CN207474461U - A kind of flexible filament that chip is laterally set with vacuum suction structure - Google Patents

Abstract

The flexible filament with vacuum suction structure transverse direction setting chip that luminescence chip is fixed in adhesive means, combination degree is high, each section combination is stablized and keeps high pliability is not used the utility model is related to a kind of, advantage is：It is fixed by the way of vacuum suction while avoids that colloid hardens and flexible filament is made to generate hard brittleness in the case of hot environment use for a long time, its pliability is made to decline the problem of even completely losing pliability；The mode of vacuum suction can still keep higher conjugation under certain damaged condition；The step of traditional adhesive means are fixed circuit layer, eliminate gluing in process of production is substituted by the way of vacuum suction, and has saved the waiting viscose glue fully charge cured time, the formation efficiency of flexible filament will be greatly improved；With preferable flexibility and intensity；It damages or damages caused by luminescence chip when dramatically avoiding bending, bending filament.

Description

A kind of flexible filament that chip is laterally set with vacuum suction structure

Technical field

The utility model is related to a kind of LED filament field more particularly to it is a kind of without using adhesive means to luminescence chip into Row fixation, combination degree are high, each section combine stablize and keep high pliability there is vacuum suction structure laterally setting core The flexible filament of piece.

Background technology

Light emitting diode（Light emitting diode）Referred to as LED is by gallium（Ga）, arsenic（As）, phosphorus（P）And nitrogen （N）Made from the compound for waiting elements, it is made of electronics with the principle of visible ray can be given off during hole-recombination.Different elements Compound prepares light emitting diode institute exposure light difference, and such as wherein gallium arsenide diode glows, gallium phosphide diode green light, Silicon carbide diode Yellow light-emitting low temperature, gallium nitride diode blue light-emitting, is subdivided into Organic Light Emitting Diode in terms of chemical property OLED and inorganic light-emitting diode LED.Its basic structure is one piece of electroluminescent chip of semiconductor material, with elargol, admittedly On brilliant tin cream or latex solidified to stent, chip and circuit board then are connected with silver wire or gold thread, then surrounding epoxy resin Sealing is played the role of protecting internal core, finally installs shell, so the anti-seismic performance of usually LED light is very outstanding.LED In terms of the field being related to includes the daily household electrical appliances such as mobile phone, desk lamp, household electrical appliances and machinery production.

LED daylight lamp uses newest LED light source technology, digitisation appearance design, and power saving rate reaches more than 70%, 12W's The exposure intensity of LED daylight lamp can compare the fluorescent tube of 36W, and due to the effect of ballast and starter, a normal 36W The real power consumption of fluorescent tube in 42-44W or so, produce a large amount of waste of energy.Compared to common fluorescent tube, LED daylight lamp not only has larger advantage at energy saving aspect, and service life is several even more in ten times common of fluorescent tube or more Can be non-maintaining, without often replacing fluorescent tube, ballast and starter, environmentally protective semi-conductor electricity light source exposure light is more Soft, spectrum is purer, these are all conducive to the health and sight protectio of user.

Different LED light can also have being related to for more hommization, and a kind of such as cold light source of 6000K can give one The visually refrigerant feeling of kind.

Illumination market is gradually exited now with ordinary incandescent lamp, LED type lighting source occupies rapidly entire illumination Market also encounters some problems during Conventional LED light sources substitute incandescent lamp.Such as in dicoration, traditional white heat Tungsten filament can be bent to arbitrary shape so as to which various figures be presented by lamp source, but LED filament on the market does not have this kind at present Ability loses its flexibility, after bending due to the brittleness of its chip and using colloid curing after adhesive means fixation luminescence chip It is easy to cause the damage of LED filament；For another example adhesive means fix luminescence chip, the adhesive means shadow significantly during the manufacturing Rung its formation efficiency, and LED filament outer layer apply colloid oxidation, aging after compound protective layer is destroyed cause to bond it is unstable, Chip, which is easily shifted, comes off or damaged, even occurs some electric leakages surprisingly, and such damage mode is the most commonly seen damage of LED filament One of bad mode, another relatively conventional damage mode are and the LED cores since LED flexibilities filament will often be bent, be bent Piece is usually hard structure and its length direction is parallel with filament length direction, and in bending, bending, LED chip is in bending place node It is just easily impaired.

Patent Office of the People's Republic of China disclosed on 2 22nd, 2017 it is a kind of have can the arbitrary flexible filament of plastotype utility model The authority of patent, license publication number CN20597315U, the utility model employ equal in LED flexibility filaments both sides Circuit layer is set, LED light chip is equipped on the circuit layer of both sides, then by fluorescent glue overall package, form an entirety knot Structure, substantially increase its whole ductility and can deformation nature, but the utility model is still to LED light by the way of gluing Each section is fixed and bonds, and reduces its production efficiency and is not avoided that ED filaments outer layer applies compound protective layer and is destroyed rear glue Matter oxidation, aging cause bond it is unstable, chip easily shift, come off or damage even occur some electric leakage surprisingly etc. accidents ask Topic.

Utility model content

The utility model is that colloid is consolidated after solving the above-mentioned brittleness due to chip and fixing luminescence chip using adhesive means Change and lose its flexibility, the damage of LED filament is easy to cause after bending；For another example adhesive means fix luminescence chip, are made in production Adhesive means leverage its formation efficiency during making, and apply colloid oxygen after compound protective layer is destroyed in LED filament outer layer Change, aging cause bond it is unstable, chip easily shift, come off or damage even occur some electric leakage surprisingly etc. accidents and due to LED flexibilities filament will often be bent, be bent, and LED chip is usually hard structure and its length direction is put down with filament length direction Row, in bending, bending, LED chip is in the problem of bending place node is just easily impaired, provides a kind of without using gluing side Luminescence chip is fixed in formula, combination degree is high, each section combine stablize and keep high pliability there is vacuum suction Structure laterally sets the flexible filament of chip.

To achieve the above object, the utility model uses following technical scheme：

A kind of flexible filament that chip is laterally set with vacuum suction structure including flexible substrate, circuit layer and shines Chip, the flexible substrate is linear for length, and circuit layer is coated on the outside of flexible substrate, and luminescence chip is mounted on circuit layer, hair The length direction of optical chip and the length direction of flexible substrate are mutually perpendicular to, by vacuumizing the two between circuit layer and flexible substrate Vacuum suction effect is generated under atmospheric pressure effect, circuit layer is equipped with several chip mounting holes, and flexible substrate end is outside Connecting portion is extended to form, connecting portion is equipped with mounting hole, and circuit layer both ends are equipped with the electrical connection hole of perforation circuit layer and flexible substrate, It is coated outside circuit layer and luminescence chip by fluorescence rubberised layer and forms an overall structure.It is substituted by the way of vacuum suction Circuit layer is fixed in traditional adhesive means, the step of eliminating gluing in process of production, and has saved waiting viscose glue The fully charge cured time, the formation efficiency of flexible filament will be greatly improved, and there are colloids to be directly exposed to sky for gluing The problems such as deterioration by oxidation is also easy to produce under conditions of gas leads to the damage that comes off, and vacuum suction dramatically can avoid this from asking Topic, the mode of vacuum suction can still keep higher conjugation under certain damaged condition, only need to be with pumping in generating process Vacuum machine carries out vacuum pumping to it and rapidly circuit layer can be fixed, under conditions of air is directly exposed to also not Product quality can be caused to decline due to the problem of deterioration by oxidation；Since the use of LED light will generate a large amount of heat, using vacuum The mode of absorption fixes while avoids that colloid hardens and generates flexible filament in the case of hot environment use for a long time Hard brittleness makes its pliability decline the problem of even completely losing pliability.

Preferably, the circuit layer before vacuum suction for polyline shaped or wavy, and flexible substrate incomplete contact between, Gap location has air.Polyline shaped or the circuit layer of wave threadiness and flexible substrate are there are certain gap, there are air in gap, Circuit layer is coated and fixed completely with flexible substrate after being vacuumized by evacuator, and that receives ambient pressure pressure makees electricity consumption Road floor and flexible substrate are fixed to each other stabilization.

Preferably, the flexible substrate material is flexible polyvinyl chloride, flexible mineral insulation material and flexible epoxy tree Any one in fat modified organic silicone resin.Using the flexible substrate of more than material preparation with preferable flexibility and by force Degree.

Preferably, the luminescence chip is divided into luminous zone, electrode district and conduction region.

Preferably, the luminous zone is LED chip, conduction region is highly conducting metal, high-conductive plastic, general elargol or solid Any one in brilliant tin cream, preferably die bond solder paste.

Preferably, the circuit layer is equipped with arbitrary in calendering circuit, etched circuit, copper facing circuit or printed circuit It is a kind of.

The above-mentioned flexible filament that chip is laterally set with vacuum suction structure, coats one layer of broken line on the outside of flexible substrate Shape or wavy circuit layer, circuit layer are equipped with chip mounting hole, and the conduction region on luminescence chip is aligned chip mounting hole It is installed, then the air between evacuator extracting circuit layer and flexible substrate in gap, generates vacuum environment and cause electricity Road floor mutually adsorbs fixation with flexible substrate, and chip mounting hole deforms upon so that luminescence chip installation stabilization, the production Installation steps are quick and easy, have the efficiency of higher production work.

Above-mentioned luminescence chip is laterally set, i.e. the length direction of luminescence chip and the length direction of flexible substrate is mutually perpendicular to, changes The setting direction of luminescence chip is become, luminescence chip can have been avoided to be in bending place node as possible in filament bending, bending Position, change less but can dramatically avoid luminescence chip due to being damaged when bending, being bent in filament, are impaired Problem.

The beneficial effects of the utility model are：It is fixed while is avoided for a long time in high temperature ring by the way of vacuum suction Colloid hardens and flexible filament is made to generate hard brittleness in the case of the use of border, declines its pliability and even completely loses pliability The problem of；The mode of vacuum suction can still keep higher conjugation under certain damaged condition；Using the side of vacuum suction Formula is fixed circuit layer to substitute traditional adhesive means, the step of eliminating gluing in process of production, and saves The viscose glue fully charge cured time is waited for, the formation efficiency of flexible filament will be greatly improved；With preferable flexibility and by force Degree；It damages or damages caused by luminescence chip when dramatically avoiding bending, bending filament.

Description of the drawings

Fig. 1 is schematic diagram of the utility model before vacuum suction step；

Fig. 2 is schematic diagram of the utility model after vacuum suction step；

Fig. 3 is the product schematic diagram of the utility model；

In figure, 1 flexible substrate, 2 circuit layers, 201 chip mounting holes, 3 luminescence chips, 301 luminous zones, 302 conduction regions, 303 electrode districts, 4 connecting portions, 5 mounting holes, 6 electrical connection holes, 7 fluorescence rubberised layers.

Specific embodiment

A kind of flexible filament that chip is laterally set with vacuum suction structure, including flexible substrate 1, circuit layer 2 and hair Optical chip 3, the flexible substrate 1 is linear for length, and circuit layer 2 is coated on 1 outside of flexible substrate, and luminescence chip 3 is mounted on circuit On layer 2, the length direction of the length direction and flexible substrate 1 of luminescence chip 3 is mutually perpendicular to, and passes through pumping between circuit layer 2 and flexible substrate 1 Vacuum causes the two to generate vacuum suction effect under atmospheric pressure effect, and circuit layer 2 is equipped with several chip mounting holes 201, 1 end of flexible substrate extends outward to form connecting portion 4, and connecting portion 4 is equipped with mounting hole 5, and 2 both ends of circuit layer are equipped with perforation circuit layer 2 and the electrical connection hole 6 of flexible substrate 1, it is coated by fluorescence rubberised layer 7 outside circuit layer 2 and luminescence chip 3 and forms an entirety knot Structure.Traditional adhesive means are substituted by the way of vacuum suction circuit layer 2 is fixed, eliminate in process of production The step of gluing, and the waiting viscose glue fully charge cured time has been saved, the formation efficiency of flexible filament will be greatly improved, and There are colloids deterioration by oxidation is also easy to produce under conditions of being directly exposed to air the problems such as gluing, lead to the damage that comes off, and vacuum Absorption can dramatically avoid this problem, and the mode of vacuum suction can still keep higher knot under certain damaged condition Right, in generating process only need to carry out vacuum pumping to it with evacuator can rapidly be fixed circuit layer 2, Being directly exposed under conditions of air will not be since the problem of deterioration by oxidation, causes product quality to decline；Due to making for LED light With a large amount of heat will be generated, fixed while avoided in situation about being used for a long time in hot environment by the way of vacuum suction Lower colloid hardens and flexible filament is made to generate hard brittleness, its pliability is made to decline the problem of even completely losing pliability.

The circuit layer 2 is polyline shaped or wavy before vacuum suction, with 1 incomplete contact between of flexible substrate, gap location There is air.Polyline shaped or the circuit layer 2 of wave threadiness and flexible substrate 1 are there are certain gap, there are air in gap, logical It crosses evacuator and carries out vacuumizing rear circuit layer 2 and be coated and fixed completely with flexible substrate 1, receive the application circuit of ambient pressure pressure Layer 2 is fixed to each other stabilization with flexible substrate 1.

1 material of flexible substrate is flexible polyvinyl chloride, flexible mineral insulation material and flexible-epoxy modification have Any one in machine silicones.There is preferable flexibility and intensity using the flexible substrate 1 of more than material preparation.

The luminescence chip 3 divides for luminous zone 301, electrode district 303 and conduction region 302.

The luminous zone 301 is LED chip, and conduction region 302 is highly conducting metal, high-conductive plastic, general elargol or die bond Any one in tin cream, preferably die bond solder paste.

The circuit layer 2 is equipped with any one in calendering circuit, etched circuit, copper facing circuit or printed circuit.

The above-mentioned flexible filament that chip is laterally set with vacuum suction structure, in 1 one layer of folding of outside cladding of flexible substrate Linear or wavy circuit layer 2, circuit layer 2 are equipped with chip mounting hole 201, the conduction region 302 on luminescence chip 3 are aligned Chip mounting hole 201 is installed, then the air between evacuator extracting circuit layer 2 and flexible substrate 1 in gap, is generated Vacuum environment causes circuit layer 2 to be fixed with the mutually absorption of flexible substrate 1, and chip mounting hole 201 is deformed upon so that shining The installation of chip 3 is stablized, and the production installation steps are quick and easy, has the efficiency of higher production work.

Laterally setting, the i.e. length direction of luminescence chip 3 and the length direction of flexible substrate 1 are mutually perpendicular to above-mentioned luminescence chip 3, The setting direction of luminescence chip 3 is changed, luminescence chip 3 can be avoided to be in bending place section as possible in filament bending, bending The position of point, change less but can dramatically avoid luminescence chip 3 due to being damaged when bending, being bent in filament, quilt The problem of damage.

In actual installation process, by 2 encapsulation of circuit layer on the outside of flexible substrate 1, by the conduction region on luminescence chip 3 302 alignment chip mounting holes 201 laterally is installed by setting, and when installation suitably stretches circuit layer 2, so that vacuum is inhaled Attached, the air between evacuator extracting circuit layer 2 and flexible substrate 1 in gap, gap are compressed after installation is complete, are generated Vacuum environment causes circuit layer 2 to fit closely fixation with the mutually absorption of flexible substrate 1 under the action of extraneous atmospheric pressure, Its outer surface applies fluorescent glue, makes smooth fluorescence rubberised layer 7, and perforation circuit layer 2 and flexible substrate are got at 2 both ends of circuit layer Mounting hole 5, the flexible filament that chip is laterally set with vacuum suction structure are got in 1 electrical connection hole 6 in connecting portion 4 Production is completed, and being fixed, connect and being powered can use.Flexible substrate 1 used is flexible mineral insulation material in the present embodiment Material, conduction region 302 select excellent die bond solder paste material preparation, and circuit layer 2 selects the mode of printed circuit to set circuit.

The beneficial effects of the utility model are：It is fixed while is avoided for a long time in high temperature ring by the way of vacuum suction Colloid hardens and flexible filament is made to generate hard brittleness in the case of the use of border, declines its pliability and even completely loses pliability The problem of；The mode of vacuum suction can still keep higher conjugation under certain damaged condition；Using the side of vacuum suction Formula is fixed circuit layer 2 to substitute traditional adhesive means, the step of eliminating gluing in process of production, and saves The viscose glue fully charge cured time is waited for, the formation efficiency of flexible filament will be greatly improved；With preferable flexibility and by force Degree；To damaging or damaging caused by luminescence chip 3 when dramatically avoiding bending, bending filament.

Claims (6)

1. a kind of flexible filament that chip is laterally set with vacuum suction structure, including flexible substrate（1）, circuit layer（2）With Luminescence chip（3）, which is characterized in that the flexible substrate（1）For the linear circuit layer of length（2）It is coated on flexible substrate（1）Outside, Luminescence chip（3）Mounted on circuit layer（2）On, luminescence chip（3）Length direction and flexible substrate（1）Length direction mutually hang down Directly, circuit layer（2）With flexible substrate（1）Between by both vacuumizing generate vacuum suction effect under atmospheric pressure effect, Circuit layer（2）It is equipped with several chip mounting holes（201）, flexible substrate（1）End extends outward to form connecting portion（4）, even Socket part（4）Equipped with mounting hole（5）, circuit layer（2）Both ends are equipped with perforation circuit layer（2）And flexible substrate（1）Electrical connection hole （6）, circuit layer（2）And luminescence chip（3）Outside is by fluorescence rubberised layer（7）Cladding forms an overall structure.

2. a kind of flexible filament that chip is laterally set with vacuum suction structure according to claim 1, feature exist In the circuit layer（2）It is polyline shaped or wavy before vacuum suction, with flexible substrate（1）Incomplete contact between, gap location have Air.

3. a kind of flexible filament that chip is laterally set with vacuum suction structure according to claim 1 and 2, feature It is, the flexible substrate（1）Material is flexible polyvinyl chloride, flexible mineral insulation material and flexible-epoxy modification are organic Any one in silicones.

4. a kind of flexible filament that chip is laterally set with vacuum suction structure according to claim 1, feature exist In the luminescence chip（3）It is divided into luminous zone（301）, electrode district（303）And conduction region（302）.

5. a kind of flexible filament that chip is laterally set with vacuum suction structure according to claim 1 and 4, feature It is, the luminous zone（301）For LED chip, conduction region（302）For highly conducting metal, high-conductive plastic, general elargol or die bond Any one in tin cream, preferably die bond solder paste.

6. a kind of flexible filament that chip is laterally set with vacuum suction structure according to claim 1, feature exist In the circuit layer（2）It is equipped with any one in calendering circuit, etched circuit, copper facing circuit or printed circuit.