CN109148669B - Production method of modular filament and L ED filament - Google Patents
Production method of modular filament and L ED filament Download PDFInfo
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- CN109148669B CN109148669B CN201810940106.8A CN201810940106A CN109148669B CN 109148669 B CN109148669 B CN 109148669B CN 201810940106 A CN201810940106 A CN 201810940106A CN 109148669 B CN109148669 B CN 109148669B
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- conductive
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- filament
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000011324 bead Substances 0.000 claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 claims description 59
- 239000000178 monomer Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to a production method of a modular filament and an L ED filament, wherein L ED lamp beads are fixed on a substrate in a fastener mode, electric connection among L ED lamp beads is realized through fasteners, L ED lamp beads can be produced in batch, production efficiency can be improved, and when one L ED lamp bead fails, the lamp bead can be replaced, so that the whole L ED filament cannot be scrapped.
Description
Technical Field
The invention relates to the field of lighting, in particular to a production method of a modular filament and an L ED filament.
Background
In order to ensure that each L ED filament can have a sufficiently high driving voltage, dozens or even dozens of L ED chips are usually packaged in series on the substrate, which leads to a relatively slender substrate, the substrate is easily broken in the manufacturing process, and a plurality of L ED chips are packaged in series, wherein if a problem occurs in one of the ED L ED chips, the whole L ED filament is scrapped, and the material is wasted.
Disclosure of Invention
The invention aims to provide a production method of a modular filament and an L ED filament, so as to solve the problems.
The specific scheme is as follows:
a method of producing a modular filament comprising the steps of:
s1, preparing a packaging support, wherein the packaging support is provided with a plurality of packaging support single bodies, and each packaging single body is provided with a packaging area positioned in the middle of the packaging support single body and a positive electrode and a negative electrode which are positioned on two opposite sides of the packaging support single body and are electrically isolated from each other;
s2, carrying out L ED packaging operation on each packaging support monomer on the packaging support;
s3, cutting the packaging support into a plurality of L ED lamp beads, wherein each L ED lamp bead corresponds to one packaging support monomer;
s4, preparing a substrate, wherein the substrate comprises a strip-shaped and insulating filament substrate, both ends of the filament substrate in the length direction are provided with a conductive piece and a plurality of groups of fasteners which are positioned between the two conductive pieces and are arranged in sequence, each group of fasteners comprises two conductive fasteners which are mutually electrically isolated, and the two adjacent groups of fasteners are electrically connected;
s5, fixing the L ED lamp beads on the filament substrate through fasteners, and electrically connecting the positive electrode and the negative electrode on each single packaging support with one conductive fastener in a group of fasteners respectively to obtain the L ED filament.
Furthermore, the filament substrate is a plastic substrate, and the fastener and the conductive piece are arranged in a die cavity of a die of the filament substrate and are integrally formed with the filament substrate.
Furthermore, the filament substrate is a ceramic substrate, and the fastener and the conductive piece are fixed on the ceramic substrate in a pre-embedded manner.
Furthermore, each conductive fastener comprises a conductive connecting part in the shape of 'L' and a conductive clamping part located on one end of the conductive connecting part, the clamping part is located outside the filament substrate, and the positive electrode and the negative electrode of each packaging support monomer are provided with clamping through holes matched with the clamping parts.
Furthermore, except two conductive fasteners positioned at the outermost sides of the two ends of the filament substrate in the length direction, the connecting parts of the other conductive fasteners are connected with the connecting part of an adjacent conductive fastener in the other adjacent group of fasteners into a whole.
Furthermore, the connecting parts of the two conductive fasteners positioned at the outermost sides of the two ends of the filament substrate in the length direction are respectively connected with the conductive parts on the end parts of the two conductive fasteners into a whole.
The invention provides an L ED filament, which comprises a substrate and a plurality of L ED lamp beads fixedly installed on the substrate, wherein the substrate comprises a strip-shaped insulated filament substrate, both ends of the filament substrate in the length direction are provided with a conductive piece and a plurality of groups of fasteners which are arranged between the conductive pieces in sequence, each group of fasteners comprises two conductive fasteners which are mutually electrically isolated, the two adjacent groups of fasteners are electrically connected, each L ED lamp bead comprises a packaging support monomer and a L ED chip packaged on the packaging support monomer, each packaging monomer is provided with a packaging area positioned in the middle of the packaging support monomer and a positive electrode and a negative electrode which are positioned on the opposite sides of the packaging support monomer and are mutually electrically isolated, the L ED lamp beads are fixed on the filament substrate through the fasteners, and the positive electrode and the negative electrode on each packaging support monomer are respectively and electrically connected with one of the two conductive fasteners in the group of fasteners.
Compared with the prior art, the L ED lamp filament has the advantages that L ED lamp beads of the L ED lamp filament are fixed on the lamp filament substrate through fasteners and are electrically connected among all L ED lamp beads through the fasteners, L ED lamp beads can be produced in batch, production efficiency can be improved, when a certain L ED lamp bead fails, the lamp bead can be replaced, and the whole L ED lamp filament cannot be scrapped.
Drawings
Fig. 1 shows a schematic diagram of an L ED filament.
Fig. 2 shows a schematic view of a substrate.
FIG. 3 shows a schematic view of an L ED lamp bead.
Fig. 4 shows a schematic view of the package support before packaging.
Fig. 5 shows a schematic view of the package support after packaging.
Fig. 6 shows a schematic view of two conductive fasteners adjacent to two adjacent sets of fasteners being integrally connected.
Fig. 7 shows a schematic view of the outermost conductive fastening member integrally connected to the conductive member.
Detailed Description
To further illustrate the various embodiments, the invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
Example 1
As shown in fig. 1-3, the present invention provides an L ED filament, which includes a substrate 1 and a plurality of L ED lamp beads 2 fixedly mounted on the substrate 1, wherein, referring to fig. 2, the substrate 1 includes a strip-shaped, insulated filament substrate 10, the filament substrate 10 has a conductive member 12 at both ends in a length direction and a plurality of sets of fasteners 14 disposed between the conductive members 12 and arranged in sequence, each set of fasteners 14 includes two conductive fasteners 14a and 14b electrically isolated from each other, and electrical connection is achieved between two adjacent sets of fasteners 14, referring to fig. 3, the L ED lamp beads 2 include package support monomers 20 and L ED chips 22 packaged on the package support monomers 20, each package support monomer 20 has a package region located in the middle of the package support monomer and positive and negative electrodes 200 and 202 electrically isolated from each other on opposite sides of the package support monomer 20, the positive and negative electrodes 200 and 202 are electrically isolated from each other by an insulated plastic 204, and the positive and the negative electrodes 200 and 202 are fixed as a whole.
The process of packaging L ED chips 22 on a package support monomer 20 is the prior art, in this embodiment, a L ED chip 22 is described by taking a front-mounted chip as an example, L ED chip 22 is fixed on a packaging region in the middle of the package support monomer through a die attach adhesive, after the die attach adhesive is baked and cured, electrical connection between an electrode on L ED chip 22 and a positive electrode 200 and a negative electrode 202 is realized through a bonding wire, then a dot packaging adhesive operation is performed, L ED chip 22 and the bonding wire are covered by a packaging adhesive 24, L ED lamp bead 2, L ED lamp bead 2 is prepared after the packaging adhesive 24 is baked and cured, and the positive electrode 200 and the negative electrode 202 on each package support monomer 20 are respectively electrically connected with one of two conductive fasteners 14a and 14b in a group of fasteners 14, so that all L ED lamp beads on the whole substrate are connected in series or in parallel.
Example 2
The present example provides a production method for making the modular L ED filament of example 1, comprising the steps of:
s1, referring to fig. 4, preparing a package support having a plurality of package support cells 20 thereon, where only three rows of package support cells 20 are shown in fig. 4, in practice, the plurality of package support cells 20 may be arranged in multiple rows and multiple columns, each package support cell 20 has a package region located in the middle of the package support cell and positive and negative electrodes 200 and 202 located on opposite sides of the package support cell and electrically isolated from each other, the positive and negative electrodes 200 and 202 are electrically isolated from each other by an insulating plastic material 204 (e.g., PPA, PC, etc.), and the positive and negative electrodes 200 and 202 are fixed into a whole;
s2, performing L ED packaging operations on each single package support on the package support, where the packaging process is the prior art, and in this embodiment, a L ED chip 22 is described as an example of a front-mounted chip, first, dam glue is dispensed around the packaging region in the middle of the single package support to form a dam 206, so as to facilitate subsequent dispensing operations of packaging glue, after the dam glue is cured, die bonding is performed, L ED chip 22 is fixed on the packaging region in the middle of the single package support through the die bonding glue, after the die bonding glue is cured, electrical connection between an electrode on L ED chip 22 and a positive electrode 200 and a negative electrode 202 is realized through a bonding wire, then, dispensing operations are performed, packaging glue is dispensed in the region surrounded by the dam to cover L ED chip 22 and the bonding wire, after the packaging glue 24 is cured, a structure as shown in fig. 5 is formed, and a plurality of L ED beads are packaged on the package support once.
S3, cutting the packaging support according to each packaging support monomer, wherein each packaging support monomer is cut into an independent L ED lamp bead 2, and the L ED lamp bead 2 is structurally shown in figure 3;
s4, preparing a substrate 1 as shown in fig. 2, where the substrate 1 includes a strip-shaped, insulated filament substrate 10, the filament substrate 10 has a conductive member 12 and a plurality of sets of fasteners 14 located between the conductive members 12 and arranged in sequence at both ends in the length direction, each set of fasteners 14 includes two conductive fasteners 14a and 14b electrically isolated from each other, and two adjacent sets of fasteners 14 are electrically connected to each other;
s5, fixing the L ED lamp beads 2 on the filament substrate 10 through fasteners 14, and electrically connecting the positive electrode 200 and the negative electrode 202 on each single package support 20 with one of two conductive fasteners in a group of fasteners, respectively, to form a L ED filament.
When the filament substrate 10 is a plastic substrate, the fastener 14 and the conductive member 12 are both placed in a mold cavity of a mold for manufacturing the filament substrate 10 in advance and fixed, and then injection-molded together with the filament substrate 10, so that the fastener 14 is fixed on the filament substrate 10.
When the filament substrate 10 is a ceramic substrate, the fastening member 14 and the conductive member 12 are fixed on the ceramic substrate by pre-embedding, and then sintered and formed together with the ceramic substrate, wherein the fastening member 14 and the conductive member 12 are made of a metal material, such as iron, and the melting point of the metal material is higher than the sintering temperature of the ceramic substrate. The fasteners 14 and the conductive elements 12 may also be plated after sintering.
In order to facilitate the fixing of the fasteners 14 on the filament substrate 10 and the fixing of the L ED lamp bead, as shown in fig. 2 and fig. 6, each of the conductive fasteners 14a and 14b includes a conductive connection portion 140 in a shape of "L" and a conductive fastening portion 142 on one end of the connection portion, the fastening portion 142 is located outside the filament substrate 10, and the positive electrode 200 and the negative electrode 202 of the single package support 20 both have a fastening through hole 208 · "L" which matches with the fastening portion 142.
Referring to fig. 2 and 6, except for the two conductive fasteners located at the outermost sides of the two ends of the filament substrate 10 in the length direction, the connecting portions of the other conductive fasteners are integrally connected to the connecting portion of an adjacent conductive fastener in the other adjacent group of fasteners, that is, the two conductive fasteners adjacent to the two adjacent groups of fasteners are formed by an electrical conductor in the shape of "L", the lower portion of the "L" shape is fixed in the filament substrate, and the fastening portion 142 extends to the outside of the filament substrate, so that the fasteners 14 are fixed and the electrical connection between the fasteners does not require additional wiring.
Referring to fig. 2 and 7, the connection portions of two conductive fasteners located at the outermost sides of the two ends of the filament substrate 10 in the length direction are respectively connected with the conductive members 12 at the ends thereof, the conductive members 12 have bending portions fixed in the filament substrate 10, and at least a portion of the conductive members 12 protrudes out of the filament substrate, so that an external power supply is electrically connected to the filament substrate, the bending portions can facilitate the fixing of the conductive members 12, the bending portions adjacent to the conductive fasteners are integrally connected with the connection portions of the conductive fasteners, so that the conductive members 12 and the conductive fasteners can be electrically connected without additional wiring.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A method for producing a modular filament, comprising the steps of:
s1, preparing a packaging support, wherein the packaging support is provided with a plurality of packaging support single bodies, and each packaging support single body is provided with a packaging area positioned in the middle of the packaging support single body and a positive electrode and a negative electrode which are positioned on two opposite sides of the packaging support single body and are electrically isolated from each other;
s2, carrying out L ED packaging operation on each packaging support monomer on the packaging support;
s3, cutting the packaging support into a plurality of L ED lamp beads, wherein each L ED lamp bead corresponds to one packaging support monomer;
s4, preparing a substrate, wherein the substrate comprises a strip-shaped and insulating filament substrate, both ends of the filament substrate in the length direction are provided with a conductive piece and a plurality of groups of fasteners which are positioned between the two conductive pieces and are arranged in sequence, each group of fasteners comprises two conductive fasteners which are mutually electrically isolated, and the two adjacent groups of fasteners are electrically connected;
s5, fixing the L ED lamp beads on the filament substrate through fasteners, and electrically connecting the positive electrode and the negative electrode on each single packaging support with one of two conductive fasteners in a group of fasteners respectively to form the L ED filament, wherein each conductive fastener comprises a conductive connecting part in a shape of L and a conductive clamping part located on one end of the conductive connecting part, the clamping part is located outside the filament substrate, and the positive electrode and the negative electrode of each single packaging support are provided with clamping through holes matched with the clamping part.
2. The production method according to claim 1, characterized in that: the filament substrate is a plastic substrate, and the fastener and the conductive piece are arranged in a die cavity of a die of the filament substrate and are integrally formed with the filament substrate.
3. The production method according to claim 1, characterized in that: the filament substrate is a ceramic substrate, and the fastener and the conductive piece are fixed on the ceramic substrate in a pre-embedded mode.
4. The production method according to claim 1, characterized in that: except two conductive fasteners positioned at the outermost sides of the two ends of the filament substrate in the length direction, the connecting parts of the other conductive fasteners are connected with the connecting part of an adjacent conductive fastener in the other adjacent group of fasteners into a whole.
5. The production method according to claim 1, characterized in that: the connecting parts of the two conductive fasteners positioned at the outermost sides of the two ends of the filament substrate in the length direction are respectively connected with the conductive parts on the end parts of the two conductive fasteners into a whole.
6. An L ED filament comprises a substrate and a plurality of L ED lamp beads fixedly mounted on the substrate, and is characterized in that the substrate comprises a strip-shaped insulated filament substrate, both ends of the filament substrate in the length direction are provided with a conductive piece and a plurality of groups of fasteners which are arranged between the conductive pieces in sequence, each group of fasteners comprises two conductive fasteners which are electrically isolated from each other, and the two adjacent groups of fasteners are electrically connected, each L ED lamp bead comprises a single packaging support and a L ED chip packaged on the single packaging support, each single packaging support is provided with a packaging area in the middle of the single packaging support and positive and negative electrodes which are positioned on opposite sides of the single packaging support and are electrically isolated from each other, the L ED lamp beads are fixed on the filament substrate through the fasteners, the positive and negative electrodes on the single packaging support are respectively and electrically connected with one of the two conductive fasteners in the group of fasteners, each conductive fastener comprises a conductive connecting part in a shape of 'L' and a conductive clamping part positioned on one end of the conductive connecting parts, the clamping part is positioned outside the filament substrate, and the positive and the negative electrodes of the single packaging support are provided with through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810940106.8A CN109148669B (en) | 2018-08-17 | 2018-08-17 | Production method of modular filament and L ED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810940106.8A CN109148669B (en) | 2018-08-17 | 2018-08-17 | Production method of modular filament and L ED filament |
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| Publication Number | Publication Date |
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| CN109148669A CN109148669A (en) | 2019-01-04 |
| CN109148669B true CN109148669B (en) | 2020-07-31 |
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| CN201810940106.8A Active CN109148669B (en) | 2018-08-17 | 2018-08-17 | Production method of modular filament and L ED filament |
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| CN206682890U (en) * | 2017-04-24 | 2017-11-28 | 深圳市源磊科技有限公司 | Filament support, LED filament, filament support plate and LED filament plate |
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| CN102661515A (en) * | 2012-05-10 | 2012-09-12 | 陈广友 | Light emitting diode (LED) lamp |
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| CN109148669A (en) | 2019-01-04 |
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