200834998 26662pif.doc 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種發光二極體封裝（light emitting di〇f package)，且更特定言之，是關於一種清楚地移除習 知遺留於封裝本體（package body )之表面上之導線架Gead frame)之殘留物部分的發光二極體封裝，以秦 光二極體封裝之方法。 衣化每 【先前技術】 源:^二發光二極體_封裝包括LED、用於將電 '、也口牙過其中之LED的導線架，以及用於 且限制led之安裝空間的封裝本體。 ¥、、泉木 線架2縣’首先製備具有導線架部分之導 ^ π十例如，藉由樹脂成型（resin molding)來 f 繞導_卩件之物嫩本體，且接文ίΐ: 且=所f形狀使其彎曲。此時，在製造LED封裝t ί 一起存在於在朗物部分連同導線^部 然而，因為在先^4 1後’切割並移除殘留物部分。 體後破切叫6為在尤則技術中殘留物部分是在形成封穿太 可至封裝本體之外部，t 題，可切割殘留物部八以有平滑形狀。為了解決此問 同的平面上。^ I、讀在與封裝本體之表面相 可能的。即使意 匕男、際上在製造極小LED封裝中為不 免地突出即使其可能，在-定程度上殘留物部分亦4: 7 200834998 26662pif.doc 【發明内容】 .【技術問題】 因此，本發明之目標為提供一種製造藉由允許導線架 之殘留物部分不突出至封裝本體之外部而具有平滑形狀之 ^ LED封裝的方法。 本發明之另一目標為提供一種藉由允許導線架之殘留 物部分不突出至封裝本體之外部而具有平滑形狀之LED 封裝。 【技術解決方案】 根據本發明之態樣，提供一種製造LED封裝之方法， 其包括以下步驟：製備具有導線架部分以及共同提供之用 於支撐導線架部分之殘留物部分的導線架部件；以及形成 環繞導線架部件之部分以支撐導線架部分的封裝本體，其 中在形成封裝本體前，在封裝本體之輪廓内部的任意位置 處預先切割殘留物部分。 根據本發明之另一態樣，提供一種製造LED封裝之方 • 法，其包括以下步驟：製備具有導線架部分以及共同提供 之用於支撐導線架部分之殘留物部分的導線架部件；以及 形成樣繞導線架部件之部分以支撐導線架部分的封裝本 體，其中在形成封裝本體前，在封裝本體之輪廓内部的任 意位置處預先且部分地切割殘留物部分。此時，此方法可 - 更包括藉由在形成封裝本體後施加衝擊而移除在形成封裝 • 本體前經部分地切割之殘留物部分的步驟。另外，可藉由 在殘留物部分中形成V形切割凹槽來執行部分切割步驟。 8 200834998 26662pif.doc 較佳藉由樹脂成型來形成封裝本體。較佳製備導線架 部件以具有多個導線架部分。 根據本發明之又一態樣，提供一種LED封裝，其包 括：經提供以將電源施加至LED之導線架，導線架共同具 有待切割之殘留物部分以及導線；以及環繞導線架之部分 以支撐導線架的封裝本體，其中導線延伸以穿過封裝本體 之輪廓，且殘留物部分定位於輪廓之内部。 【有利效應】 根據本發明之實施例，L E D封裝藉由允許導線架之殘 留物部分不突出至封裝本體之外部而具有平滑形狀。另 外，因為在形成封裝本體前，殘留物部分加固並支撐導線 架之主要部分，所以在過程中可防止導線架之不良變形。 【實施方式】 【最佳模式】 下文將參看隨附圖式來詳細描述本發明之較佳實施 例。 圖1為根據本發明之實施例之LED封裝的透視圖，其 中將為LED封裝之主要特徵的部分展示為放大圖。參看圖 1，根據本發明之實施例的LED封裝1具有安裝LED 2之 結構，且包括封裝本體10、導線架20、透鏡30、散熱片 (heat sink) 40以及其類似物。 導線架20包括多個内部導線22 (在此圖中僅展示内 部導線中之一者）以及整體連接至多個内部導線22之多個 外部導線24。外部導線24自封裝本體10之内部延伸至外 9 200834998 26662pii.doc 轲衮本體10 邛且言曲以定位於封裝本體10之底表面上〜π，肢 支撐導線架20，同時環繞導線架20之部分（特定言之， 癸 内部導線22)，且用於安裝LED 2之開口形成於封裝本體 10之上部部分中。 在此實施例中，用於促進LED 2散熱之棒條（亦即， 散熱片40)安裝於封裝本體1〇中。散熱片4〇具有附著 LED 2之上部部分以及經由封裝本體1〇之底部開口暴露 φ 至封裝本體10之外部的下部部分。散熱片40上2LED 2 由接線（bonding wire ) 3連接至内部導線22，且因此1^1) 2可接收經由導線架20自外部施加之電流。儘管散熱片用 =此實施例中，但不具有散熱片之LED封裝亦在本發明之 範鱗内。當省略散熱片時，可將LEr)附著於内部導線中之 任一者上。 透鏡30形狀開σ (其軸於縣核iq之上部部 刀上）内以保護LED2,且通常藉由樹脂成型 ^時所因為透鏡3G在較小程度上與本發“ » W，所以將省略對其之詳細描述。 斯申直接相 於斜ίίΓ之放大圖，具有粗略矩形橫戴面之孔 於封衣本體10之側輪廓上。另外， 艾孔形成 線架20之部分（亦即，導線架 ==2内存在導 固導線架20之主要部分的部分。在中月 部分地切割殘留物部分26，且接 1对裝本體10前 後所施加之轉進行完全_。因本 留物部分26為在製造LED封裝，:物部分26)。殘 固導線架20之主要部分的部公 从中用於支撐或加 體10 26定位於 10 200834998 26662pif.doc ⑺邵），所以 孔12之内部（亦即，封裝本體ι〇之御輜 封裝本體10可具有平滑表面。 下文將參看圖2至圖5來描述製造LED封袈 f6中自封裝本體1G之表面移除導_烈之殘留物部分 圖2為部分展示用於形成上述導線架如 的透涵。參相2，導線架部件糊^架部件 材f諸如銅）製成，且整體地具有構成上述)金屬 見圖D之組件的内部導線22以及外部2〇(參 線架部件2⑻整體地具有㈣战上述散^4。此外，導 支撐部分2:>。此時，待定位於封裝太體^ 4G之散熱片 諸如内部導線22叹散熱片支撐部分之内部的部分， 2〇〇的連接至外部框架21()之殘留物’由導線架部件 可藉由衝切加工（师ss maehining ^力，或支撐。 。儘管未詳細說明，但多個導線=導線架部件 線架部件200。此使得能夠同時執行在=佳連接至-導 形成多個封裝本體10之過程。 夕個導線架部分中 在圖2中，待在隨後過程中形成之 廓L由虛線表示。參看圖2之放大圖，:體1〇的侧輪 之切割凹槽262形成於侧輪廓L之:有粗略“V”形 中。因為切割凹槽262存在於封裝本發n殘留物部分26 内部，所以突出至封裝本體1〇之側表之側輪廓L的 可被完全切割且由在形成封裝本體灰的殘留物部分26 於導線架部件200之衝擊移除。因此見圖1)後施加 一、戒本體10可具有 200834998 26662pif.doc 平滑衣面而不具有殘留物部分之突出 圖3展示允許散熱片4〇由導^件 程。在此過程中，可將預先製備 千200支撐之過 多個散熱片支禮部分25 (其為“架部件Z3支樓於 間。此時，很顯然，可在絮；iL 之邛分）之 裝時省略圖3中所示之過^不具讀熱片仙之咖封 圖4展示封裝本體1〇經#、 之部分的狀態。如圖4中所示f 線架部件200 _成型形成以覆蓋導線架部件· (例如）藉由 導線22)、散熱片支撐部分25以 I*、（亦即’内部 的部分。此時，圖2以及圖3中示:j殘留物部分26 於封裝本體10之内部的殘留物部分％ 凹槽2幻形成 在如上文所述形成封裝太體一 線架部件細之外部導線的過程。接^ ^亍切割並彎曲導 於封裝本體10上且藉由成型扑:執仃將LED安裝 封裝本體10之上部部分上的開口 :形::=^於 的過程。若如上文所述完成所有過程，則可^ ζ見圖1) 1，如圖5中所示。 衣w LED封裝 參看圖5,導線架之殘留物部分％ 封裝本體ίο之外部。在此狀況下，若將解=地延伸至 部分26，則切割在封裝本體1〇之内；千^加於殘留物 見圖2以及圖3)的鄭近部分，且因此^^曰262(冬 忉之外部的殘留物部分26。移除在封//夕雕除在封裝本體 殘留物部分26，以使得UED封裝具有平滑之外部的 12 200834998 26662pif.doc 圖6為根據本發明之另一實施 透視圖。袁看圄6菇士卢妗矣-]之¥線木部件200的 _ 6 ’猎由虛線表不’可看到在 (參見圖1)之側輪廓L内部完全切 ；本' 留物邱八^緣木口Η牛200之殘 l 此時，儘f殘留物部分％得以切割，㈣ 由外部導線％整體地形成。因此，如在先前 =例中㈣，有可能在導線架部件上形成封裝本體200834998 26662pif.doc IX. Description of the Invention: [Technical Field] The present invention relates to a light emitting dimmer package, and more particularly to a clear removal of a conventional A light-emitting diode package of a residue portion of a lead frame (Gead frame) left on the surface of a package body, which is packaged by Qinguang diode. Each of the prior art sources includes: an LED, a lead frame for electrically, and an LED for passing the LED, and a package body for and limiting the mounting space of the LED. ¥、、泉木线架2县' Firstly prepare the guide with the lead frame part π10 For example, by resin molding, f is used to wrap the body of the 卩 piece, and the message ΐ: and = The shape of f is curved. At this time, the LED package t ί is present together in the object portion along with the wire portion. However, since the residue portion is cut and removed after the previous film. The post-body break is called 6 in the case where the residue is partially formed outside the package body, and the residue portion 8 can be cut to have a smooth shape. In order to solve this problem on the same plane. ^ I. Reading is possible on the surface of the package body. Even if it is intended to create a very small LED package, it is inevitably prominent even if it is possible, and the residue portion is also 4: 7 200834998 26662pif.doc [Technical Problem] Therefore, the present invention It is an object to provide a method of manufacturing an LED package having a smooth shape by allowing a residue portion of the lead frame not to protrude to the outside of the package body. Another object of the present invention is to provide an LED package having a smooth shape by allowing a residue portion of the lead frame not to protrude to the outside of the package body. [Technical Solution] According to an aspect of the present invention, there is provided a method of manufacturing an LED package, comprising the steps of: preparing a lead frame member having a lead frame portion and a commonly provided residue portion for supporting the lead frame portion; A package body is formed that surrounds a portion of the leadframe member to support the leadframe portion, wherein the residue portion is pre-cut at any location within the contour of the package body prior to forming the package body. According to another aspect of the present invention, there is provided a method of manufacturing an LED package, comprising the steps of: preparing a lead frame member having a lead frame portion and a common portion for supporting a residue portion of the lead frame portion; and forming A portion of the leadframe member is wrapped around the leadframe member to support the leadframe portion, wherein the residue portion is pre- and partially cut at any location within the contour of the package body prior to forming the package body. At this time, the method may further include the step of removing the portion of the residue partially cut before forming the package body by applying an impact after forming the package body. Alternatively, the partial cutting step can be performed by forming a V-shaped cutting groove in the residue portion. 8 200834998 26662pif.doc The package body is preferably formed by resin molding. Preferably, the leadframe component is fabricated to have a plurality of leadframe sections. According to still another aspect of the present invention, an LED package is provided, comprising: a lead frame provided to apply a power source to an LED, the lead frame collectively having a residue portion to be cut and a wire; and a portion surrounding the lead frame to support A package body of the leadframe, wherein the wires extend to pass through the outline of the package body and the residue portion is positioned inside the outline. [Advantageous Effect] According to an embodiment of the present invention, the L E D package has a smooth shape by allowing the residue portion of the lead frame not to protrude to the outside of the package body. In addition, since the residue partially reinforces and supports the main portion of the lead frame before the package body is formed, poor deformation of the lead frame can be prevented in the process. [Embodiment] [Best Mode] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is a perspective view of an LED package in accordance with an embodiment of the present invention, in which portions of the main features of the LED package are shown as enlarged views. Referring to Fig. 1, an LED package 1 according to an embodiment of the present invention has a structure in which an LED 2 is mounted, and includes a package body 10, a lead frame 20, a lens 30, a heat sink 40, and the like. The leadframe 20 includes a plurality of inner conductors 22 (only one of the inner conductors is shown in this figure) and a plurality of outer conductors 24 that are integrally connected to the plurality of inner conductors 22. The outer lead 24 extends from the inside of the package body 10 to the outer body 10 34 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 轲衮 〜 〜 〜 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Part (specifically, the inner wire 22), and an opening for mounting the LED 2 is formed in the upper portion of the package body 10. In this embodiment, the rods (i.e., the heat sinks 40) for promoting heat dissipation of the LEDs 2 are mounted in the package body 1A. The heat sink 4 has a portion to which the upper portion of the LED 2 is attached and a lower portion that exposes φ to the outside of the package body 10 via the bottom opening of the package body 1 . The 2LED 2 on the heat sink 40 is connected to the internal wire 22 by a bonding wire 3, and thus the 1 2) 2 can receive a current applied from the outside via the lead frame 20. Although the heat sink is used in this embodiment, an LED package having no heat sink is also within the scope of the present invention. When the heat sink is omitted, LEr) can be attached to any of the internal wires. The lens 30 is shaped to open σ (the axis of which is on the upper part of the county core iq) to protect the LED 2, and is usually formed by resin molding because the lens 3G is to a lesser extent with the present invention "» W, so it will be omitted. A detailed description of the singularity of the slanting slanting surface, with a roughly rectangular cross-sectional hole on the side profile of the closure body 10. In addition, the E-hole forms part of the wire frame 20 (ie, the wire The frame == 2 is in the portion of the main portion of the lead frame 20. The residue portion 26 is partially cut in the middle month, and the rotation applied before and after the pair of the body 10 is completely _. In order to manufacture the LED package, the object portion 26). The main part of the residual lead frame 20 is used for support or addition 10 26 is positioned at 10 200834998 26662pif.doc (7) Shao), so the inside of the hole 12 (also That is, the encapsulation body 10 of the package body ι can have a smooth surface. Hereinafter, the portion of the residue of the self-package body 1G in the LED package f6 can be removed by referring to FIG. 2 to FIG. The culvert for forming the lead frame as described above is shown in part. The phase conductor 2, the lead frame member paste member member material f such as copper, and integrally has the inner conductor 22 and the outer portion 2 of the assembly of the metal shown in Fig. D (the wire holder member 2 (8) integrally has (4) In addition, the support portion 2: > At this time, the heat sink to be positioned in the package body 4G such as the inner wire 22 sighs the inner portion of the heat sink support portion, 2〇〇 is connected to the outside The residue of the frame 21() can be cut by the lead frame member by a punching process (s. maehining force, or support. Although not described in detail, a plurality of wires = lead frame member wire frame member 200. This enables At the same time, the process of forming a plurality of package bodies 10 at the same time is performed. In the case of the lead frame portion in Fig. 2, the profile L to be formed in the subsequent process is indicated by a broken line. Referring to the enlarged view of Fig. 2, The cutting groove 262 of the side wheel of the body 1 is formed in the side profile L: there is a rough "V" shape. Since the cutting groove 262 exists inside the package portion 26 of the package, it protrudes to the package body 1〇 The side profile L of the side table can be completely cut and The residue portion 26 forming the package body ash is removed from the impact of the lead frame member 200. Therefore, as shown in Fig. 1), the body 10 can have a smooth surface of the 200834998 26662 pif.doc without a residue portion. 3 shows that the heat sink 4 is allowed to be guided by the guide. In this process, a plurality of heat sink support parts 25 (which are "frame parts Z3" in the room can be prepared in advance. Obviously, the state shown in FIG. 3 can be omitted when the package of the floc; iL can be omitted. The state of the package body 1 is shown in FIG. As shown in Fig. 4, the f-wire frame member 200 is formed to cover the lead frame member (for example, by the wire 22), the fin support portion 25 to I*, (i.e., the 'internal portion. 2 and shown in Fig. 3: the residual portion of the j residue portion 26 inside the package body 10 is recessed 2 to form a process of forming a thin external conductor of the package body of the wire as described above. The crucible is cut and bent to be guided onto the package body 10 and is configured to mount the LED on the upper portion of the package body 10 by means of a molding: a process of: shape:: If all processes are completed as described above, Can be seen in Figure 1) 1, as shown in Figure 5. Clothing w LED package Referring to Figure 5, the residue portion of the lead frame is packaged outside the body ίο. In this case, if the solution = ground is extended to the portion 26, the cut is within the package body 1〇; the positive portion of the residue is shown in Fig. 2 and Fig. 3), and thus ^^曰262 ( The residue portion 26 of the outer portion of the winter scorpion. The removal is removed in the package body residue portion 26 so that the UED package has a smooth outer portion. 12 200834998 26662pif.doc FIG. 6 is another according to the present invention. Implementation of the perspective. Yuan see 圄 6 士 妗矣 妗矣 ] ] ] ¥ 线 木 木 木 木 木 木 木 木 木 木 木 木 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎Residue Qiu Ba ^ edge Mukou yak 200 residual l At this point, part of the residual residue is cut, (4) formed by the outer wire %. Therefore, as in the previous = example (four), it is possible in the lead frame parts Forming a package body
f管已用特定實施例描述了本發明，但熟習此項技術 梦=顯而易見可在本發明以及隨附申請專利範圍之範疇内 =其進行各種修改、改變以及變化。因此，上述描述以及 ^附圖式應被理解為不限制本發明之技術精神，而是説明 本發明。 【圖式簡單說明】 圖1為根據本發明之實施例之LED封裝的透視圖。 圖2至圖5為說明用於製造圖1中之LED封裝之方法 的視圖。 圖6為根據本發明之另一實施例之用於LED封裝之導 線架部件的透視圖。 【主要元件符號說明】 1:LED封裝The present invention has been described in terms of a specific embodiment, but it is obvious that it can be variously modified, changed, and changed within the scope of the invention and the scope of the appended claims. Therefore, the above description and the drawings are to be understood as not limiting the technical spirit of the present invention, but rather the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an LED package in accordance with an embodiment of the present invention. 2 to 5 are views for explaining a method for manufacturing the LED package of Fig. 1. Figure 6 is a perspective view of a wireframe component for an LED package in accordance with another embodiment of the present invention. [Main component symbol description] 1: LED package
2 : LED 3 :接線 10 :封裝本體 U :孔 13 200834998 26662pif.doc 20 :導線架 22 :内部導線 24 :外部導線 25 :散熱片支撐部分 26 :殘留物部分 30 :透鏡 40 :散熱片 200 :導線架部件 210 :外部框架 262 :切割凹槽 L :侧輪廓2 : LED 3 : Wiring 10 : Package body U : Hole 13 200834998 26662pif.doc 20 : Lead frame 22 : Internal lead 24 : External lead 25 : Heat sink support portion 26 : Residue portion 30 : Lens 40 : Heat sink 200 : Lead frame component 210: outer frame 262: cutting groove L: side profile