1376042 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種却裝古，土 p 0丨e -衣方去，竹别疋一種發光模组的封裝方 法。 【先前技術】 發光二極體(Llght Emitting Dl〇de，LED)係屬於一種化合物半 導體7L件’其主要以ΠΙ·ν族元素所組成。發光二極體具備驅動電 壓低、壽命長、耗電量低、反應速度快、安全性高（發光二極體 為冷性發光，所產生的熱相對較少）等特性。 <目前的白光發光二極體大多是以料光奶,)晶片或藍光晶片 來與營光粉搭配域的。以具有藍光晶片的白光發光二極體為 例:主要係在藍光“ _圍填統有黃綺光粉的透明膠，利 用^光晶片所發出的藍色絲發藍光晶料圍的黃光螢光粉來產 t黃色光。由於藍光晶片所發出之藍色光有一部分會穿透過混有 :光瑩光粉的透明膠，因此透過藍光晶片所發出的藍色光配合上 更光螢光粉所發出之黃色光，即可形成藍黃混合之二波長的白光。 壓模製程係將發光晶片置入具有混有螢光粉的透明膠的模穴 内後再將模穴加熱以固化透明膠。其中，在製程過程中，昆 於透明膠中的螢光粉會受重力影響而逐漸下沉至模穴底部，而不 疋均勻分布於透明膠内，因此會使所形成的白光發光二極體所發 出的白光均勻度控制不易、良率不佳。 點膠製程係將先行將發光晶片固晶打線於碗杯狀結構的内底 座上’再將混有螢光粉的透明膠注入碗杯狀結構内，最後固化透 1376042 月％其中，於透明膠的固化過程中，混於透明膠中的螢光粉亦 會因重力影響而逐漸下沉至碗杯狀結構底部並部分覆蓋在發光晶 $上，而不是均勻分布於透明膠中。由於發光晶片正面出光強度 丁乂強且至光粉數量較少’而發光晶片側面出絲度較弱且營光粉 數里較多’目此t使卿成的自光發光二歸所發㈣白光偏藍 且有黃暈縣。同時，因為螢光粉部分覆蓋在發光晶片上容易: 為發光晶片的高熱而使得螢光粉的壽命減少。1376042 VI. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention relates to an encapsulation method for a light-emitting module that is equipped with ancient, soil p 0丨e-clothes, and bamboo. [Prior Art] A light-emitting diode (LED) belongs to a compound semiconductor 7L member which is mainly composed of a ΠΙ·ν group element. The light-emitting diode has characteristics such as low driving voltage, long life, low power consumption, high reaction speed, high safety (light-emitting diode is cold light, and relatively little heat is generated). <The current white light-emitting diodes are mostly matched with camping powder for wafers or blue light wafers. Taking a white light emitting diode with a blue light wafer as an example: mainly in the blue light " _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ t yellow light. Since a part of the blue light emitted by the blue light film penetrates through the transparent glue mixed with the light-emitting powder, the blue light emitted by the blue light wafer is combined with the yellow light emitted by the brighter fluorescent powder. The blue-yellow mixed two-wavelength white light can be formed. The molding process is to place the light-emitting wafer into a cavity having a transparent plastic mixed with fluorescent powder, and then heat the cavity to cure the transparent adhesive, wherein during the process. The fluorescent powder in the transparent plastic will gradually sink to the bottom of the cavity under the influence of gravity, and will not be evenly distributed in the transparent plastic, so the uniformity of white light emitted by the formed white light emitting diode will be caused. The control is not easy, and the yield is not good. The dispensing process will firstly bond the luminescent wafer to the inner base of the cup-shaped structure, and then inject the transparent plastic mixed with the fluorescent powder into the cup-shaped structure, and finally cure. 137604 In February, during the curing process of the transparent adhesive, the fluorescent powder mixed in the transparent plastic will gradually sink to the bottom of the cup-shaped structure due to the influence of gravity and partially cover the luminous crystal, instead of being evenly distributed. In the transparent plastic, because the light intensity of the front surface of the light-emitting chip is strong and the amount of the light powder is small, and the side of the light-emitting chip is weaker and the number of the light-emitting powder is more than the number of the light-emitting powder. (4) The white light is bluish and has a yellow halo county. At the same time, because the phosphor powder partially covers the light-emitting wafer, it is easy to: the life of the phosphor powder is reduced for the high heat of the light-emitting chip.
【發明内容】 本發明提供—種發光模組的封裝方法，用以避免無法均勾分 布螢光粉導致卿成的白光發光L修出的自光#度控制 不易且良率不佳的問題。 又工 本發明提供-紐储_縣料，_於具有上模結 發先杈組的封裝方法包含有： 首先，設置螢光伽於上模具具有模穴的表面。 接著，形成膠體於螢光_相對於上模具的另 膠體係覆蓋f光薄顯應於每—該模穴·置。 其中基板 然後，設置基板於膠體相對於螢光薄膜的另—側 具有發光晶片，發光晶片係對應於模穴並接觸膝體。 接著，以上顧與,賴壓合紐、膠體 :膠體硬化並藉膠體而將基板和細膜相互接合而形成:光: 最後，將發賴组自上模具和下模具上脫離 5 前述發光模組被形成後，發光模組在對應每個模穴位置均來 成-個發U件。此發光元件包含了與敎對應的發光 j 體與螢光薄膜。 / 本發明之封裝綠另包含：於螢光_設置於上模具具有模 =的-侧上之步驟後，透過模穴上的通孔進行抽氣，以吸弓丨營光 薄膜接觸於每一模穴的内壁。 在則模組自上模具和下模具脫離之步驟後，更包含 切割發光餘时離發光元件之步驟或再:欠加熱脫離後之發光模 組之步驟。 、 ▲在前述設置螢光_於上模舶步歡前，更包含設置離形 膜於上模具’以使得離職錄上模具絲光薄膜之間。 本4月藉由上述方法，g卩可使每個發光元件都具有厚度一致 的螢光薄膜。由於螢光__螢光粉係均勻分佈，因此，當發 光元件發出光树’即可得_㈣光色，亦敎黃暈現象。I 外藉本發明之方法，亦使得製錄為簡單快速。 有關本發明㈣徵財作，魏合_作最㈣施例詳細說 明如下。 【實施方式】SUMMARY OF THE INVENTION The present invention provides a method for packaging a light-emitting module, in order to avoid the problem that the self-lighting degree control of the white light-emitting L repaired by the white light-emitting L is not easy and the yield is not good. Further, the present invention provides a method for packaging a package having a top mold and a first mold group. First, a fluorescent glazing is provided on the surface of the upper mold having a cavity. Next, a colloid is formed in the phosphor _ with respect to the adhesive system of the upper mold to cover the f-light thinning, which is applied to each of the cavities. Wherein the substrate is then provided with a light-emitting wafer on the other side of the colloid relative to the phosphor film, the light-emitting chip corresponding to the cavity and contacting the knee body. Then, taking the above considerations, the colloid: the colloid is hardened and the substrate and the thin film are joined to each other by the colloid: light: Finally, the smashing group is detached from the upper mold and the lower mold. After being formed, the light-emitting module is formed into a U-piece at a position corresponding to each cavity. The light-emitting element includes a light-emitting body and a fluorescent film corresponding to 敎. / The package green of the present invention further comprises: after the step of arranging the fluorescent film on the side of the upper mold having the mold = side, pumping through the through hole in the cavity, and sucking the bowing light film to contact each The inner wall of the cavity. After the step of detaching the module from the upper mold and the lower mold, the step of cutting the light-emitting time from the light-emitting element or the step of illuminating the light-emitting mold after the heat is removed is further included. ▲ Before the above-mentioned setting of the fluorescent light _ before the upper mold, the step further includes setting the release film on the upper mold ′ to make the separation between the mold and the mercerized film. In the present invention, by the above method, each of the light-emitting elements can have a phosphor film having a uniform thickness. Since the fluorescent __fluorescent powder is evenly distributed, when the light-emitting element emits a light tree, the _ (four) light color is obtained, and the yellow light is also faint. I borrowing the method of the present invention also makes recording as simple and fast. Regarding the invention (4) levy, the Wei He _ the most (four) application details are as follows. [Embodiment]
「第1A圖」、「第1B圖」、「第1C圖」、「第1D圖」、「第1E 圖」第1F圖」與「第1G圖」係為本發明第一實施例之發光模 組的封裝方法的流程示意圖。 &本實施例之發光模組的封裝方法可適用於具有上模具1〇〇與 下核具200之壓模機才冓，其中上模具100的表S 110具有-個以 1376042 上的模穴120。 模穴120係被配置在上模具⑽朝向下模具·的表面ιι〇。 上模具應另具有多個通孔121。通孔ΐ2ι則與模穴⑽呈一對一 配置’並連通模穴12〇。 請參照「第1A圖」，依據本發明發光模組的封裝方法第一實 施例，其首先’係將螢光薄膜2〇設置於上模具⑽具有模穴12〇 的表面no上（步驟一）。接著，請參照「第1B圖」。為使營光薄 膜20能更佳地貼合於膜穴12G的_ 122，因此，在步驟一後可 .以透過模穴⑽上的通孔121抽取模穴12Q内的氣體，螢光薄膜 20被吸附並接觸於每一模穴12〇的内壁122。 、 其中，模穴120的位置可隨模穴12〇的形狀或上模具 設計而變換。 螢光涛膜2〇可包括有透明薄膜U及螢光粉22，螢光粉22 係混合於透明_ 21中。較佳的實施方式為，螢光粉^係 散佈在透明薄助中。請參照「第.1C圖」，於步驟—後，將膠體 30注入於螢光薄膜2〇柏對於上模具⑽的表面2此上，形成腰雕 30於螢光薄㈣相對於上模具⑽的另—表面通（步驟二= 亦即，由於螢光薄膜20受到吸力而使營光薄膜2〇的表面如 觸於模穴12G之内壁122,因此將膠體3G往上模具刚的表面11〇 注入時，會注人於$光_ Μ相對表面施的另-表面逃上。 在注入膠體3〇時，可於對應模穴120中之模穴120的位 持續注入膠體30於螢光薄膜2〇的表面2〇b上。注入膠體 作可持續至膠體3Q擴散至螢光薄膜20的整個表面2Gb且填滿^ 7 1376042 光薄膜20因為模穴120的形狀而形成的凹槽。 其中，上述之膠體30内可具有多個擴散粒子31，以在光嗲、雨 過時具有將光線擴散的效果。 。、 請參照「第1D圖」，於步驟二後，將具有發光晶片％之基板 40設置於膠體30相對於螢光薄膜20的另一側上，的g j F7，將具有 發光晶片50之基板40設置於位於螢光薄膜2〇❸表面咖上的膠 體30上。其中，基板40上具有發光晶片5〇的一側之表面心可 接觸於膠體30’且發光晶片50的位置可對應於模穴12〇的位置（步 前述基板40具有一個以上的發光晶片5〇,且每一發光晶片 5〇設置於基板40的表面41上。其中，每—發光晶片5〇與: 40之間可透過-個以上的接合線6Q連f每—發光晶片％與基 板40之間亦可透過覆晶等方式連接而不需要接合線6〇。每一發光 晶片5〇與其所連接之接合線60的位置可對應於相同的模穴120 或位於相同的模穴12〇中。 前述步驟三中，至少一發光晶片5〇可位於單一模穴12〇中。 此外，亦可係二個以上的發光晶4 5〇同對應同—歡12〇或位於 單一模穴120中。 八中，吸附有螢光薄膜2〇的每一模穴12〇所形成的凹槽深度 可大於發光；50_部與基板4G設置有發光晶片％的表面41 之間的高度，以使模穴12〇容置發光晶片5〇於模穴12〇内。每一 模穴120白勺深度大於吸附有螢光薄膜2〇的每一模穴12〇所形成的 凹槽深度。"1A", "1B", "1C", "1D", "1E", 1F, and "1G" are the illumination modes of the first embodiment of the present invention. Schematic diagram of the group's packaging method. The packaging method of the light-emitting module of the present embodiment can be applied to a molding machine having an upper mold 1 and a lower core 200, wherein the table S 110 of the upper mold 100 has a cavity on the 1374402 120. The cavity 120 is disposed on the surface of the upper mold (10) facing the lower mold. The upper mold should have a plurality of through holes 121. The through hole ΐ 2 ι is in a one-to-one configuration with the cavity (10) and communicates with the cavity 12 〇. Referring to FIG. 1A, according to a first embodiment of a method for packaging a light-emitting module according to the present invention, first, a fluorescent film 2 is disposed on a surface no of the upper mold (10) having a cavity 12〇 (step 1). . Next, please refer to "1B". In order to make the camping film 20 better adhere to the _122 of the film hole 12G, the gas in the cavity 12Q can be extracted through the through hole 121 in the cavity (10) after the step 1, the fluorescent film 20 It is adsorbed and contacts the inner wall 122 of each cavity 12〇. Wherein, the position of the cavity 120 can be changed according to the shape of the cavity 12 or the design of the upper die. The fluorescent film 2 can include a transparent film U and a fluorescent powder 22, and the fluorescent powder 22 is mixed in the transparent _21. In a preferred embodiment, the phosphor powder is dispersed in a transparent thin aid. Please refer to "Fig. 1C". After the step -, the colloid 30 is injected into the fluorescent film 2, and the surface of the upper mold (10) is formed on the surface 2 of the upper mold (10) to form the waist sculpture 30 in the fluorescent thin (four) relative to the upper mold (10). In addition, the surface is turned on (Step 2 = that is, since the surface of the camping film 2 is exposed to the inner wall 122 of the cavity 12G due to the suction of the fluorescent film 20, the colloid 3G is injected into the surface 11 of the upper mold. At the same time, the other side of the surface is applied to the surface of the cavity 120, and the colloid 30 is continuously injected into the phosphor film 2 at the position of the cavity 120 in the corresponding cavity 120. On the surface 2〇b, the colloid is injected as a groove which can be continued until the colloid 3Q diffuses to the entire surface 2Gb of the fluorescent film 20 and fills the surface of the photo film 20 due to the shape of the cavity 120. The colloid 30 may have a plurality of diffusing particles 31 therein to have an effect of diffusing light during the light or rain. Please refer to "1D", and after step 2, the substrate 40 having the light-emitting wafer % is disposed. The colloid 30 will have a hair with respect to the gj F7 on the other side of the fluorescent film 20. The substrate 40 of the wafer 50 is disposed on the colloid 30 on the surface of the phosphor film 2, wherein the surface of the substrate 40 having the side of the light-emitting wafer 5 is in contact with the colloid 30' and the position of the light-emitting wafer 50 Corresponding to the position of the cavity 12 ( (the substrate 40 has more than one luminescent wafer 5 步, and each luminescent wafer 5 〇 is disposed on the surface 41 of the substrate 40. wherein each luminescent wafer 5 〇: 40 Between each of the illuminating wafers and the substrate 40, the illuminating wafers and the substrate 40 can be connected by flip chip or the like without the bonding wires 6 〇. The position of the line 60 may correspond to the same cavity 120 or be located in the same cavity 12〇. In the foregoing step 3, at least one of the light-emitting chips 5〇 may be located in a single cavity 12〇. The illuminating crystal 4 5 〇 corresponds to the same - Huan 12 〇 or located in a single cavity 120. In the eighth, each cavity 12 吸附 adsorbed with a fluorescent film 2 〇 can form a groove depth greater than the illuminating; 50_ Between the portion and the substrate 4G provided with the surface 41 of the luminescent wafer % Degrees, so that the cavity 12 accommodates the luminescent wafer 5 in the cavity 12 。. The depth of each cavity 120 is greater than the depth of the groove formed by each cavity 12 吸附 to which the fluorescent film 2 吸附 is adsorbed .
0U4Z 終照丨第1E圖」，於步驟三後，利用上模具與下模呈 ==基极膠體3Q和螢光_Q。基板4〇、膠㈣和 二二、Μ被上模具⑽與下模具壓合加織’會歸體30 域基板4G和查光_ 2G相互接合而形成發光模組70 (步驟四）。 此處熱壓麵形成之發光· 7()請配合「第π圖」閱覽之。 =板組㈣應每個模穴⑶位置具有—個發細牛？！。因此， 母發光兀件71包含有與模穴12〇對應的基 =、膠體3。與營光薄膜⑽。營光薄膜2。位於發光： 的出光面位置且混合有多個螢光粉22。 請倾「第1F圖」，於步驟四後，龜模具⑽和下模且 驟^離，减發域組7Q自上模具靡和下赌上脫（步 體30 ^ .由於為了提升製程速度，於步驟四熱塵合基板40、膠 於上束3賴Μ時，並未麵合直至膠體％完全·，而是 再五由上模具_和下模具上脫離發光模組70後， 是叙發絲組7G直至賴3G 。也就 化仏/，其_合的温度與時間縣讓频30完全固· 化’僅使膠體30 _顧化效果後，即可執行步驟五。 發光=「第m圖」，於步驟五後，另可進行下一步驟，以將 分離上分離。步驟六為切割細㈣以 藉由上述本發明之封裝方法，即可使得每個發光元件π具有 厚度均勻的;、|y 可通過相等2G。如此—來，發光糾71所發出之先線即 果，進而得2Q ’ 光粉22數光效 在前=枝色溫，並減少產生黃暈現象。 步驟(方法）Γ驟之w’本發邮可包含「提供#光_2〇」之 粉22。接^ H dB_與螢光 1中，、秀_ ，、有螢光粉22的透明勝體以形成螢光薄膜20。 以形成i明^村質可為透明樹脂等’透明膠體於受熱後固化 法本發明另可包含「提供基板」之蝴方 Μ Θ」提供基板的方法包括：設置至少—發光晶 接至Λ、板4G上（步驟Α);以及利用至少—接合線60雷性^ 接至少一發来曰-「王遇 日日片：>0和基威40 (步驟B )。 膜發光模組的封裝方法藉由將先行製作好的螢光薄 、八120内壁122’再注入膠體30於膜穴120内。然 後，將先行固晶打線完的基板4〇 …、 mm ^ ^ ”有各先日日片50的一側接觸 二一 # ’㈣上模具⑽與下模具的爐合後，會於 ::膜請内形成一發光元件71。將基板4〇脫離上模具⑽ 。下松具200後’赠基㈣上會財至少—發光元件η，且營 光薄膜20位於每一發光元件71的出光面上。 「第3A圖」、「第3B圖」、「第3C圖」、「第3〇圖」、「第3£ 圖」、「第3F圖」與「第3G圖」係為本發明第二實施例之發光模 組的封裝方法的流程示意圖。 請參照「第从圖」〜「第犴圖 於此實施例，螢光薄膜 11 ^，並合併參照前述實施例。 與黏者層24。其中，私 D有透月缚膜21、多個螢光粉22 個螢光粉22可藉由袭^ 24位於透明薄膜21的表面上，且多 提供營光面上。 明镩膣、 的方法可包括：首先，π』★ — a 片膜21的表面上。 先形成黏者層24於透 以致於多個鸯_藉二 本實施例之封裝方法利用榮θ 於透明薄膜以的表面上。 分布於發光元件7 叶膜20使多個螢光粉22均勻 提高螢光粉22的使用妄i、可避免螢光粉22受熱衰減並以 「第4ΑΓ 同日村提轉程速度。0U4Z 丨 丨 1E picture", after step 3, using the upper mold and the lower mold = = base gel 3Q and fluorescent _Q. The substrate 4, the glue (4) and the second and second sides are pressed and woven by the upper mold (10) and the lower mold, and the substrate 30G and the light _ 2G are joined to each other to form the light-emitting module 70 (step 4). Here, the light-emitting surface is formed by the light-emitting surface. 7() Please read it in accordance with the "Phase π". = plate group (four) should have a hairy cow in each cavity (3) position? ! . Therefore, the mother light-emitting element 71 includes a base = colloid 3 corresponding to the cavity 12A. With the camp light film (10). Camp light film 2. Located at the illuminating surface position of the illuminating: and mixed with a plurality of phosphors 22. Please pour "F1F". After step 4, the turtle mold (10) and the lower mold are separated, and the sub-group 7Q is removed from the upper mold and the next gambling is off (step body 30 ^. Since in order to improve the process speed, In the fourth step, the hot-dusting substrate 40 and the glue are applied to the upper bundle 3, and the surface is not covered until the colloid % is completely, but after being separated from the upper mold _ and the lower mold by the light-emitting module 70, it is Silk group 7G up to Lai 3G. It is also 仏 /, the temperature of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the following step, the next step may be further performed to separate the separation. Step 6 is to cut the fine (4) to make each of the light-emitting elements π have a uniform thickness by the above-described packaging method of the present invention; , | y can pass equal 2G. So - to, the first line issued by the illuminating correction 71 is the result, and then get 2Q 'light powder 22 light effect in front = branch color temperature, and reduce the occurrence of yellow halo. Step (method) The e-mail of this step can contain the powder of "provide #光_2〇". Connected to H dB_ and fluorescent 1 , , show _ , and have fire The transparent body of the powder 22 is formed to form the fluorescent film 20. The transparent film of the transparent resin or the like can be formed into a transparent film. The present invention can also include a substrate for providing a substrate. The method comprises: setting at least - illuminating the galvanic connection to the rafter, the plate 4G (step Α); and using at least the bonding wire 60 to connect at least one of the ridges to the ridge - "Wang Yuri Japanese Film: > 0 and威40 (Step B). The packaging method of the film light-emitting module is re-injected into the film cavity 120 by the pre-formed fluorescent thin, eight 120 inner wall 122'. 4〇..., mm ^ ^ "There is a side of each of the first Japanese wafers 50 contacting the two ones. ' (4) After the upper mold (10) is combined with the lower mold, a light-emitting element 71 is formed in the film: 〇 〇 上 上 上 上 上 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下"3C", "3rd", "3rd", "3F" and "3G" A schematic flow chart of a method for packaging a light-emitting module according to a second embodiment. Please refer to "the following figures" to "the first embodiment of the present invention, the fluorescent film 11^, and refer to the foregoing embodiment in combination with the adhesive layer. 24. Among them, the private D has a translucent film 21, and a plurality of phosphor powders 22 phosphors 22 can be located on the surface of the transparent film 21 by the attack 24, and are provided on the camping surface. The method may include: firstly, on the surface of the film 21. The adhesive layer 24 is formed so as to be transparent so that the package method of the present embodiment utilizes the surface of the transparent film. Distributed on the light-emitting element 7 The leaf film 20 causes the plurality of phosphor powders 22 to uniformly increase the use of the phosphor powder 22, and the fluorescent powder 22 can be prevented from being thermally attenuated and "the fourth day of the same day.
弟Α圖」、「第4Β圖」、「第4C f」、「第，」與「⑽圖」:為 組的封裝方法的流程圖。 發光模 請參照「第4A网 r # 其中，於步驟一之前弟4_^二’並合併參照前述實施例。 螢光_ 20之間。_之^ ―離形膜80於上模具爾 於上模具觸具有模穴^^驟—之前可先行設置離形膜如 光_20於離形膜8〇相對於上模具1〇〇的表面上。叹置虫 二膜::用1避免_螢光薄_穴内固化後 曰黏附於杈穴内，而無法脫離。 請參照「第4A圖」，首先，將離形膜80與螢光薄膜20設置 具具有模穴12G的—側的表面⑽上。接著，請參照 弟4B圖」’當經由通孔]21抽取模穴12〇内的氣體後，會使離 11 1376042 形膜80與螢光薄膜20吸附於每—模穴i2〇的内 80接觸於每一模穴12〇的内壁122。此時，螢光^膜離形膜 形膜80相對上模具1〇0的表面。 ‘貼附於離 在本實施例中發光模組的封裝方法同樣可 此步驟之前，將膠體3〇與多個擴散粒子Μ混合。:此步驟或 请茶照「第4C圖」’然後’將膠體3〇注入於第圖」） 對於上模具κκ)的表面20b上。亦即，由於營光薄H㈣相 奶受到吸力而使離形膜δ0接觸於模穴12〇之内壁η、離形膜 膜20貼附於離形膜8〇相對上模 且螢光薄 上模請絲㈣叫=:= = =膠體师 Ϊ00的表面20b上。 、相對上模具 在注入膠體30時，可於對顧穴m 的位置來持續注入膠體3〇於營光薄膜20的表面模穴-體30的動作可持續踢㈣擴散至螢光_ =注入膠 ^螢U 20因為模穴12〇的形狀而形成的凹槽。 參照「第4D圖」，接著，將具有發光晶片5〇 ^某板40* 片置對於紅賴20的_側上，亦即，將具有發光: 板心置於位於螢光薄膜2g的表面獅上的膠體3〇 上。其中，基板40上具有發光晶片5〇的一側之 雖、體二〇 ’且發光晶片50的位置可對應於模穴120、的位置。、 發/曰、t 一發光晶片50可位於至少-模穴120中，亦即， 、、片50可單獨對應單一模穴12〇或單獨位於單一模穴η。 ，發光晶片50亦可係二個以上一同對應單一模穴12〇或位於單 1376042 ' 一模穴120中。 . 每一發光晶片50與其所連接之接合線60的位置可對應於相 ' 同的模穴120或位於相同的模穴120中。 • 其中，吸附有離形膜8〇與螢光薄膜20的每一模穴12〇所形 成的凹槽深度可大於發光晶# 50的頂部與基板4〇設置有發光晶 =的表面41之間的高度’用以容置發光晶片5〇於模穴内。 :一模穴120❾深度大於吸附有離形膜8〇與螢光薄膜2〇的每一 模穴120所形成的凹槽深度。 • 3請參照「第4E圖」’然後，利用上模具100與下模具朋熱 壓合基板40、膠體30、螢光薄膜2〇與離形膜8〇。基板4〇、膠體 3〇和螢光義20被上模具·與下模具2_合加熱後，會使膠 體30觉熱誕且絲板40和f光_ 2G被接合而形成發光模 組 70。 、 其中，發光模組70具有發光元件7;1，且每一發光元件7ι可 一對一對應於每一模穴12〇。 •、胃“、、第4FSI」’接著’將上模具1GG和下模具200分離， 並由上模具100和下模具上脫離形成之發光模組％。其中， 發槪组70具有發光元件71的一側的表面上具有營光薄膜2〇。 此日r離形膜80仍貼附並接觸於每—模幻2〇的内壁122。 其中，由於為了提昇製程速度，於步驟四錢合基板4〇、膠 .肢30和螢光薄膜料，並未熱壓合直至膠體30完全固化，而是 .2述轉五由上模具⑽和下模具· 發綠组7〇後， 再仃加熱脫離後之發光模組7〇直至谬體3〇固化。 13 ，參照「第4G圖」’最後’若欲由發細組7G來得到更小的 發先早兀，可切割發光模組70以分離出每一發光元件71。此 件71包含有基板4〇、發^晶片％、接合線、膠體％與 :=ΓΓ ’朦體30混合有多個擴散粒子31。細膜 、，光7L件71的出絲位置且混合有多個螢光粉22。 本實關之發絲_封裝方法藉由將先行製作好的離形膜 ^置於膜穴m内壁！22 ’並於離形賴相對上模具⑽的表 面。又置有f光薄膜2〇 ’再注人賴3()於敎⑽内。然後，將先"Different map", "4th map", "4C f", "第," and "(10)图" are flowcharts of the package method of the group. For the illuminating mode, please refer to "4A network r # 其中 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Before the touch has a cavity, it can be set before the release film such as light _20 on the surface of the release film 8 〇 relative to the upper mold 1 叹 叹 二 二 : : : : : : : : : : : : : : 萤 萤 萤 萤 萤 萤After the solidification in the cavity, the crucible adheres to the crucible and cannot be separated. Referring to "Fig. 4A", first, the release film 80 and the fluorescent film 20 are placed on the surface (10) having the cavity 12G side. Next, please refer to the 4B figure "When the gas in the cavity 12 is extracted through the through hole 21", the film 13 from the 11 1376042 film and the fluorescent film 20 are adsorbed in the inner cavity 80 of each cavity i2. The inner wall 122 of each cavity 12 。. At this time, the fluorescent film release film 80 is opposed to the surface of the upper mold 1〇0. The glue 3 is mixed with a plurality of diffusion particles 之前 before the step of attaching the light-emitting module in the embodiment. : In this step, please take a photo of "Cth 4C" and then "Inject the colloid 3" onto the surface 20b of the upper mold κκ). That is, since the camping thin H (four) phase milk is subjected to suction, the release film δ0 is in contact with the inner wall η of the cavity 12〇, and the release film 20 is attached to the release film 8〇 opposite the upper mold and the fluorescent thin upper mold Please wire (4) called =:= = = on the surface 20b of the colloid Ϊ00. When the upper mold is injected into the colloid 30, the colloid 3 can be continuously injected at the position of the cavity m. The action of the cavity-body 30 on the surface of the camping film 20 can be continued (4) diffusion to the fluorescent _ = injection glue ^Fluor U 20 is a groove formed by the shape of the cavity 12〇. Referring to "4D", next, a sheet 40* having a light-emitting chip is placed on the side of the red sheet 20, that is, it will have light: the core is placed on the surface of the fluorescent film 2g. The upper colloid is on top of it. The substrate 40 has a body 〇' on the side of the luminescent wafer 5, and the position of the luminescent wafer 50 corresponds to the position of the cavity 120. The illuminating wafer 50 may be located in at least the cavity 120, that is, the sheet 50 may correspond to a single cavity 12 单独 alone or in a single cavity η. The illuminating wafer 50 may also be two or more corresponding to a single cavity 12 〇 or located in a single hole 1312042. The position of each of the illuminating wafers 50 to which the bonding wires 60 are attached may correspond to the same cavity 120 or be located in the same cavity 120. • wherein the depth of the groove formed by adsorbing the release film 8〇 and each cavity 12〇 of the fluorescent film 20 may be greater than between the top of the light-emitting crystal #50 and the surface 41 of the substrate 4 provided with the light-emitting crystal= The height 'is used to accommodate the luminescent wafer 5 in the cavity. The depth of a cavity 120 ❾ is greater than the depth of the groove formed by each cavity 120 to which the release film 8 吸附 and the fluorescent film 2 吸附 are adsorbed. • 3 Refer to “4E”. Then, the upper mold 100 and the lower mold are used to press-bond the substrate 40, the colloid 30, the fluorescent film 2〇, and the release film 8〇. After the substrate 4, the colloid 3, and the fluorescent element 20 are heated by the upper mold and the lower mold 2, the glue 30 is heated and the core plate 40 and the f light _ 2G are joined to form the light-emitting mold 70. The light emitting module 70 has the light emitting elements 7; 1, and each of the light emitting elements 7ι can correspond to each of the cavity 12's in a one-to-one manner. • The stomach ", 4FSI" is then 'separated' from the upper mold 1GG and the lower mold 200, and the light-emitting module % formed by the upper mold 100 and the lower mold is separated. Among them, the hairpin group 70 has a light-emitting film 2 on the surface of one side of the light-emitting element 71. On this day, the r-shaped film 80 is still attached and contacts the inner wall 122 of each phantom. Among them, in order to increase the process speed, in step 4, the substrate 4, the glue, the limb 30 and the fluorescent film material are not thermocompressed until the colloid 30 is completely cured, but the second is replaced by the upper mold (10) and After the lower mold and the green group are 7 ,, the illuminating module 7 is heated and detached until the 谬 3 〇 is solidified. 13 . Referring to the "4G map" 'last', if the thinner set 7G is to be used to obtain a smaller initial sound, the light-emitting module 70 can be cut to separate each of the light-emitting elements 71. This member 71 includes a substrate 4, a wafer %, a bonding wire, a colloid %, and a := 朦 朦 body 30 in which a plurality of diffusion particles 31 are mixed. The fine film and the light output position of the light 7L member 71 are mixed with a plurality of phosphor powders 22. The hair of the actual closure _ packaging method by placing the pre-made release film ^ on the inner wall of the membrane cavity m! 22 ‘and the shape of the mold (10). In addition, a f-light film 2 〇 ' is placed again in the 敎 (10). Then, will
订口日日打線凡的基板40中具有發光晶片5〇的一側接觸膠體％。 接著’經過上模具⑽與下模具的賴合後，會於每一膜穴 120 71〇^^40 後二此時基板4〇上會射至少—發光元㈣，且#光馳2〇位 於母-發光元件71的出光面上。離形膜8〇用以避免發光模組凡 脫離時，不會因為表面黏著等而使得脫離不易。 本實施例之封裝方法利用螢光薄膜20使多個螢光粉22均勻The side of the substrate 40 having the order of the light-emitting wafer 5 is contacted with the colloid %. Then, after passing through the upper mold (10) and the lower mold, it will be at each film hole 120 71〇^^40. At this time, at least the light-emitting element (4) will be emitted on the substrate 4〇, and #光驰2〇 is located at the mother. a light-emitting surface of the light-emitting element 71. The release film 8 〇 is used to prevent the illuminating module from being detached, and it is not easy to detach due to surface adhesion or the like. The packaging method of this embodiment utilizes the fluorescent film 20 to uniformize the plurality of phosphors 22
分=於發光元件71的出光表面’可避免螢光粉22受熱衰減並以 提向榮光粉22的使用壽命，同時可提高製程速度。 ^發明所揭露之發絲_封裝方法，藉由將先行製作好的 ，光薄膜設置於膜穴内壁’當於膜穴内注人膠體後置人固晶打線 完的基板以接觸谬體’經由紐合後使基板、膠體、勞光薄膜相 互接合以形成具有至少—發光元件的發紐組且螢光薄膜位於每 -發光兀件的出光面上。於此，利用螢光薄膜使多個螢絲均勻 分布於發光tl件的出光表面，可避免螢絲受熱衰減並以提高營 14 光粉的使用壽命，同時可提高製程速度。 定Ί 之較佳實施觸露如上 疋特明，任何熟習相 '，、、其叫^限 内，當可作麵之❻ 了 ’在不祕本翻之精神和範圍 才兄月揭社申請專利範 m知園項視 【圖式簡單說明】 ，、考馮， 第1A-1G11係為本 程示意圖； ^ 貫施例之發光模組的封裝方、、4 7 π流 ^圖係為本發明之基板固晶打線流程圖； 程圖；叹G 本㈣第二實補之發絲_塊方法流 程圖 錢、4〇圖係為本發明第三實施例之發光模組的封裝方法流 【主要元件符號說明】 20.·.· 2〇a... 20b.. 21.... 22 ...., 24.. ... 30. ..... 31.. ·.. 4〇 .··.. ··••螢光薄膜 ··*.表面 ··*.表面 ··..透明薄臈 _·••螢光粉 _...难占者層 •••膠體 ···擴散粒子 ··.基板 1376042 41.........................表面 50.........................發光晶片 60.........................接合線 70 .........................發光模組 71 .........................發光元件 80.........................離形膜 100.......................上模具 200.......................下模具 110.......................表面 _ 120 .......................膜穴 121 .......................通孔 122 .......................内壁 16The light-emitting surface of the light-emitting element 71 prevents the phosphor powder 22 from being thermally attenuated and promotes the life of the glazing powder 22, while increasing the processing speed. The hairline_encapsulation method disclosed in the invention, by placing a light film which is prepared in advance, is disposed on the inner wall of the film cavity, and when the colloid is injected into the film cavity, the substrate is fixed by the solid crystal to contact the carcass. After the bonding, the substrate, the colloid, and the glazing film are bonded to each other to form a wicking group having at least a luminescent element, and the fluorescent film is located on the illuminating surface of each illuminating element. Herein, the fluorescent film is used to uniformly distribute the plurality of filaments on the light-emitting surface of the light-emitting tl member, thereby preventing the filament from being thermally attenuated and improving the service life of the battalion powder, and at the same time, increasing the processing speed. The preferred implementation of Dingxiang is as special as the above, and any familiarity with the ',,,,, and the inside of the limit, when it can be used as a face, 'in the spirit of the secret and the scope of the brothers to apply for a patent Fan m Zhiyuan item view [simple description of the diagram], Kao Feng, 1A-1G11 is the schematic diagram of this process; ^ The encapsulation side of the illumination module of the application example, and the 4 7 π flow ^ diagram is the invention The substrate solid crystal wiring flow chart; Cheng Tu; sing G This (four) second real complement hairline _ block method flow chart money, 4 〇 diagram is the third embodiment of the invention of the light-emitting module packaging method flow [main Description of component symbols] 20.··· 2〇a... 20b.. 21.... 22 ...., 24.. ... 30. ..... 31.. ·.. 4〇 .···.•Fluorescent film··*.Surface··*.Surface···.Transparent thin 臈··••Fluorescent powder _...Difficult occupant layer•••colloid·· ·Diffusion particles··.substrate 1376042 41........................ Surface 50.............. ...........luminescent wafer 60.........................bonding wire 70 ........ .................Lighting module 71.........................Lighting element 80. ............... .........Folding film 100....................... Upper mold 200........... ............ Lower mold 110....................... Surface _ 120 ......... ..............membrane 121 .......................through hole 122 ....... ................ inner wall 16