CN211757881U - Positioning etching cutting die - Google Patents
Positioning etching cutting die Download PDFInfo
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- CN211757881U CN211757881U CN201922308924.9U CN201922308924U CN211757881U CN 211757881 U CN211757881 U CN 211757881U CN 201922308924 U CN201922308924 U CN 201922308924U CN 211757881 U CN211757881 U CN 211757881U
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- 238000005520 cutting process Methods 0.000 title claims abstract description 129
- 238000005530 etching Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 83
- 238000004080 punching Methods 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000003754 machining Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 16
- 239000002699 waste material Substances 0.000 description 6
- 239000011148 porous material Substances 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 240000007643 Phytolacca americana Species 0.000 description 1
- 235000009074 Phytolacca americana Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Abstract
The utility model relates to a positioning etching cutting die, which comprises a cutting die upper plate and a cutting die lower plate, wherein the cutting die upper plate is provided with a product die cutter, a material belt to be punched is arranged between the cutting die upper plate and the cutting die lower plate, the cutting die upper plate is also provided with a positioning mechanism, and the positioning mechanism comprises a punching die cutter for punching the material belt to be punched to obtain a hole structure and a positioning guide pillar matched with the shape of the hole structure; the lower plate of the cutting die is provided with a positioning opening matched with the positioning guide pillar; in the positioning and punching processes of the material belt to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening on a lower plate of a cutting die, and a positioning guide pillar of an upper plate of the cutting die penetrates through the positioning hole to enter the positioning opening; and the product die-cutting cutters and the punching die-cutting cutters of the upper plate of the cutting die punch the shapes of the products and the new hole structures on the material belt to be punched. Compared with the prior art, the utility model has the advantages of the location is accurate, simple process, machining efficiency is high, the product yield is high, die-cut effect is stable.
Description
Technical Field
The utility model relates to a cutting die especially relates to a location etching cutting die.
Background
For a product which needs to be subjected to die cutting on the material belt and then subjected to slitting, the advancing direction of the product material belt needs to be strictly controlled, otherwise, the distance between products obtained by die cutting is inconsistent, and the precision processing requirement is not met. In order to position the material belt, in the prior art, positioning holes with the same distance are usually machined in the material belt, and the positioning holes are used for positioning the material belt and a product die-cutting rule, so that the machined product is positioned accurately. For example, chinese patent CN 109794990 a discloses a die cutting process with die cutting positioning holes reserved, which is to set the die cutting positioning holes at the beginning of die cutting and always reserve the die cutting positioning holes by cutting during the die cutting process, so as to ensure that the product is always positioned during the processing process and ensure the processing precision of the product. This kind of locate mode need now take and process out the locating hole, and the process is more, is unfavorable for using manpower sparingly material resources, practices thrift the cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a location etching cutting die in order to overcome the defects of inaccurate location and complicated location process existing in the prior art.
The purpose of the utility model can be realized through the following technical scheme:
a positioning etching cutting die comprises a cutting die upper plate and a cutting die lower plate, wherein a product die cutter is arranged on the cutting die upper plate, a material belt to be punched is arranged between the cutting die upper plate and the cutting die lower plate, and a positioning mechanism is also arranged on the cutting die upper plate and comprises a punching die cutter for punching the material belt to be punched to obtain a hole structure and a positioning guide pillar matched with the hole structure in shape; the lower plate of the cutting die is provided with a positioning opening matched with the positioning guide pillar; in the positioning and punching processes of the material belt to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening on the lower plate of the cutting die, and a positioning guide pillar of the upper plate of the cutting die penetrates through the positioning hole to enter the positioning opening; and the product die-cutting cutters and the punching die-cutting cutters of the upper plate of the cutting die punch the shapes of the products and the new hole structures on the material strips to be punched.
The utility model discloses add punching die-cutting rule and location guide pillar on the cutting die upper plate, adopt punching die-cutting rule to obtain a pore structure in waiting that die-cut material area is die-cut earlier on the material area, regard as the locating hole with this pore structure, to the die-cut position in next step in material area fix a position, the location opening of the pore structure alignment cutting die hypoplastron that will most recently die-cut, the location guide pillar and the location open position of cutting die upper plate correspond, consequently, the die-cut position interval on the material area of the product die-cutting rule in the adjacent two die-cut processes keeps unanimous, this interval is actually for punching die-cutting rule and the interval between the location guide pillar.
The wafer in the hole structure on the material belt to be punched is connected with the main body of the material belt to be punched through a connecting strip; the punching die-cutting knife comprises a hole structure die-cutting knife matched with the hole structure in shape and size and a connecting strip die-cutting knife matched with the connecting strip in shape and size.
Because the hole structures obtained by punching and cutting the material belt by the punching and die-cutting tool are only used as positioning structures, the material belt materials (namely wafers) in the hole structures are not required to be discharged as waste materials, and the process is increased because the waste materials in the discharge holes are additionally provided with the process; consequently the utility model discloses a punching die cutter is treating the disk that die-cut material area die-cut does not cut off with the material area main part, but keeps being connected with the material area main part through a connecting strip, and along with advancing of material area, downthehole disk keeps connecting on the material area like this, does not produce the waste material, does not relate to the waste discharge problem, has simplified the process. In the use process, the positioning guide post moves downwards, the wafer in the hole structure on the material belt is poked into the positioning opening, and the wafer and the connecting strip are attached to the inner wall of the positioning opening because the wafer is connected with the material belt main body through the connecting strip; after die cutting is completed, the positioning guide post is withdrawn from the positioning opening, the material belt moves forwards, the wafer is pulled out from the positioning opening, and the wafer moves forwards along with the material belt.
The axial direction of the connecting strip die-cutting knife is parallel to the feeding direction of the material strip to be punched, and the arrangement direction of the hole structure die-cutting knife relative to the connecting strip die-cutting knife is opposite to the feeding direction of the material strip to be punched.
Because the thickness of the sheet material is strictly ensured in the transportation and subsequent processing processes of the sheet material, the direction of the circular sheet obtained by punching relative to the connecting strip is opposite to the feeding direction of the material belt to be punched, and the arrangement is such that when the material belt moves forwards, the circular sheet generated by punching of the punching die cutter and the connecting strip structure can just return to the hollow position on the material belt main body instead of overlapping with the material belt main body, so that the local position on the material belt is thickened, and the next processing is influenced.
The width of the connecting strip die-cutting rule is smaller than that of the hole structure die-cutting rule, and the circle center of the hole structure die-cutting rule is positioned in the axial direction of the connecting strip die-cutting rule
And a widening structure is arranged at the joint of the connecting strip and the main body of the material belt to be punched.
The structure is widened in the setting, can guarantee the stable connection of connecting strip in the material area main part, can not take place to drop with the material area main part, causes the production waste material, influences processing.
The positioning mechanisms are respectively arranged at the two sides of the upper plate of the cutting die to position the two sides of the material belt to be punched; the product die-cutting rule is arranged between the two positioning mechanisms.
The positioning mechanism comprises two positioning guide pillars, and the lower plate of the cutting die is provided with two positioning openings matched with the positioning guide pillars in position; in the positioning process, two hole structures obtained by latest punching are respectively aligned to the two positioning openings.
The positioning opening is a through hole or a cylindrical deep groove.
And the product die-cutting knife is arranged in alignment with the positioning guide pillar along the width direction of the punched material.
Compared with the prior art, the utility model has the advantages of it is following:
(1) in the die cutting process, the cutting die is simultaneously processed with a hole structure to position the punching of the next group of products, so that the distance between two adjacent groups of products is strictly kept consistent, and the positioning precision is high;
(2) the positioning is convenient, the waste discharge of the wafer material in the positioning hole is not needed, the working procedures are reduced, the processing efficiency is improved, and the cost is saved;
(3) the direction of the circular sheet and the connecting strip generated by the punching die-cutting knife is designed to be opposite to the feeding direction of the material belt, and when the material belt advances, the circular sheet and the connecting strip are just recombined with the hollow structure generated by punching, so that the consistency of the thickness of the material belt is ensured;
(4) the utility model discloses a die-cut process stable in quality, the product yield is high.
Drawings
Fig. 1 is a schematic front view of an upper plate of a cutting die in embodiment 1;
FIG. 2 is a schematic right-view structural view of an upper plate of the cutting die in embodiment 1;
fig. 3 is a schematic structural diagram of a material tape obtained by using the cutting die of embodiment 1 in the punching process;
FIG. 4 is a schematic structural view of an upper plate of a cutting die in accordance with embodiment 2;
fig. 5 is a schematic structural diagram of a material tape obtained by using the cutting die of embodiment 2 in the punching process;
FIG. 6 is a schematic structural view of example 2 when the mold is opened;
FIG. 7 is a schematic structural view of embodiment 2 in the mold closed state;
in the figure, 1 is a cutting die upper plate, 2 is a cutting die lower plate, 3 is a product die-cutting rule, 4 is a material belt to be punched, 41 is a product release film, 42 is a product double-sided adhesive tape, 5 is a punching die-cutting rule, 6 is a positioning guide pillar, 7 is a positioning opening, 8 is a wafer, 9 is a connecting strip, 10 is a widening structure, 11 is a feeding direction, and 12 is a hollow structure.
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
Example 1
A positioning etching cutting die comprises a cutting die upper plate 1 and a cutting die lower plate 2, wherein a product die cutter 3 and a positioning mechanism are arranged on the cutting die upper plate 1 as shown in figures 1 and 2, the positioning mechanism comprises a punching die cutter 5 for punching a material strip 4 to be punched to obtain a hole structure and a positioning guide pillar 6 matched with the shape of the hole structure, the number of the positioning guide pillars 6 is two, and the product die cutter 3 is aligned with the positioning guide pillar 6 located in the middle along the width direction of the punched material strip. In this embodiment, the material tape to be punched is composed of a product release film 41 and a product double-sided adhesive tape 42 attached to the product release film, and the positioning etching cutting die can punch hole structures on two sides of the product release film.
In the positioning process, two hole structures obtained by latest punching are respectively aligned to the two positioning openings 7; the two side positions of the cutting die upper plate 1 are respectively provided with a positioning mechanism for positioning the two side positions of the material belt 4 to be punched so as to ensure that the material belt 4 to be punched cannot deviate; the product die-cutting rule 3 is arranged between the two positioning mechanisms. The cutting die lower plate 2 is provided with a positioning opening 7 matched with the positioning guide pillar 6, and the positioning opening 7 is a through hole in the embodiment; the material belt 4 to be punched is arranged between the upper cutting die plate 1 and the lower cutting die plate 2.
In the positioning and punching processes of the material belt 4 to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening 7 on the lower cutting die plate 2, and a positioning guide pillar 6 of the upper cutting die plate 1 penetrates through the positioning hole to enter the positioning opening 7; the product die cutters 3 and the punching die cutters 5 of the cutting die upper plate 1 punch a product shape and a new hole structure on the material strip 4 to be punched. The wafer 8 in the hole structure on the material belt 4 to be punched is connected with the main body of the material belt 4 to be punched through a connecting strip 9; the punching die-cutting cutters 5 comprise hole structure die-cutting cutters matched with the hole structure in shape and size and connecting strip die-cutting cutters matched with the connecting strips 9 in shape and size. Moreover, the axial direction of the connecting strip 9 is parallel to the feed direction 11 of the strip 4 to be die-cut, and the direction of the disc 8 with respect to the connecting strip 9 is opposite to the feed direction 11 of the strip 4 to be die-cut; the width of the connecting strip 9 is smaller than that of the hole structure, and the circle center of the hole structure is positioned in the axial direction of the connecting strip 9; the connection of the connecting strip 9 and the main body of the strip 4 to be die-cut is provided with a widening 10. As shown in fig. 3, the material tape 4 to be processed moves forward along the feeding direction 11, when moving each time, two hole structures located at the leftmost end are just located on the positioning opening 7 of the cutting die lower plate 2, so as to complete accurate positioning and perform die cutting, after die cutting is completed, the material tape 4 to be die-cut continues to move forward along the feeding direction 11, the wafer and the connecting strip generated by die cutting return to the corresponding hollow position of the material tape 4 to be die-cut again, and the wafer and the connecting strip cannot overlap with other parts of the material tape 4 to be die-cut to cause local thickening.
Example 2
The main body structure of the positioning etching cutting die is the same as that of the embodiment 1, and the difference is that the arrangement direction of the punching cutting die arranged on the upper plate of the cutting die is different in the embodiment, the punching cutting die in the embodiment can also punch and cut a wafer 8 and a connecting strip 9 on a strip with punching, and the tail part of the connecting strip 9 is connected with the main body of the strip 4 with punching and is not cut. Instead of the axial direction of the connecting strips 9 being parallel to the tape feed direction 11 with die-cutting in example 1, the axial direction of the connecting strips in this example is perpendicular to the tape feed direction with die-cutting, as shown in fig. 4. The structure is only suitable for products with low requirements on the thickness of the sheet, and even if the local thickness of the sheet is increased, the subsequent processing technology is not influenced. This is because, as shown in fig. 5, as the punched material tape moves forward along the feeding direction, the whole structure formed by the connecting strip 9 and the disc 8 is not in the same straight line perpendicular to the feeding direction 11, so that the disc cannot return to the hole structure of the punched material tape and stick to other positions of the material tape, resulting in local thickening. As shown in fig. 6 and 7, when the die is opened, a hole structure is punched on the material strip 4 to be punched by the punching die cutter, when the die is closed, the positioning guide post 6 pokes the wafer 8 in the hole structure into the positioning opening 7, then the positioning guide post 6 rises, the material strip 4 with punching moves forwards, but because the setting direction of the wafer and the connecting strip is not on the same straight line with the feeding direction, the wafer and the connecting strip are not returned to the hollow structure 12 on the material strip to be punched, and local thickening is caused.
The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by those skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (9)
1. A positioning etching cutting die comprises a cutting die upper plate (1) and a cutting die lower plate (2), wherein a product die-cutting rule (3) is arranged on the cutting die upper plate (1), a material belt (4) to be punched is arranged between the cutting die upper plate (1) and the cutting die lower plate (2), and the positioning etching cutting die is characterized in that,
the cutting die upper plate (1) is also provided with a positioning mechanism, and the positioning mechanism comprises a punching die cutter (5) for punching and cutting the material strip (4) to be punched to obtain a hole structure and a positioning guide pillar (6) matched with the hole structure in shape; a positioning opening (7) matched with the positioning guide post (6) is arranged on the cutting die lower plate (2);
in the positioning and punching process of the material belt (4) to be punched, a punched hole structure is used as a positioning hole to align to a positioning opening (7) on the lower cutting die plate (2), and a positioning guide pillar (6) of the upper cutting die plate (1) penetrates through the positioning hole to enter the positioning opening (7); and the punching die cutter (5) punches a new hole structure on the material belt (4) to be punched.
2. A positioned etching knife die according to claim 1, characterized in that the discs (8) in the hole structure of the strip of material (4) to be punched are connected with the body of the strip of material (4) to be punched by a connecting strip (9); the punching die-cutting rule (5) comprises a hole structure die-cutting rule matched with the hole structure in shape and size and a connecting strip die-cutting rule matched with the connecting strip (9) in shape and size.
3. A positioned etching knife die according to claim 2, characterized in that the axial direction of the connecting strip die cutter is parallel to the feed direction (11) of the strip of material (4) to be blanked, and the arrangement direction of the hole structure die cutter relative to the connecting strip die cutter is opposite to the feed direction (11) of the strip of material (4) to be blanked.
4. The positioning etching cutter die of claim 3, wherein the width of the connecting strip cutting die is smaller than the width of the hole structure cutting die, and the center of the hole structure cutting die is located in the axial direction of the connecting strip cutting die.
5. A positioned etching knife die according to claim 3, characterised in that the connection of the connecting strip (9) to the body of the strip (4) to be punched is provided with a widening (10).
6. The positioning etching cutting die according to claim 1, wherein the positioning mechanisms are respectively arranged at two side positions of the cutting die upper plate (1) to position two side positions of the material belt (4) to be cut; the product die-cutting rule (3) is arranged between the two positioning mechanisms.
7. The positioning etching cutting die according to claim 1, wherein the positioning mechanism comprises two positioning guide pillars (6), and two positioning openings (7) matched with the positioning guide pillars (6) are arranged on the cutting die lower plate (2); in the positioning process, two hole structures obtained by the latest punching are respectively aligned with the two positioning openings (7).
8. A positioning and etching die as claimed in claim 1, characterized in that the positioning opening (7) is a through hole or a cylindrical deep groove.
9. A positioning and etching die as set forth in claim 1, characterized in that the product cutting rule (3) is arranged in alignment with the positioning guide post (6) in the width direction of the punched material web.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922308924.9U CN211757881U (en) | 2019-12-20 | 2019-12-20 | Positioning etching cutting die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922308924.9U CN211757881U (en) | 2019-12-20 | 2019-12-20 | Positioning etching cutting die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211757881U true CN211757881U (en) | 2020-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922308924.9U Active CN211757881U (en) | 2019-12-20 | 2019-12-20 | Positioning etching cutting die |
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| Country | Link |
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| CN (1) | CN211757881U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571533A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Cutting die for discharging small round hole waste |
-
2019
- 2019-12-20 CN CN201922308924.9U patent/CN211757881U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571533A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Cutting die for discharging small round hole waste |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
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| CP03 | Change of name, title or address |