200915609 九、發明說明： 【發明所屬之技術領域】 本發明有關發光二極體支架成 精準定位之射出成形模具，將可配合 私，提前於樹脂基座充填之前，並將=製 電性接腳，埋入樹脂基座内，—體成二刀旱度之 生電性接腳剝離，及固晶過程中^、怠：致發 J程缺失。在本發明的發光二極等= 中，另增散熱接腳設計，隨著發光_ ^ ^ 功率增加，做為散熱或導熱途徑。 —的發光 【先前技術】 環伴發=極，晶粒具有體積+、無汞、 衣保名電、辱期長等優點，且1辛、、田 漸漸取代-般習用：鶴：ί泡： 先燈g專。為了廣為推廣及完全取 处 體不斷的被要求降低製作成：，及 挺问發光效率及可靠度。 —及 Ο 小功率發光二極體1 ◦，其構造 腳“」所示，至少包含樹脂基座15， . 0，及LED晶粒3 〇。晶粒固定於正、 =電”腳的其中之一，並打線連接另一極， 之閉路設計。電性接腳包覆於發光二 】以利於發光二極體錫鋒於電路板 士 ^接通電性。在樹脂基座封裝製程中，一般 =射出固形基座後，再將電性接腳 极二於表面，容易造成（1)接腳剝離2 2 ; (2) 树月曰破損2 4 ; (3)功能區樹脂基座密封剝離2 200915609 ，请參閱「第二圖」所示。接腳剝離2 2缺失， $利於準確固定發光二極體；功能區樹脂基座密 山剝離2 6，在固晶過程中，黏膠會自裂縫中滲 。以上製程排序限制與缺點，此乃歸咎於射出 拉具精度及樹脂流動不易控制等因素。200915609 IX. Description of the invention: [Technical field of the invention] The present invention relates to an injection molding die for accurately positioning a light-emitting diode support, which can be combined with the private, before the resin base is filled, and will be a controllable pin. , embedded in the resin base, the body is formed into a two-knife dryness of the electrical electrical stripping, and in the solid crystal process ^, 怠: the loss of the J process. In the light-emitting diodes and the like of the present invention, the heat-dissipating pin design is additionally provided, and as the power of the light-emitting _ ^ ^ increases, it is used as a heat dissipation or heat conduction path. - Luminescence [Prior Art] Ring accompanied by the pole, the grain has the advantages of volume +, no mercury, clothing insurance name, long humiliation, etc., and 1 Xin, Tian Tian gradually replaced - the common use: Crane: ί bubble: First light g special. In order to be widely promoted and fully taken, it is continuously required to reduce the production:, and to ask for luminous efficiency and reliability. — and Ο Low-power LEDs 1 ◦, the structure of the foot “”, including at least the resin pedestal 15, 0, and the LED die 3 〇. The die is fixed on one of the positive and = electric feet, and the wire is connected to the other pole, and the closed circuit is designed. The electrical pin is covered in the light-emitting diode 2 to facilitate the light-emitting diode tin front in the circuit board Conductivity. In the resin base package process, generally = after the solid base is shot, the electrical pin is placed on the surface, which is easy to cause (1) the strip is peeled off 2 2 ; (2) 4; (3) Functional area resin base seal stripping 2 200915609, please refer to "Second figure". The pin peeling 2 2 is missing, which is good for accurately fixing the light-emitting diode; the functional area resin base is peeled off. 2 6, in the solid crystal process, the glue will seep from the crack. The above process scheduling limitations and shortcomings are due to factors such as the accuracy of the injection puller and the difficulty in controlling the resin flow.
^般高功率之發光二極體，需另植入導熱 ^，增加發光二極體與外界之間快速的熱傳導途 ，二但是，此外加的導熱體植入製程，需額外增 ^ t出樹脂基座製程的複雜性，若能採一體剪 哉、成形，可大幅減少工時、成本。 【發明内容】 發明往習用之發光二極體支架固形方式，本 "°又a十可避免因電性接腳折彎時，造成包覆不 2 = 3明設計重點在於加強射出 的：：模？ΐ;㈣脂流動條件，樹脂基座成ϊ 二極體基ϋ η接：斷面’使之與發光 二極：二以所示^:說明本發明之發光 電性接腳已丄之樹脂射入成形，此時 接續再進Γ:: 一參體的樹脂基座合而為一。 成之發ί線及功能區填充等製程。完 示，上請參閱「第四圖」所 刀之以上尽度的電性接腳2 8，包 200915609 ，於發光二極體樹脂基座内，且其固形密合條 )牛，不严發生前述的（丨〕接腳剝離；⑺樹脂破損，· (3)功能區樹脂基座密封剝離2 6等缺點。 【實施方式】 兹謹，本發a月「發光二極體支架成形法」的 内广，及其所產生的功效，配合圖式，舉出 之較佳實施例詳細說明如下。 茶 請參閱「第五圖」所示，取一適當大小 4二般基材可為銅材，或銀，或銅、 、艮等σ孟體，有較佳之導電及導埶性。 材裁剪為適當形乙包含做為i 電”支架2 i。接續，不同 g 二極體封裝製程，在充填樹脂基座之前， :折電性接腳折成適當之形狀，請： 开】狀ί:」斤不’此時的基材具有高度不-的^High-power LEDs need to be implanted with heat-conducting ^ to increase the rapid thermal conduction between the LEDs and the outside world. However, in addition to the thermal implant implantation process, additional resin is required. The complexity of the pedestal process can greatly reduce man-hours and costs if it can be integrated and cut. SUMMARY OF THE INVENTION Invented to the conventional light-emitting diode bracket solid-shaped method, this " ° and a ten can avoid the bending of the electrical pin, resulting in the coating is not 2 = 3 Ming design focus on strengthening the injection:: mold? (4) Lipid flow conditions, resin susceptor ϊ diode body ϋ η connection: section 'make it and light-emitting diode: two to show ^: Describe the resin of the present invention Into the forming, at this time, continue to advance:: The resin base of one of the components is combined into one. Processes such as the line and functional area filling. At the end of the exhibition, please refer to the "Electrical Pins 2" of the "Fourth Diagram", including 200915609, in the base of the light-emitting diode resin, and its solid-shaped tight strip) cattle, not strict The above-mentioned (丨) pin peeling; (7) resin breakage, (3) functional area resin base seal peeling 26, etc. [Embodiment] Zh, this month, "light emitting diode bracket forming method" The details of the preferred embodiments are as follows. For the tea, please refer to the "fifth figure". Take a suitable size and the base material can be copper. Or silver, or copper, bismuth, etc., have better conductivity and conductivity. The material is cut into a suitable shape, including as an i-electric bracket 2 i. Continuation, different g diode packaging process, in filling Before the resin base, the electric-reducing pin is folded into an appropriate shape, please: Open: ί: "金不不" The substrate at this time has a height not -
掉H，將已裁剪、折彎的基材1 4，嵌入古 具:參:彎;:rr均 形？：完成樹脂基座1 “電：接 二口二树月曰基座1 5 ’包含LED晶粒巴: 〇，及電性接腳2 0，且電性接腳P :丄“ 4 :中，達到-體成形之目的，且外型』J以 =體自基材上切斷分開，最後：：發 3月參閱「第八圖」所示。 σ果， 200915609 發光二極體在發光禍@^ ^ 持續累積於基座内 產生的熱量會 光二極體的永丄”效率，甚至造成發 射出成形製程前^ ，的做法，在樹脂基座 置入射出ΐί二外加植入導熱體的方式， 耵出模具内。本發明設計，請來盥 、 二極體所需的散熱接腳ν8，Λ材 分開的過程中，留下#一柽體自基材上切斷 之功能/ ㈤下政熱接腳，提供散熱及導熱 散熱接腳之發光二極體，若發埶量古 熱對流散熱。相對的，當及：積朽m中進行 '，2多的熱篁需要快速的導熱方式，將埶U 二極體帶走。請參閱「第+円 ^…里自 塊5 5 ，遠接I Γ圖」所不，利用導熱 H ,以妾 極體之散熱接腳2 0，考量勒 能具有電性，所以在散熱塊 ‘、，、接腳2 0之間，提供一電性絕緣層5 4計、。H is removed, and the cut and bent substrate 14 is embedded in the ancient tool: gin: bend; rr uniform? : Complete the resin base 1 "Electric: Connect two two-tree raft base 1 5 ' contains LED die: 〇, and electrical pin 2 0, and electrical pin P: 丄 "4: Medium, For the purpose of body-forming, and the shape of the body is cut off from the substrate by the body, and finally:: See the "Figure 8" in March. σ果, 200915609 Luminous diodes in the luminosity @^ ^ The heat generated in the susceptor continues to accumulate in the eternal efficiency of the photodiode, even causing the formation of the molding process before the ^, the resin base The 入射ί2 is added to the heat-transfer body and is thrown out of the mold. The design of the present invention, please take the heat-dissipating pin ν8 required for the 盥 and the diode, and leave the Λ material in the process of separating the Λ material. The function of cutting off the substrate / (5) The lower heat pin, providing the light-emitting diode of heat dissipation and heat-dissipating heat-dissipating pin, if the heat is convective heat dissipation. Relatively, when: More than 2 enthusiasm requires a fast thermal conduction method, and the 埶U diode is taken away. Please refer to "The +5^,... from the block 5 5, the remote I Γ", use the heat conduction H, the bungee The heat sink pin 20 of the body is considered to have electrical properties, so an electrical insulating layer is provided between the heat sink block ', and the pin 20 .
C 綜上所述，本發明的發光二極體芊成 法，調整基座電性接腳的折彎製程，使得U = 出時一併包覆電性接腳，達到一體成形之目^ 進而使本發明更實用、更符合使用者之 已符合發明專利申請之要件，爰依法提出專利申 請。 惟以上所述者，僅為本發明之發光二極俨 架成形法的實施例而已，當不能以此限定本發^ 實施之範圍；故，凡依本發明申請專利範圍^ 明說明書内容所作之簡單的等效變化與修飾，二 應仍屬本發明專利涵蓋之範圍内。 白 200915609 【圖式簡單說明】 第一圖：係一般發光二極體封裝牟 第二圖：係一般發光二極體支意圖。 卜 意圖。 了凌製裎缺失示 ，二圖：係本發明之發光二極體封裝 — 第七圖 第八圖 第九圖 ^四圖··係本發明之發光二極體支架 |示意圖。 第五圖··係本發明之發光二極體基材辨j $視圖。 第六圖:=之發光二極體基材電 係本發明之發光二極體樹脂基座封裝示 意圖。 係本發明之發光二極體支架封裝完成品 示意圖。 係本發明之另一發光二極體支架封裝完 成品示意圖。 第十圖：係本發明之發光二極體熱導方式示意圖。 【主要元件符號說明】 10 發光二極體 14 ----基材 15 ----樹脂基座 18- 20- 21- 22- 24- 26- 28- -散熱接腳 '電性接腳 -支架 •-接腳剝離 -樹脂破損 --功能區樹脂基座密封剝離 •接腳包覆樹脂深度 3〇 LED 晶 粒 200915609 40--- _ _功能區 50 — --PCB 板 54 —— --電性絕緣層 55 — --導熱塊C In summary, the light-emitting diode forming method of the present invention adjusts the bending process of the pedestal electrical pins so that U=emerges the electrical pins together to achieve the purpose of integral forming. The invention is made more practical and more in line with the requirements of the user who have met the requirements of the invention patent application, and the patent application is filed according to law. However, the above description is only an embodiment of the light-emitting diode truss forming method of the present invention, and the scope of the present invention is not limited thereto. Simple equivalent changes and modifications are still within the scope of the invention. White 200915609 [Simple description of the diagram] The first picture: the general LED package 牟 The second picture: the general illumination diode intention. Bu intention. The present invention is a light-emitting diode package - the seventh figure, the eighth picture, the ninth picture, and the fourth figure, which are the light-emitting diode holders of the present invention. Fig. 5 is a view showing the j$ of the light-emitting diode substrate of the present invention. Fig. 6: Light-emitting diode substrate power of the invention The light-emitting diode resin base package of the present invention is shown. The schematic diagram of the finished package of the LED package of the present invention. A schematic diagram of a finished package of another LED package of the present invention. Fig. 10 is a schematic view showing the thermal conduction mode of the light-emitting diode of the present invention. [Main component symbol description] 10 Light-emitting diode 14 ---- Substrate 15 ---- Resin pedestal 18- 20- 21- 22- 24- 26- 28- - Thermal pin 'Electrical pin - Bracket • - Pin Peel - Resin Damage - Functional Area Resin Base Seal Stripping • Pin Cover Resin Depth 3 〇 LED Die 200915609 40--- _ _ Functional Area 50 — -- PCB Board 54 —— -- Electrical insulation layer 55 — --thermal block