CN207398170U - The flexible filament that a kind of LED chip is laterally set - Google Patents
The flexible filament that a kind of LED chip is laterally set Download PDFInfo
- Publication number
- CN207398170U CN207398170U CN201721211339.1U CN201721211339U CN207398170U CN 207398170 U CN207398170 U CN 207398170U CN 201721211339 U CN201721211339 U CN 201721211339U CN 207398170 U CN207398170 U CN 207398170U
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- Prior art keywords
- flexible
- led chip
- led
- line layer
- bending
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Abstract
The utility model is related to the flexible filament that a kind of combination degree is high, each several part combination is stable and the LED chip of high pliability is kept laterally to set, its advantage is：LED chip is laterally set, the single long length accounting on flexible wire body length direction can be shortened, during so that bending or bending occurring for flexible filament, the LED component laterally set also has better buckle resistance energy, it is not easy due to bending, bending generation brittle failure, can also laterally set so that its chip light angle bigger；LED chip can play certain cushioning effect to folding force in bending or bending, reduce line layer suffered by the middle part of LED chip and flexible wire body to its extruding force, further strengthen its buckle resistance energy there are 60~90 ° of cambered surface；Flexible filament overall flexibility is outstanding, and each structure division installation, which combines, stablizes, and benefits from long lifespan, illumination range is big, and extremely outstanding performance is shown in terms of bend resistance ability.
Description
Technical field
The utility model is related to a kind of LED filament field more particularly to a kind of combination degree be high, each several part combine stablize and
The flexible filament that the LED chip of high pliability is kept laterally to set.
Background technology
Light emitting diode（Light emitting diode）Referred to as LED is by gallium（Ga）, arsenic（As）, phosphorus（P）And nitrogen
（N）Made from the compound for waiting elements, it is made of electronics with the principle of visible ray can be given off during hole-recombination.Different elements
Compound prepares light emitting diode institute exposure light difference, and such as wherein gallium arsenide diode glows, gallium phosphide diode green light,
Silicon carbide diode Yellow light-emitting low temperature, gallium nitride diode blue light-emitting, is subdivided into Organic Light Emitting Diode in terms of chemical property
OLED and inorganic light-emitting diode LED.Its basic structure is one piece of electroluminescent chip of semiconductor material, with elargol, admittedly
Brilliant tin cream or latex solidified are on stent, then with silver wire or gold thread connection chip and circuit board, then surrounding epoxy resin
Sealing is played the role of protecting internal core, finally installs shell, so the anti-seismic performance of usually LED light is very outstanding.LED
In terms of the field being related to includes the daily household electrical appliances such as mobile phone, desk lamp, household electrical appliances and machinery production.
LED daylight lamp uses newest LED light source technology, digitisation appearance design, and power saving rate reaches more than 70%, 12W's
The exposure intensity of LED daylight lamp can compare the fluorescent tube of 36W, and due to the effect of ballast and starter, a normal 36W
The real power consumption of fluorescent tube in 42-44W or so, generate substantial amounts of waste of energy.Compared to common fluorescent tube,
LED daylight lamp not only has larger advantage at energy saving aspect, and service life is several even more in ten times common of fluorescent tube or more
Can be non-maintaining, without often replacing fluorescent tube, ballast and starter, environmentally protective semi-conductor electricity light source exposure light is more
Soft, spectrum is purer, these are all conducive to the health and sight protectio of user.
Different LED light can also have being related to for more hommization, and a kind of such as cold light source of 6000K can give one
The visually refrigerant sensation of kind.
Illumination market is progressively exited now with ordinary incandescent lamp, LED type lighting source occupies rapidly entire illumination
Market also encounters some problems during Conventional LED light sources substitute incandescent lamp.Such as in dicoration, traditional white heat
Tungsten filament can be bent to arbitrary shape so as to which various figures be presented by lamp source, but LED filament on the market does not possess this kind at present
Ability, curing forfeiture due to the brittleness of its chip and using colloid after adhesive means fixation luminescence chip, its is flexible, after bending
It is easy to cause the damage of LED filament；For another example since LED flexibilities filament will often be bent, bend, and LED chip is usually hard
Matter structure and its length direction is parallel with filament length direction, in bending, bending LED chip be in bending place node just easily by
Damage, cracking or even fracture situation.
Patent Office of the People's Republic of China disclosed on 2 22nd, 2017 it is a kind of have can the arbitrary flexible filament of plastotype utility model
The authority of patent, license publication number CN20597315U, the utility model employ equal in LED flexibility filaments both sides
Circuit layer is set, LED light chip is equipped on the circuit layer of both sides, then by fluorescent glue overall package, forms an entirety knot
Structure, substantially increase its whole ductility and can deformation nature, but its LED chip length direction is still parallel with filament length direction,
The hidden danger of easily damaged fracture during in the presence of bending, bending.
Utility model content
The utility model is that colloid is consolidated after solving the above-mentioned brittleness due to chip and fixing luminescence chip using adhesive means
Change and lose that its is flexible, the damage of LED filament is easy to cause after bending, since LED flexibilities filament will often be bent, bend,
And LED chip is usually hard structure and its length direction is parallel with filament length direction, in bending, bending, LED chip is in curved
The problem of node is just easily impaired at folding provides a kind of combination degree height, each several part combines and stablizes and keep high pliability
The flexible filament that laterally sets of LED chip.
To achieve the above object, the utility model uses following technical scheme：
The flexible filament that a kind of LED chip is laterally set, including flexible wire body, line layer and LED component, the line layer
Flexible wires external surface is coated on, is fixed by gluing, the LED component is mounted on again by gluing on line layer, LED groups
The length direction of part and the length direction of flexible wire body are mutually perpendicular to, and flexible wire body, line layer and LED component are sealed by fluorescence rubberised layer
Close into an entirety.Device integration degree is high, and LED component is shortened rectangular in flexible wire body by the way of laterally setting
Upward single long length accounting so that when bending or bending occur for flexible filament, the LED component laterally set also has preferably
Buckle resistance energy is not easy due to bending, bending generation brittle failure.
Preferably, the LED component includes LED chip, electrode section and fixed part, LED component is consolidated by colloid
It is scheduled on line layer, colloid is die bond solder paste.Die bond solder paste is using thermal conductivity as metal alloys such as 40W/MK or so SnAgCu
Make the bonding material of matrix, fully meet RoHS and halogen-free grade environmental protection standards, there are two poles with other for LED chip encapsulation
The fusion between metal/metal, metal/plastic etc. is realized in the encapsulation of pipe constant power device, and LED heat dissipations can be greatly lowered
The thermal resistance of passage realizes preferably electrical connection and bonding strength, in addition, die bond solder paste die bond solder paste is only needed by reflow ovens welding
5-7min, compared with the 30-90min of general elargol, die bond speed is fast, saves energy consumption, die bond solder paste and existing conductive silver glue phase
Than not only having better heat conductivility, the heat dissipation bottleneck of great power LED can be alleviated, so as to improve the reliability of LED, extended
The service life of LED light.
Preferably, there are the arcs of 60~90 ° of radians in the one side close to line layer for the LED chip in the LED component
Face.
Preferably, the flexibility wire body is by flexible polyvinyl chloride, flexible mineral insulation material, metal, metal alloy, soft
Any one in property epoxy resin modified organosilicon resin, CEM-3, polyimides is made.It is made of more than material soft
Property wire body have stronger flexibility and intensity, especially flexible mineral insulation material, have splendid intensity and insulating properties.
Preferably, the line layer is equipped with arbitrary in calendering circuit, etched circuit, copper facing circuit or printed circuit
It is a kind of.
Preferably, the flexibility wire body outwardly extending portion, as connecting portion, connecting portion is equipped with mounting hole.
Preferably, the lap of the connecting portion and line layer is equipped with the electrical connection of through connection portion and line layer
Hole.
Above-mentioned LED component shortens the single long length accounting on flexible wire body length direction by the way of laterally setting,
It such as long rod and short stick, is easier to be broken compared with short stick bending or bending duration rod, similarly occur in flexible filament curved
When folding or bending, the LED component laterally set also has better buckle resistance energy, is not easy due to bending, bending generation brittle failure,
It and, can in bending or bending due to the LED chip in LED component in the one side close to line layer there are 60~90 ° of cambered surface
Certain cushioning effect to folding force is played, reduces the extruding of line layer suffered by the middle part of LED chip and flexible wire body to it
Power further strengthens its buckle resistance energy.
In addition, the connection mode of no welding point causes the suppleness of flexible wire body and line layer to get a promotion, flexible wires
Have one by strong general chloroprene adhesive, solvent or fusion pressure sensitive adhesive, JL-499 or JL-480 etc. between body and line layer
Determine high temperature resistance and pliability and toughness insulating cement is still kept to bond flexible wire body and line layer after bonding, it is ensured that its
Overall flexibility higher.
Fixed part insertion line layer installation in LED component, improves the LED component installation opposite with line layer and stablizes
Property.
The beneficial effects of the utility model are：The utility model laterally sets LED chip, on the one hand can shorten soft
Property wire body length direction on single long length accounting so that when bending or bending occur for flexible filament, the LED component that laterally sets
It with better buckle resistance energy, is not easy due to bending, bending generation brittle failure, on the other hand laterally sets so that the illumination of its chip
Angle bigger, i.e. its light uniformity are promoted compared to the LED chip of longitudinal arrangement；Due to the LED chip in LED component
In the one side close to line layer there are 60~90 ° of cambered surface, certain buffering to folding force can be played in bending or bending
Effect reduces line layer suffered by the middle part of LED chip and flexible wire body to its extruding force, further strengthens its buckle resistance
Energy；Flexible filament overall flexibility is outstanding, and each structure division installation, which combines, stablizes, and benefits from long lifespan, illumination range is big, anti-
Extremely outstanding performance is shown in terms of bending ability.
Description of the drawings
Fig. 1 is that the utility model applies the schematic diagram before fluorescence rubberised layer；
Fig. 2 is that the utility model applies the schematic diagram after fluorescence rubberised layer；
Fig. 3 is the structure diagram of the utility model end amplification；
In figure, 1 flexible wire body, 2 line layers, 3LED components, 301LED chips, 302 fixed parts, 303 electrode sections,
304 colloids, 4 connecting portions, 5 mounting holes, 6 electrical connection holes, 7 fluorescence rubberised layers.
Specific embodiment
The flexible filament that a kind of LED chip is laterally set, including flexible wire body 1, line layer 2 and LED component 3, the line
Road floor 2 is coated on flexible 1 outer surface of wire body, is fixed by gluing, and the LED component 3 is mounted on line layer 2 again by gluing
On, the length direction of LED component 3 and the length direction of flexible wire body 1 are mutually perpendicular to, and flexible wire body 1, line layer 2 and LED component 3 are logical
It crosses fluorescence rubberised layer 7 and closes into an entirety.Device integration degree is high, and LED component 3 is shortened by the way of laterally setting
Single long length accounting on flexible 1 length direction of wire body so that when bending or bending occur for flexible filament, laterally set
LED component 3 also has better buckle resistance energy, is not easy due to bending, bending generation brittle failure.
The LED component 3 includes LED chip 301, electrode section 303 and fixed part 302, and LED component 3 passes through colloid
304 are fixed on line layer 2, and colloid 304 is die bond solder paste.Die bond solder paste is using thermal conductivity as 40W/MK or so SnAgCu etc.
Metal alloy makees the bonding material of matrix, fully meet RoHS and it is halogen-free wait environmental protection standards, for LED chip 301 encapsulation and
The fusion between metal/metal, metal/plastic etc. is realized in other encapsulation with diode constant power device, can be significantly
The thermal resistance of LED heat dissipation channels is reduced, realizes preferably electrical connection and bonding strength, in addition, die bond solder paste die bond solder paste is by returning
Stream stove welding only needs 5-7min, and compared with the 30-90min of general elargol, die bond speed is fast, saves energy consumption, die bond solder paste with it is existing
There is conductive silver glue compared to not only having better heat conductivility, the heat dissipation bottleneck of great power LED can be alleviated, so as to improve LED
Reliability, extend the service life of LED light.
There are the cambered surfaces of 60~90 ° of radians in the one side close to line layer 2 for LED chip 301 in the LED component 3.
The flexibility wire body 1 is by flexible polyvinyl chloride, flexible mineral insulation material, metal, metal alloy, flexible epoxy tree
Any one in fat modified organic silicone resin, CEM-3, polyimides is made.The flexible wire body 1 made of more than material has
There are stronger flexibility and intensity, especially flexible mineral insulation material, there is splendid intensity and insulating properties.
The line layer 2 is equipped with any one in calendering circuit, etched circuit, copper facing circuit or printed circuit.
Flexibility 1 outwardly extending portion of wire body is equipped with mounting hole 5 as connecting portion 4, connecting portion 4.
The lap of the connecting portion 4 and line layer 2 is equipped with through connection portion 4 and the electrical connection hole 6 of line layer 2.
By the way of laterally setting, the single long length shortened on flexible 1 length direction of wire body accounts for above-mentioned LED component 3
Than such as long rod and short stick, being easier to be broken compared with short stick bending or bending duration rod, similarly occur in flexible filament
When bending or bending, the LED component 3 laterally set also has better buckle resistance energy, is not easy crisp due to bending, bending generation
It is disconnected, and since the LED chip 301 in LED component 3 in the one side close to line layer 2 has 60~90 ° of cambered surface, bending or
Certain cushioning effect to folding force can be played during bending, reduces line layer 2 and flexible wires suffered by 301 middle part of LED chip
Body 1 further strengthens its buckle resistance energy to its extruding force.
In addition, the connection mode of no welding point causes the suppleness of flexible wire body 1 and line layer 2 to get a promotion, it is flexible
Pass through the tools such as strong general chloroprene adhesive, solvent or fusion pressure sensitive adhesive, JL-499 or JL-480 between wire body 1 and line layer 2
There is certain high temperature resistance and still keep pliability and toughness insulating cement after bonding to bond flexible wire body 1 and line layer 2, it can
Ensure its overall flexibility higher.
Fixed part 302 in LED component 3 is embedded in line layer 2 and installs, and it is opposite with line layer 2 to improve LED component 3
Mounting stability.
In the present embodiment, flexible wire body 1 selects flexible-epoxy modified organic silicone resin, and colloid 304 selects die bond
Tin cream, line layer 2 select printed circuit to prepare circuit needed for LED chip 301.It is tested by bending, obtained by the preparation
For the flexible filament that LED chip 301 is laterally set after repeatedly bending, LED chip 301 is excellent, shines normal, surface without
There is apparent damaged trace, and filament is whole without excessively high heat is generated, that is, and radiate not smooth situation, compared to common LED
Filament, irradiated area are larger.
The beneficial effects of the utility model are：The utility model laterally sets LED chip 301, on the one hand can shorten
Single long length accounting on flexible 1 length direction of wire body so that when bending or bending occur for flexible filament, the LED that laterally sets
Component 3 also has better buckle resistance energy, is not easy, due to bending, bending generation brittle failure, on the other hand laterally to set and cause it
Chip light angle bigger, i.e. its light uniformity are promoted compared to the LED chip 301 of longitudinal arrangement；Due to LED component
LED chip 301 on 3, there are 60~90 ° of cambered surface, can be played in bending or bending to curved in the one side close to line layer 2
Certain cushioning effect of power is rolled over, reduces line layer 2 suffered by the middle part of LED chip 301 and flexible wire body 1 to its extruding force,
Further strengthen its buckle resistance energy；Flexible filament overall flexibility is outstanding, and each structure division installation, which combines, stablizes, and benefits from
Long lifespan, illumination range is big, and extremely outstanding performance is shown in terms of bend resistance ability.
Claims (7)
1. a kind of flexible filament that LED chip is laterally set, including flexible wire body（1）, line layer（2）And LED component（3）,
It is characterized in that, the line layer（2）It is coated on flexible wire body（1）Outer surface is fixed by gluing, the LED component（3）Equally
Line layer is mounted on by gluing（2）On, LED component（3）Length direction and flexible wire body（1）Length direction be mutually perpendicular to, it is soft
Property wire body（1）, line layer（2）And LED component（3）Pass through fluorescence rubberised layer（7）Close into an entirety.
2. the flexible filament that a kind of LED chip according to claim 1 is laterally set, which is characterized in that the LED component
（3）Including LED chip（301）, electrode section（303）And fixed part（302）, LED component（3）Pass through colloid（304）It is fixed
In line layer（2）On, colloid（304）For die bond solder paste.
3. the flexible filament that a kind of LED chip according to claim 1 or 2 is laterally set, which is characterized in that the LED
Component（3）On LED chip（301）Close to line layer（2）One side there are 60~90 ° of radians cambered surface.
4. the flexible filament that a kind of LED chip according to claim 1 is laterally set, which is characterized in that the flexible wires
Body（1）By flexible polyvinyl chloride, flexible mineral insulation material, metal, metal alloy, flexible-epoxy modified organic silicon tree
Any one in fat, CEM-3, polyimides is made.
5. the flexible filament that a kind of LED chip according to claim 1 is laterally set, which is characterized in that the line layer
（2）It is equipped with any one in calendering circuit, etched circuit, copper facing circuit or printed circuit.
6. the flexible filament that a kind of LED chip according to claim 1 is laterally set, which is characterized in that the flexible wires
Body（1）Outwardly extending portion is as connecting portion（4）, connecting portion（4）It is equipped with mounting hole（5）.
7. the flexible filament that a kind of LED chip according to claim 6 is laterally set, which is characterized in that the connecting portion
（4）And line layer（2）Lap be equipped with through connection portion（4）And line layer（2）Electrical connection hole（6）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721211339.1U CN207398170U (en) | 2017-09-20 | 2017-09-20 | The flexible filament that a kind of LED chip is laterally set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721211339.1U CN207398170U (en) | 2017-09-20 | 2017-09-20 | The flexible filament that a kind of LED chip is laterally set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207398170U true CN207398170U (en) | 2018-05-22 |
Family
ID=62403616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721211339.1U Expired - Fee Related CN207398170U (en) | 2017-09-20 | 2017-09-20 | The flexible filament that a kind of LED chip is laterally set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207398170U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148669A (en) * | 2018-08-17 | 2019-01-04 | 厦门多彩光电子科技有限公司 | A kind of production method and LED filament of modularization filament |
-
2017
- 2017-09-20 CN CN201721211339.1U patent/CN207398170U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148669A (en) * | 2018-08-17 | 2019-01-04 | 厦门多彩光电子科技有限公司 | A kind of production method and LED filament of modularization filament |
| CN109148669B (en) * | 2018-08-17 | 2020-07-31 | 厦门多彩光电子科技有限公司 | Production method of modular filament and L ED filament |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 Termination date: 20200920 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |