication Critical patent/CN113000668A/en
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Publication of CN113000668B publication Critical patent/CN113000668B/en
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Abstract

The invention relates to a bidirectionally positioned etching cutting die, wherein a product die cutter and a positioning mechanism are arranged on an upper plate of the cutting die, and the positioning mechanism comprises a first punching die cutter, a positioning guide post and a second punching die cutter which are sequentially arranged along the feeding direction and the same interval of a material belt to be punched; a positioning opening matched with the positioning guide post is formed in the lower plate of the cutting die; the lower plate of the cutting die is provided with an avoidance step at the corresponding position of the first punching die cutter; in the positioning and punching process of the material belt to be punched, a punched hole structure is used as a positioning hole to be aligned with a positioning opening on a lower plate of a cutting die, and a positioning guide post of an upper plate of the cutting die passes through the positioning hole to enter the positioning opening; and punching the material strip to be punched by a second punching die cutter to obtain a new hole structure. Compared with the prior art, the invention has the advantages of bidirectional positioning, no need of repeatedly opening the die, simple process, high processing efficiency, high product yield, stable punching effect and the like.

Description

Etching cutting die with bidirectional positioning function
Technical Field
The invention relates to a cutting die, in particular to a bidirectionally positioned etching cutting die.
Background
For products which need to be die-cut at the material belt and then cut, the advancing direction of the material belt of the products needs to be strictly controlled, otherwise, the intervals of the products obtained by die cutting are inconsistent, and the precision processing requirement is not met. In order to position the material belt, the prior art generally processes positioning holes with the same interval on the material belt, and the positioning holes are used for positioning the product die-cutting knife, so that the processed product is positioned accurately. For example, chinese patent CN 109794990A discloses a die-cutting process for retaining a die-cutting positioning hole, which is to set the die-cutting positioning hole at the beginning of die-cutting, and retain the die-cutting positioning hole all the time by cutting during die-cutting, so as to ensure that the product is positioned all the time during processing and ensure the processing precision of the product.
In general, the processing flow of the product is punching and waste discharge, and some asymmetric products have requirements on punching directions, and the punching directions are not difficult to cause waste discharge, such as the double faced adhesive tape product in fig. 1, and the direction from which the punching is beneficial to subsequent waste discharge cannot be judged before punching; when the cutting die is manufactured, the cutting die can only be punched along one direction, if the specific working effect of the waste discharge process is found, the waste discharge is difficult to be carried out in the punching direction of the current cutting die, and the positioning mechanism on the cutter and the product cutting die are manufactured, cannot be changed, and only the punched material belt can be rolled first and then discharged, but the method not only increases the rolling process, but also the material is easy to be adhered back, and the waste material of the outer frame and the product are adhered back after rolling, so that the waste discharge is difficult and the sheet is easy to fall.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a bi-directional positioning etching cutting die.
The aim of the invention can be achieved by the following technical scheme:
The etching cutting die comprises a cutting die upper plate and a cutting die lower plate, wherein a product die cutter is arranged on the cutting die upper plate, a material strip to be punched is arranged between the cutting die upper plate and the cutting die lower plate, and a positioning mechanism is further arranged on the cutting die upper plate and comprises a first punching die cutter, a positioning guide post and a second punching die cutter which are sequentially arranged along the feeding direction of the material strip to be punched at the same interval; a positioning opening matched with the positioning guide post is formed in the lower plate of the cutting die; the lower plate of the cutting die is provided with an avoidance step at the corresponding position of the first punching die cutter; the first punching die cutter or the second punching die cutter punches the material strip to be punched to obtain a hole structure; in the positioning and punching processes of the material belt to be punched, a punched hole structure is used as a positioning hole to align with a positioning opening on the lower plate of the cutting die, and a positioning guide post of the upper plate of the cutting die passes through the positioning hole to enter the positioning opening; and the second punching die cutter punches a new hole structure on the material belt to be punched.
The invention firstly completes the positioning process through the positioning guide post and the punching die cutter, the punching die cutter and the positioning guide post are additionally arranged on the upper plate of the cutting die, the punching die cutter is adopted to punch a material belt of the material belt to be punched to obtain a hole structure, the hole structure is used as a positioning hole to position the punching position of the next step of the material belt, the latest punched hole structure is aligned with the positioning opening of the lower plate of the cutting die, the positioning guide post of the upper plate of the cutting die corresponds to the positioning opening, therefore, the interval between the punching positions of the product die cutters on the material belt in the adjacent punching processes is kept consistent, and the interval is actually the interval between the punching die cutter and the positioning guide post.
On the basis of finishing the positioning function, the invention can realize that the etching cutting die can cut products in two directions through arranging two punching die cutters, namely the first punching die cutter and the second punching die cutter, and matching with the avoidance step of the lower plate of the cutting die, and in the use process, if the situation that waste is not easy to discharge according to the existing cutting direction is found, the upper plate of the cutting die can be rotated for 180 degrees to change the positions of the first punching die cutter and the second punching die cutter, thereby realizing the change of the direction of the products cut on the material belt to be cut and facilitating waste discharge.
Two positioning guide posts are arranged in the positioning mechanism, namely a first positioning guide post and a second positioning guide post; the first punching die cutter, the first positioning guide post, the two positioning guide posts and the second punching die cutter are arranged at equal intervals.
Two positioning guide posts are arranged in each positioning mechanism, and during positioning, the two positioning guide posts are inserted into the positioning openings, so that the positioning effect and the accuracy are improved.
The height of the upward raised step avoiding the step is at least 1mm.
The function of avoiding the step is that when the punching die cutter above the avoiding step acts on the material belt to be punched, the material belt can not be punched, and repeated punching of the material belt is avoided.
And taking the width direction of the material belt to be punched as a symmetry axis, and the product die-cutting knife is of an asymmetric structure.
The wafer in the hole structure on the material belt to be punched is connected with the main body of the material belt to be punched through a connecting strip; the punching die-cutting knife comprises a punching structure die-cutting knife matched with the shape and the size of the punching structure and a connecting strip die-cutting knife matched with the shape and the size of the connecting strip.
Because the punching die cutter is used for punching the hole structures obtained by punching on the material belt only as the positioning structures, the material belt materials (namely the wafer) in the hole structures do not need to be discharged as waste materials, and the waste materials in the discharge holes are additionally provided with working procedures, so that the working procedures are increased; therefore, the wafer punched by the punching die cutter of the invention is not cut off from the material belt main body, but is connected with the material belt main body through a connecting strip, so that the wafer in the hole is connected with the material belt along with the advancing of the material belt, no waste is generated, the waste discharging problem is not involved, and the process is simplified. In the use process, the positioning guide post moves downwards to poke the circular disc in the hole structure on the material belt into the positioning opening, and the circular disc and the connecting strip are tightly attached to the inner wall of the positioning opening as the circular disc is connected with the material belt main body through the connecting strip; after die cutting is completed, the positioning guide post is withdrawn from the positioning opening, the material belt moves forward, the wafer is pulled out of the positioning opening, and the material belt moves forward.
The axial direction of the connecting strip die cutter is perpendicular to the feeding direction of the material belt to be punched.
The axial direction of the connecting strip die cutter is parallel to the feeding direction of the material belt to be punched, and the hole structure die cutters of the first punching die cutter and the second punching die cutter are far away from the positioning guide pillar.
Because the thickness of the sheet material is strictly ensured during the transportation and subsequent processing of the sheet material, the direction of the die-cut wafer relative to the connecting strip is further opposite to the feeding direction of the material strip to be die-cut, and the arrangement is such that when the material strip moves forward, the punching die cutter is used for die-cutting the produced wafer and the connecting strip structure can just return to the hollowed-out position on the material strip main body, but not overlap with the material strip main body, so that the local position on the material strip is thickened, and the next processing is affected.
The width of the connecting strip obtained by punching is smaller than the width of the wafer, and the circle center of the wafer is positioned in the axial direction of the connecting strip; and the connection part of the connecting strip and the main body of the material belt to be punched is punched to obtain a widened structure.
The structure is widened in the setting, the connecting strip can be guaranteed to be stably connected to the material belt main body, the connecting strip cannot fall off from the material belt main body, waste is generated, and processing is affected.
The positioning mechanisms are respectively arranged at the two sides of the upper plate of the cutting die to position the two sides of the material belt to be punched; the product die-cutting knife is arranged between the two positioning mechanisms.
The positioning opening is a through hole or a cylindrical deep groove.
Compared with the prior art, the invention has the following advantages:
(1) The invention realizes that the cutting die can perform bidirectional punching, changes the mode that the original scheme can only perform punching in the same direction, and reduces the waiting time and the cost of repeatedly opening the die;
(2) In the die cutting process, the cutting die simultaneously processes a hole structure, positions the die cutting of the next group of products, strictly ensures that the intervals between the products of two adjacent groups are kept consistent, and has high positioning precision;
(3) The positioning is convenient, the waste of the wafer materials in the positioning holes is not required, the working procedures are reduced, the processing efficiency is improved, and the cost is saved;
(4) The orientation of the wafer and the connecting strip generated by the punching die cutter is designed to be opposite to the feeding direction of the material strip, and when the material strip advances, the wafer and the connecting strip are just recombined with the hollow structure generated by punching, so that the thickness consistency of the material strip is ensured.
Drawings
FIG. 1 is a schematic diagram of the structure of a die-cut product of the present invention;
fig. 2 is a schematic front view of the upper plate of the cutting die of embodiment 1;
Fig. 3 is a schematic right-view structure of the upper plate of the cutting die of embodiment 1;
FIG. 4 is a front view in cross section of example 1 with the mold open;
FIG. 5 is a front view in cross section of example 1 with the mold closed;
FIG. 6 is a schematic view of the structure of a material strip obtained by using the die of example 1 in the punching process;
fig. 7 is a schematic diagram showing the front view of the upper plate of the cutting die in embodiment 2;
FIG. 8 is a schematic diagram showing the front view of the upper plate of the cutting die in the comparative example;
In the figure, 1 is a cutting die upper plate, 2 is a cutting die lower plate, 3 is a product die cutter, 4 is a material belt to be punched, 41 is a product release film, 42 is a product double faced adhesive tape, 5 is a first punching die cutter, 6 is a second punching die cutter, 7 is a first positioning guide post, 8 is a second positioning guide post, 9 is a positioning opening, 10 is a hole structure die cutter, 11 is a connecting strip die cutter, 12 is a wafer, 13 is a connecting strip, 14 is a widening structure, 15 is a feeding direction, and 16 is an avoidance step.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
Example 1
The product shape obtained by processing the etching cutting die is shown in figure 1, the shape has directivity, the width direction of the material belt 4 to be punched is taken as a symmetry axis, and the product die-cutting knife 3 is of an asymmetric structure; the etching cutting die comprises a cutting die upper plate 1 and a cutting die lower plate 2, a material strip 4 to be punched is arranged between the cutting die upper plate 1 and the cutting die lower plate 2, as shown in fig. 2 and 3, a product die cutter 3 and a positioning mechanism are arranged on the cutting die upper plate 1, and the positioning mechanism comprises a first punching die cutter 5, a first positioning guide pillar 7, a second positioning guide pillar 8 and a second punching die cutter 6 which are sequentially arranged along the feeding direction 15 of the material strip 4 to be punched at the same interval; the lower plate 2 of the cutting die is provided with a positioning opening 9 matched with the first positioning guide post 7 and the second positioning guide post 8, and the positioning opening 9 is a through hole; the lower cutting die plate 2 is provided with an avoidance step 16 at a position corresponding to the first punching die cutter 5, and as shown in fig. 4 and 5, the step height of the avoidance step 16 is 1mm; the two sides of the upper plate 1 of the cutting die are respectively provided with a positioning mechanism for positioning the two sides of the material belt 4 to be punched; the product die-cutting knife 3 is arranged between the two positioning mechanisms. The first punching die cutter 5 and the second punching die cutter 6 punch the material strip 4 to be punched to obtain a hole structure; in the positioning and punching process of the material belt 4 to be punched, a punched hole structure is used as a positioning hole to be aligned with a positioning opening 9 on the lower plate 2 of the cutting die, and a positioning guide post of the upper plate 1 of the cutting die passes through the positioning hole to enter the positioning opening 9; the second punching die 6 punches a new hole structure in the material web 4 to be punched.
As shown in fig. 6, the material belt to be punched consists of a product release film 41 and a product double-sided adhesive 42 attached to the product release film, and a bidirectionally positioned etching knife die can punch hole structures on two sides of the product release film; the wafer 12 in the hole structure on the material belt 4 to be punched is connected with the main body of the material belt 4 to be punched through the connecting strip 13, the width of the connecting strip 13 obtained by punching is smaller than that of the wafer 12, and the center of the wafer 12 is positioned in the axial direction of the connecting strip 13; the junction of the connecting strip with the body of the material web 4 to be die-cut is die-cut to obtain a widened structure 14. As shown in fig. 2, the punching die-cutting blade includes a hole structure die-cutting blade 10 matching the shape and size of the hole structure and a connecting bar die-cutting blade 11 matching the shape and size of the connecting bar 13, and the end of the connecting bar die-cutting blade 11 away from the hole structure die-cutting blade 10 is provided with a widening structure. The axial direction of the connecting strip die cutter 11 is perpendicular to the feeding direction 15 of the material web 4 to be die cut.
The use process of the embodiment is as follows:
As shown in fig. 4, the die is in an open position, the blanking belt 4 with the punch moves towards the feeding direction 15, and two hole structures which are punched recently on the blanking belt 4 with the punch are aligned to two positioning openings on the lower plate 2 of the cutting die respectively, so that the positioning process is completed; then the upper plate 1 of the cutting die moves downwards, the die is closed, as shown in fig. 5, the positioning guide post moves downwards and enters the positioning opening, and meanwhile, the round piece and the connecting piece inside the hollowed-out part obtained by punching the material belt are poked into the positioning opening, and the round piece and the connecting piece are attached to the inner wall of the positioning opening due to the fact that the connecting piece is connected with the main body of the material belt; in the downward punching process, the shape pattern of the product is punched on the material belt to be punched, and the second punching die cutter 6 processes a new hole structure on the material belt to be punched as a positioning hole for positioning in the next punching. After punching is finished, the die is opened, the upper plate 1 of the cutting die moves upwards to return to the die opening position, then the material belt to be punched moves forwards, the wafer and the connecting sheet are pulled out of the positioning opening, and the wafer and the connecting sheet continue to move forwards; the direction of the punched product is shown in fig. 6.
If the subsequent punching direction shown in fig. 6 is found to be unfavorable for the subsequent waste discharge work, the upper plate 1 of the cutting die is rotated 180 degrees, the shape direction of the product is changed, and the subsequent punching processing is performed. After the upper plate 1 of the rotary cutting die, the positions of the first punching die cutter 5 and the second punching die cutter 6 are exchanged, the first punching die cutter 5 processes a hole structure on a material belt with punching, and the second punching die cutter 6 is positioned above the avoidance step and does not act on the material belt with punching any more.
Example 2
The main structure of this embodiment is the same as that of embodiment 1, except that the direction of the punching die provided on the upper plate of the cutting die in this embodiment is different, and the punching die in this embodiment can also punch out the wafer 12 and the connecting strip 13 on the punched material tape, and the tail of the connecting strip 13 remains connected with the main body of the punched material tape 4 without cutting. Unlike the axial direction of the tie bar die cutter 11 in embodiment 1 which is perpendicular to the feeding direction 15 of the material tape 4 to be die-cut, the axial direction of the tie bar die cutter 11 in this embodiment is parallel to the feeding direction 15 of the material tape 4 to be die-cut, and the hole structure die cutters 10 of the first and second hole punching die cutters 5 and 6 are both disposed away from the positioning guide post; the positioning opening 9 in this embodiment is a cylindrical deep groove, as shown in fig. 7.
The overall structure of the wafer and the connector obtained by punching on the material belt 4 to be punched in the cutting die of this embodiment extends along the direction opposite to the feeding direction 15 of the material belt 4 to be punched, when the material belt continues to move forward toward the feeding direction after punching is completed, the wafer and the connecting sheet can return to the hollow structure on the material belt to be punched and spliced into a whole with the material belt, instead of attaching the wafer and the connecting sheet to other positions of the material belt as in embodiment 1, so that the material belt is locally thickened. The cutting die of the embodiment is suitable for processing the material strips of the sheet materials, and the thickness of the sheet materials is strictly ensured in the transportation and subsequent processing processes of the sheet materials, so that local thickening is avoided as much as possible, otherwise, the traction movement of the sheet products can not be completed.
Comparative example
The comparative example is a one-way punching cutting die, the structure of which is shown in fig. 8, a product die cutter 3 and a positioning mechanism are arranged on a cutting die upper plate 1, the positioning mechanism comprises a second punching die cutter 6, a first positioning guide post 7 and a second positioning guide post 8 which are sequentially arranged along the feeding direction 15 of a material belt 4 to be punched at the same interval; the product can be punched only along one direction, so that a product with one direction is obtained, and the punching direction cannot be changed.
The foregoing describes specific embodiments of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the claims without affecting the spirit of the invention.

Claims (7)

1. The etching cutting die with two-way positioning comprises a cutting die upper plate (1) and a cutting die lower plate (2), wherein a product die cutter (3) is arranged on the cutting die upper plate (1), a material belt (4) to be punched is arranged between the cutting die upper plate (1) and the cutting die lower plate (2), and is characterized in that,
The upper cutting die plate (1) is also provided with a positioning mechanism, and the positioning mechanism comprises a first punching die cutter (5), a positioning guide post and a second punching die cutter (6) which are sequentially arranged along the feeding direction (15) of the material strip (4) to be punched at the same interval; a positioning opening (9) matched with the positioning guide post is formed in the lower cutting die plate (2); the lower cutting die plate (2) is provided with an avoidance step (16) at the corresponding position of the first punching die cutter (5); the first punching die cutter (5) or the second punching die cutter (6) punches a hole structure on the material belt (4) to be punched;
In the positioning and punching processes of the material belt (4) to be punched, a hole structure obtained by punching is used as a positioning hole to be aligned with a positioning opening (9) on the lower cutting die plate (2), and a positioning guide post of the upper cutting die plate (1) passes through the positioning hole to enter the positioning opening (9); the second punching die cutter (6) punches a material belt (4) to be punched to obtain a new hole structure;
Two positioning guide posts are arranged in the positioning mechanism, namely a first positioning guide post (7) and a second positioning guide post (8); the first punching die cutter (5), the first positioning guide pillar (7), the second positioning guide pillar (8) and the second punching die cutter (6) are arranged at equal intervals;
The wafer (12) in the hole structure on the material belt (4) to be punched is connected with the main body of the material belt (4) to be punched through a connecting strip (13); the punching die-cutting knife comprises a punching structure die-cutting knife (10) matched with the shape and the size of the punching structure and a connecting strip die-cutting knife (11) matched with the shape and the size of the connecting strip (13); the width of the connecting strip (13) obtained by punching is smaller than the width of the circular sheet (12), and the center of the circular sheet (12) is positioned in the axial direction of the connecting strip (13); and the connection part of the connecting strip and the main body of the material belt (4) to be punched is punched to obtain a widened structure (14).
2. The bidirectionally positioned etching die as claimed in claim 1, wherein the upwardly projecting step height of the relief step (16) is at least 1mm.
3. The bi-directional positioning etching cutting die according to claim 1, wherein the product die-cutting knife (3) has an asymmetric structure with the width direction of the material strip (4) to be die-cut as a symmetry axis.
4. The bi-directional positioned etching die according to claim 1, characterized in that the axial direction of the connecting strip die cutter (11) is perpendicular to the feeding direction (15) of the material strip (4) to be die cut.
5. The bi-directional positioned etching die according to claim 1, characterized in that the axial direction of the connecting strip die cutter (11) is parallel to the feeding direction (15) of the material strip (4) to be die-cut, and that the hole structure die cutters (10) of the first and second punching die cutters (5, 6) are both arranged away from the positioning guide post.
6. The bi-directional positioning etching cutting die according to claim 1, wherein the positioning mechanisms are respectively arranged at two side positions of the upper plate (1) of the cutting die to position two side positions of the material belt (4) to be punched; the product die cutting knife (3) is arranged between the two positioning guide posts.
7. The etching tool according to claim 1, characterized in that the positioning opening (9) is a through hole or a cylindrical deep groove.
CN201911324982.9A 2019-12-20 Etching cutting die with bidirectional positioning function Active CN113000668B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911324982.9A CN113000668B (en) 2019-12-20 Etching cutting die with bidirectional positioning function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911324982.9A CN113000668B (en) 2019-12-20 Etching cutting die with bidirectional positioning function

Publications (2)

Publication Number Publication Date
CN113000668A CN113000668A (en) 2021-06-22
CN113000668B true CN113000668B (en) 2024-07-09

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211757882U (en) * 2019-12-20 2020-10-27 昊佰电子科技(上海)有限公司 Etching cutting die of two-way location

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211757882U (en) * 2019-12-20 2020-10-27 昊佰电子科技(上海)有限公司 Etching cutting die of two-way location

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