200912348 九、發明說明： 【發明所屬之技術領域】 本發明是關於-種電子檢測裝置， 板片的大型基板。 ^括有夕個基 【先前技術】 制元件—般透過—㈣單元餘製造，例如工廠 電子晶粒分類（dectrical die _ing， ，製程以及封裝製程（packagingpr〇cess)。在心 在EDS製程中於晶圓内檢測電子電路的 並且在封”辦Μ ί- ®上早舰錄元件， 個的半導體=件後封於環氧樹脂中且封震成單 曰片之Sr瓜以如下步驟進行。由電子測試器透過盥 的探針尖端施加電訊號至石夕晶圓上之晶 極塾接後’奸職11透過探針尖端從晶片之電 常訊號，並侧晶片是否正常操作。因此，通 节糟由包括與晶片的電極 ^ 來進行EDS製程。_讀針尖端的電子測試器 最近’由於半導體製程技術的發展，p祛田士 扮 導體元件，單：:圓 電加，用以檢測更大石夕晶圓的 叫針基板加大，許職⑽平坦舰化，並因 200912348 此存在大型電子賴㈣探針尖端無法與^的電極塾 (electrode pad)均勻接觸的問題。 為了解決此問題，已經建議將平坦度足夠高的多個小 基j反片組裝成大型電子測試器的探針基板。然而，在電子 測試器的水平方向或垂直方向上配置每—基板片存在諸多 ，難。在迫種情況下，每一基板片可能位於大型電子測試 器内的不同垂直位置，並且因而各基板片的探針無法均勻 地配置於同一高度。 〇此外，在大型電子測試器的情況下，當大型電子測試 器中的任-探針不卫作’必須用新的測試器來替代整個電 子測試器，由此惡化了電子職ϋ的維護效率。 【發明内容】 因此，本發明體提供一種電子檢測裝置，其基板由多 個多個基板片組裝而成。 奴田夕 小根據本發明的—方面，提供了-種電子裝置，包括： 至>一基板片（substratepieces)，此至少二基板片包括與 檢測目標接觸的至少一探針（pr()be);至少一支撐件 ^support member) ’支撐基板片使得基板片彼此相鄰 疋4 乂及至^ 一调節件（adjusting member )，調節各基 板片相對支撐件的相對位置。探針定位於基板片的第一表 ，土板片和探針構成主基板結構（primary substrate structure)。 & 於μ施例中’調節件包括在垂直於支撐件的方向上 調即各基板>}相對切件之相對位置的第―調節單元。 200912348 於一實施例中，調節件包括在平行於支撐件的方向 調節各基板片相對支撐件之相對位置的第二調節單元。200912348 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic detecting device, a large substrate of a sheet. ^ Included in the base [previous technology] components - generally through - (four) cell manufacturing, such as factory electronic grain classification (dectrical die _ing, process and packaging process (packagingpr〇cess). In the heart in the EDS process in the crystal In the circle, the electronic circuit is detected and the semiconductor component is sealed, and the semiconductor is sealed in an epoxy resin and sealed into a single-chip Sr. The following steps are performed. The tester applies a signal signal through the probe tip of the crucible to the crystal pole on the Si Xi wafer. After the spoiler 11 passes the probe tip from the wafer to the normal signal, and the side wafer is operating normally. Therefore, the pass is bad. The EDS process is performed by the electrode including the wafer. _ The electronic tester for reading the tip of the needle recently 'Because of the development of semiconductor process technology, p祛田士 dressed as a conductor element, single:: round electric plus, used to detect the larger stone eve The wafer substrate of the wafer is enlarged, and the job (10) is flat and the problem is that the large-scale electronic (4) probe tip cannot be in uniform contact with the electrode pad due to the 200912348. In order to solve this problem, It has been proposed to assemble a plurality of small-substrate reversals having a sufficiently high flatness into a probe substrate of a large electronic tester. However, it is difficult to arrange each of the substrate sheets in the horizontal or vertical direction of the electronic tester. In the case of forced seeding, each of the substrate sheets may be located at different vertical positions within the large electronic tester, and thus the probes of the respective substrate sheets may not be uniformly disposed at the same height. 〇 In addition, in the case of a large electronic tester, Any-probe in a large electronic tester is not required to replace the entire electronic tester with a new tester, thereby deteriorating the maintenance efficiency of the electronic job. [Invention] Therefore, the present invention provides an electronic body. The detecting device has a substrate assembled from a plurality of substrate sheets. According to the aspect of the invention, there is provided an electronic device comprising: to > a substrate piece, the at least two substrates The sheet includes at least one probe (pr()be) in contact with the detection target; at least one support member) 'supporting the substrate sheet such that the substrate sheets are adjacent to each other 疋4 乂To an adjusting member, the relative position of each substrate piece relative to the support member is adjusted. The probe is positioned on the first table of the substrate piece, and the soil plate and the probe constitute a primary substrate structure. In the embodiment of the invention, the adjustment member includes a first adjustment unit that is adjusted in a direction perpendicular to the support member, that is, the relative position of each substrate > relative to the cutting member. 200912348 In an embodiment, the adjustment member is included in parallel to the support. The direction of the piece adjusts the second adjustment unit of the relative position of each substrate piece relative to the support.
於一貫施例中，第一調節單元或第二調節單元包括向 基板片施加壓力的調節螺絲（adjusting screw )，以夢^ 節基板片的相對位置。 5 D 於一實施例中，調節螺絲包括牽引基板片的牽引螺絲 (pull screw)以及推動基板片的推動螺絲（pushscrewf。' 於一實施例中，檢測裝置更包括介於基板片與支撐件 之間的至少一插入件（inserii〇n member )。 於一實施例中，檢測裝置更包括介於基板片與調節螺 絲之間的至少一補強件（reinforce member )。 於一實施例中，補強件包括調節螺絲所插入的貫孔 (penetration hole )。 於一實施例中’電子檢測裝置更包括與各基板之第二 表面接觸的輔助基板結構（SUpplementary substrate structure) ’基板片的第二表面與基板片的第一表面相對。 於一實施例中，輔助基板包括印刷電路板。 於一實施例中’輔助基板包括空間轉換器（space transformer)。 於一實施例中’輔助基板更包括定位於空間轉換器上 的印刷電路板（printed circuit board，PCB )。 於一實施例中，電子檢測裝置更包括將主基板結構的 基板片電性連接到辅助基板結構的連接件（connection member) ° 200912348 於-實施例中’基板片藉由焊接結合到輔助基板結構 上。 於一實施例中，電子檢測裝置更包括位於與第一表面 相對的基板結構之第二表面上的連接端（c〇nnecti〇n terminal)，連接端與探針藉由内部電路彼此電性連接。 於-實施例中，支撐件包括支撐基板片第一表面之邊 ，部份的第-框架（first frame )卩及支禮基板片之侧面的 第二框架（second frame )’使得探針定位於第一框架内部。 於一實施射’支撐件包括支禮與第-表面相對的基 板片之第二表面的第-框架以及支撐基板片之侧面的第二 框架。 於一實施例中，探針包括彈簧裝置（springdevice)。 於一實施例中，探針包括複合連接裝置（c〇mp〇site connection device ) 〇 於一實施例中，支撐件包括多個支撐條，支撐基板片， 使得基板片彼此相鄰定位。 於一實施例中，支撐件更包括框架，支撐基板片，使 得基板片彼此相鄰定位。 於一實施例中，調節件在平行於定位在框架内的基板 片之第一表面的方向上調節基板片的相對位置。 於一實施例中，調節件在垂直於定位在框架内的基板 片之第一表面的方向上調節基板片的相對位置。 於一實施例中，調節件在平行於定位在支撐條上的基 板片之第一表面的方向上調節基板片的相對位置。 200912348 於一實施例中，調節件包括向基板片施加壓力的調節 螺絲，以藉此調節基板片的相對位置。 於一實施例中，調節螺絲包括牽引基板片的第一螺絲 以及推動基板片的第二螺絲。 於一實施例中，電子檢測裝置更包括安裝於接合第一 螺絲之基板片部份的多個補強件（reinforce members )。 於一實施例中，電子檢測裝置更包括介於基板片與調 節螺絲之間的至少一補強件。 於一實施例中’補強件包括調節螺絲所插入的貫孔。 於一實施例中’支撐條包括在第一方向上延伸於基板 片上的第一條狀物（first bar)以及在垂直於第一方向的第 二方向上延伸於基板片上的第二條狀物（secondbar)。 於一實施例中，第一條狀物和第二條狀物定位於基板 片的同一表面。 於一實施例中’第二條狀物固定到第一條狀物。 於一實施例中，電子檢測裝置更包括至少一附加調節 件，用以在垂直方向上調節第二條狀物相對框架之相對位 置。 於一實施例中，第一條狀物和第二條狀物定位於基板 片的不同表面。 於一實施例中，電子檢測裝置更包括至少一附加調節 件（additional adjusting member)，用以在垂直方向上調 節第一條狀物和第二條狀物中之一者相對框架的相對位 置。 200912348 於^實，中，支#件包括支撐基板片的板狀物 (p ate)，使得基板片彼此相鄰定位。 於-實施例中，支撐件更包括從板狀物突出的柱狀 (column ) ° 於-實施例中，電子檢測裝置更包括穿過支撐件且固 定到與第-表面相對的基板片之第二表面上的至少一螺拾 (bolt) ’調節件藉由調節螺栓的位置來調節基板片的相 對位置。 於一實施例中，調節件包括與螺栓耦接的至少一螺母 (nut)，使得螺栓根據螺母的旋轉在垂直方向上移動，並 且藉由螺栓的垂直移動來調節固定於螺栓之基板片的相對 位置。 於一實施例中’調節件更包括固定到支撐件和調節螺 、、糸一者上的至少一螺栓蓋（b〇ltc〇ver)，螺栓蓋施加壓力 到螺栓以藉此保持由螺母調節之螺栓的垂直位置。 於一實施例中，調節件更包括固定於支撐件的至少一 螺絲，螺絲施加壓力至螺栓以藉此在平行於支撐件的方向 上移動螺栓。 ° 於一實施例中，貫孔的直徑大於螺栓的直徑。 根據本發明的實施例，支撐基板片，使得基板片彼此 ^鄰地配置於框架内，並且因而將基板片形成大型基板。 藉由在垂直及平行於基板片之上表面的方向上調節螺絲來 調節基板片與框架之間的間隙距離。因此，在水平和垂直 方向上調節電子檢測裝置的大型基板。 200912348 此外，支撐條更安裝於基板片上，並且可在垂直和水 平方向上調節基板片與支撐條之間的間隙距離以及基板片 與框架之間的距離。 【實施方式】 現f參照附圖更全面地描述本發明，附圖中顯示了本 發明的實施例。然而，本發明可以藉由許多不同形式實現 ?且=應，釋為侷限於本案所闡述的實施例。更破切地， 提供這些實施例是爲了使本公開内容透徹且詳盡，並且可 以將本發明的範圍全面地轉達給本領域熟知此項技藝者。 在附圖中，為了清楚起見誇大了層和區的尺寸以及相對尺 寸。 應該理解，當—元件或層被稱為“位於,，、 =接於”另-科或層上時，它可以直接位於、連接= 其他元件或層上或者可以存在中間元件或層。相 接_' “直接_於”或者“直接 要理Μ心Γ 多的任細及所有組合。 案使用術語“第—，，、“第二和，，和“第三，， 部件、田區^、部件、區、層和/或部份，但這些元件、 語僅用於區;。這些術 層或部份。_，Γ 區、層或者雜料一區域、 論之第-元件、，離本發明教導的情況下，下文討 。卩件、區、層或者部份可稱為第一元件、 11 200912348 部件、區、層或者部份。 “上，，===’例如“下方，，、“下面，，、“下，，、“上方”、 所干元生在本案中的使用是為了便於描述圖中 除了圖中所示的方位外，空件的關係。應該理解 用和/或操作時的不同方位對:語意圖包括元件在使 則描述為處於其他元件和/戍=;_如果圖中的元件反轉， 定位於此其他元件或零件的和/或下面的元件將 可包括上方和下方兩種23;:，示範性術語‘‘下π ㈣度或者纽其財幻，其财歧位(旋 描述進行相應地解釋。 、〃所使用的空間相對 作為 個”意圖包括複數形式，除非上吏下用文m开ς式;一”或者“一 更要理解術語“包括，，和/或“包:^Τ他方式明確表示。 在所提到的特徵、整體、步摔^^中^用時表示存 排除存在或增加其他特 件和/或部件，但不 件和/或其群組t的-個或多i體、步驟、操作、元件、部 圖示是示土圖來描述本發明的實施例，這些 此外，要預期到由^^^=及+間結構）的示意圖。 變化。因而，本發二二2差而可能產生的形狀 偏差：圏二是要包括例如由裳造所產二： 為矩形的植入區域通常在其邊綠具有圓 12 200912348 轉徵和/或植人濃度[梯度變化，而不是從植入區 植人區域的二位變化。同樣，藉由植人所形成的埋 内:生域與經其發生植入的表面之間的區域 -系種私度的植人。因而，圖中所示的區域本質上是 不思'生的亚且其形狀並不意圖限制本發明的範圍。 =非以其他方式定義，本案所使用的所有術語（包括 義;=所屬領域的熟知此項技 、吊理解的相冋。更要理解，諸如通用字血中定義 義應解釋為具有與相關領域背景下的含義相 或者過份正式的形式進行解釋，除非 面圖。 彳7子檢測裝置的線A-A，的橫截 片ηί照多圖個1支和 =，電子檢_ 100可包括多個基板 於-管如I件、多個調節件以及多個插入件140。 120,以使撐件包括支持基板片U〇的框架 節基板月m 鄰定位。調節件可包括用以調 土各AM 1 in切件之相對位置的調節螺絲130。 土板片110可定形成板狀，並且多個摈η 面上，針可==二 可獨立於目標直接翻。例如，探針112 基板二==者=將-組探針恤 或者结針112單舰钱於基板 13 200912348 片110的下表面。此外，探針112可與基板片11〇同時一 體製成。儘管本實施例公開了懸臂型探針（ca福ever咖 probe)，但允許使用本領域熟知此項技藝者習知的任意其 他修改作為探針的形狀。例如，垂直型探針可用來替代懸 臂型探針或者與懸臂型探針結合作為探針112。 於λ加例中，採針可包括位於膜片上的彈簧單元、 複合連接單元（composite c〇nnecti〇n unit)以及點接觸突 塊（point_c〇macted bump)。彈簧單元可包括任意類型的 縱向元件，其端部是相對外力呈彈性的。複合連接單元可 包括芯元件（core device)以及披覆元件（〇ver_c〇ating device)，披覆元件為披覆有某些材質的芯元件。披覆元 件具有相對小的降服強度（yield对代呢也）且包括延展性 材質，而披覆元件具有相對大的降服強度且包括硬質材 貝延展性材質的實例可包括金線（gold wire)，而硬質 材貝的男、例可包括錄（Ni)和錄合金。披覆元件的披覆製 程可包括用以披覆芯元件的芯之芯披覆、單層或多層披覆 製程、粗披覆製程（其中在披覆表面上保留多個微小突起） 以及全披覆或部份披覆製程（其中披覆芯的整體或部份）。 披覆可藉由本領域熟知此項技藝者習知的適當方法進行， 例如 H ( precipitation )、電鑛（electroplating )、化學 氣相沈積（chemical vapor deposition，CVD)、物理氣相 沈積（physical vapor deposition，PVD)以及固相、液相以 及氣相之間的相分離。此外’芯元件可包括縱向元件，其 包括硬質材質且作為彈簧裝置。 14 200912348 多個電極墊（未繪示）可位於各基板片11〇之上表面 上，並且各電極墊可包括導電材質。訊號線（未繪示）定 位於基板片110的内部，並且可電性連接到電極墊以及探 針112。例如，訊號線可包括多層配線結構（mu跑ayered wiring structure )以及電性連接於多層配線結構之介層窗插 塞（via-plug )。 基板片110配置成使得基板片Ho的侧面彼此相鄰。 例如，基板片110的側面可彼此直接接觸或者與相鄰侧面 間隔較小的間隙距離。 此外，基板片110可配置成檢查圖案（checkpattem) 或者交叉條狀圖案（cross stripe pattern)。此外，基板片 110可串聯配置。當基板片110配置成檢查圖案或者交叉 條狀圖案時，為大型電子檢測裝置100提供了偶數個基板 片110。在本實施例中’為大型電子檢測裝置1〇〇提供二、 四、六或八個基板片。當基板片11〇串聯配置時，可為大 型電子檢測裝置100提供至少二基板片。 圖3是圖1所示之框架的透視圖，而圖4是圖1所示 之框架的變型的透視圖。 參照圖1至圖4 ’框架120可包括第一子框架122以 及第二子框架124。 第一子框架122定形成板狀，並且具有與基板片u〇 數量相同的開口。第一子框架122可支撐基板片11〇的邊 緣部份。基板片110上之探針112透過第一子框架122的 開口暴露。 15 200912348 第二子框架124從第一子框架122的邊緣部份垂直突 起。第二子框架124支撐彼此相鄰配置之基板片no的側 面。當基板片110在框架120内配置成檢查圖案時，鄰近 之基板片110的一對側面彼此直接接觸，而基板片的 至少一侧面不與另一基板片11〇接觸。之後，基板片110 之與鄰近基板片110的另一侧面接觸的側面被稱作結合側 面（conjugate side surface) ’而基板片11〇與另一鄰近基 板片110的另一侧面不接觸的侧面被稱作孤立侧面 (isolated side surface)。因而，第二子框架124可以支持 基板片110的孤立側面。如圖3所示，第二子框架124不 位於鄰近基板片110之間，以使鄰近基板片11〇具有至少 一結合側面。然而，第二子框架124也可如圖4所示的位 於鄰近基板片110之間，以使基板片110不具有結合側面。 在這種情況下，第二子框架124可支撐基板片110的所有 侧面。 框架120支撐基板片11〇,以使基板片丨1〇彼此相鄰， 使得多個基板片110可在電子檢測裝置1〇〇内組成單 型探針基板。 中心件（未繪示）介於框架12〇與基板片n〇之間， 使得各基板片110定位於框架12〇的中心。中心件的實例 可包括彈簧片。 再次參照圖1和圖2，調節螺絲130可包括第一螺絲 132以及第二螺絲134。 、' 於一實施例中，第一螺絲132可包括第一牽引螺絲 16 200912348 132a以及第一推動螺絲132b。 第一牽引螺絲132a可在圖3和圖4内的z軸方向上從 第一子框架122的下表面向上旋擰（screw叩）到第一子 框架122的上表面，藉此穿過第-子框架122並插入基板 片110。第一牽引螺絲132a也可從基板片11〇的上表面向 下旋擰（screw down)到基板片110的下表面，以藉此穿 過基板片110並插入第一子框架122。因而，藉由在z軸 方向上擰緊第一牽引螺絲132a來縮短第一子框架122與基 板片110之間的第一間隙距離。 第一推動螺絲132b可在z軸方向上從第一子框架 的下表面向上旋擰到第一子框架122的上表面，藉此穿過 第一子框架122並與基板片110接觸。第一推動螺絲13沘 也可從基板片110的上表面向下旋擰到基板片11〇的下表 面，以藉此穿過基板片110並與第一子框架122接觸。因 而，藉由在Z軸方向上擰緊第一推動螺絲132b來增加第一 子框架122與基板片110之間的第一間隙距離。 因此，可藉由第一牽引螺絲132a與第一推動螺絲132b 控制第一子框架122與基板片110之間的第一間隙距離， 以藉此在z轴方向上調節基板片110相對第一子框架122 的垂直位置。 於一實施例中，第二螺絲134可包括第二牽引螺絲 134a以及第二推動螺絲134b。 第一牽引螺絲134a可在圖3和圖4的X軸或y軸方向 上從第二子框架124的外表面旋擰到第二子框架124的内 17 200912348 内面因二藉，穿過第二子框架124並且插入到基板片no ’可藉由在X軸或y軸方向上擰緊第二牽引螺絲 134a來縮短第二子框架124與基板片削之間的第二間 距離。 、 第一推動螺絲134b可在χ軸或y軸方向上從第二子框 架124的外表面旋擰到第二子框帛124㈣表Sr，以藉此 穿過第二子框架124並且接觸基板片110。因而，可藉由 在X轴或y軸方向上擰緊第二推動螺絲134b來增加第二子 框架124與基板片11〇之間的第二間隙距離。 因而’可藉由第二牽引螺絲134a與第二推動螺絲134b 來控制第二子框架124與基板片110之間的第二間隙距 離，藉此在X軸或y軸方向上調節基板片n〇相對第二子 框架124的水平位置。第二螺絲134可穿過第二子輕架 124’並且在基板片11〇之至少一孤立側面上牽引或推動基 板片110,使得可在與基板片11〇的上表面平行之乂軸或y 轴方向上調節各基板片110。於本實施例中，第二螺絲134 接合到基板片110的二孤立側面。 第一螺絲132和第二螺絲134通過框架120的第一 孔，並且經第二孔插入基板片110。 於一實施例中’第一牽引螺絲132a和第二牽引螺絲 134a所通過的第一孔的直徑大於第一推動螺絲132b和第 二推動螺絲134b所通過之第一孔的直徑。 於一實施例中，第一孔的直徑實質上與第一螺絲132 的直徑相同，而第二孔的直徑實質上與第二嫘絲134的直 18 200912348 徑相同。如本領域熟知此項技藝者所習知的，第一螺絲132 和第二螺絲134與第一孔和第二孔的侧壁的間隔距離處於 容許的製程容限（processing tolerance)内。 於本實施例中，第二螺絲134接合到彼此相鄰之基板 片no的第一和第二孤立側面，並且藉由在一第二螺絲134 接合到基板片110之第一孤立侧面的情況下鬆開或擰緊接 合於第二孤立側面之另-第二螺絲134，在平行於基板片 110,上表面的X軸* y軸方向上調節基板片n。。進一 步j由在第-螺絲132接合於基板片11〇之 擰緊接合於孤立側面之第二螺絲 ： =:二之上表面的χ柏或y軸方向上調節=片 、兄下，藉弟"'螺絲134接合於基板片110下表面的情 板片^開或摔緊第一螺絲132在2轴方向上調節基 除去二如本領域熟知此項技藝者所習知的， 可僅包括第-螺_， 110。 y釉万向上調節基板片 貫施例中，如本領域熟知此項技蓺者 使得僅在X _ y 可僅包括第二螺絲132， ii〇。 y軸方向科在4方向上調節基板片 一Ϊ施例中，如本領域熟知此項技蓺者π H絲132a和第二牵引螺絲丨 w町 %外，調節螺 19 200912348 絲130僅包括第一推動螺絲132b和第二推動螺絲13牝， 使得僅以在X軸、y軸和z軸方向增加但不減小基板片ιι〇 與框架120之間的第一和第二間隙距離的方式調節基板片 110。 土 因此，調節螺絲130可控制基板片110與框架12〇之 間的第一和第二間隙距離，藉此調節各基板片11〇的水平 位置和垂直位置。 如下文參照圖55和圖56所描述的，利用接合於基板 片110上之螺栓和螺母來替代調節螺絲13〇，以藉由螺栓 和螺母來調節各基板片110的水平位置和垂直位置。' 於一實施例中，插入件140可包括第一插入部142和 第二插入部144。 第一插入部142介於第一子框架122與基板片11〇之 下表面之間。第一插入部142可具有體積彈性（v〇iume elasticity)和形狀彈性（shape eiasticity)。具有體積彈性 之第一插入部142的實例可包括含彈性材質的彈性板，而 具有形狀彈性之第一插入部142的實例可包括彈簧以及墊 圈。彈簧或墊圈可與第一螺絲132 —起使用。第—子框架 122藉由第一插入部142與基板片110間隔。擰緊第一螺 絲132可引起第一插入部142的壓縮，而藉由鬆開第一螺 絲132來恢復壓縮的第一插入部142。此外，第一插入部 142可吸收施加於基板片11〇的外部衝擊。如本領域熟知 此項技藝者習知的，儘管本實施例揭示了第一插入部142 包括彈性材質，但第一插入部142可包括非彈性材質。當 20 200912348 弟子框架122藉由第一插入部142與基板片11〇分離或 間隔時，第一子框架122與基板片110之間的間隔距離由 第一插入部142的長度確定。因而，當調節基板片110時， 其長度對應於間隔距離的第一插入部142可插入於第一子 框架122與基板片11 〇之間，以藉此輕易地控制第—子框 架122與基板片11〇之間的間隔距離。 弟一插入部144可介於第二子框架124與基板片11〇 之孤立侧面之間’並可介於鄰近基板片no之間。當第二 子框架124介於基板片110之間時，第二插入部144可僅 介於第二子框架124與基板片11〇之孤立側面之間。第二 插入部14的結構和配置與第一插入部142相同，並且省略 了關於第二插入部144的更詳細的描述。 如本領域熟知此項技藝者習知的，儘管本實施例揭示 了插入件140介於框架120與基板片11〇之間，但是框架 120與基板片11〇之間也可不設置插入件。 因此，藉由調節螺絲130來調節基板片no的垂直和 水平位置，以使基板片110的垂直調節可允許基板片n〇 在z轴方向上定位於相同位置，以藉此改良基板片11()的 高度均勻度’並且基板片110的水平調節允許安裝於基板 片110上的探針在X軸或y轴方向上串聯配置。 圖5是繪示圖1所示之電子檢測裝置中的基板片調節 的平面圖，而圖6是繪示圖2所示之電子檢測裝置中的基 板片調節的橫截面圖。 在圖5和圖6’為了便於描述，使用了與圖3和圖4 200912348 相同的卡氏座標系統（Cartesian coordinate system)，並且 因而x軸和y軸平行於框架12〇的頂面延伸，而Z轴垂直 於框架120的頂面延伸。在本實施例中，基板片⑴包括 兩個孤立側面以及兩個結合側面，並且因而在下文中將平 行於=軸之基板片11〇的孤立侧面稱為第一孤立側面，而 將平订於y軸之基板片i 1G的孤立侧面稱為第二孤立側面。 於-實施例中，藉由擰緊接合於基板片11〇之第二孤 立侧面的第二牽引螺絲13如來在χ轴方向上靠近第二子框 架j24移動基板片11〇,並且藉由摔緊接合於基板片⑽ ^第二孤立侧面上的第二推動螺絲⑽在X轴方向上遠離 第子框架m㈣基板片u。。在這種情況下，面向基 板=110之第-孤立側面的第二牽引螺絲⑽牢固地接合 m二上’使得面向第一孤立側面的第二牽引螺絲 主立側面的第二推動螺絲⑽仍接觸基 板片110的情況下與基板片110 一起在 ==::r4a所通過之框架120的第-：徑 ί二的直徑’經框架120之第-孔插入In a consistent embodiment, the first conditioning unit or the second conditioning unit includes an adjusting screw that applies pressure to the substrate sheet to capture the relative position of the substrate sheet. 5D In one embodiment, the adjusting screw comprises a pull screw for pulling the substrate piece and a push screw for pushing the substrate piece. In an embodiment, the detecting device further comprises a substrate piece and a support member. At least one insert member (in the embodiment), the detecting device further includes at least one reinforcing member interposed between the substrate piece and the adjusting screw. In an embodiment, the reinforcing member The invention includes a penetration hole into which the adjusting screw is inserted. In an embodiment, the electronic detecting device further includes an auxiliary substrate structure that contacts the second surface of each substrate, and a second surface of the substrate sheet and the substrate. The first substrate is opposite to each other. In one embodiment, the auxiliary substrate comprises a printed circuit board. In an embodiment, the auxiliary substrate comprises a space transformer. In an embodiment, the auxiliary substrate further comprises a space. a printed circuit board (PCB) on the converter. In an embodiment, the electronic detection device further includes a main The substrate piece of the board structure is electrically connected to the connection member of the auxiliary substrate structure. [200912348] In the embodiment, the substrate piece is bonded to the auxiliary substrate structure by soldering. In an embodiment, the electronic detecting device further includes a connection end on the second surface of the substrate structure opposite to the first surface, the connection end and the probe are electrically connected to each other by an internal circuit. In the embodiment, the support member includes a support The side of the first surface of the substrate piece, a portion of the first frame and the second frame of the side of the substrate substrate enable the probe to be positioned inside the first frame. The support member includes a first frame that supports the second surface of the substrate sheet opposite to the first surface and a second frame that supports the side surface of the substrate sheet. In one embodiment, the probe includes a spring device. In an embodiment, the probe includes a composite connection device (c〇mp〇site connection device). In one embodiment, the support member includes a plurality of support strips, supporting the substrate piece, so that the substrate piece is In an embodiment, the support further includes a frame supporting the substrate piece such that the substrate pieces are positioned adjacent to each other. In one embodiment, the adjustment member is parallel to the first substrate piece positioned in the frame. The relative position of the substrate sheets is adjusted in the direction of the surface. In one embodiment, the adjustment members adjust the relative positions of the substrate sheets in a direction perpendicular to the first surface of the substrate sheets positioned within the frame. In one embodiment, the adjustment member adjusts the relative position of the substrate sheet in a direction parallel to the first surface of the substrate sheet positioned on the support strip. In an embodiment, the adjustment member includes an adjustment screw that applies pressure to the substrate piece to thereby adjust the relative position of the substrate piece. In one embodiment, the adjustment screw includes a first screw that pulls the substrate piece and a second screw that pushes the substrate piece. In one embodiment, the electronic detecting device further includes a plurality of reinforce members mounted on the substrate piece portion of the first screw. In one embodiment, the electronic detecting device further includes at least one reinforcing member interposed between the substrate piece and the adjusting screw. In one embodiment, the 'reinforcing member' includes a through hole into which the adjusting screw is inserted. In one embodiment, the support strip includes a first bar extending in a first direction on the substrate sheet and a second strip extending on the substrate sheet in a second direction perpendicular to the first direction. (secondbar). In one embodiment, the first strip and the second strip are positioned on the same surface of the substrate sheet. In one embodiment, the second strip is secured to the first strip. In one embodiment, the electronic detection device further includes at least one additional adjustment member for adjusting the relative position of the second strip relative to the frame in a vertical direction. In one embodiment, the first strip and the second strip are positioned on different surfaces of the substrate sheet. In one embodiment, the electronic detecting device further includes at least one additional adjusting member for adjusting the relative position of one of the first strip and the second strip relative to the frame in a vertical direction. 200912348 In the middle, the support member includes a plate supporting the substrate piece such that the substrate pieces are positioned adjacent to each other. In an embodiment, the support member further includes a column protruding from the plate. In the embodiment, the electronic detecting device further includes a substrate piece that passes through the support member and is fixed to the substrate surface opposite to the first surface. At least one bolt's adjustment member on the two surfaces adjusts the relative position of the substrate sheets by adjusting the position of the bolts. In an embodiment, the adjusting member includes at least one nut coupled to the bolt, so that the bolt moves in a vertical direction according to the rotation of the nut, and the relative movement of the substrate piece fixed to the bolt is adjusted by the vertical movement of the bolt. position. In an embodiment, the adjusting member further comprises at least one bolt cover (b〇ltc〇ver) fixed to the support member and the adjusting screw, and the bolt cover applies pressure to the bolt to thereby maintain the adjustment by the nut. The vertical position of the bolt. In one embodiment, the adjustment member further includes at least one screw secured to the support member, the screw applying pressure to the bolt to thereby move the bolt in a direction parallel to the support member. ° In one embodiment, the diameter of the through hole is larger than the diameter of the bolt. According to an embodiment of the present invention, the substrate sheets are supported such that the substrate sheets are disposed adjacent to each other within the frame, and thus the substrate sheets are formed into a large substrate. The gap distance between the substrate piece and the frame is adjusted by adjusting the screws in a direction perpendicular and parallel to the upper surface of the substrate piece. Therefore, the large substrate of the electronic detecting device is adjusted in the horizontal and vertical directions. 200912348 In addition, the support strip is further mounted on the substrate piece, and the gap distance between the substrate piece and the support strip and the distance between the substrate piece and the frame can be adjusted in the vertical and horizontal directions. [Embodiment] The present invention will now be described more fully hereinafter with reference to the accompanying drawings in which FIG. However, the invention can be embodied in many different forms and is intended to be limited to the embodiments set forth herein. The embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention may be fully conveyed to those skilled in the art. In the drawings, the size and relative dimensions of the layers and regions are exaggerated for clarity. It will be understood that when an element or layer is referred to as "located on," Dating _' "Direct _" or "Directly arguing for more details and all combinations. The case uses the terms "--,," "Second and," and "Third,, parts, field ^, parts, zones, layers and/or parts, but these elements, words are used only for zones; These layers or parts. _, Γ zone, layer or groceries-area, the first element, and the teachings of the present invention are discussed below. A component, region, layer or portion may be referred to as a first component, 11 200912348 component, region, layer or portion. "上,, ===', for example, "below,", "below,", "lower,", "above", and the use of the dry metamorphism in this case is for the convenience of describing the orientation in the figure except the figure. Outside, the relationship of empty pieces. It should be understood that different orientations are used and/or operational: the language intent includes the elements being described as being in other elements and /戍=; if the elements in the figures are reversed, positioned in the other elements or parts and/or The following components will be able to include both upper and lower 23;:, the exemplary term ''under π (four) degrees or New Zealand's financial illusion, its fiscal position (spin description is interpreted accordingly.) "Intended to include the plural form, unless the captain is used to open the syllabary; a" or "a more understanding of the term "including," and / or "package: ^ Τ his way to express clearly. , whole, step, and when used to indicate the existence or exclusion of other special features and / or components, but not and / or its group t - or more than the body, steps, operations, components, departments The illustration is a soil map to describe an embodiment of the present invention, and in addition, a schematic diagram of the structure between ^^^= and + is expected. Therefore, the shape deviation of the present invention may be: The second is to include, for example, the production of the two: the rectangular implant area is usually The green side has a round 12 200912348 transition and / or implant concentration [gradient change, rather than a two-dimensional change from the implanted area of the implanted area. Similarly, the burial formed by the implanted person: the birth area and the The region between the implanted surfaces occurs - the planting of the species. Thus, the regions shown in the figures are essentially inconspicuous and their shape is not intended to limit the scope of the invention. Other ways to define, all the terms used in this case (including the meaning; = the well-known skills in the field, the relative understanding of the understanding. It is also understood that the definition in the general word blood should be interpreted as having the context of the relevant field The meaning phase or the excessive formal form is explained, unless the surface is shown. 彳7 sub-detection device line AA, the cross-section ηί photo multi-graph 1 and =, electronic inspection _ 100 can include multiple substrates in the tube For example, the I piece, the plurality of adjusting members and the plurality of inserting members 140. 120, so that the supporting member comprises the frame joint substrate of the supporting substrate piece U〇. The adjusting member may comprise the grounding of each AM 1 in cutting piece. The relative position of the adjusting screw 130. The soil sheet 110 can be formed into a plate And on multiple 摈n faces, the needle can be == two can be directly flipped independently of the target. For example, the probe 112 substrate two == person = will - group probe shirt or pin 112 single ship money on the substrate 13 200912348 The lower surface of the 110. Further, the probe 112 can be integrally formed with the substrate sheet 11 。. Although the present embodiment discloses a cantilever type probe, it is allowed to use the skill of the art. Any other modification is known as the shape of the probe. For example, a vertical probe can be used in place of or in combination with a cantilever probe as probe 112. In the lambda addition, the needle can be placed on the diaphragm. Spring unit, composite connection unit (composite c〇nnecti〇n unit) and point contact projection (point_c〇macted bump). The spring unit can comprise any type of longitudinal element whose ends are resilient to external forces. The composite connecting unit may include a core device and a 〇ver_c〇ating device, and the covering member is a core member coated with certain materials. The drape element has a relatively small drop strength (yield also) and includes a ductile material, while the drape element has a relatively large drop strength and examples of hard material shell ductile materials may include a gold wire. The male and the case of the hard material shell may include a recording (Ni) and a recording alloy. The coating process of the cladding element may include a core core coating for covering the core element, a single layer or a multilayer coating process, a coarse coating process (in which a plurality of minute protrusions are left on the surface of the coating), and a full coating Cover or partial coating process (in which the whole or part of the core is covered). The coating can be carried out by any suitable method known to those skilled in the art, such as H (precipitation), electroplating, chemical vapor deposition (CVD), physical vapor deposition (physical vapor deposition). , PVD) and phase separation between the solid phase, the liquid phase, and the gas phase. Further, the core element may comprise a longitudinal element comprising a hard material and acting as a spring means. 14 200912348 A plurality of electrode pads (not shown) may be located on the upper surface of each of the substrate sheets 11 , and each of the electrode pads may include a conductive material. A signal line (not shown) is located inside the substrate piece 110 and is electrically connected to the electrode pad and the probe 112. For example, the signal line may include a multilayer wiring structure (mu run ayered wiring structure) and a via-plug electrically connected to the multilayer wiring structure. The substrate sheets 110 are disposed such that the side faces of the substrate sheets Ho are adjacent to each other. For example, the sides of the substrate sheet 110 may be in direct contact with each other or a small gap distance from adjacent sides. Further, the substrate piece 110 may be configured to inspect a checkpattem or a cross stripe pattern. Further, the substrate sheets 110 may be arranged in series. When the substrate sheet 110 is configured to inspect a pattern or a cross strip pattern, an even number of substrate sheets 110 are provided for the large electronic detecting device 100. In the present embodiment, two, four, six or eight substrate sheets are provided for the large-scale electronic detecting device 1A. When the substrate sheets 11 are arranged in series, at least two substrate sheets can be provided for the large-sized electronic detecting device 100. Figure 3 is a perspective view of the frame shown in Figure 1, and Figure 4 is a perspective view of a variation of the frame shown in Figure 1. Referring to Figures 1 through 4, the frame 120 can include a first sub-frame 122 and a second sub-frame 124. The first sub-frame 122 is formed into a plate shape and has the same number of openings as the substrate piece u. The first sub-frame 122 can support the edge portion of the substrate piece 11〇. The probe 112 on the substrate piece 110 is exposed through the opening of the first sub-frame 122. 15 200912348 The second sub-frame 124 protrudes perpendicularly from the edge portion of the first sub-frame 122. The second sub-frame 124 supports the side faces of the substrate sheets no disposed adjacent to each other. When the substrate sheet 110 is disposed in the frame 120 to inspect the pattern, a pair of side faces of the adjacent substrate sheets 110 are in direct contact with each other, and at least one side surface of the substrate sheet is not in contact with the other substrate sheet 11 . Thereafter, the side of the substrate piece 110 that is in contact with the other side of the adjacent substrate piece 110 is referred to as a conjugate side surface 'the side of the substrate piece 11 不 that is not in contact with the other side of the other adjacent substrate piece 110 is It is called an isolated side surface. Thus, the second sub-frame 124 can support the isolated side of the substrate piece 110. As shown in FIG. 3, the second sub-frame 124 is not located between adjacent substrate sheets 110 such that adjacent substrate sheets 11 have at least one combined side. However, the second sub-frame 124 may also be located between adjacent substrate sheets 110 as shown in FIG. 4 such that the substrate sheet 110 does not have a bonding side. In this case, the second sub-frame 124 can support all sides of the substrate piece 110. The frame 120 supports the substrate sheets 11A so that the substrate sheets 1丨 are adjacent to each other such that the plurality of substrate sheets 110 can constitute a single-type probe substrate in the electron detecting device 1A. A center member (not shown) is interposed between the frame 12A and the substrate sheet n〇 such that each of the substrate sheets 110 is positioned at the center of the frame 12〇. An example of a center piece may include a spring piece. Referring again to Figures 1 and 2, the adjustment screw 130 can include a first screw 132 and a second screw 134. In an embodiment, the first screw 132 can include a first traction screw 16 200912348 132a and a first push screw 132b. The first traction screw 132a may be screwed upward from the lower surface of the first sub-frame 122 to the upper surface of the first sub-frame 122 in the z-axis direction in FIGS. 3 and 4, thereby passing through the first The sub-frame 122 is inserted into the substrate piece 110. The first pulling screw 132a can also be screwed down from the upper surface of the substrate piece 11 to the lower surface of the substrate piece 110 to thereby pass through the substrate piece 110 and be inserted into the first sub-frame 122. Thus, the first gap distance between the first sub-frame 122 and the substrate sheet 110 is shortened by tightening the first pulling screw 132a in the z-axis direction. The first push screw 132b is screwed upward from the lower surface of the first sub-frame to the upper surface of the first sub-frame 122 in the z-axis direction, thereby passing through the first sub-frame 122 and coming into contact with the substrate piece 110. The first push screw 13 turns can also be screwed down from the upper surface of the substrate piece 110 to the lower surface of the substrate piece 11 to thereby pass through the substrate piece 110 and come into contact with the first sub-frame 122. Therefore, the first gap distance between the first sub-frame 122 and the substrate piece 110 is increased by tightening the first push screw 132b in the Z-axis direction. Therefore, the first gap distance between the first sub-frame 122 and the substrate piece 110 can be controlled by the first pulling screw 132a and the first pushing screw 132b, thereby adjusting the substrate piece 110 relative to the first sub-section in the z-axis direction. The vertical position of the frame 122. In an embodiment, the second screw 134 can include a second traction screw 134a and a second push screw 134b. The first traction screw 134a can be screwed from the outer surface of the second sub-frame 124 to the inner surface of the second sub-frame 124 in the X-axis or y-axis direction of FIGS. 3 and 4, and the inner surface of the second sub-frame 124 is passed through the second The sub-frame 124 and the insertion into the substrate piece no' can shorten the second distance between the second sub-frame 124 and the substrate piece by tightening the second pulling screw 134a in the X-axis or y-axis direction. The first push screw 134b can be screwed from the outer surface of the second sub-frame 124 to the second sub-frame 124 (four) table Sr in the x-axis or y-axis direction, thereby passing through the second sub-frame 124 and contacting the substrate piece 110. Thus, the second gap distance between the second sub-frame 124 and the substrate piece 11〇 can be increased by tightening the second push screw 134b in the X-axis or y-axis direction. Therefore, the second gap distance between the second sub-frame 124 and the substrate piece 110 can be controlled by the second pulling screw 134a and the second pushing screw 134b, thereby adjusting the substrate piece n in the X-axis or y-axis direction. Relative to the horizontal position of the second sub-frame 124. The second screw 134 can pass through the second sub-light frame 124' and pull or push the substrate piece 110 on at least one isolated side of the substrate piece 11 , so that the yoke or y can be parallel to the upper surface of the substrate piece 11〇 Each of the substrate sheets 110 is adjusted in the axial direction. In the present embodiment, the second screw 134 is bonded to the two isolated side faces of the substrate piece 110. The first screw 132 and the second screw 134 pass through the first hole of the frame 120 and are inserted into the substrate piece 110 through the second hole. In one embodiment, the diameter of the first hole through which the first traction screw 132a and the second traction screw 134a pass is larger than the diameter of the first hole through which the first push screw 132b and the second push screw 134b pass. In one embodiment, the diameter of the first hole is substantially the same as the diameter of the first screw 132, and the diameter of the second hole is substantially the same as the diameter of the straight wire 18 200912348 of the second wire 134. As is well known to those skilled in the art, the first screw 132 and the second screw 134 are spaced apart from the sidewalls of the first and second apertures within acceptable processing tolerances. In the present embodiment, the second screw 134 is bonded to the first and second isolated sides of the substrate piece no adjacent to each other, and by the bonding of a second screw 134 to the first isolated side of the substrate piece 110 The other-second screw 134 joined to the second isolated side is loosened or screwed, and the substrate piece n is adjusted in the X-axis*y-axis direction parallel to the upper surface of the substrate piece 110. . Further, the second screw is screwed to the isolated side by the first screw 13 joined to the substrate piece 11: =: the upper surface of the cypress or the y-axis direction is adjusted = piece, brother, borrowed brother " The screw 134 is bonded to the lower surface of the substrate sheet 110 to open or collapse the first screw 132 to adjust the base in the 2-axis direction. As is well known to those skilled in the art, it may include only the first Snail _, 110. y glazing varnish upward adjustment of the substrate sheet In the embodiment, as is well known in the art, only the second screw 132, ii 可 can be included only at X y y. The y-axis direction section adjusts the substrate piece in the four directions. In the embodiment, as is well known in the art, the π H wire 132a and the second traction screw 丨w %%, the adjustment screw 19 200912348 wire 130 includes only the first A push screw 132b and a second push screw 13牝 are adjusted so as to increase only in the X-axis, y-axis, and z-axis directions without reducing the first and second gap distances between the substrate piece ιι and the frame 120. Substrate sheet 110. Therefore, the adjusting screw 130 can control the first and second gap distances between the substrate piece 110 and the frame 12, thereby adjusting the horizontal position and the vertical position of each of the substrate pieces 11A. The adjusting screw 13A is replaced with a bolt and a nut joined to the substrate piece 110 to adjust the horizontal position and the vertical position of each of the substrate pieces 110 by bolts and nuts, as described below with reference to Figs. 55 and 56. In one embodiment, the insert 140 can include a first insert 142 and a second insert 144. The first insertion portion 142 is interposed between the first sub-frame 122 and the lower surface of the substrate piece 11A. The first insertion portion 142 may have a volume elasticity and a shape eiasticity. An example of the first insertion portion 142 having volume elasticity may include an elastic plate containing an elastic material, and an example of the first insertion portion 142 having a shape elasticity may include a spring and a gasket. A spring or washer can be used with the first screw 132. The first sub-frame 122 is spaced apart from the substrate piece 110 by the first insertion portion 142. Tightening the first screw 132 causes compression of the first insertion portion 142, and the first insertion portion 142 is restored by loosening the first screw 132. Further, the first insertion portion 142 can absorb an external impact applied to the substrate sheet 11A. As is well known to those skilled in the art, although the present embodiment discloses that the first insertion portion 142 includes an elastic material, the first insertion portion 142 may include a non-elastic material. When the discriminal frame 122 is separated or spaced from the substrate piece 11 by the first insertion portion 142, the separation distance between the first sub-frame 122 and the substrate piece 110 is determined by the length of the first insertion portion 142. Therefore, when the substrate piece 110 is adjusted, the first insertion portion 142 whose length corresponds to the separation distance can be inserted between the first sub-frame 122 and the substrate piece 11 , to thereby easily control the first sub-frame 122 and the substrate. The separation distance between the sheets 11〇. The first insertion portion 144 may be interposed between the second sub-frame 124 and the isolated side of the substrate sheet 11' and may be interposed between adjacent substrate sheets no. When the second sub-frame 124 is interposed between the substrate sheets 110, the second insertion portion 144 may be interposed only between the second sub-frame 124 and the isolated side of the substrate sheet 11''. The structure and configuration of the second insertion portion 14 are the same as those of the first insertion portion 142, and a more detailed description about the second insertion portion 144 is omitted. As is well known to those skilled in the art, although the present embodiment discloses that the interposer 140 is interposed between the frame 120 and the substrate piece 11A, the interposer may not be disposed between the frame 120 and the substrate piece 11''. Therefore, the vertical and horizontal positions of the substrate sheets no are adjusted by adjusting the screws 130 so that the vertical adjustment of the substrate sheets 110 allows the substrate sheets n〇 to be positioned at the same position in the z-axis direction, thereby improving the substrate sheets 11 ( The height uniformity 'and the horizontal adjustment of the substrate piece 110 allows the probes mounted on the substrate piece 110 to be arranged in series in the X-axis or y-axis direction. Figure 5 is a plan view showing the adjustment of the substrate piece in the electronic detecting device shown in Figure 1, and Figure 6 is a cross-sectional view showing the adjustment of the substrate in the electronic detecting device shown in Figure 2. In FIGS. 5 and 6', for the convenience of description, the same Cartesian coordinate system as that of FIGS. 3 and 4 200912348 is used, and thus the x-axis and the y-axis extend parallel to the top surface of the frame 12A, and The Z axis extends perpendicular to the top surface of the frame 120. In the present embodiment, the substrate piece (1) includes two isolated side faces and two joined side faces, and thus the isolated side surface of the substrate piece 11〇 parallel to the = axis will hereinafter be referred to as a first isolated side surface, and will be flat on y. The isolated side of the substrate piece i 1G of the shaft is referred to as a second isolated side. In the embodiment, the second pulling screw 13 joined to the second isolated side of the substrate piece 11 is screwed to move the substrate piece 11 靠近 in the z-axis direction toward the second sub-frame j24, and is joined by breaking. The second push screw (10) on the second isolated side of the substrate piece (10) is away from the first sub-m frame (m) of the substrate piece u in the X-axis direction. . In this case, the second pulling screw (10) facing the first-isolated side of the substrate=110 firmly engages the m's upper side so that the second push screw (10) of the main vertical side of the second pulling screw facing the first isolated side is still in contact In the case of the substrate piece 110, the diameter of the -: diameter ί of the frame 120 through which the ==::r4a passes together with the substrate piece 110 is inserted through the first hole of the frame 120
二5 孤立側面的第二牽引螺絲134a可在X °移動，直到面對第二孤立側面的第二牽引if # 完全旋擰入基板片11〇内。 的弟晕引螺絲 Θ上軸方向上移動’其移動方式與x軸方 向上的上述移動實質上相同。 於一實施例中，藉由擰腎笛 ^ „ 可在ζ財向上向下t動/Λϋ使基板片 卜移動，並且猶由擰緊第一推動螺 22 200912348 絲132b在z軸方向上向上移動。以相同的方式，由於第二 牽引螺絲134a所通過之框架12㈣第一孔的直徑大於第二 牵引螺絲134a的直徑’經框架12〇之第一孔插入基板片 no之孤立側面的第二牽引螺絲134a可在z軸方向上移 動，直到第一牽引螺絲132a穿過第一子框架完全旋擰入基 板片110内。在這種情況下，面向孤立侧面的第二推動螺 絲134b仍與基板片11〇接觸。 ” 圖7是根據本發明第二實施例的電子檢測裴置之平面 圖，而圖8是沿圖7所示之電子檢測裝置的線β·β，的橫截 面圖。 八 參照圖7和圖8，根據本發明第二實施例的電子檢測 裝置200可包括多個基板片21〇、支撐件、調節件以 入件240 〇 支撐件可包括框架220,而調節件可包括多個調節螺 絲 230。 ，板片210、框架220、調節螺絲23〇以及插入件24〇 與，恥圖1和圖6詳細描述的基板片110、框架120、調節 螺、、糸130以及插入件時14〇實質上相同，除了調節螺絲Μ。 的以下配置。 調節螺絲230的第一螺絲232接合或接觸基板片21〇 的外圍部份，以使第-螺絲232在X軸方向上呈之字形 (=gzag)配置。也就是說，第一基板片21〇周圍之第一 螺，232和與第一基板片210相鄰之第二基板片210周圍 的第一螺絲不是在χ軸方向串聯配置。具體來說，第一螺 23 200912348 絲232位於基板片210的外圍部份，藉此減小框竿22〇之 第一子框架222的寬度。因而，探針可以更大的間隙距離 安裝於基板片210的下表面。 圖9是根據本發明第三實施例的電子檢測裝置之平面 圖，而圖10是沿圖9所示之電子檢測裝置的線c_c，的橫 截面圖。 參照圖9和圖10’根據本發明第三實施例的電子檢測 裝置300可包括多個基板片31〇、支撐件、調節件以及插 入件340。 支撐件可包括框架320,而調節件可包括多個調節螺 絲33J)。根據第三實施例的電子檢測裝置3〇〇的結構和配 置與參照圖1至圖6所描述的電子檢測裝置1⑻實質上相 同，除了將根據第一貫施例的電子檢測裝置翻轉過 來。也就是說，第三實施例之電子檢測裝置3〇〇的上部對 應於第一實施例之電子檢測裝置100的下部。結果，基板 片310、框· 320、调卽螺絲330以及插入件340與參照圖 1至圖6詳細描述的基板片11〇、框架12〇、調節螺絲uo 以及插入件140實質上相同，除了基板片31〇上的探針312 位於與基板片110上之探針112相對的位置。 框架320可支撐第三實施例之電子檢測裝置3〇〇的基 板片310的側面以及上表面，藉此最小化位於其下表面的 相鄰基板片310之間的間隙距離並且最小化安裝於各基板 片310之下表面的相鄰探針312之間的間隙距離。 圖11是根據本發明第四實施例的電子檢測裝置之平 24 200912348 面圖’而圖12是沿圖11所示之電子檢測裝置的線d_d, 的橫截面圖。 參照圖11和圖12，根據本發明第四實施例的電子檢 測裝置400可包括多個基板片41〇、支樓件、調節件、插 入件440以及補強件450。 支撐件可包括框架420,而調節件可包括多個調節螺 絲 430。 ’、 基板片410、框架420、調節螺絲430以及插入件44〇 的結構及配置與參照圖1和圖6詳細描述的基板片11〇、 框架120、調節螺絲no以及插入件14〇實質上相同。 補強件450可包括第一補強部（first rdnf〇rce pat)衫2 和第二補強部（second reinforce pat) 454。 於一實施例中，第一補強部452位於第一螺絲432接 合基板片410的位置。第一補強部452的材料強度大於基 板片410的材料強度，藉此便於形成第一螺絲々Μ所經過 的螺絲孔。 於一實施例中，當第一螺絲432從第一子框架422之 下表面向上旋擰時，第一補強部452位於第一牽引螺絲 432a接合基板片410的位置。 此外’當第一螺絲432從基板片410的上表面向下旋 擰時，第一補強部452可位於第一螺絲432接合基板片410 的位置。 第一框架422與基板片410之間的第一間隙距離由第 一螺絲432控制，並且因而在垂直方向上調節各基板片41〇 25 200912348 以使各基板片410的上表面彼此共面。 第一補強部452可藉由黏膠貼附到基板片410上，或 者藉由干涉配合（interference fit)接合到基板片410上。 於一實施例中，第二補強部454位於第一螺絲434接 合基板片410的位置。第二補強部454的材料強度大於基 板片410的材料強度’藉此便於形成第二螺絲434所經過 的螺絲孔。 於一實施例中，當第一螺絲432從第一子框架422的 下表面向下旋擰時，第一補強部452位於第一牽引螺絲 432a接合基板片410的位置。 第二螺絲434通過第二子框架424並接合到基板片 410，使得第二補強部454可位於第二牽引螺絲434a接合 基板片410的位置。 圖13是根據本發明第五實施例的電子檢測裝置之平 面圖，而圖14是沿圖13所示之電子檢測裝置的線E_E，的 橫截面圖。 麥照圖13和圖14，根據本發明第五實施例的電子檢 測裝置獅可包括多個基板片训、支撐件、調節件以及 插入件540。 支撐件可包括框架520，而調節件可包括多個調節螺 絲 530。 基板片510可包括主體512和輔助件514。 t基板片510的主體512定形成板狀，並且多個探針515 從主體512的下表面突出。探針515可直接接觸要檢測的 26 200912348 目標。多個電子塾（未繪示）配置於主體512的上表面。 訊號線（未綠示）配置於主體512N，且探針515經由訊 號線電性連接於電子墊。 輔助件514可沿主體512的邊緣部份配置。輔助件514 強度A於主體512的材料強度，藉此便於形成調節 累、、、糸所經過的螺絲孔。 於一實施例中，輔助件514可藉由螺絲接合到主 二=，主體512包括突出部’而輔助件514包括對應 =犬出部之凹陷部，使得主體512的突出部插入輔助件別 :凹卩並且螺絲旋入位於凹陷部甲的突出部。此外，主 =2的突出部可藉由干涉配合接合到輔助件514的凹陷 陷^體512的突出部可藉由黏膠黏附到辅助# 514的凹 框架520、調節螺絲530以及插入件54〇與袁 $=_架12。、調節螺絲13〇峨二 並且基板片51G與基板片11G的區別之處在 '凋即螺絲接合到基板片510的輔助件514上。 圖15是根據本發明第六實施例的電子檢測裝置之平 ‘：圖16是沿圖15所示之電子檢測裝置的線-，的 咐15和圖16，根據本發明第六實施例的電子檢 貝J裝置600可包括多個基板片61〇、 插入件_。 糊牛、調即件以及 支撐件可包括框架62〇’而調節件可包括多個調節螺 27 200912348 絲 630。 基板片610和框架620的結構和配置與參照圖1至圖 6所描述的基板片110和框架120實質上相同。 調節螺絲630可包括第一螺絲632和第二螺絲634。 第一螺絲632可從第一子框架622的下表面向上旋 擰，並且穿過第一子框架622，以藉此與基板片61〇的下 表面直接接觸。因而，藉由第一螺絲632的移動來控制基 板片610與第一子框架622之間的第一間隙距離。因而， 可在垂直方向上調節基板片610，以使各基板片61〇的上 表面彼此共面。 第二螺絲634可從第二子框架624的外表面向内旋 擰’並傾斜於基板片610穿過第二子框架624，以藉此與 基板片610的侧面直接接觸。因而，藉由第二螺絲634的 移動來控制基板片610與第二子柩架624之間的第二間隙 距離。因而’可在水平方向上調節基板片61〇，以使基板 片610上的探針成直線配置。 如圖15和圖16所示’第二子框架624介於彼此相鄰 的基板片610之間，以使第二子框架624支撐基板片610 的所有側面。在這種情況下，第二螺絲634傾斜於基板片 610穿透第二子框架624,並因而基板片610的各側面分別 與第'一螺絲634直接接觸。 於一實施例中，調節螺絲630可在沒有第二螺絲634 的情況下包括第一螺絲632，使得僅在垂直方向上調節基 板片610。 28 200912348 於一貧施例中，調節螺絲630可在沒有第一螺絲M2 的情況下包括第二螺絲634,使得僅在水平方向上調節基 板片610。 因此，可由調節螺絲630在垂直和水平方向上控制基 板片610與框架620之間的間隙距離，以藉此調節各基板 片610的位置。 插入件640可包括第一插入部642以及第二插入部 644。 第一插入部642介於第一子框架622與基板片610下 表面之間。第一插入部642可具有體積彈性和形狀彈性。 第一插入部642的實例可包括含彈性材質的彈性板、彈簧 以及墊圈。第一子框架622藉由第一插入部642與基板片 610間隔。第一插入部642可吸收施加於基板片61〇的外 部衝擊。 第二插入部644可介於第二子框架624以及基板片 610的孤立側面之間，並且介於鄰近基板片61〇之間。當 第二子框架624介於相鄰基板片610之間時，第二插入部 644僅_介於第二子框架124與基板片11〇之孤立側面之間。 第二插入部644也可具有體積彈性和形狀彈性。第二 插入部644的實例可包括含彈性材質的彈性板、彈簧以及 墊圈。第二子框架624藉由第二插入部644與基板片61〇 間隔。擰緊第二螺絲634可引起第二插入部644的壓縮， 並且可藉由鬆開第二螺絲634而恢復壓縮的第二插入部 644。第二插入部644可吸收施加於基板片61〇的外部衝擊。 29 200912348 如本領域熟知此項技藝者習知的，儘管上述實施例揭 不了插入件640介於框架620與基板片610之間，但是插 入件640可不必介於框架620與基板片610之間。例如， 框架620與基板片61〇之間不設置插入件。 圖17是根據本發明第七實施例的電子檢測裝置之平 面圖，而圖18是沿圖17所示之電子檢測裝置的線G_G， 的橫截面圖。 參照圖17和圖18,根據本發明第七實施例的電子檢 測裝置700可包括多個基板片71〇、支撐件、調節件以及 插入件740。 支撐件可包括多個單元框架720，而調節件可包括多 個調節螺絲730。 基板片710、調節螺絲73〇以及插入件74〇的結構和 配置與參照圖1至圖6所描述的基板片n〇、調節螺絲13〇 以及插入件140相同。 此外，如本領域熟知此項技藝者所習知的，基板片 71〇、調_螺絲730以及插入件74〇的結構和配置還與參照 圖7至圖16所描述的基板片11〇、調節螺絲13〇以及插入 件140相同。 電子檢測裝置700可包括至少二彼此接合的單元框架 720 ’亚且各單凡框架72〇定形成方形環，其橫截面為大寫 字母的‘L，形。各單元框架72〇可與基板片71〇的側面以及 下表面的邊緣部份接觸，使得探針712位於除其邊緣部份 之外的基板片710下表面上。 30 200912348 在本實施例中，單元框架720可包括第一子框架722 以及第二子框架724。 第一子框架722定形成板狀，並且具有與基板片71〇 數量相同的開口。基板片710上之探針712透過第一子框 架722的開口暴露。第一子框架722可支撐基板片71〇的 邊緣部份。 第二子框架724從第一子框架722的邊緣部份垂直延 伸。第二子框架724可支撐基板片71〇的側面。 各單元框架720可包括突起726和/或與突起726對應 之凹陷728。於一實施例中，突起726和與突起726對應 之凹陷728分別定位於彼此面對之單元框架72〇的第二子 框架724的側面上。因而，當突起726和凹陷728彼此耦 接於相鄰第二子框架724之間時，相鄰單元框架72〇彼此 接合，並因而多個單元框架720形成與參照圖4所描述之 ，架120類似的大型框架。因此，多個基板片71〇可分別 藉由突起726和凹陷728定位於構成大型框架的各單元框 架720上，並且因而基板片71〇也形成定位於同一共面表 面上的大型基板。 於一實施例中，突起726和凹陷728分別定位於單元 框架72G之第二子框架724的側面的同—高度上。然而， 如本領域熟知此項技藝者習知的，每對突起726和凹陷728 可位於f元框架720之第二子框架724的侧面的不同高度。 儘官本實施例公開了突起726和凹陷728可位於單位 框架72G的第二子框架724的不同侧面，但突起726和凹 31 200912348 陷728也可位於單位框架72〇之第二子框架似的同一侧 面。 1中心件（未繪示）介於彼此相鄰的單元框架720之間， 使得各基板片710定位於單元框架72〇的中心。中心件的 實例可包括彈簧片。 於Λ施例中，主框架（未繪示）位於單元框架72〇 之大型框架的下部，以使主框架支撐大龍架的側面以及 下表面的邊緣部份。主框架更包槪伸過絲架中心部份 的支撐栅格。支樓栅格可支撐相鄰單元框架72㈣麵接部。 圖19是根據本發明第八實施例的電子檢測裝置的橫 截面圖。 —參=圖I9 ’根據第八實施例的電子檢測裝置8〇〇包括 第一及第二基板結構81〇及82〇、連接件83〇、耦接件 以及平面度控制器850。 於-實施例中，第-基板結構81〇可包括多個基板 片、框架、多個調節螺絲以及多個插人件。第—基板結構 810的結構和配置與參照圖丨至圖6所描述的裝置1⑼實 質上相同。 、 此外，第一基板結構810的結構和配置也與參照圖7 至圖18描述的裝置實質上相同，並可由參照圖7至圖18 描述的裝置所替代。 第二基板結構820定位於第一基板結構81〇上，並且 可包括訊?組（未和）以及電性連接於訊號線的多個連 接孔822。導電層824形成於連接孔822的内表面。導電 32 200912348 € 824可包括第—導電材質’諸如銅（Cu)。訊號線可電 性連接至附加測試器。第二基板結構820彳包括印刷電路 板（printed circuit board，PCB )以及多層基板。 弟一基板結構810和第二基板結構82〇藉由連接件 830，性連接。例如，位於連接孔η2内表面上的導電層 824藉由連接件83〇電性連接至電子墊（未繪示）^ 件830可包括第二導電材質，諸如金屬。 連接件830㈣一端部832 連接到第一基板結構 810的電子塾。例如，第一端部832可與電子墊接觸或者 固定於電子塾上。 連接件830之與第一端部832相對的第二部份幻4可 插入第二基板結構82〇的連接孔822。例如，第二部份㈣ 接孔822之内表面上的導電層824或者固定於導電 於-實施例中’配線元件（例如撓性電路板“⑽疏 printed circuit，FPC，，）可用於替代連接件㈣，並且因而 錯由配線元倾此紐連接第—基板轉_ 結構820。 尔一I敬 第-基板結構⑽和第二基板結構82() #由輛接件 840彼此機械耦接。於—實施例中，轉接件_可包括 -補強件84卜第二補強件842、彈簧片844以及 第一補強件841可定形成碟狀，並且定位於第二基板 結構820上。第二補強件842可定形成環狀，並且沿第二 基板結構820的邊緣部份配置。第—補強件841、第二基 33 200912348 板結構820以及第二補強件842藉由第一螺栓8幻彼此固 定。彈簧片可接觸第二補強件842以及第一基板結構81〇 的框架。第二補強件842藉由第二螺栓84ό固定到彈簧片 844，而彈簧片藉由第三螺栓847固定到框架。 平面度控制器850穿透第一補強件gw和第二基板結 構820，並且與弟一基板結構81〇的上表面接觸。第一基 板結構810的厚度根據製造第一基板結構81〇的不同製程 條件以及環境沿其縱向方向變化，並因而儘管一 構810和第二基板結構82〇彼此平行配 結構810的上表面接觸之平面度控制器85〇可藉由控制平 面度控制器850與第一基板結構81〇之間的接 制第-基板結細之下表面的平面度，以使== 置於同一共面表面上。 平面度控制H 850不必配置於f子檢難置_内。 藉由第-調節螺絲在相對基板片頂面的垂直方向上來 第-基板結構810的基板片，使得藉由替代平面度控制器 =〇角=調節螺絲來控制第—基板結構㈣的平面度或料 此外，第二調節螺絲也可調節電子檢測農置_内 基板片的位置。 ☆於-實施例中，當電子檢啦置_的結構和配置盘 蒼照圖17和圖18描述的裝置7〇〇實質上相同時 其 板結構_可包括—鮮元鍊，並且各單元 ς 34 200912348 第二基板結構820。因此’第一螺栓845使第一補強件84卜 第二基板結構820以及單元框架彼此接合。 圖20是根據本發明第九實施例的電子檢測裝置的橫 截面圖。 參照圖20，根據第九實施例的電子檢測裝置9〇〇可包 括第一基板結構910、第二基板結構920以及耦接件93()。 +於一實施例中，第一基板結構91〇和第二基板結構92〇 可藉由耦接件930彼此耦接，以使第一基板結構91〇的上 表面與第二基板結構920的下表面直接電性接觸。例如， 耦接件930可包括補強件931以及多個螺栓932。 第-補強件931定形成碟形，並且可定位於第二基板 結構920的上表面上。第一補強件93卜第二基板結構· 以及第一基板結構910的框架由螺栓932彼此固定。 第二基板結構920可在不使用第一補強件931的情況 下由螺栓932直接耦接於第一基板結構91〇的框架。 於-實施射，當電子檢測裝置_的結構和配置與 參照圖17和圖18描述的裝置實質上相同時，第一基 板結構910可包括-些單元_，並且螺 第-基板結構910的各 因此，藉由第-基板結構910的第一調節螺絲在相對 二板片之頂面的垂直方向上調節電子檢測裝置卿的基板 片0 圖21疋根據本發明第十實施例的電子檢測裝置的橫 35 200912348 圖21 ’根據第十實施例的電子檢測裝置1000可 包括第一基板結構1010和第二基板結構1020。 第一基板結構1〇1〇和第二基板結構1〇2〇的結構和配 置與參照圖19描述的第-基板結構81G和第二基板結構 820相同。 於+一實施例中’第一基板結構1010和第二基板結構 1〇2(^藉由諸如焊接及黏膠等結合件（未繪示）彼此固定， 以使第一基板結構1〇1〇的上表面與第二基板結構1〇2〇的 下表面直接電性接觸。 於一實施例中，當第一基板結構1〇1〇的結構和配置與 參照圖17和18描述的裝置7〇〇實質上相同時，第一基板 結構1010可包括_些單元框架，並且因而第二基板結構 1020分別與各單元框架固定。 因此，藉由第一基板結構1010的第一調節螺絲在相對 基板片頂面的垂直方向上調節電子檢測裝置1000的基板 片。 圖22是根據本發明第十一實施例的電子檢測裝置的 橫截面圖。 參照圖22,根據第十一實施例的電子檢測裝置11〇〇 包括第一基板結構1110、第二基板結構112〇、第三基板結 構1130、第一連接件114〇、第二連接件115〇、耦接件116〇 以及平面度控制器117〇。 第一基板結構111〇和第二基板結構112〇的結構和配 置與參照圖19所描述的第一基板結構81〇和第二基板結構 36 200912348 820實質上相同。 於一實施例中，第三基板結構113〇可介於第一基板結 構mo和第二基板結構1120之間，並且可包括基板1132 以及支撐基板1132的側面和下表面的支撐件1134。訊號 線定位於第三基板結構113〇的基板1132内。基板1132 的實例可包括印刷電路板（pCB)以及多層基板。 一第一連接件1140可電性連接第一基板結構u 1〇和第 二基板結構1130〇第一連接件114〇的第一端部1142與第 -基板結構11K)接觸或者固定到第—基板結構⑴〇。食 第-端部相對之第-連接件114〇的第二端部U44與第^ 基板，構1130接觸或者固定於第三基板結構113〇。 貧第二連接件1150電性連接於第二基板結才冓1120和第 =板結構1130。在本實施例’第二連接件1150電性連 結m接ϋ122絲面上的導電層1124以及第三基板 ^盘第-其/子塾°第二連接件115G的第—端部1152 弟^基板結構113〇接觸或者固定於第三基板結構 /、第一端部相對之第二連接件115〇 接觸或固定於第二基板結構mo的導電層 w1154 實=种，畴Μ (諸域性印刷電路板 i 5〇廿曰替代第一連接件1140和第二連接件 :且=由配線元件彼此電性連接第一基板結構 板結構to板結構1130、第三基板結構⑽和第二基 轉接件_彼此輕接第一基板結構111〇、第二基板 37 200912348 Z 基板結構113G °於—實施例中，她牛 可包括弟-補強件⑽、第二補強件ιΐ62、第三補 強件1163、彈簧1164以及多個螺检。 補強件1161可_成碟狀，並且可錄於第二基 板結構1120的上表面卜。笛_站& 〖面上弟-補強件1162可定形成環狀， 、’w /〇、一土板結構112〇的邊緣部份配置。第三補強件 =3可定形成環狀，並可沿第三基板結構㈣的邊緣部 =配置’使得第三補強件1163沿第三基板結構的支 芽件1134配置。輕接件116〇的第一螺栓η%可彼此固定 第-補強件116卜第二基板結構U2G以及第二補強件 1162。彈簧片1164可彼此連接第二補強件1162與第三基 板結構1130❾支撐件1134,以使—部份彈箦片1164抑制 基板^132的上表面，並因而由支撐件1134支撐基板Hu。 第二螺栓1166可將彈簧片1164固定於第二補強件 1162上，並且第三螺栓1167可將彈簧片1164固定於第三 基板結構1130的支撐件1134。第四螺栓1168可將支撐件 1 一 134固定於第三補強件1163 ,並且第五螺栓1169可將第 ^補強件1163固定於第一基板結構111〇的框架。附加彈 更片（未繪示）更安裝於第三補強件1163與第一基板結構 1110的框架之間’以使第一基板結構m〇的基板片上表 面由附加彈簧片彈性按壓，以藉此將基板片固定於第一基 板結構1110的框架上。 ^ —儘管本實施例揭示了第一基板結構1110的框架可與 第二補強件1163分開配置，並且因而藉由第五螺栓1169 38 200912348 彼，固疋第-基板結構111G的框架以及第三觀件，框架 和第三補強件1169可在不使用第五螺栓1169的情況下- 體形成。 平面度控制器1170可穿過第一補強件Π61和第二基 ，結構112G ’並隨後接觸第三基板結構113()的上表面。 第:基板結構mo的厚度根據製造第一基板結構111〇的 不同製程條件以及環境沿其縱向方向變化，並且因此儘管 第-基板結構1110平行於第二基板結構U2G配置，第一 基板結構1110的探針尖端不定位於共面表面上。與第三基 板結構113G之上表面接觸的平面度控制器n7G可藉由γ 制平面度控制器117〇與第三基板結構⑽之間的^觸^ 度來控制第-基板結構111G的水平角度，减探針的尖端 配置於同—共面表面上。因而，第-基板結構1110之下表 面上的探針尖端定位於同一共面表面。 電子檢難置1100内可不配置平面度控制器117〇。 調節螺絲在相對基板片頂面的垂直方向上來調節 ώ基板結構110的基板片，使得可由調節螺絲替代平面 f控制器1170來控制第一基板結構1110之下表面的平面 度或水平角度。 上此外’第二調節獅還可在平行於基板片頂面的 上調節第一基板結構1110中的基板片位置。 橫截^3。是根據本發㈣忙實關的電子檢概置的 參照圖23’根據第十二實施例的電子檢測震置讓 39 200912348 包括第一基板結構1210、第二基板結構122〇、第三基板結 構1230、連接件1240、麵接件1250以及平面度控制器 1260。 °° 第一基板結構1210和第二基板結構122〇的結構和配 置與參照圖19描述的第一基板結構810和第二基板結構 820貫質上相同。 弟二基板結構1230、連接件1240以及平面度控制器 1260的結構和配置與參照圖22描述的第三基板結構 1130、第二連接件H50以及平面度控制器117〇實質上相 同。 ' 耦接件1250可彼此耦接第一基板結構121〇、第二基 板結構1220和第三基板結構123〇,以使第—基板結構121〇 的上表面與第二基板結構1230的下表面直接接觸，並且因 而第一基板結構1210和第三基板結構123〇彼此電性連 接。於一實施例中，耦接件1250可包括第一補強件1251、 第二補強件1252、彈簧片1254以及多個螺栓。 第一補強件1251定形成碟狀，並且可定位於第二 結構=20的上表面。第二補強件1252可定形成環狀，並 I沿第二基板結構122〇的邊緣部份配置。耦接件125〇的 第螺检1255可以彼此固定第一補強件1251、第二基板 結構122G以及第二補餅1252 ^彈簧片1254可接觸^二 補強件1252以及第三基板結構123〇的支撐件1234。第二 螺检1256可將彈簧片1254固定於第二補強件1252上^ 且第三螺栓1257可將彈簧片1254固定於第三基板結構 200912348 1230的支撐件]234上。 彈簧片1254可彼此連接第二補強件咖和第三基板 結構123〇的支樓件⑵4以使彈簧片⑽的一部份按祕 板1232的上表面並因此由支撐件1234支撐基板12幻。 第四螺栓1258可將支撐件1234固定於第一基板結構 ⑵0的框架，以使第—基板結構㈣和第三基板結構123〇 彼此直接接觸且電性連接。此外，第一基板結構ΐ2ι〇上的 電子墊、纟。合至第二基板結構123〇的另—電子墊，以藉此彼 此電性連接第一和第三基板結構。 於:實施例中，第一基板結構121〇和第三基板結構 1230可藉由連接件124〇彼此電性連接，並且第二基板結 構1220和第三基板結構123〇可藉由直接接觸而彼此電性 連接。 此外’第一基板結構121〇的第一調節螺絲還可在相對 基板片之頂面的垂直方向上調節第一基板結構1210内的 基板片。 圖24是根據本發明第十三實施例的電子檢測裝置的 橫截面圖。 參照圖24’根據第十三實施例的電子檢測裝置13〇〇 包括第一基板結構131〇、第二基板結構132〇、第三基板結 構1330、第一連接件1340、第二連接件1350、耦接件1360 以及平面度控制器1370。 第一基板結構1310包括多個基板片，各基板片由一單 元框架支撐’而耦接件1360將第一基板結構1310固定到 200912348 第二基板結構1330，以使各單元框架彼此間隔。除了上述 分離的單元框架，電子檢測裝置丨遞内的第—基板結構 1310、第二基板結構132〇、第三基板結構133〇、第一連接 件1340、第二連接件1350、耦接件1360以及平面度控制 器1370的結構和配置與參照圖22描述的電子檢測裝置 11〇〇中的第一基板結構1110、第二基板結構112〇、第三 基板結構1130、第一連接件114〇、第二連接件115〇、耦 接件1160以及平面度控制器117〇相同。 因此’第一基板結構131〇的第一調節螺絲可在相對電 子檢測裝置1300中之基板片頂面的垂直方向上調節第— 基板結構1310的基板片。 此外，第一基板結構131〇的第二調節螺絲可在相對電 子核測裝置1300中之基板片頂面的水平方向上調節第一 基板結構1310的基板片。 圖25是根據本發明第十四實施例的電子檢測裝置的 橫截面圖。 參照圖25,根據第十四實施例的電子檢測裝置14〇〇 包括第一基板結構141〇、第二基板結構142〇、第三基板結 構1430、連接件1440、耦接件1450以及平面度控制器 1460。 。 第一基板結構1410包括多個基板片，各基板片由一單 ，框架支撐，而耦接件1450將第一基板結構1410固定到 第三基板結構1430，以使各單元框架彼此間隔。除了上述 分離的單元框架，電子檢測裝置1400内的第一基板結構 42 200912348 1410、第二基板結構1420、第三基板結構1430、連接件 1440、耦接件1450以及平面度控制器146〇的結構和配置 與參照圖23描述的電子檢測裝置12〇〇中的第一基板結構 1210、第二基板結構1220、第三基板結構1230、連接件 1240、耦接件1250以及平面度控制器126〇相同。 因此，弟一基板結構1410的第一調節螺絲可在相對電 子檢測裝置1400中之基板片頂面的垂直方向上調節第一 基板結構1410的基板片。 圖26繪示圖1至圖18所示之電子檢測裝置的組裝方 法的製程步驟的流程圖。 圖1至圖18中揭示的電子檢測裝置具有類似的結構和 配置，因而下文基於圖1至圖6所揭示的裝置描述電子檢 測裝置的組裝方法。 參照圖26，將基板片π〇定位於框架120内（步驟 S110)。 提供包括第一子框架122和第二子框架124的框架 i2^’並且將基板片定位於框架120内，使得基板片彼此相 鄰定位，並且基板片表面的某些部份由框架120支撐。例 如:基板片110之下表面的邊緣部份以及侧面由框架12〇 支撐，並且因此安裝於除邊緣部份之外的基板片下表面上 的探針112暴露於周圍。如圖1〇所示，基板片n〇的頂表 面邊緣部份以及側面也可由框架12〇支樓。 隨後，要與檢測目標直接接觸的探針112安裝於基板 片U0上。例如，探針可在基板片110定位於框架120之 43 200912348 前安裝於基板>；110的下表面上。基板片11G可定位於框 架120内，並且隨後將探針112安裝於框架12〇内的基板 片110的下表面上。 P过後’將調卽螺絲130安裝於框架120上（步驟si2〇)。 第一調節螺絲132可從其底部向上穿透第一子框架 122，並且可固定或接觸基板片11〇。此外，一 斷從其頂部向下穿透第一子框架11〇,並:可= 觸基板片122。第二調節螺絲134可在平行於基板片11〇 之頂面的方向上穿透第二子框架124,並可固定或接觸基 板片110。包括第一插入部！42和第二插入部144的插入 件140安裝於基板片110上，並隨後將調節螺絲14〇安裝 於框架120。第一插入部142插入第一子框架122與基板 片11〇之下表面之間的第一邊界區。第二插入部144插入 第一子框架124與基板片no之側面之間以及彼此相鄰的 鄰近基板片的側面之間的第二邊界區。 框架120與基板片11〇之間的間隙距離由調節件13〇 控制，並且因而藉由調節件13〇來調節框架12〇中之基板 片Π0的位置（步驟S130)。 藉由第一調節螺絲132牽引或推動基板片11〇 ,以藉 此調節第一子框架122與基板片110之下表面之間的間隙 距離。因而，藉由第一調節螺絲132在相對框架120中的 基板片110之上表面的垂直方向上調節基板片的位置。 可藉由第二調節螺絲134牽引或推動基板片11〇,以 藉此調節第二子框架122與基板片11〇側面之間的間隙距 44 200912348 離。因而，藉由第二調節螺絲134在平中的 基板片m之上表面的水平方向上調節基板片的位置。 圖27!會示了圖19至圖25所示之電子檢測裝置之组装 方法的製程步驟的流程圖。 圖I9至圖25中揭*的電子檢測裝置具有類似的姑構 和配置目而下文基於圖所揭示的震置描述電子檢測裝 置的組裝方法。 參，圖27 ’框架、多個基板片11〇以及多個調節嫘絲 組裝成第一基板結構8〇〇(步驟S210)。 隨後，要與檢測目標直接接觸的探針安裝於基板月 810上。例如，探針可在基板片81〇定位於框架之前安裝 於基板片810的下表面上。基板片81〇可定位於框架内， 並且隨後將探針安裝於框架内的基板片81〇的下表面上。 隨後，藉由第一基板結構810和第二基板結構82〇的 直接接觸將第一基板結構810電性連接至第二基板結構 820 上（步驟 S220)。 框架與基板片810之間的間隙距離由調節件控制，並 且因而藉由調節件來調節框架内之基板片的位置（步 S230)。 用以控制框架與基板片810之間的間隙距離的過程與 參照圖26描述的用以調節框架與基板片之間的間隙距離 的控制過程實質上相同。 藉由利用調節螺絲控制框架與基板片之間的間隙距離 來調節基板片的位置。 45 200912348 圖28是根據本發明第十五實施例的電子檢測裝置的 平面圖。圖29是沿圖28之線H-H，的橫截面圖，而圖3〇 疋沿圖28的線I-Ι的橫截面圖。 參照圖28和圖30，根據第十五實施例的電子檢測裝 置1500可包括基板片1510、支撐件、調節件、耦接件155〇^ 插入件1560以及補強件1570。 於一實施例中，支撐件包括框架1520和支撐條153〇， 並且可支撐基板片以使基板片11〇彼此相鄰定位。調節件 可包括多個調節螺絲1540並且可調節基板片相對框架 1520的相對位置。 圖31是圖28所示之基板片的平面圖，而圖32是沿圖 31所示之基板片的線j_j，的橫截面圖。 參照圖28至圖32’各基板片151〇可包括位於其下表 面的多個探針1512。本實施例中的基板片151〇的結構和 配置與參照圖1和圖2描述的基板片110實質上相同。 圖33是繪示圖28所示之電子檢測裝置的框架的透視 圖。 參照圖33,框架1520可支撐基板片1510並可包括第 一子框架1522和第二子框架1524。 第一子框架1522定形成板狀’並且具有與基板片 數量相同的開口。第一子框架122可支撐基板片151〇之下 表面的邊緣部份。基板片1510上之探針1512透過第一子 框架1522的開口暴露。 第二子框架1524從第一子框架1522的邊緣部份垂直 46 200912348 突起。弟·一子框架1524支稽彼此相鄰配置之基板片bio 的侧面。當基板片1510在框架1520内配置成檢查圖案時， 鄰近基板片1510的一對側面彼此直接接觸，而基板片151〇 的至少一侧面不與其他基板片1510接觸。如上文所定義 的’基板片1510之與鄰近基板片1510的另一侧面直接接 觸的側面被稱作結合側面’而基板片1510之與另一基板片 1510的另一侧面不接觸的側面被稱作孤立側面。因而，第 一子框架1524可以支持基板片1510的孤立側面。第二子 框架1524的頂面略微高於基板片1510的上表面。如圖28 至圖30以及圖33所示，第二子框架1524不位於鄰近基板$ 片1510之間，以使鄰近基板片151〇具有至少一結合側面。 然而，第二子框架1524也可位於鄰近基板片1510之間， 以使基板片1510不具有結合侧面。在這種情況下，第二子 框架1524可支禮基板片1510的所有側面。 於一實施例中，框架1520可僅包括第二子框架1524, 而不包括第一子框架1522。 框架1520可支撐基板片151〇,使得基板片151〇彼此 相鄰配置，以使多個基板片1510可在電子檢測裝置1500 内組裝成單個大型探針基板。 〜中心件（未繪示）介於框架1520與基板片151〇之間， 使得各基板片丨51〇定位於框架1520的中心。中心件的實 例可包括彈簧片。 支撐件1530可定位於基板片151〇的上表面並定形成 條狀。例如，支撐件1530可包括多個第一條狀物1532以 47 200912348 及多個第二條狀物1534。 例中—對第—條狀物1532可定位於基板片 1510的邊緣部份，且彼此平行地在第—方向上延伸。因 此’位於基板片之上表面上的接觸墊經成對基板片· 之間的空間暴露。 第二條狀物1534定位於第一條狀物1532上，並且彼 此平行地在垂直於第一方向的第二方向上延伸❶例如，第 二條狀物1534在第二方向上於基板片⑽上方沿基板片 1510的中部延伸。由於第—和第二條狀物定形成細長的條 狀物且彼此父叉，基板片1510之上表面上的電子墊經第一 條狀物1532和第二條狀物1534定義的空間暴露。 第一條狀物1532和第二條狀物1534可一體形成，以 使支撐件1530定形成栅格（支撐柵格）。在本實施例中， 位於基板片1510之上表面上的支撐條可替代支撐栅格作 為支撐件1530。 支撐件1530還可僅包括第一條狀物1532，而不包括 第二條狀物1534。在這種情況下，第一條狀物1532可彼 此連接且一體形成。 再次參照圖28至圖30,調節螺絲1540可包括第一調 節螺絲1542和第二調節螺絲1544。 第一調節螺絲1542可調節基板片1510相對第一條狀 物1532和第二條狀物1534的相對位置，而第二調節螺絲 1544調節基板片1510相對框架1520的相對位置。 於一實施例中’第一調節螺絲1542和第二調節螺絲 48 200912348 1544可包括多辦引螺絲和多個推動螺絲，其巾藉由摔緊 牽引螺絲來牽引基板片⑸〇以藉此調節基板片151〇的位 置’並且藉由擰緊軸螺絲推祕板# 以藉此 基板片1510的位置。 於一實施例中，第一調節螺絲1542可包括第一 絲1542a和第一推動螺絲⑽。匕括第牽引螺 第一牽引螺絲1542a從支撐條丨532的上部向下旋擰到 其下部，以藉此穿透支撐條1532並插入基板片1510。第 一牽引螺絲1542a也可從基板片151〇的下表面向上旋擰到 其上表面，以藉此穿透基板片151〇並插入支撐條1532。 因此，藉由擰緊第一牽引螺絲1542a來縮短第一支撐條 1532與基板片1510之間的第一間隙距離。 第一推動螺絲1542b從支撐條1532的上部向下旋擰到 其下部，以藉此穿透支撐條1532並與基板片151〇接觸。 弟推動螺絲1542b也可從基板片1510的下表面向上旋擰 到其上表面，以藉此穿透基板片1510並接觸第一條狀物 1532。因此’藉由擰緊第一推動螺絲丨542b來縮短第一支 撐條1532與基板片1510之間的第一間隙距離。 因此，精由第一牽引螺絲1542a和第一推動螺絲1542b 來控制第一條狀物1532與基板片1510之間的第一間隙距 離’藉此在相對基板片1510之上表面的垂直方向上調節基 板片1510的相對位置。 當使用第一牽引螺絲和第一推動螺絲1542&和l542b 作為調節螺絲1540來調節基板片1510的位置時，可藉由 49 200912348 外部條件輕易地鬆開調節螺絲154G，例如藉由調節 1540的熱膨脹以及震動，並且因而基板片151〇相對第二 條狀物1532的位置可輕易地改變。然而，當第一 1542,第一推動螺絲⑽二者同時作為調節螺絲二 來調節基板片1510的位置時，第一推動螺絲154孔可由 一牽引螺絲1542a互補擰緊，並且第一牽引螺絲1542可由 第一推動螺絲1542b互補擰緊，並且因而一旦藉 絲1540來調節基板片151〇的位置，基板片151〇相二 條狀物1542穩定定位。 於一實施例中’第二調節螺絲1544可包括第二牽引螺 絲1544a和第二推動螺絲i544b。 ” 第二牽引螺絲1544a從第二子框架1524的外表面向内 旋擰到第二子框架1524的内表面，以藉此穿透第二子框架 1524並插入基板片151〇。因此，藉由擰緊第二牽引螺絲 1544a來縮短第二子框架1524與基板片151〇之間的第二 間隙距離。The second traction screw 134a of the second 5 isolated side can move at X °, Until the second traction if # facing the second isolated side is completely screwed into the substrate piece 11〇. The dice of the dice screw moves in the direction of the upper axis of the ’. The movement is substantially the same as the above movement in the x-axis direction. In an embodiment, By twisting the kidney flute ^ „ you can move the substrate slice up and down in the fortune. And the first push screw 22 is tightened. 200912348 The wire 132b moves upward in the z-axis direction. In the same way, Since the diameter of the first hole of the frame 12 (four) through which the second traction screw 134a passes is larger than the diameter of the second traction screw 134a, the second traction screw 134a inserted into the isolated side of the substrate piece no through the first hole of the frame 12 is available on the z-axis Moving in the direction, Until the first traction screw 132a is completely screwed into the substrate sheet 110 through the first sub-frame. under these circumstances, The second push screw 134b facing the isolated side is still in contact with the substrate piece 11A. Figure 7 is a plan view of an electronic detecting device according to a second embodiment of the present invention, 8 is a line β·β along the electronic detecting device shown in FIG. A cross-sectional view of the section. Eight, referring to Figure 7 and Figure 8, The electronic detecting device 200 according to the second embodiment of the present invention may include a plurality of substrate sheets 21, supporting item, The adjustment member to the inlet 240 〇 the support member may include a frame 220, The adjustment member may include a plurality of adjustment screws 230. , Plate 210, Frame 220, Adjusting screw 23〇 and insert 24〇, The substrate sheet 110 described in detail in FIGS. 1 and 6 Frame 120, Adjustment screw, , 糸130 and inserts are essentially the same, In addition to adjusting the screw Μ. The following configuration. The first screw 232 of the adjusting screw 230 engages or contacts the peripheral portion of the substrate piece 21〇, The first screw 232 is arranged in a zigzag shape (=gzag) in the X-axis direction. That is, a first screw around the first substrate piece 21〇, The first screws around the second substrate piece 210 adjacent to the first substrate piece 210 are not disposed in series in the z-axis direction. Specifically, The first screw 23 200912348 is located at the outer periphery of the substrate sheet 210. Thereby, the width of the first sub-frame 222 of the frame 22 is reduced. thus, The probe can be mounted on the lower surface of the substrate sheet 210 with a larger gap distance. Figure 9 is a plan view of an electronic detecting device in accordance with a third embodiment of the present invention, 10 is a line c_c along the electronic detecting device shown in FIG. Cross section view. Referring to Figures 9 and 10', an electronic detecting device 300 according to a third embodiment of the present invention may include a plurality of substrate sheets 31, supporting item, The adjustment member and the insertion member 340. The support member can include a frame 320, The adjustment member may include a plurality of adjustment screws 33J). The structure and configuration of the electronic detecting device 3A according to the third embodiment are substantially the same as those of the electronic detecting device 1 (8) described with reference to Figs. 1 to 6, In addition to flipping the electronic detecting device according to the first embodiment. That is, The upper portion of the electronic detecting device 3'' of the third embodiment corresponds to the lower portion of the electronic detecting device 100 of the first embodiment. result, Substrate sheet 310, Box · 320, The tuning screw 330 and the insert 340 are the substrate sheets 11 described in detail with reference to FIGS. 1 to 6, Frame 12〇, The adjustment screw uo and the insert 140 are substantially identical, The probe 312 on the substrate piece 31 is located at a position opposite to the probe 112 on the substrate piece 110. The frame 320 can support the side surface and the upper surface of the substrate sheet 310 of the electronic detecting device 3A of the third embodiment. Thereby, the gap distance between adjacent substrate sheets 310 on the lower surface thereof is minimized and the gap distance between adjacent probes 312 mounted on the lower surface of each substrate sheet 310 is minimized. Figure 11 is a plan view of an electronic detecting device according to a fourth embodiment of the present invention, and Figure 12 is a line d_d of the electronic detecting device shown in Figure 11; Cross-sectional view. Referring to Figures 11 and 12, The electronic detecting device 400 according to the fourth embodiment of the present invention may include a plurality of substrate sheets 41, Branch building, Adjustment parts, The insert 440 and the reinforcing member 450 are inserted. The support member can include a frame 420, The adjustment member may include a plurality of adjustment screws 430. ’, Substrate sheet 410, Frame 420, The structure and arrangement of the adjusting screw 430 and the insert 44A are the same as those of the substrate sheet 11 described in detail with reference to FIGS. 1 and 6. Frame 120, The adjustment screw no and the insert 14 are substantially identical. The reinforcing member 450 may include a first reinforcing portion 2 and a second reinforce pat 454. In an embodiment, The first reinforcing portion 452 is located at a position where the first screw 432 is joined to the substrate piece 410. The material strength of the first reinforcing portion 452 is greater than the material strength of the substrate sheet 410, This facilitates the formation of the screw holes through which the first screw turns. In an embodiment, When the first screw 432 is screwed upward from the lower surface of the first sub-frame 422, The first reinforcing portion 452 is located at a position where the first pulling screw 432a engages the substrate piece 410. Further, when the first screw 432 is screwed downward from the upper surface of the substrate piece 410, The first reinforcing portion 452 may be located at a position where the first screw 432 engages the substrate piece 410. The first gap distance between the first frame 422 and the substrate piece 410 is controlled by the first screw 432. And thus, the respective substrate pieces 41 〇 25 200912348 are adjusted in the vertical direction so that the upper surfaces of the respective substrate pieces 410 are coplanar with each other. The first reinforcing portion 452 can be attached to the substrate piece 410 by adhesive. Or bonded to the substrate piece 410 by an interference fit. In an embodiment, The second reinforcing portion 454 is located at a position where the first screw 434 is joined to the substrate piece 410. The material strength of the second reinforcing portion 454 is greater than the material strength of the substrate sheet 410, thereby facilitating the formation of the screw holes through which the second screw 434 passes. In an embodiment, When the first screw 432 is screwed downward from the lower surface of the first sub-frame 422, The first reinforcing portion 452 is located at a position where the first pulling screw 432a engages the substrate piece 410. The second screw 434 passes through the second sub-frame 424 and is bonded to the substrate piece 410, The second reinforcing portion 454 can be positioned at a position where the second pulling screw 434a engages the substrate piece 410. Figure 13 is a plan view of an electronic detecting device in accordance with a fifth embodiment of the present invention, 14 is a line E_E of the electronic detecting device shown in FIG. Cross-sectional view. Mai Zhao 13 and Figure 14, The electronic detecting device lion according to the fifth embodiment of the present invention may include a plurality of substrate pieces, supporting item, The adjustment member and the insert 540. The support member can include a frame 520, The adjustment member may include a plurality of adjustment screws 530. The substrate sheet 510 can include a body 512 and an auxiliary member 514. The main body 512 of the t substrate piece 510 is formed into a plate shape. And a plurality of probes 515 protrude from the lower surface of the body 512. Probe 515 is in direct contact with the 26 200912348 target to be detected. A plurality of electronic turns (not shown) are disposed on the upper surface of the body 512. The signal line (not shown) is disposed on the main body 512N. The probe 515 is electrically connected to the electronic pad via a signal line. The auxiliary member 514 can be disposed along an edge portion of the body 512. Auxiliary member 514 strength A is the material strength of body 512, Thereby facilitating the formation of adjustments, , , The screw holes that pass through. In an embodiment, The auxiliary member 514 can be joined to the main two by screwing, The body 512 includes a protrusion and the auxiliary member 514 includes a corresponding depression of the dog. The protrusion of the main body 512 is inserted into the auxiliary part: The recess is screwed and the screw is screwed into the projection at the recess A. In addition, The protrusion of the main = 2 can be joined to the recess of the auxiliary member 514 by the interference fit, and the protrusion of the recess 512 can be adhered to the concave frame 520 of the auxiliary # 514 by the adhesive, Adjust screw 530 and insert 54 〇 with Yuan $=_ frame 12. , The adjusting screw 13 is two and the difference between the substrate piece 51G and the substrate piece 11G is 'welded to the auxiliary member 514 of the substrate piece 510. Figure 15 is a diagram of an electronic detecting device according to a sixth embodiment of the present invention: Figure 16 is a line - along the line of the electronic detecting device shown in Figure 15; 咐15 and Figure 16, The electronic coupon J apparatus 600 according to the sixth embodiment of the present invention may include a plurality of substrate sheets 61, Insert _. Paste cow, The adjustment member and the support member may include a frame 62〇' and the adjustment member may include a plurality of adjustment screws 27 200912348 wires 630. The structure and configuration of the substrate piece 610 and the frame 620 are substantially the same as those of the substrate piece 110 and the frame 120 described with reference to Figs. The adjustment screw 630 can include a first screw 632 and a second screw 634. The first screw 632 can be screwed upward from the lower surface of the first sub-frame 622. And passing through the first sub-frame 622, Thereby, it is in direct contact with the lower surface of the substrate piece 61. thus, The first gap distance between the substrate sheet 610 and the first sub-frame 622 is controlled by the movement of the first screw 632. thus, The substrate piece 610 can be adjusted in the vertical direction, The upper surfaces of the respective substrate pieces 61 are coplanar with each other. The second screw 634 can be screwed inwardly from the outer surface of the second sub-frame 624 and inclined to the substrate piece 610 through the second sub-frame 624. Thereby, it is in direct contact with the side surface of the substrate piece 610. thus, The second gap distance between the substrate piece 610 and the second sub-truss 624 is controlled by the movement of the second screw 634. Thus, the substrate sheet 61 can be adjusted in the horizontal direction, The probes on the substrate sheet 610 are arranged in a straight line. As shown in Figs. 15 and 16, the second sub-frame 624 is interposed between the substrate pieces 610 adjacent to each other. The second sub-frame 624 supports all sides of the substrate piece 610. under these circumstances, The second screw 634 is inclined to the substrate piece 610 to penetrate the second sub-frame 624. Thus, each side of the substrate piece 610 is in direct contact with the first screw 634, respectively. In an embodiment, The adjusting screw 630 can include the first screw 632 without the second screw 634, The substrate sheet 610 is adjusted only in the vertical direction. 28 200912348 In a case of poverty, The adjusting screw 630 can include the second screw 634 without the first screw M2, The substrate sheet 610 is adjusted only in the horizontal direction. therefore, The gap distance between the substrate sheet 610 and the frame 620 can be controlled in the vertical and horizontal directions by the adjusting screw 630, Thereby, the position of each of the substrate sheets 610 is adjusted. The insert 640 can include a first insert 642 and a second insert 644. The first insertion portion 642 is interposed between the first sub-frame 622 and the lower surface of the substrate piece 610. The first insertion portion 642 may have volume elasticity and shape elasticity. An example of the first insertion portion 642 may include an elastic plate containing an elastic material, Spring and washer. The first sub-frame 622 is spaced apart from the substrate piece 610 by the first insertion portion 642. The first insertion portion 642 can absorb an external impact applied to the substrate piece 61. The second insertion portion 644 can be interposed between the second sub-frame 624 and the isolated side of the substrate piece 610. And between adjacent substrate sheets 61 。. When the second sub-frame 624 is interposed between adjacent substrate pieces 610, The second insertion portion 644 is only_between the second sub-frame 124 and the isolated side of the substrate piece 11''. The second insertion portion 644 may also have volume elasticity and shape elasticity. An example of the second insertion portion 644 may include an elastic plate containing an elastic material, Spring and washer. The second sub-frame 624 is spaced apart from the substrate piece 61 by the second insertion portion 644. Tightening the second screw 634 can cause compression of the second insertion portion 644, And the compressed second insertion portion 644 can be restored by loosening the second screw 634. The second insertion portion 644 can absorb an external impact applied to the substrate piece 61. 29 200912348 as is well known in the art to those skilled in the art, Although the above embodiment discloses that the interposer 640 is interposed between the frame 620 and the substrate piece 610, However, the insert 640 may not necessarily be interposed between the frame 620 and the substrate piece 610. E.g, No insert is provided between the frame 620 and the substrate piece 61〇. Figure 17 is a plan view of an electronic detecting device in accordance with a seventh embodiment of the present invention, 18 is a line G_G of the electronic detecting device shown in FIG. Cross-sectional view. Referring to Figures 17 and 18, The electronic detecting device 700 according to the seventh embodiment of the present invention may include a plurality of substrate sheets 71, supporting item, The adjustment member and the insert 740. The support member may include a plurality of unit frames 720, The adjustment member may include a plurality of adjustment screws 730. Substrate sheet 710, The structure and arrangement of the adjusting screw 73A and the insert 74A are the same as those described with reference to Figs. 1 to 6, The adjusting screw 13A and the insert 140 are the same. In addition, As is well known to those skilled in the art, Substrate sheet 71〇, The structure and configuration of the adjustment screw 730 and the insert 74A are also the substrate sheets 11 described with reference to Figs. 7 to 16, The adjusting screw 13A and the insert 140 are the same. The electronic detecting device 700 may include at least two unit frames 720' joined to each other and each of the frames 72 is determined to form a square ring. ‘L, whose cross section is capitalized shape. Each of the unit frames 72A can be in contact with the side portions of the substrate piece 71 and the edge portions of the lower surface. The probe 712 is placed on the lower surface of the substrate piece 710 except for its edge portion. 30 200912348 In this embodiment, The unit frame 720 can include a first sub-frame 722 and a second sub-frame 724. The first sub-frame 722 is formed into a plate shape, And having the same number of openings as the substrate piece 71. The probe 712 on the substrate piece 710 is exposed through the opening of the first sub-frame 722. The first sub-frame 722 can support the edge portion of the substrate piece 71. The second sub-frame 724 extends perpendicularly from the edge portion of the first sub-frame 722. The second sub-frame 724 can support the side of the substrate piece 71〇. Each unit frame 720 can include a protrusion 726 and/or a recess 728 corresponding to the protrusion 726. In an embodiment, The protrusion 726 and the recess 728 corresponding to the protrusion 726 are respectively positioned on the sides of the second sub-frame 724 facing the unit frame 72A facing each other. thus, When the protrusion 726 and the recess 728 are coupled to each other between adjacent second sub-frames 724, Adjacent unit frames 72 are joined to each other, And thus a plurality of unit frames 720 are formed as described with reference to FIG. 4, The frame 120 is similar to a large frame. therefore, The plurality of substrate sheets 71 can be positioned on the respective unit frames 720 constituting the large frame by the protrusions 726 and the recesses 728, respectively. Further, the substrate piece 71 is thus formed as a large substrate positioned on the same coplanar surface. In an embodiment, The protrusion 726 and the recess 728 are respectively positioned at the same height of the side of the second sub-frame 724 of the unit frame 72G. however, As is well known to those skilled in the art, Each pair of protrusions 726 and recesses 728 can be located at different heights of the sides of the second sub-frame 724 of the f-ary frame 720. It is disclosed herein that the protrusions 726 and recesses 728 can be located on different sides of the second sub-frame 724 of the unit frame 72G. However, the protrusion 726 and the recess 31 200912348 728 may also be located on the same side of the second sub-frame of the unit frame 72〇. 1 center member (not shown) is between the unit frames 720 adjacent to each other, Each of the substrate pieces 710 is positioned at the center of the unit frame 72A. An example of a center piece may include a spring piece. In the case of Yu Yu, The main frame (not shown) is located at the lower portion of the large frame of the unit frame 72〇, The main frame supports the side of the large dragon frame and the edge portion of the lower surface. The main frame also extends over the support grid that extends through the center of the wire frame. The branch grid can support the adjacent unit frame 72 (four) face joint. Figure 19 is a cross-sectional view of an electronic detecting device in accordance with an eighth embodiment of the present invention. - Fig. I9' The electronic detecting device 8A according to the eighth embodiment includes first and second substrate structures 81A and 82A, Connector 83〇, The coupling and the flatness controller 850. In the embodiment, The first substrate structure 81A may include a plurality of substrate sheets, frame, Multiple adjustment screws and multiple inserts. The structure and configuration of the first substrate structure 810 is substantially the same as the device 1 (9) described with reference to Figs. , In addition, The structure and configuration of the first substrate structure 810 is also substantially the same as the device described with reference to FIGS. 7 to 18, And it can be replaced by the device described with reference to FIGS. 7 to 18. The second substrate structure 820 is positioned on the first substrate structure 81〇, And can include news? A group (not) and a plurality of connection holes 822 electrically connected to the signal line. A conductive layer 824 is formed on the inner surface of the connection hole 822. Conductive 32 200912348 € 824 may include a first conductive material such as copper (Cu). The signal line can be electrically connected to an additional tester. The second substrate structure 820 includes a printed circuit board ( PCB) and multilayer substrates. a substrate structure 810 and a second substrate structure 82 are connected by a connector 830, Sexual connection. E.g, The conductive layer 824 located on the inner surface of the connection hole η2 is electrically connected to the electronic pad (not shown) 830 by the connecting member 83, and may include a second conductive material. Such as metal. One end portion 832 of the connector 830 (four) is connected to the electronic cymbal of the first substrate structure 810. E.g, The first end 832 can be in contact with or attached to the electronic pad. A second portion of the connector 830 opposite the first end portion 832 can be inserted into the attachment hole 822 of the second substrate structure 82A. E.g, The second portion (4) of the conductive layer 824 on the inner surface of the via 822 is either fixed to the conductive member in the embodiment - for example, a flexible printed circuit board (10). FPC, , ) can be used to replace the connector (4), And thus, the wiring element is connected to the first substrate-to-substrate turn 820. The first substrate structure (10) and the second substrate structure 82 () are mechanically coupled to each other by the vehicle members 840. In the embodiment, The adapter _ may include a reinforcing member 84 and a second reinforcing member 842, The spring piece 844 and the first reinforcing member 841 can be formed into a dish shape. And positioned on the second substrate structure 820. The second reinforcing member 842 can be formed into a ring shape. And disposed along an edge portion of the second substrate structure 820. The first reinforcement member 841, The second base 33 200912348 is configured such that the plate structure 820 and the second reinforcing member 842 are fixed to each other by the first bolts 8. The spring leaf can contact the second reinforcement member 842 and the frame of the first substrate structure 81A. The second reinforcing member 842 is fixed to the spring piece 844 by the second bolt 84 ,, The spring piece is fixed to the frame by a third bolt 847. The flatness controller 850 penetrates the first reinforcing member gw and the second substrate structure 820, And in contact with the upper surface of the substrate structure 81〇. The thickness of the first substrate structure 810 varies according to different process conditions for fabricating the first substrate structure 81 and the environment along its longitudinal direction. And thus the flatness controller 85, which is in contact with the upper surface of the parallel arrangement 810 of the first substrate 810 and the second substrate structure 82, can be connected between the control flatness controller 850 and the first substrate structure 81A. The flatness of the surface below the first-substrate junction, So that == is placed on the same coplanar surface. The flatness control H 850 does not have to be configured in the f subtest. The substrate piece of the first substrate structure 810 in the vertical direction of the top surface of the opposite substrate piece by the first adjusting screw, The flatness or material of the first substrate structure (4) is controlled by replacing the flatness controller = 〇 angle = adjusting screw. The second adjustment screw can also adjust the position of the electronic detection _ inner substrate piece. ☆ In the embodiment, When the structure and the configuration disk of the electronic inspection device are substantially the same as the device 7 described in Fig. 17 and Fig. 18, the plate structure_ may include a fresh element chain. And each unit ς 34 200912348 second substrate structure 820. Therefore, the first bolt 845 causes the first reinforcing member 84 and the second substrate structure 820 and the unit frame to be joined to each other. Figure 20 is a cross-sectional view of an electronic detecting device in accordance with a ninth embodiment of the present invention. Referring to Figure 20, The electronic detecting device 9A according to the ninth embodiment may include a first substrate structure 910, The second substrate structure 920 and the coupling member 93(). In an embodiment, The first substrate structure 91 and the second substrate structure 92 are coupled to each other by a coupling member 930. The upper surface of the first substrate structure 91 is directly in electrical contact with the lower surface of the second substrate structure 920. E.g, The coupling 930 can include a reinforcing member 931 and a plurality of bolts 932. The first reinforcing member 931 is formed into a dish shape, And it can be positioned on the upper surface of the second substrate structure 920. The first reinforcing member 93 and the second substrate structure·and the frame of the first substrate structure 910 are fixed to each other by bolts 932. The second substrate structure 920 can be directly coupled to the frame of the first substrate structure 91 by the bolts 932 without using the first reinforcing member 931. In-the implementation of shooting, When the structure and configuration of the electronic detecting device_ are substantially the same as those described with reference to Figs. 17 and 18, The first substrate structure 910 can include some units _, And each of the spiral-substrate structures 910 Adjusting the substrate piece of the electronic detecting device in the vertical direction of the top surface of the opposite plate by the first adjusting screw of the first substrate structure 910. FIG. 21 is a horizontal cross section of the electronic detecting device according to the tenth embodiment of the present invention. 200912348 FIG. 21 'The electronic detection device 1000 according to the tenth embodiment may include a first substrate structure 1010 and a second substrate structure 1020. The structure and arrangement of the first substrate structure 1〇1〇 and the second substrate structure 1〇2〇 are the same as those of the first substrate structure 81G and the second substrate structure 820 described with reference to FIG. In the first embodiment, the first substrate structure 1010 and the second substrate structure 1〇2 are fixed to each other by a bonding member (not shown) such as soldering and adhesive. The upper surface of the first substrate structure 1〇1〇 is in direct electrical contact with the lower surface of the second substrate structure 1〇2〇. In an embodiment, When the structure and configuration of the first substrate structure 1〇1〇 are substantially the same as those of the device 7〇〇 described with reference to FIGS. 17 and 18, The first substrate structure 1010 may include some unit frames, And thus the second substrate structure 1020 is fixed to each unit frame. therefore, The substrate piece of the electronic detecting device 1000 is adjusted in the vertical direction with respect to the top surface of the substrate by the first adjusting screw of the first substrate structure 1010. Figure 22 is a cross-sectional view of an electronic detecting device in accordance with an eleventh embodiment of the present invention. Referring to Figure 22, The electronic detecting device 11A according to the eleventh embodiment includes a first substrate structure 1110, The second substrate structure 112〇, The third substrate structure 1130, The first connecting member 114〇, The second connector 115〇, The coupling member 116〇 and the flatness controller 117〇. The structure and configuration of the first substrate structure 111 and the second substrate structure 112 are substantially the same as those of the first substrate structure 81 and the second substrate structure 36 200912348 820 described with reference to FIG. In an embodiment, The third substrate structure 113A may be interposed between the first substrate structure mo and the second substrate structure 1120. And may include a substrate 1132 and a support 1134 that supports the side and lower surfaces of the substrate 1132. The signal line is positioned within the substrate 1132 of the third substrate structure 113A. Examples of the substrate 1132 may include a printed circuit board (pCB) and a multilayer substrate. A first connecting member 1140 is electrically connected to the first substrate structure u 1 and the second substrate structure 1130. The first end portion 1142 of the first connecting member 114 is in contact with or fixed to the first substrate. Structure (1) 〇. The second end portion U44 of the first end portion of the first connecting member 114 is opposite to the first substrate, The structure 1130 is in contact with or fixed to the third substrate structure 113A. The lean second connector 1150 is electrically connected to the second substrate junction 1120 and the = plate structure 1130. In the present embodiment, the second connecting member 1150 electrically connects the conductive layer 1124 on the surface of the m-connector 122 and the first end portion 1152 of the second substrate member 115G. The structure 113 is contacted or fixed to the third substrate structure/, The first end portion is opposite to the second connecting member 115 接触 in contact with or fixed to the conductive layer w1154 of the second substrate structure mo, Domains (regional printed circuit boards i 5〇廿曰 instead of the first connector 1140 and the second connector: And = electrically connected to the first substrate structure by the wiring elements, the board structure to the board structure 1130, The third substrate structure (10) and the second base adapter are lightly connected to each other by the first substrate structure 111, Second substrate 37 200912348 Z substrate structure 113G ° - in the embodiment, Her cow can include a brother-reinforcing piece (10), The second reinforcement ιΐ62, The third reinforcement 1163, Spring 1164 and multiple thread checks. The reinforcing member 1161 can be in the form of a dish. And it can be recorded on the upper surface of the second substrate structure 1120. Flute_Station & 〖face brother - reinforcement 1162 can be formed into a ring, , ‘w /〇, The edge portion of a soil structure 112 is disposed. The third reinforcement member =3 can be formed into a ring shape, The third reinforcing member 1163 may be disposed along the branching member 1134 of the third substrate structure along the edge portion of the third substrate structure (4). The first bolts η% of the light fittings 116A can be fixed to each other by the first reinforcing member 116, the second substrate structure U2G, and the second reinforcing member 1162. The spring piece 1164 can connect the second reinforcement member 1162 and the third substrate structure 1130 ❾ support member 1134 to each other. So that the partial elastic piece 1164 suppresses the upper surface of the substrate ^132, The substrate Hu is thus supported by the support 1134. The second bolt 1166 can fix the spring piece 1164 to the second reinforcing member 1162. And the third bolt 1167 can fix the spring piece 1164 to the support 1134 of the third substrate structure 1130. The fourth bolt 1168 can fix the support members 1 - 134 to the third reinforcement member 1163 . And the fifth bolt 1169 can fix the first reinforcing member 1163 to the frame of the first substrate structure 111A. The additional elastic piece (not shown) is further mounted between the third reinforcing member 1163 and the frame of the first substrate structure 1110 so that the upper surface of the substrate piece of the first substrate structure m is elastically pressed by the additional spring piece. Thereby, the substrate piece is fixed to the frame of the first substrate structure 1110. ^ - although this embodiment discloses that the frame of the first substrate structure 1110 can be disposed separately from the second reinforcement member 1163, And thus by the fifth bolt 1169 38 200912348, a frame and a third viewing member of the first-substrate structure 111G, The frame and the third reinforcing member 1169 can be formed in a body without using the fifth bolt 1169. The flatness controller 1170 can pass through the first reinforcement member 61 and the second base. The structure 112G' and then contacts the upper surface of the third substrate structure 113(). No.: The thickness of the substrate structure mo varies according to different process conditions for manufacturing the first substrate structure 111 and the environment along its longitudinal direction. And thus although the first substrate structure 1110 is arranged parallel to the second substrate structure U2G, The probe tip of the first substrate structure 1110 is not positioned on the coplanar surface. The flatness controller n7G in contact with the upper surface of the third substrate structure 113G can control the horizontal angle of the first substrate structure 111G by the degree of contact between the gamma flatness controller 117 and the third substrate structure (10). , The tip of the subtraction probe is placed on the same-coplanar surface. thus, The probe tips on the underside of the first substrate structure 1110 are positioned on the same coplanar surface. The flatness controller 117〇 may not be disposed in the electronic test fixture 1100. The adjusting screw adjusts the substrate piece of the ώ substrate structure 110 in a vertical direction opposite to the top surface of the substrate piece, The flatness or horizontal angle of the lower surface of the first substrate structure 1110 can be controlled by an adjustment screw instead of the plane f controller 1170. Further, the second lion can also adjust the position of the substrate in the first substrate structure 1110 parallel to the top surface of the substrate. Cross section ^3. According to the present invention, the electronic detection device according to the twelfth embodiment is included in the electronic detection device according to the fourth embodiment. The 2009-12348 includes a first substrate structure 1210, The second substrate structure 122〇, The third substrate structure 1230, Connector 1240, Facet member 1250 and flatness controller 1260. The structure and arrangement of the first substrate structure 1210 and the second substrate structure 122 are substantially the same as those of the first substrate structure 810 and the second substrate structure 820 described with reference to FIG. Brother two substrate structure 1230, The structure and configuration of the connector 1240 and the flatness controller 1260 are the same as the third substrate structure 1130 described with reference to FIG. The second connector H50 and the flatness controller 117 are substantially identical. The coupling members 1250 can be coupled to each other with the first substrate structure 121 , The second substrate structure 1220 and the third substrate structure 123 are So that the upper surface of the first substrate structure 121A is in direct contact with the lower surface of the second substrate structure 1230, And thus the first substrate structure 1210 and the third substrate structure 123 are electrically connected to each other. In an embodiment, The coupling 1250 can include a first reinforcement 1251 Second reinforcing member 1252 Spring piece 1254 and a plurality of bolts. The first reinforcing member 1251 is formed into a dish shape. And it can be positioned on the upper surface of the second structure = 20. The second reinforcing member 1252 can be formed into a ring shape. And I is disposed along an edge portion of the second substrate structure 122. The first screw 1255 of the coupling member 125 can fix the first reinforcing member 1251 to each other. The second substrate structure 122G and the second patch 1252 ^ spring sheet 1254 can contact the second reinforcement member 1252 and the support member 1234 of the third substrate structure 123A. The second screw 1256 can secure the spring piece 1254 to the second reinforcement member 1252 and the third bolt 1257 can secure the spring piece 1254 to the support member 234 of the third substrate structure 200912348 1230. The spring piece 1254 can connect the second reinforcing member and the branch member (2) 4 of the third substrate structure 123 to each other such that a portion of the spring piece (10) supports the substrate 12 by the upper surface of the secret plate 1232 and thus by the support member 1234. The fourth bolt 1258 can fix the support member 1234 to the frame of the first substrate structure (2)0. The first substrate structure (4) and the third substrate structure 123 are directly in contact with each other and electrically connected. In addition, The electronic pad on the first substrate structure ΐ2ι〇, Hey. a further electronic pad that is coupled to the second substrate structure 123? Thereby, the first and third substrate structures are electrically connected to each other. to: In an embodiment, The first substrate structure 121 and the third substrate structure 1230 can be electrically connected to each other by the connecting member 124. And the second substrate structure 1220 and the third substrate structure 123 are electrically connected to each other by direct contact. Further, the first adjustment screw of the first substrate structure 121A can also adjust the substrate piece in the first substrate structure 1210 in a vertical direction with respect to the top surface of the substrate piece. Figure 24 is a cross-sectional view showing an electronic detecting device in accordance with a thirteenth embodiment of the present invention. Referring to Fig. 24', the electronic detecting device 13' according to the thirteenth embodiment includes a first substrate structure 131A, The second substrate structure 132〇, The third substrate structure 1330, First connector 1340, Second connector 1350, Coupling 1360 and flatness controller 1370. The first substrate structure 1310 includes a plurality of substrate sheets, Each of the substrate sheets is supported by a unit frame, and the coupling member 1360 secures the first substrate structure 1310 to the 200912348 second substrate structure 1330. In order to separate the unit frames from each other. In addition to the above separated unit frame, The first substrate structure 1310 in the electronic detection device The second substrate structure 132〇, The third substrate structure 133〇, First connector 1340, Second connector 1350, The structure and configuration of the coupling member 1360 and the flatness controller 1370 are the first substrate structure 1110 in the electronic detecting device 11A described with reference to FIG. The second substrate structure 112〇, a third substrate structure 1130, The first connecting member 114〇, The second connector 115〇, Coupling 1160 and flatness controller 117 are identical. Therefore, the first adjustment screw of the first substrate structure 131 can adjust the substrate piece of the first substrate structure 1310 in the vertical direction with respect to the top surface of the substrate piece in the electron detecting device 1300. In addition, The second adjustment screw of the first substrate structure 131A can adjust the substrate piece of the first substrate structure 1310 in a horizontal direction with respect to the top surface of the substrate piece in the electronic measuring device 1300. Figure 25 is a cross-sectional view showing an electronic detecting device in accordance with a fourteenth embodiment of the present invention. Referring to Figure 25, The electronic detecting device 14A according to the fourteenth embodiment includes a first substrate structure 141A, The second substrate structure 142, The third substrate structure 1430, Connector 1440, Coupling 1450 and flatness controller 1460. . The first substrate structure 1410 includes a plurality of substrate sheets, Each substrate piece is made of a single sheet. Frame support, The coupling member 1450 fixes the first substrate structure 1410 to the third substrate structure 1430. In order to separate the unit frames from each other. In addition to the above separated unit frame, First substrate structure in the electronic detecting device 1400 42 200912348 1410, a second substrate structure 1420, a third substrate structure 1430, Connector 1440, The structure and configuration of the coupling member 1450 and the flatness controller 146A are the first substrate structure 1210 in the electronic detecting device 12A described with reference to FIG. a second substrate structure 1220, a third substrate structure 1230, Connector 1240, The coupling 1250 and the flatness controller 126 are the same. therefore, The first adjustment screw of the substrate-structure 1410 can adjust the substrate piece of the first substrate structure 1410 in a direction perpendicular to the top surface of the substrate piece in the electronic detecting device 1400. Figure 26 is a flow chart showing the process steps of the assembly method of the electronic detecting device shown in Figures 1 through 18. The electronic detecting device disclosed in Figs. 1 to 18 has a similar structure and configuration. Thus, the assembly method of the electronic detecting device will be described below based on the devices disclosed in Figs. Referring to Figure 26, The substrate piece π is positioned in the frame 120 (step S110). Providing a frame i2^' including the first sub-frame 122 and the second sub-frame 124 and positioning the substrate piece within the frame 120, Positioning the substrate sheets adjacent to each other, And some portions of the surface of the substrate sheet are supported by the frame 120. E.g: The edge portion and the side surface of the lower surface of the substrate piece 110 are supported by the frame 12? And thus the probe 112 mounted on the lower surface of the substrate piece except the edge portion is exposed to the surroundings. As shown in Figure 1, The top surface edge portion and the side surface of the substrate sheet n can also be supported by the frame 12. Subsequently, The probe 112 to be in direct contact with the detection target is mounted on the substrate sheet U0. E.g, The probe can be mounted on the substrate before the substrate piece 110 is positioned at the frame 120 43 200912348>; On the lower surface of 110. The substrate piece 11G can be positioned in the frame 120. And then the probe 112 is mounted on the lower surface of the substrate sheet 110 in the frame 12A. After P has passed, the tuning screw 130 is attached to the frame 120 (step si2〇). The first adjusting screw 132 can penetrate the first sub-frame 122 upward from the bottom thereof. And the substrate sheet 11 can be fixed or contacted. In addition, A break penetrates the first sub-frame 11〇 from the top thereof, and: Can be touched to the substrate piece 122. The second adjusting screw 134 can penetrate the second sub-frame 124 in a direction parallel to the top surface of the substrate piece 11? The substrate sheet 110 can be fixed or contacted. Includes the first insert! The insert member 42 of the 42 and the second insertion portion 144 is mounted on the substrate piece 110, Then, the adjusting screw 14 is attached to the frame 120. The first insertion portion 142 is inserted into the first boundary region between the first sub-frame 122 and the lower surface of the substrate sheet 11 . The second insertion portion 144 is inserted into the second boundary portion between the first sub-frame 124 and the side of the substrate sheet no and between the sides of the adjacent substrate sheets adjacent to each other. The gap distance between the frame 120 and the substrate piece 11〇 is controlled by the adjusting member 13〇, And thus the position of the substrate sheet 〇 0 in the frame 12 is adjusted by the regulating member 13 ( (step S130). Pulling or pushing the substrate piece 11〇 by the first adjusting screw 132, Thereby, the gap distance between the first sub-frame 122 and the lower surface of the substrate piece 110 is adjusted. thus, The position of the substrate piece is adjusted by the first adjustment screw 132 in the vertical direction of the upper surface of the substrate piece 110 in the opposite frame 120. The substrate piece 11 can be pulled or pushed by the second adjusting screw 134, Thereby, the gap between the second sub-frame 122 and the side surface of the substrate piece 11 is adjusted to be 44 200912348. thus, The position of the substrate piece is adjusted in the horizontal direction of the upper surface of the flat substrate piece m by the second adjusting screw 134. Figure 27! A flowchart showing the process steps of the assembly method of the electronic detecting device shown in Figs. 19 to 25 is shown. The electronic detecting device disclosed in Figures I9 to 25 has a similar configuration and configuration, and the method of assembling the electronic detecting device will be described below based on the shock disclosed in the drawings. Participation, Figure 27 ’frame, The plurality of substrate pieces 11A and the plurality of adjustment wires are assembled into the first substrate structure 8 (step S210). Subsequently, A probe to be in direct contact with the detection target is mounted on the substrate month 810. E.g, The probe can be mounted on the lower surface of the substrate piece 810 before the substrate piece 81 is positioned on the frame. The substrate piece 81〇 can be positioned in the frame, And then the probe is mounted on the lower surface of the substrate piece 81 in the frame. Subsequently, The first substrate structure 810 is electrically connected to the second substrate structure 820 by direct contact of the first substrate structure 810 and the second substrate structure 82 (step S220). The gap distance between the frame and the substrate piece 810 is controlled by an adjustment member. And thus, the position of the substrate piece in the frame is adjusted by the adjusting member (step S230). The process for controlling the gap distance between the frame and the substrate piece 810 is substantially the same as the control process for adjusting the gap distance between the frame and the substrate piece described with reference to Fig. 26. The position of the substrate piece is adjusted by controlling the gap distance between the frame and the substrate piece by using an adjusting screw. 45 200912348 Figure 28 is a plan view showing an electronic detecting apparatus according to a fifteenth embodiment of the present invention. Figure 29 is a line H-H along line 28, Cross-sectional view, 3 is a cross-sectional view taken along line I-Ι of FIG. 28. Referring to Figures 28 and 30, The electronic detecting device 1500 according to the fifteenth embodiment may include a substrate piece 1510, supporting item, Adjustment parts, The coupling member 155 插入 ^ the insert member 1560 and the reinforcing member 1570. In an embodiment, The support member includes a frame 1520 and a support bar 153〇, And the substrate sheets can be supported to position the substrate sheets 11 adjacent to each other. The adjustment member can include a plurality of adjustment screws 1540 and can adjust the relative position of the substrate piece relative to the frame 1520. Figure 31 is a plan view of the substrate piece shown in Figure 28, And Fig. 32 is a line j_j along the substrate piece shown in Fig. 31, Cross-sectional view. Each of the substrate sheets 151'' with reference to Figs. 28 to 32' may include a plurality of probes 1512 on the lower surface thereof. The structure and arrangement of the substrate piece 151A in this embodiment are substantially the same as those of the substrate piece 110 described with reference to Figs. 1 and 2. Figure 33 is a perspective view showing the frame of the electronic detecting device shown in Figure 28. Referring to Figure 33, The frame 1520 can support the substrate piece 1510 and can include a first sub-frame 1522 and a second sub-frame 1524. The first sub-frame 1522 is formed into a plate shape and has the same number of openings as the substrate piece. The first sub-frame 122 can support an edge portion of the lower surface of the substrate piece 151. The probe 1512 on the substrate piece 1510 is exposed through the opening of the first sub-frame 1522. The second sub-frame 1524 protrudes from the edge portion of the first sub-frame 1522 vertically 46 200912348. A sub-frame 1524 is the side of the substrate piece bio disposed adjacent to each other. When the substrate piece 1510 is disposed in the frame 1520 to inspect the pattern, A pair of side faces adjacent to the substrate piece 1510 are in direct contact with each other, At least one side surface of the substrate piece 151 is not in contact with the other substrate piece 1510. The side of the substrate piece 1510 that is in direct contact with the other side of the adjacent substrate piece 1510 as defined above is referred to as the bonding side 'and the side of the substrate piece 1510 that is not in contact with the other side of the other substrate piece 1510 is called Make an isolated side. thus, The first sub-frame 1524 can support the isolated side of the substrate sheet 1510. The top surface of the second sub-frame 1524 is slightly higher than the upper surface of the substrate piece 1510. As shown in Figure 28 to Figure 30 and Figure 33, The second sub-frame 1524 is not located between adjacent substrates $1010, The adjacent substrate sheet 151 has at least one bonding side. however, The second sub-frame 1524 can also be located between adjacent substrate sheets 1510. So that the substrate piece 1510 does not have a bonding side. under these circumstances, The second sub-frame 1524 can support all sides of the substrate piece 1510. In an embodiment, The frame 1520 can include only the second sub-frame 1524, The first sub-frame 1522 is not included. The frame 1520 can support the substrate piece 151〇, The substrate sheets 151 are arranged adjacent to each other, The plurality of substrate sheets 1510 can be assembled into a single large probe substrate in the electron detecting device 1500. ~ a center member (not shown) is interposed between the frame 1520 and the substrate piece 151? Each of the substrate sheets 51 is positioned at the center of the frame 1520. Examples of the center piece may include a spring piece. The support member 1530 can be positioned on the upper surface of the substrate piece 151〇 and formed into a strip shape. E.g, The support 1530 can include a plurality of first strips 1532 to 47 200912348 and a plurality of second strips 1534. In the example, the first strip 1532 can be positioned at the edge portion of the substrate sheet 1510. And extending parallel to each other in the first direction. Therefore, the contact pads on the upper surface of the substrate sheet are exposed through the space between the pair of substrate sheets. The second strip 1534 is positioned on the first strip 1532, And extending in parallel in a second direction perpendicular to the first direction, for example, The second strip 1534 extends in the second direction over the substrate sheet (10) along the middle of the substrate sheet 1510. Since the first and second strips are formed into elongated strips and are forked to each other, The electronic pads on the upper surface of the substrate sheet 1510 are exposed through the spaces defined by the first strips 1532 and the second strips 1534. The first strip 1532 and the second strip 1534 can be integrally formed. The support member 1530 is shaped into a grid (support grid). In this embodiment, A support strip on the upper surface of the substrate piece 1510 can be used as the support member 1530 instead of the support grid. The support 1530 may also include only the first strip 1532, The second strip 1534 is not included. under these circumstances, The first strips 1532 can be joined to each other and formed integrally. Referring again to Figures 28 through 30, The adjustment screw 1540 can include a first adjustment screw 1542 and a second adjustment screw 1544. The first adjustment screw 1542 can adjust the relative position of the substrate piece 1510 relative to the first strip 1532 and the second strip 1534. The second adjustment screw 1544 adjusts the relative position of the substrate piece 1510 relative to the frame 1520. In an embodiment, the first adjusting screw 1542 and the second adjusting screw 48 200912348 1544 may include a plurality of screw and a plurality of pushing screws. The towel pulls the substrate piece (5) by pulling the pulling screw to thereby adjust the position ′ of the substrate piece 151 并且 and pushes the plate # by tightening the shaft screw to thereby position the substrate piece 1510. In an embodiment, The first adjustment screw 1542 can include a first wire 1542a and a first push screw (10). The first traction screw 1542a is screwed downward from the upper portion of the support bar 532 to the lower portion thereof. Thereby, the support strip 1532 is penetrated and inserted into the substrate piece 1510. The first pulling screw 1542a can also be screwed upward from the lower surface of the substrate piece 151〇 to the upper surface thereof. Thereby, the substrate piece 151 is penetrated and inserted into the support bar 1532. therefore, The first gap distance between the first support strip 1532 and the substrate piece 1510 is shortened by tightening the first pull screw 1542a. The first push screw 1542b is screwed downward from the upper portion of the support bar 1532 to the lower portion thereof. Thereby, the support strip 1532 is penetrated and brought into contact with the substrate piece 151. The driver push screw 1542b can also be screwed upward from the lower surface of the substrate piece 1510 to the upper surface thereof. Thereby, the substrate piece 1510 is penetrated and contacts the first strip 1532. Therefore, the first gap distance between the first stay 1532 and the substrate piece 1510 is shortened by tightening the first push screw 542b. therefore, The first gap distance between the first strip 1532 and the substrate piece 1510 is controlled by the first pulling screw 1542a and the first pushing screw 1542b, thereby adjusting the substrate piece in the vertical direction of the upper surface of the opposite substrate piece 1510. The relative position of 1510. When using the first traction screw and the first push screw 1542& And l542b as the adjustment screw 1540 to adjust the position of the substrate piece 1510, The adjusting screw 154G can be easily loosened by external conditions of 49 200912348, For example, by adjusting the thermal expansion and vibration of the 1540, And thus the position of the substrate piece 151 〇 relative to the second strip 1532 can be easily changed. however, When the first 1542, When the first push screw (10) simultaneously serves as the adjusting screw 2 to adjust the position of the substrate piece 1510, The first push screw 154 hole can be complementarily tightened by a pulling screw 1542a. And the first traction screw 1542 can be complementarily tightened by the first push screw 1542b. And thus, once the wire 1540 is used to adjust the position of the substrate piece 151, The substrate sheet 151 is stably positioned by the two phases 1542. In an embodiment, the second adjustment screw 1544 can include a second traction screw 1544a and a second push screw i544b. The second traction screw 1544a is screwed inwardly from the outer surface of the second sub-frame 1524 to the inner surface of the second sub-frame 1524. Thereby, the second sub-frame 1524 is penetrated and inserted into the substrate piece 151. therefore, The second gap distance between the second sub-frame 1524 and the substrate piece 151 is shortened by tightening the second pulling screw 1544a.
第二推動螺絲1544b從第二子框架1524的外表面向内 旋擰到第二子框架1524的内表面，以藉此穿透第二子框架 1524並接觸基板片151〇。因此，藉由擰緊第二推動螺絲 1544b來增加第二子框架1524與基板片1510之間的第二 間隙距離。 因而’可藉由第二牽引螺絲1544a和第二推動螺絲 1544b來控制第二子框架1524與基板片151〇之間的第二 間隙距離’藉此調節基板片1510相對第二子框架124的相 50 200912348 對水平位置。第二螺絲1544可穿過第二子桓架1524，並 且在基板片1510之至少-孤立侧面上牽引或推動基板片 1510,使得可在與基板片1510之上表面平行的方向上調節 各基板片1510。於本實施例中，第二螺絲1534接合到基 板片1510的二孤立侧面。 此外，在弟二牵引推動螺絲1544a和第二推動螺絲 1544b的調節完成後，使用第二牵引螺絲154如和第二推 動螺絲1544b將基板片1510相對於第二子框架1524固定 於調節位置。 第一调郎螺絲1542和第二調節螺絲1544可通過框架 1520和第一條狀物1532的第一螺絲孔，並且經第二螺絲 孔插入基板片1510。 於一實施例中，第一牽引螺絲1542a和第二牵引螺絲 1544a所通過之第一螺絲孔的直徑大於第一推動螺絲 1542b和第二推動螺絲1544b所通過之第一螺絲孔。 於一實施例中’第一螺絲孔的直徑與第一調節螺絲 1542的直徑實質上相同，並且第二螺絲孔的直徑與第二調 節螺絲1544的直徑實質上相同。第一調節螺絲1542和第 二調節螺絲1544與第一和第二螺絲孔之側壁的間隔距離 處於容許的製程容限内。 第二調節螺絲1544接合於彼此相鄰之基板片1510的 第一和第二孤立側面，並且藉由在一第二調節螺絲1544 接合於基板片1510之第一孤立側面的情況下鬆開或擰緊 接合於第二孤立侧面的另一第二調節螺絲1544來在平行 51 200912348 =基板1 110之上表面的方向上調節基板片151〇。此外， 藉由在第-螺絲1542接合於基板片151G之下表面的情況 下鬆開或擰緊接合於孤城面的第二調節觸1544來在 平行於基板片1510之上表面的方向上調節基板片151〇。 此外，藉由在第二調節螺絲1544接合於基板片151〇之下 表面的情況下鬆開或擰緊第—調節觸1542在垂直於基 板片1510之上表面的方向上調節基板片1510。 於一實施例中，調節螺絲1 可僅包括第-調節螺絲 1542 ’而不包括第二調,累絲1544，使得僅在垂直於基板 片1510之上表面的方向上調節基板片1510 ,而不在平行 於基板片151G之上表面的方向上調節基板片151〇。 於-實施例中，調節螺絲154〇僅包括 15桃和第_二推_絲1观，料包括第—牵引螺絲 15=a和第—牽引螺絲1544&，以僅在相對基板片⑸〇之 ^表^的垂直和水平方向上減小但不增加基板片i5i〇與 ir 1532之間的第一間隙距離以及基板片測與 弟子框架1524之間第二間隙輯的方式來調節基板片 1 Ml) 〇 1542於^施H —絲154G僅包括第—牽引螺絲 1542:和螺絲Μ*’而不包括第-推動螺絲 螺絲_，以僅在相對_ 1510之 i 向上增加但不減小基板片⑸〇與 二之間的第一間隙距離以及基板片1510與 弟一子框架1524之料二_輯的方絲調節基板片 52 200912348 1510。 因此’調節螺絲1540可控制基板片1510與支撐條 1530之間的第一間隙距離以及基板片151與框架152〇之 間的第二間隙距離，以藉此調節各基板片110相對支撐條 1530和框架1520的水平和垂直位置。 ' 耦接件1550可彼此耦接第一條狀物1532和第二條狀 物1534。例如，耦接件155〇可向下穿過第二支撐條1534, 並插入第一條狀物1532。因此，第一條狀物1532和第二 條狀物1534可由耦接件155〇彼此耦接。 如下文芩照圖55和圖56所描述的，利用接合於基板 片1510上之螺栓和螺母來替代調節螺絲154〇，以藉由螺 栓和螺母來调郎各基板片1510的水平和垂直位置。 ' 於一實施例中，插入件1560可包括第一插入部1562 和第二插入部1564。 第一插入部1562介於第一條狀物1532與基板片151〇 之上表面之間。第一插入部1562可具有體積彈性和形狀彈 性。具有體積彈性之第一插入部1562的實例可包括含彈性 材質的彈性板，而具有形狀彈性之第一插入部1562的實例 可包括彈簧以及墊圈。彈簧或墊圈可與第一調節螺絲1542 一起使用。第一條狀物1532藉由第一插入部1562與基板 片1510間隔。擰緊第-調節螺絲1542可引起第一插入部 I562的壓縮’而藉由鬆開第一調節螺絲⑼2來恢復壓縮 的第一插入部1562。此外，第一插入部1562可吸收施加 於基板片1510的外部衝擊。 53 200912348 此外，第一插入部1562更可介於第一子框架1522與 基板片1510之下表面之間。 第二插入部1564可介於第二子框架1524以及基板片 1510的孤立側面之間，並且介於鄰近基板片151〇的結合 侧面之間。當第二子框架1524介於基板片151〇之間時， 第二插入部1564僅介於第二子框架1524與基板片151〇 之侧面之間。第二插入部1564的結構和配置與第一插入部 1562相同，並且省略了關於第二插入部1564的更詳細的 描述。 儘管本實施例揭示了插入件1560介於第二子框架 1524與基板片1510之間以及第一支撐條1532與基板片 1510之間，但也可在第二子框架1524與基板片151〇之間 以及第一支撐條1532與基板片1510之間不設置插入件。 在這種情況下’基板片1510直接接觸第一條狀物1532或 第二子框架1524。 補強件1570可包括第一補強部1572和第二補強部 1574。 如圖31和圖32所示，第一補強部1572位於第一調節 螺絲1542之第一牽引螺絲1542a接合基板片1510的位 置。第一補強部1572的材料強度大於基板片1510的材料 強度，藉此便於在基板片1510上形成第一螺絲1542所經 過之螺絲孔。於一實施例中，第一補強部1572可藉由黏膠 黏附於基板片1510或藉由干涉配合插入基板片1510。 第二補強部1574位於第二調節螺絲1544之第二牽引 54 200912348 ------— 螺絲1544a接合基板片1510的位置。第二補強部1574的 結構和配置與第一補強部1572相同，並且省略了關於第二 補強部15 74的詳細描述。 儘管本實施例揭示了補強件1570如圖28至圖32所示 地安裝於基板片1510上，但也可以不安裝補強件於基板片 1510上。在這種情況下，第一牽引螺絲i542a和第二牽引 螺絲1544a可與基板片1510直接接觸。 因此，電子檢測裝置1500的調節螺絲1540可調節基 板片1510的位置。也就是，在相對基板片151〇之上表面 的垂直方向上調節基板片1510,使得基板片151〇的高度 相同。此外’在相對基板片1510之上表面的水平方向上調 節基板片1510’使得基板片1510的探針1512位於同一共 面表面。 於一實施例中，電子檢測裝置1500内可不包括框架 1520和第二調節蜾絲1544。在這種情況下，可僅由第一調 節螺絲1542在相對基板片1510之上表面的垂直方向上調 節基板片1510相對支撐條1530的相對位置。 圖34是基板片調節後的圖28至圖32所示之電子檢測 装置的平面圖，而圖35是圖34所示之電子檢測裝置的橫 截面圖。 在圖34和圖35中，為了便於描述，卡氏座標系統採 用如下定義。X軸和垂直於X軸的y軸定義成使得基板片 1510的頂面平行於X軸與y轴產生的表面。z軸定義成垂 直於X轴和y軸二者，使得z軸垂直於基板片151〇的頂面。 55 200912348 下文中，垂直於χ軸的框架1520的侧面被稱作第一表面， 而垂直於y轴的框架1520的側面被稱作第二表面。面向基 板片1510且垂直於第一和第二表面二者之支撐條1530的 表面被稱作第三表面。 參照圖34和圖35,可擰緊框架1520之第一表面上的 第一牽引螺絲1544a 並因而在χ轴方向上牽引基板片 1510’並且可擰緊框架1520之第一表面上的第二推動螺絲 1544b並因而在χ軸方向上推動基板片1510。結果，藉由 位於框架1520之第一表面上的第二調節螺絲1544在χ轴 方向上移動基板片1510。在這種情況下，位於框架1520 之第二表面上的第二推動螺絲1544b固定於基板片151〇 並且因而位於框架1520之第二表面上的第二推動螺絲 1544b也在χ轴方向與基板片MW 一同移動。位於框架 1520之第二表面上的第二推動螺絲154仙僅與基板片i5i〇 接觸。出於上述原因，第二牽引螺絲1544a所穿過之框架 1520的螺絲孔的直徑大於第二牽引螺絲1544&的直徑。因 而，當位於框架1520之第二表面上的第二牽引螺絲1M4a 經框架1520的第-螺絲孔接合於基板片上時，第二牽引螺 絲1544a在χ軸方向上與基板片151〇一起移動，直到第二 調節螺絲1544完全擰緊。 基板片1510在y軸方向上的移動與χ軸移動相同，並 因而忽略了基板片在y軸方向上移動的更詳細描述。 可擰緊位於支撐條1530之第三表面上的第一牽引螺 絲1542a，並因而基板片！㈣可在2軸方向上向上移動，、 56 200912348 並且可擰緊位於支撐條153〇之第三表面上的第一推動螺 絲1542b，並且因而基板片151〇在ζ軸方向上向下移動。 結果’藉由位於支撐條153〇之第三表面上之第一調節螺絲 1542在ζ軸方向上移動基板片ι51〇。在這種情況下，位於 框架1520之第一和第二表面上的第二牽引螺絲1544a經框 架1520的第一螺絲孔固定於基板片ι51〇,並且因而位於 框架1520之第二表面的第二牽引螺絲1544a也可在z軸方 向上與基板片151〇 一同移動。因而，第二牽引螺絲154如 在ζ軸方向上與基板片151〇 一同移動，直到第二調節螺絲 1544完全擰緊，並且位於框架152〇的第一和第二表面上 的第二推動螺絲154仆僅與基板片151〇接觸。 於一實施例中，多個支撐條153〇位於基板片151〇上。 支樓條1530的數量根據基板片151〇的數量（例如，2、4、 i、^片）和尺寸發生變化。當基板片數量增加 ，例如， 仗4片增加到16片，並且組裝後的基板整體尺寸不變時， ，增加支撐條153G上的螺絲孔就足以調節增加的基板 不^支撐條1530的任何變化。特別是，當基板片151〇 的數量和_根據不同檢測條件發生變化時，例如，從2 ,2列（2x2)矩陣型變成2攔父3列㈤）矩陣型時，僅 二板片-就足以應對基板片1510的改變，不需對整 板片仍^私任何修改。也就是，原有的2X2矩陣型基 保持不變，並在第一條狀物划所延伸的列方向上 板片到原有的2X2矩陣型基板片1510上。可僅 糟由^或互換第二條狀物1534將附加基板片輕易地固 57 200912348 基板片1510的數 定於原有的2x2基板片1510上。因此 1和陣列可根據檢測環境輕易地改變。 此外，當電子檢測裝置中的一支撐條咖破損時，僅 利用新的支撐條來替換破損之支#條，同時除了破損之支 撐條外的其他支撐絲持不變，並且整織板的㈣位置 Z僅針對絲破損之讀條絲板片進行，藉此便於檢 測裝置的維謹。 、，圖36是根據本發明第十六實施例的電子檢測裝置之 平面圖，而圖37是沿圖36所示之電子檢測裝置的線κ_κ, 的橫截面圖。 參照圖36和圖37，根據第十六實施例的電子檢測裝 置1600可包括基板片161〇、支撐件、調節件、耦接件165〇、 插入件1660以及補強件1670。 於一實施例中，支撐件包括框架1620和支撐條163〇, 並且可支撐基板片1610以使基板片161〇彼此相鄰定位。 調節件可包括多個調節螺絲1640並且可調節基板片161〇 相對框架1620的相對位置。 本實施例中的基板片1610、框架1620、調節螺絲164〇 以及插入件1660的結構及配置與參照圖28和圖32詳細描 述的基板片1510、框架1520、調節螺絲1540以及插入件 1560實質上相同。 支撐條1630的結構和配置可與參照圖28至圖32描述 的支撐條1530實質上相同，除了第二條狀物1634延伸到 框架1620，並因而第二條狀物1634與框架1620的上表面 58 200912348 接觸。 耦接件1650可包括第一固定螺絲1652和第二固定螺 絲 1654 。 第一固定螺絲1652的結構和配置與參照圖28至圖32 描述的耦接件1550實質上相同。 第二固定螺絲1654可包括第三牽引螺絲1654a和第三 推動螺絲1654b。 第三牽引螺絲1654a還可從第二條狀物1634的上表面 向下旋擰到其下表面，以藉此穿透第二條狀物1634並插入 第二子框架1624。第三推動螺絲165牝還可從第二條狀物 1634的下表面向上旋擰到其上表面，以藉此穿透第二條狀 物1634並插入第二子框架1624。第二子框架1624與第二 條狀物1634之間的第一間隙距離藉由擰緊第三牽引螺絲 1654a而縮短，並藉由擰緊第三推動螺絲1654b而增加。 第三牽引螺絲1654a和第三推動螺絲1654b還可調節 第一框架1622與基板片1610之間的第二間隙距離，使得 可在相對基板片1610之上表面的垂直方向上調節基板片 1610 〇 補強件1670可包括第一補強部1672和第二補強部 1674。 第一補強部1672和第二補強部1674的結構和配置與 針對圖28至圖32描述的第一補強部1572和第二補強部 1574實質上相同，並因而省略了關於第一補強部1672和 第二補強部1674的詳細描述。 59 200912348 於一實施例中’第一條狀物1632更延伸到第二子框架 1624，使得第一條狀物1632可接觸第二子框架i624的上 表面。因此，包括第三牵引螺絲1654a和第三推動螺絲 1654b的第二固定螺絲1654還可調節第一條狀物1632與 第二子框架1624之間的第三間隙距離。 圖38是繪示圖36所示之電子檢測裝置的透視圖。 夢照圖38，框架1620僅包括第二子框架1624，但不 包括第一子框架1622，並因而第一條狀物1632或第二條 狀物1634接合於第二框架1624。 “圖39是根據本發明第十七實施例的電子檢測裝置之 平面圖，而圖40是沿圖39所示之電子檢測裝置的線l_l， 的橫截面圖。 參妝圖39和圖40，根據第十七實施例的電子檢測裝 置1700可包括基板片pH)、支撐件、調節件、輕接件I?%、 插入件1760以及補強件1770。 於一實施例中，支撐件包括框架172〇和支撐條173〇， 並且可支撐基板片1710以使基板片171〇彼此相鄰定位。 調節件可包括多個調節螺絲1740並且可調節基板片171〇 相對框架1720的相對位置。 本實施例中的基板片1610、框架1620、調節螺絲164〇 以及插入件1660的結構及配置與參照圖28至圖32詳細描 述的基板片1510、框架1520、調節螺絲1540以及插入件 1560實質上相同。 第二條狀物1734定位於基板片1710的邊緣部份並且 200912348 耦接件1750的第一固定螺絲1752將第二條狀物1734固定 於基板片1710。基板片πιο、框架1720、支撐條173〇、 調節螺絲1740、輸件1750以及插入件176〇的結構和配 置與參照圖36至圖38描述的基板片1610、框架162〇、支 樓條1630、調節螺絲1640、轉接件1650以及插入件166〇 相同，除了耦接件1750之第一固定螺絲1752的上述配置， 因此忽略了基板片1710、框架1720、支撐條173〇、調節 螺絲1740、耦接件1750以及插入件176〇的詳細描述。 補強件1770可包括第一補強部1772、第二補強部1774 和第三補強部1776。 第一補強部1772和第二補強部1774的結構和配置與 針對圖28和圖32描述的第一補強部1572和第二補強部 1574只貝上相同，並因而省略了關於第一補強部1772和 第二補強部1774的詳細描述。 於只施例中，第三補強部1776位於搞接件1750之 第口疋螺絲1752接合基板片171〇的位置。第三補強部 17= _的材料強度大於基板片171〇的材料強度，藉此便於 在第三補強部1776上形成第一固定螺絲1752所經過之螺 絲孔。於一實施例中，第三補強部1776可藉由黏膠黏附於 基板片Π10或藉由干涉配合插入基板片171〇。 接合於安裝有多個探針之基板片171〇下表面上的第 一固之螺絲1754調節第二條狀物1734與框架1720之間的 間隙距離。因而，可藉由第二固定螺絲1734在上表面的垂 直方向上在其下部調節基板片1710。 61 200912348 圖41是根據本發明第十八實施例的電子檢測裝置之 平面圖，而圖42是沿圖41所示之檢測裝置的線M_M，的 橫截面圖。 參照圖41和圖42，根據第十八實施例的電子檢測裝 置1800可包括基板片1810、支撐件、調節件、耦接件1850 以及插入件I860。 於一實施例中，支撐件包括框架1820和支撐條183〇, 並且可支撐基板片1810以使基板片181〇彼此相鄰定位。 調節件可包括多個調節螺絲1840並且可調節基板片181〇 相對框架1820的相對位置。圖43是圖41所示之電子檢測 裝置的基板片的平面圖，而圖44是沿圖43的線^^^^，的橫 截面圖。 參照圖41至圖44，框架1810可包括主體1812以石 輔助件1814。 主體1812定形成板狀，並且多個探針1815位於主错 1812的下表面上。探針1815與檢測目標、 電抒（未繪示）位於主體1812的上表面。訊號二心 =安裝於主體ι812内並且電子墊和探針1815藉由訊 線彼此電性連接。 輔助件1814封閉主體1812之側面的上部。辅 ⑻4的材料強度大於主體體的材料強度，藉此便於名 主體1812上形成調節螺絲184〇所經過的螺絲孔。 =實施射，輔助件1814和主體^、可藉由螺絲 彼此固疋。例如，主體1812可包括突出部，而辅助件帥 62 200912348 可包括凹陷部，主許 絲可穿透位於辅助件Z的突出部插入凹陷部内，並且嫘 部。於-實施例中M /之凹陷部内的主體1814之突出 彼此黏附或藉由干涉==^14和主體觀可藉由黏朦 如圖42至圖44辦_ 的上部側面時，’ § 1814封社體㈣ 給探針1815，並因的下㈣圍的更多^間提供 探針1815。此外，#針 1812的下表面上安裝更多的 體㈣和第二主體位於彼此相鄰之第一主 最小的距離。 2b上的弟—和第二探針彼此間隔 側面於—她种，輔助件綱可糊域⑻2的整個 1840本框架1820、支擇條1830、調節螺絲 日1 / 及插人件獅_構和配置與參 Γ54〇固制框架跡支撐條⑽、調節螺絲 調# ^ 一、550以及插入件156〇實質上相同，除了 = ^ 1840插入基板片刪的辅助件1814,因而省略 Γ支撐條刪、調節螺絲_、固定螺絲侧 及插入件I860的更詳細描述。 平^ 45疋根據本發明第十九實施例的電子檢測裝置之 的：而:。46是沿圖45所示之電子轉^ ，照圖45和圖46 ’根據第十九實施例的電子檢測裝 置_可包括基板片191〇、支撐件、調節件、減件195〇、 63 200912348 插入件I960以及補強件1970。 於一實施例中，支撐件包括框架1920和支撐條193〇, 並且可支撐基板片1910以使基板片191〇彼此相鄰定位。 調節件可包括多個調節螺絲194〇。 本實施例中的基板片1910、框架1920、固定螺絲195〇 以及補強件1970的結構及配置與參照圖28至圖29詳細描 述的基板片1510、框架1520、固定螺絲1550以及補強件 1570實質上相同。 支撐條1930可包括第一條狀物1932和第二條狀物 1934。支撐條1930的結構和配置與參照圖28至圖％描述 的支撐條1530貫質上相同，除了本實施例之支撐條 延伸到第二框架1934和基板片191〇之間的邊界區域以及 基板片1910的上表面，藉此支撐基板片191〇的側面。因 而，下文中省略了支撐條1930的詳細描述。 於一實施例中，調節螺絲1940可作為調節件，並且可 調節基板片1910相對支撐條1930的相對位置。 調節螺絲1940可定位於支撐條193〇上，並且包括用 以在垂直方向上調節基板片位置的第一螺絲1942以及用 以在水平方向上調節基板片位置的第二螺絲1944。 本實施例中的調節螺絲1940的結構和配置與參照圖 28至圖33描述的第十五實施例中的調節螺絲154〇相同， 除了第二螺絲位於支標基板片191〇之側面的支撐條 上並且在平行於基板片1910之上表面的方向上調節基板 片1910的位置。因而’省略了調節螺絲194〇的更詳細描 64 200912348 述。 於一實施例中，第二子框架1924包括暴露第二螺絲 1944之頭部的開口，以藉此便於擰緊以及鬆開第二螺、 1944。 、 本貫％例的插入件I960的結構及配置與參照圖28至 ，33中描述的第十五實施例的調節螺絲154〇相同，除了 第二插入部1964介於支撐條1930與基板片1910的侧面之 間以及彼此相鄰的基板片1910的側面之間。因而，省略插 入件1960的更詳細描述。 電子檢測裝置1900也可不安裝框架192〇。 藉由支撐條1930以及調節螺絲1940在垂直及平行於 基板片1910之上表面的方向上來調節基板片191〇的位置。 圖47是根據本發明第二十實施例之電子檢測裝置的 橫截面圖。 參照圖47 ’根據第二十實施例的電子檢測裝置2〇〇〇 包括第一基板結構2010和第二基板結構2020、連接件 2030、耦接件2040以及平面度控制器2050。 於一實施例中，第一基板結構2〇1()可包括多個基板 片、框架、多個支撐條、多個調節螺絲、多個固定螺絲、 多個插入件以及多個補強件。第一基板結構2 〇丨〇的結構和 配置與參照圖28至圖33描述的裝置1500實質上相同。 此外，第一基板結構2010的結構和配置也可與參照圖 34至圖46描述的裝置實質上相同，並因而由圖34至圖46 所示的裝置所替代。 65 200912348 ^基板結構則定位於第—基板結構则上，並 ㈣其内部的訊號線（未緣示）以及電性連接到 的多個連接孔2022。導電層2〇24形成於連接謂2 的=面。導電層2024包括第一導電材質，例如銅（cu)。 訊號線電性連接至附加測試器。第二基板結構2_可包括 印刷電路板（PCB)以及多層基板。 匕括 第一基板結構2010和第二基板結構2〇2〇藉由 2030 ^性連接。例如’連接孔搬2之内表面上的導電層 2024藉由連接件2_電性連接至電子塾（未緣示）。^ 接件2030可包括第二導電材質，例如金屬。 連接件2030的第-端部觀可電性連接於 結，201。的電子塾。例如，第一端部2。32接觸電子^或 固定於電子塾。 相對於第-端部2032之連接件2030的第二部份2〇34 插入第二基板結構2020的連接孔2〇22。例如，第二部份 2034可接觸連接孔勘内表面上之導電層鳩或固定二 導電層2024上。 ' .於一實施例中’諸如撓性印刷電路（flexible circuit，FPC)的配線元件用以替代連接件2〇3〇，並因而 藉由配線元件彼此電性連接第一基板結構2〇1〇和第二基 板結構2020。 ^ 第一基板結構2010和第二基板結構2〇2〇藉由耦接件 2^40彼此機械耦接。於—實施例中，耦接件2〇4〇可包括 第一補強件2041、第二補強件2〇42、彈簧片2〇44以及多 66 200912348 個螺栓。 第—補強件2041定形成碟狀並且位於第二基板結構 2020上。第二補強件2〇42定形成環狀並且沿第二基板結 構2020的邊緣部份配置。第一補強件2〇41、第二基板結 ，2〇2〇e以及第二補強件2042藉由第一螺栓2045彼此固 疋。=簧片可接觸第二補強件2042和第一基板結構2010 的才[罙。第—補強件2042藉由第二螺栓2046固定於彈箬 片2〇44並且彈簧片藉由第三螺栓2047固定於框架。 士平面度控制器2050穿透第一補強件2〇41和第二基板 =構2020，並且因而接觸第一基板結構的上表面。 第了基板結構2010的厚度可根據製造第一基板結構2〇1〇 的製程條件和環境沿縱向方向發生變化，並且因而儘管第 一基板結構2010和第二基板結構2〇2〇彼此平行配置，第 二基板結構2_之探針的尖端不位於同—共面表面。接觸 第一基板結構2010之上表面的平面度控制器2〇5〇可藉由 控制平面度控制器細與第一基板結構_之間的^觸 強度來控制第-基板結構2010之下表面的平面度，使得探 針尖端配置於同一共面表面上。 =面度控制器2050不必配置於電子檢測裝置2〇〇〇 内。藉由第一調節螺絲在相對基板片之頂面的垂直方向上 f調節第-基板結構2_的基板片，使得藉由調節獅替 代平面度控制器2050來控制第一基板結構2〇1〇 的平面度或水平角度。 因此，基板片的位置可藉由第一調節螺絲在垂直於基 67 200912348 板片上表面的方向上進行調節或者藉由第一調節螺絲在平 行於基板片上表面的方向上進行調節。 圖48疋根據本發明第二十一實施例的電子檢測裝置 的橫截面圖。 ，照圖48’根據第二十一實施例的電子檢測裝置21〇〇 包括第一基板結構2110、第二基板結構212〇以及耦接件 2130。 本實細例的第一基板結構211〇和第二基板結構2120 的結構和配置與參照圖47描述的第二十實施例中的第一 基板結構2010和第二基板結構2〇2〇實質上相同，並因而 省略了第一基板結構211〇和第二基板結構212〇的更詳細 描述。 第一基板結構2110和第二基板結構2120藉由連接件 2130電性連接。例如，第一基板結構211〇和第二基板結 構2120藉由耦接件2130彼此固定，使得第一基板結構 2110的上表面電性連接於第二基板結構212〇的下表面。 搞接件2130可包括補強板2131以及多個螺栓2132。 補強板2131定形成碟狀並且位於第二基板結構212〇 上。螺栓2132可穿透補強板2131和第二基板結構2120 並且接合到第一基板結構211〇。 螺栓2132可在沒有補強板2131的情況下穿透第二基 板結構2120並且接合到第一基板結構211〇。 因此’可藉由第一基板結構2110的螺栓2132在垂直 於基板片上表面的方向上調節基板片的位置。 68 200912348 進一步’在第一基板結構2110和第二基板結構2120 彼此耦接之前藉由第一基板結構2110的調節螺絲在垂直 於基板片上表面的方向上調節基板片的位置。 圖49是根據本發明第二十二實施例的電子檢測裝置 的橫截面圖。 參照圖49,根據第二十二實施例的電子檢測裝置22〇〇 包括第一基板結構2210和第二基板結構2220。 本實施例中的第一基板結構2210和第二基板結構 2220的結構和配置與參照圖47描述的第二十實施例中的 第一基板結構2010和第二基板結構2020實質上相同，並 因而省略了第一基板結構2210和第二基板結構2220的更 詳細描述。 第一基板結構2210和第二基板結構2220彼此固定以 使第一基板結構2210之上表面直接接觸第二基板結構 2220的下表面以藉此電性連接第一基板結構2210和第二 基板結構2220。第一基板結構221〇和第二基板結構222〇 藉由結合件（未繪示）彼此固定，結合件例如是焊接件或 黏膠。 因此，在第一基板結構2210和第二基板結構222〇彼 此耦接之前藉由第一基板結構221〇的調節螺絲在垂直以 及平行於基板片上表面的方向上調節基板片的位置。 圖50是根據本發明第二十三實施例的電子檢測裝置 的橫截面圖。 參照圖50,根據第二十三實施例的電子檢測裝置23〇〇 69 200912348 包括第一基板結構2310、第二基板結構2320、第三基板結 構2330、第一連接件2340、第二連接件2350、耦接件2360 以及平面度控制器2370。 第一基板結構2310和第二基板結構2320的結構和配 置與參照圖47描述的第一基板結構201 〇和第二基板結構 2020實質上相同。 於一實施例中，第三基板結構2330介於第一基板結構 2310和第二基板結構2320之間，且可包括基板2332以及 支撐基板2332之側面和下表面的支撐件2334。訊號線（未 繪示）位於第三基板結構2330的基板2332内。基板2332 的實例可包括印刷電路板（PCB)以及多層基板。 第一連接件2340電性連接第一基板結構231〇和第三 基板結構2330。第一連接件2340的第一端部2342接觸第 一基板結構2310或固定於第一基板結構231〇。相對於第 一端部2342之第一連接件2340的第二端部2342接觸第三 基板結構2330或固定於第三基板結構233〇。 一於一實施例中，諸如撓性印刷電路板（FPC)的配線 凡件用以替代第一連接件234G，並因而藉由配線元件彼此 電丨生連接第一基板結構2310和第三基板結構2330。 第二連接件2350電性連接第二基板結構232〇和第三 ，板結構2330。於本實施例巾，第二連接件235〇電性連 位於連接孔2322之内表面上的導電層2324以及第三美 的電子塾。第二連接件則的第一端部2352 觸第二基板結構2330或固定於第三基板結構233〇。相 200912348 對於第-端部的第二連接件235()的第二端部2354接觸或 固定於第三基板結構2320的導電層。 -於-實施例巾’諸如撓性印刷電路板（Fpc)的配線 兀件用以替代第二連接件235G，並因而藉由配線元件彼此 電性連接第二基板結構232G和第三基板結構233〇。 耗接件2360彼此_第一、第二以及第三基板結構 2310、2320以及2330。於-實施例中’轉接件236〇可包 括第一補強件236卜第二補強件2362、第三補強件汨幻、 彈簧片2364以及多個螺栓。 第一補強件2361定形成碟狀並且位於第二基板結構 2320的上表面上。第二補強件2362定形成環狀並且沿第 二f板結構2320的邊緣部份配置。第三補強件2363定形 成環狀，並且沿第二基板結構2330的邊緣部份配置，使得 第三補強件2363沿第三基板結構233〇的框架2334配置。 耦接件2360的第一螺栓2365可使得第一補強件2361、第 二基板結構2320以及第二補強件2362彼此固定。彈簧片 2364彼此連接第二補強件2362與第三基板結構2330的框 架2334,以使彈簧片2364的一部份按壓基板2332之上表 面並因而由框架2334支撐基板2332。 第二螺栓2366可將彈簧片2364固定於第二補強件 2362，並且第三螺栓2367可將彈簧片2364固定於第三基 板結構2330的框架2334。第四螺拴2368可將框架2334 固定於第三補強件2363，並且第五螺栓2369可將第三補 強件2363固定於第一基板結構2310的框架。附加彈簧片 71 200912348The second push screw 1544b is screwed inwardly from the outer surface of the second sub-frame 1524 to the inner surface of the second sub-frame 1524 to thereby penetrate the second sub-frame 1524 and contact the substrate piece 151. Therefore, the second gap distance between the second sub-frame 1524 and the substrate piece 1510 is increased by tightening the second push screw 1544b. Thus, the second gap distance between the second sub-frame 1524 and the substrate piece 151 控制 can be controlled by the second traction screw 1544a and the second push screw 1544b, thereby adjusting the phase of the substrate piece 1510 relative to the second sub-frame 124. 50 200912348 For horizontal position. The second screw 1544 can pass through the second sub-truss 1524 and pull or push the substrate piece 1510 on at least the isolated side of the substrate piece 1510 such that the substrate pieces can be adjusted in a direction parallel to the upper surface of the substrate piece 1510. 1510. In the present embodiment, the second screw 1534 is joined to the two isolated sides of the substrate sheet 1510. Further, after the adjustment of the second traction driving screw 1544a and the second pushing screw 1544b is completed, the second pulling screw 154 and the second pushing screw 1544b are used to fix the substrate piece 1510 to the adjusted position with respect to the second sub-frame 1524. The first setting screw 1542 and the second adjusting screw 1544 can pass through the frame 1520 and the first screw hole of the first strip 1532, and are inserted into the substrate piece 1510 through the second screw hole. In one embodiment, the diameter of the first screw hole through which the first traction screw 1542a and the second traction screw 1544a pass is larger than the first screw hole through which the first push screw 1542b and the second push screw 1544b pass. In one embodiment, the diameter of the first screw hole is substantially the same as the diameter of the first adjustment screw 1542, and the diameter of the second screw hole is substantially the same as the diameter of the second adjustment screw 1544. The distance between the first adjustment screw 1542 and the second adjustment screw 1544 and the side walls of the first and second screw holes is within an allowable process tolerance. The second adjustment screw 1544 is joined to the first and second isolated sides of the substrate piece 1510 adjacent to each other, and is loosened or tightened by a second adjustment screw 1544 joined to the first isolated side of the substrate piece 1510. Another second adjustment screw 1544 joined to the second isolated side adjusts the substrate piece 151 在 in a direction parallel to the surface of the substrate 12 200912348 = the upper surface of the substrate 1 110. Further, the substrate piece is adjusted in a direction parallel to the upper surface of the substrate piece 1510 by loosening or screwing the second adjustment contact 1544 bonded to the mayop surface while the first screw 1542 is bonded to the lower surface of the substrate piece 151G. 151〇. Further, the substrate piece 1510 is adjusted in a direction perpendicular to the upper surface of the substrate sheet 1510 by loosening or tightening the first adjustment contact 1542 with the second adjustment screw 1544 being bonded to the lower surface of the substrate piece 151〇. In an embodiment, the adjusting screw 1 may include only the first adjusting screw 1542' and not the second adjusting, the negative wire 1544, so that the substrate piece 1510 is adjusted only in a direction perpendicular to the upper surface of the substrate piece 1510, without The substrate piece 151 is adjusted in a direction parallel to the upper surface of the substrate piece 151G. In the embodiment, the adjusting screw 154〇 includes only 15 peaches and the second and second pushing wires, and the material includes the first traction screw 15=a and the first traction screw 1544& to be only in the opposite substrate piece (5). The vertical and horizontal directions of the table are reduced without increasing the first gap distance between the substrate pieces i5i and ir 1532 and the second gap between the substrate piece and the disciple frame 1524 to adjust the substrate piece 1 Ml 〇1542 ^H-wire 154G only includes the first - traction screw 1542: and the screw Μ * ' and does not include the first - push screw _ to increase only in the relative _ 1510 i but not reduce the substrate piece (5) The first gap distance between the second and second sides and the square wire adjustment substrate piece 52 200912348 1510 of the substrate piece 1510 and the sub-frame 1524. Therefore, the adjustment screw 1540 can control the first gap distance between the substrate piece 1510 and the support bar 1530 and the second gap distance between the substrate piece 151 and the frame 152 以 to thereby adjust each substrate piece 110 relative to the support bar 1530 and The horizontal and vertical position of the frame 1520. The coupling members 1550 can couple the first strip 1532 and the second strip 1534 to each other. For example, the coupling 155 can pass down through the second support strip 1534 and insert the first strip 1532. Therefore, the first strip 1532 and the second strip 1534 can be coupled to each other by the coupling member 155 。. The adjusting screw 154A is replaced with a bolt and a nut joined to the substrate piece 1510 to adjust the horizontal and vertical positions of the substrate pieces 1510 by bolts and nuts, as described below with reference to Figs. 55 and 56. In an embodiment, the insert 1560 can include a first insert 1562 and a second insert 1564. The first insertion portion 1562 is interposed between the first strip 1532 and the upper surface of the substrate piece 151A. The first insertion portion 1562 can have volume elasticity and shape elasticity. An example of the first insertion portion 1562 having volume elasticity may include an elastic plate containing an elastic material, and examples of the first insertion portion 1562 having a shape elasticity may include a spring and a gasket. A spring or washer can be used with the first adjustment screw 1542. The first strip 1532 is spaced from the substrate sheet 1510 by the first insertion portion 1562. Tightening the first adjusting screw 1542 can cause compression of the first insertion portion I562 and restore the compressed first insertion portion 1562 by loosening the first adjusting screw (9) 2. Further, the first insertion portion 1562 can absorb an external impact applied to the substrate piece 1510. Further, the first insertion portion 1562 may be interposed between the first sub-frame 1522 and the lower surface of the substrate piece 1510. The second insertion portion 1564 can be interposed between the second sub-frame 1524 and the isolated side of the substrate piece 1510 and between adjacent side faces of the substrate piece 151A. When the second sub-frame 1524 is interposed between the substrate sheets 151, the second insertion portion 1564 is only interposed between the second sub-frame 1524 and the side of the substrate sheet 151A. The structure and configuration of the second insertion portion 1564 is the same as that of the first insertion portion 1562, and a more detailed description about the second insertion portion 1564 is omitted. Although the embodiment discloses that the interposer 1560 is interposed between the second sub-frame 1524 and the substrate piece 1510 and between the first support bar 1532 and the substrate piece 1510, the second sub-frame 1524 and the substrate piece 151 may be disposed. No intervening member is provided between the first support strip 1532 and the substrate piece 1510. In this case, the substrate piece 1510 directly contacts the first strip 1532 or the second sub-frame 1524. The reinforcing member 1570 can include a first reinforcing portion 1572 and a second reinforcing portion 1574. As shown in Figs. 31 and 32, the first reinforcing portion 1572 is located at a position where the first pulling screw 1542a of the first adjusting screw 1542 engages the substrate piece 1510. The material strength of the first reinforcing portion 1572 is greater than the material strength of the substrate piece 1510, thereby facilitating the formation of the screw holes through which the first screw 1542 passes on the substrate piece 1510. In one embodiment, the first reinforcing portion 1572 can be adhered to the substrate piece 1510 by an adhesive or inserted into the substrate piece 1510 by an interference fit. The second reinforcing portion 1574 is located at the second traction of the second adjusting screw 1544. The position of the screw 1544a engages the substrate piece 1510. The structure and configuration of the second reinforcing portion 1574 are the same as those of the first reinforcing portion 1572, and a detailed description about the second reinforcing portion 15 74 is omitted. Although the present embodiment discloses that the reinforcing member 1570 is mounted on the substrate piece 1510 as shown in Figs. 28 to 32, the reinforcing member may not be attached to the substrate piece 1510. In this case, the first traction screw i542a and the second traction screw 1544a may be in direct contact with the substrate piece 1510. Therefore, the adjusting screw 1540 of the electronic detecting device 1500 can adjust the position of the substrate sheet 1510. That is, the substrate piece 1510 is adjusted in the vertical direction with respect to the upper surface of the substrate piece 151, so that the height of the substrate piece 151 is the same. Further, the substrate piece 1510' is adjusted in the horizontal direction of the upper surface of the opposite substrate piece 1510 so that the probes 1512 of the substrate piece 1510 are located on the same coplanar surface. In one embodiment, the frame 1520 and the second adjustment wire 1544 may not be included in the electronic detection device 1500. In this case, the relative position of the substrate piece 1510 with respect to the support bar 1530 can be adjusted only by the first adjustment screw 1542 in the vertical direction with respect to the upper surface of the substrate piece 1510. Figure 34 is a plan view of the electronic detecting device shown in Figures 28 to 32 after the substrate sheet is adjusted, and Figure 35 is a cross-sectional view of the electronic detecting device shown in Figure 34. In Figs. 34 and 35, for convenience of description, the Cartesian coordinate system adopts the following definition. The X-axis and the y-axis perpendicular to the X-axis are defined such that the top surface of the substrate piece 1510 is parallel to the surface produced by the X-axis and the y-axis. The z-axis is defined to be perpendicular to both the X-axis and the y-axis such that the z-axis is perpendicular to the top surface of the substrate sheet 151. 55 200912348 Hereinafter, the side of the frame 1520 perpendicular to the x-axis is referred to as a first surface, and the side of the frame 1520 perpendicular to the y-axis is referred to as a second surface. The surface of the support strip 1530 facing the substrate sheet 1510 and perpendicular to both the first and second surfaces is referred to as a third surface. Referring to Figures 34 and 35, the first traction screw 1544a on the first surface of the frame 1520 can be tightened and thus the substrate piece 1510' can be pulled in the x-axis direction and the second push screw 1544b on the first surface of the frame 1520 can be tightened. The substrate piece 1510 is thus pushed in the direction of the x-axis. As a result, the substrate piece 1510 is moved in the z-axis direction by the second adjustment screw 1544 located on the first surface of the frame 1520. In this case, the second push screw 1544b on the second surface of the frame 1520 is fixed to the substrate piece 151 and thus the second push screw 1544b on the second surface of the frame 1520 is also in the z-axis direction and the substrate piece. MW moves together. The second push screw 154, located on the second surface of the frame 1520, is only in contact with the substrate piece i5i. For the above reasons, the diameter of the screw hole of the frame 1520 through which the second traction screw 1544a passes is larger than the diameter of the second traction screw 1544 & Thus, when the second pulling screw 1M4a on the second surface of the frame 1520 is joined to the substrate piece via the first screw hole of the frame 1520, the second pulling screw 1544a moves together with the substrate piece 151〇 in the z-axis direction until The second adjustment screw 1544 is fully tightened. The movement of the substrate piece 1510 in the y-axis direction is the same as the z-axis movement, and thus a more detailed description of the movement of the substrate piece in the y-axis direction is neglected. The first traction screw 1542a on the third surface of the support strip 1530 can be tightened, and thus the substrate piece! (4) It is possible to move upward in the 2-axis direction, 56 200912348 and to tighten the first push screw 1542b on the third surface of the support bar 153, and thus the substrate piece 151 is moved downward in the z-axis direction. As a result, the substrate piece ι 51 移动 is moved in the z-axis direction by the first adjustment screw 1542 located on the third surface of the support bar 153 。. In this case, the second traction screw 1544a on the first and second surfaces of the frame 1520 is secured to the substrate sheet ι 51 through the first screw hole of the frame 1520, and thus is located at the second surface of the frame 1520. The pulling screw 1544a can also move together with the substrate piece 151〇 in the z-axis direction. Thus, the second traction screw 154 moves together with the substrate piece 151 如 in the z-axis direction until the second adjustment screw 1544 is fully tightened, and the second push screw 154 on the first and second surfaces of the frame 152 〇 The servant is only in contact with the substrate piece 151〇. In one embodiment, a plurality of support strips 153 are located on the substrate sheet 151. The number of the slabs 1530 varies depending on the number (for example, 2, 4, i, ?) and size of the substrate piece 151. When the number of substrate sheets is increased, for example, the number of 仗4 sheets is increased to 16 pieces, and the overall size of the assembled substrate is constant, the increase of the screw holes on the support strip 153G is sufficient to adjust the increase of the substrate without any change of the support strip 1530. . In particular, when the number of substrate sheets 151 and _ vary according to different detection conditions, for example, from 2, 2 columns (2x2) matrix type to 2 block parent 3 columns (5)) matrix type, only two slices - Sufficient to cope with the change of the substrate piece 1510, it is not necessary to modify the entire plate. That is, the original 2X2 matrix type substrate remains unchanged, and the sheet is transferred to the original 2X2 matrix type substrate sheet 1510 in the column direction in which the first stripe is extended. The additional substrate piece can be easily secured by only the second strip or the second strip 1534. The 200912348 substrate sheet 1510 is numbered on the original 2x2 substrate sheet 1510. Therefore, the array and the array can be easily changed depending on the detection environment. In addition, when a support bar in the electronic detecting device is broken, only the new support bar is used to replace the broken support bar, and at the same time, the other support wires except the damaged support bar are unchanged, and the whole woven plate is (4) The position Z is only carried out for the broken wire sheet of the wire, thereby facilitating the inspection of the device. Figure 36 is a plan view of an electronic detecting device according to a sixteenth embodiment of the present invention, and Figure 37 is a cross-sectional view taken along line κ_κ of the electronic detecting device shown in Figure 36. Referring to FIGS. 36 and 37, the electronic detecting device 1600 according to the sixteenth embodiment may include a substrate piece 161A, a support member, an adjusting member, a coupling member 165A, an insert member 1660, and a reinforcing member 1670. In one embodiment, the support member includes a frame 1620 and a support strip 163A, and can support the substrate sheet 1610 to position the substrate sheets 161 adjacent to each other. The adjustment member can include a plurality of adjustment screws 1640 and can adjust the relative position of the substrate piece 161 相对 relative to the frame 1620. The structure and arrangement of the substrate piece 1610, the frame 1620, the adjusting screw 164A, and the insert 1660 in this embodiment are substantially the same as those of the substrate piece 1510, the frame 1520, the adjusting screw 1540, and the insert 1560 described in detail with reference to FIGS. 28 and 32. the same. The structure and configuration of the support strip 1630 can be substantially the same as the support strip 1530 described with reference to Figures 28-32, except that the second strip 1634 extends to the frame 1620, and thus the second strip 1634 and the upper surface of the frame 1620 58 200912348 Contact. The coupling member 1650 can include a first set screw 1652 and a second set screw 1654. The structure and configuration of the first set screw 1652 are substantially the same as the coupler 1550 described with reference to FIGS. 28 to 32. The second set screw 1654 can include a third pull screw 1654a and a third push screw 1654b. The third traction screw 1654a can also be screwed down from the upper surface of the second strip 1634 to its lower surface to thereby penetrate the second strip 1634 and be inserted into the second sub-frame 1624. The third push screw 165 can also be screwed up from the lower surface of the second strip 1634 to its upper surface to thereby penetrate the second strip 1634 and be inserted into the second sub-frame 1624. The first gap distance between the second sub-frame 1624 and the second strip 1634 is shortened by tightening the third pulling screw 1654a and is increased by tightening the third push screw 1654b. The third pulling screw 1654a and the third pushing screw 1654b can also adjust the second gap distance between the first frame 1622 and the substrate piece 1610 so that the substrate piece 1610 can be adjusted in the vertical direction of the upper surface of the opposite substrate piece 1610. The piece 1670 can include a first reinforcement 1672 and a second reinforcement 1674. The structure and configuration of the first reinforcing portion 1672 and the second reinforcing portion 1674 are substantially the same as those of the first reinforcing portion 1572 and the second reinforcing portion 1574 described with respect to FIGS. 28 to 32, and thus the first reinforcing portion 1672 and A detailed description of the second reinforcement 1674. 59 200912348 In an embodiment, the first strip 1632 extends further to the second sub-frame 1624 such that the first strip 1632 can contact the upper surface of the second sub-frame i624. Accordingly, the second set screw 1654 including the third pull screw 1654a and the third push screw 1654b can also adjust the third gap distance between the first strip 1632 and the second sub-frame 1624. Figure 38 is a perspective view showing the electronic detecting device shown in Figure 36. Dream Figure 38, frame 1620 includes only second sub-frame 1624, but does not include first sub-frame 1622, and thus first strip 1632 or second strip 1634 is joined to second frame 1624. 39 is a plan view of an electronic detecting device according to a seventeenth embodiment of the present invention, and FIG. 40 is a cross-sectional view taken along line 1-1 of the electronic detecting device shown in FIG. 39. FIG. 39 and FIG. The electronic detecting device 1700 of the seventeenth embodiment may include a substrate sheet pH), a support member, an adjustment member, a light fitting member I?%, an insert member 1760, and a reinforcing member 1770. In an embodiment, the support member includes a frame 172. And the support strip 173A, and can support the substrate piece 1710 to position the substrate piece 171 〇 adjacent to each other. The adjustment member can include a plurality of adjustment screws 1740 and can adjust the relative position of the substrate piece 171 〇 relative to the frame 1720. In this embodiment The structure and arrangement of the substrate piece 1610, the frame 1620, the adjusting screw 164, and the insert 1660 are substantially the same as those of the substrate piece 1510, the frame 1520, the adjusting screw 1540, and the insert 1560 described in detail with reference to FIGS. 28 to 32. The strip 1734 is positioned on the edge portion of the substrate piece 1710 and the first fixing screw 1752 of the 200912348 coupling 1750 secures the second strip 1734 to the substrate piece 1710. The substrate piece πιο, the frame 1720, the support 173〇, adjustment screw 1740, delivery member 1750, and insert 176〇 are constructed and arranged in accordance with substrate piece 1610, frame 162〇, fulcrum strip 1630, adjustment screw 1640, adapter 1650, and described with reference to FIGS. 36-38. The insert member 166 is identical except for the above configuration of the first set screw 1752 of the coupling member 1750, thereby ignoring the substrate piece 1710, the frame 1720, the support bar 173, the adjusting screw 1740, the coupling member 1750, and the insert member 176 DETAILED DESCRIPTION The reinforcing member 1770 can include a first reinforcing portion 1772, a second reinforcing portion 1774, and a third reinforcing portion 1776. The structure and configuration of the first reinforcing portion 1772 and the second reinforcing portion 1774 are described with respect to FIGS. 28 and 32. The first reinforcing portion 1572 and the second reinforcing portion 1574 are identical only to each other, and thus a detailed description about the first reinforcing portion 1772 and the second reinforcing portion 1774 is omitted. In the embodiment only, the third reinforcing portion 1776 is located. The first opening screw 1752 of the member 1750 engages the position of the substrate piece 171. The material strength of the third reinforcing portion 17 = _ is greater than the material strength of the substrate piece 171 , thereby facilitating the formation of the first fixing screw on the third reinforcing portion 1776 1752 In the embodiment, the third reinforcing portion 1776 can be adhered to the substrate sheet 10 by adhesive or inserted into the substrate sheet 171 by interference fit. The substrate sheet 171 is attached to the substrate with the plurality of probes mounted thereon. The first fixing screw 1754 on the lower surface of the crotch adjusts the gap distance between the second strip 1734 and the frame 1720. Thus, the substrate piece can be adjusted at the lower portion thereof in the vertical direction of the upper surface by the second fixing screw 1734 1710. 61 200912348 Figure 41 is a plan view of an electronic detecting device according to an eighteenth embodiment of the present invention, and Figure 42 is a cross-sectional view taken along line M_M of the detecting device shown in Figure 41. Referring to Figures 41 and 42, an electronic detecting device 1800 according to an eighteenth embodiment may include a substrate piece 1810, a support member, an adjustment member, a coupling member 1850, and an insert member 1860. In one embodiment, the support member includes a frame 1820 and a support strip 183A, and can support the substrate sheet 1810 such that the substrate sheets 181 are positioned adjacent each other. The adjustment member can include a plurality of adjustment screws 1840 and can adjust the relative position of the substrate piece 181 相对 relative to the frame 1820. Figure 43 is a plan view of a substrate piece of the electronic detecting device shown in Figure 41, and Figure 44 is a cross-sectional view taken along the line of Figure 43. Referring to Figures 41-44, the frame 1810 can include a body 1812 with a stone aid 1814. The body 1812 is formed in a plate shape, and a plurality of probes 1815 are located on the lower surface of the main error 1812. The probe 1815 is located on the upper surface of the main body 1812 with a detection target and an electric cymbal (not shown). The signal is installed in the main body ι 812 and the electronic pad and the probe 1815 are electrically connected to each other by the signal. The auxiliary member 1814 closes the upper portion of the side of the body 1812. The material strength of the auxiliary (8) 4 is greater than the material strength of the main body, thereby facilitating the formation of the screw holes through which the adjusting screw 184 is formed on the main body 1812. = shot, the auxiliary member 1814 and the main body ^ can be fixed to each other by screws. For example, the body 1812 can include a protrusion, and the accessory member 62 200912348 can include a recess that can penetrate the tab insertion recess in the auxiliary member Z and the crotch portion. In the embodiment, the protrusions of the main body 1814 in the recesses of the M/s are adhered to each other or by the interference ==^14 and the subject view can be adhered by the upper side of the image as shown in Fig. 42 to Fig. 44, § 1814 The body (4) is given to the probe 1815, and the probe 1815 is provided for more than the next (four) circumference. Further, the lower surface of the #针 1812 is mounted with more bodies (four) and the second body is located at a distance from the first main adjacent to each other. The brother on 2b—and the second probe are spaced apart from each other—the species of the auxiliary frame, the entire 1840 frame 1820, the control bar 1830, the adjustment screw day 1 and the inserted lion _ structure and configuration It is substantially the same as the auxiliary frame member support bar (10), the adjustment screw adjustment #^1, 550, and the insert member 156〇, except for the = ^ 1840 inserting the substrate piece-deleted auxiliary member 1814, thereby omitting the Γ support bar deletion and adjustment A more detailed description of the screw _, the set screw side and the insert I860. And the electronic detecting device according to the nineteenth embodiment of the present invention: 46 is an electron transfer device shown in FIG. 45, and FIG. 45 and FIG. 46'. The electronic detecting device according to the nineteenth embodiment may include a substrate piece 191A, a support member, an adjustment member, a subtraction member 195〇, 63 200912348 Insert I960 and reinforcement 1970. In one embodiment, the support member includes a frame 1920 and a support strip 193A, and can support the substrate sheet 1910 such that the substrate sheets 191 are positioned adjacent to each other. The adjustment member may include a plurality of adjustment screws 194A. The structure and arrangement of the substrate piece 1910, the frame 1920, the fixing screw 195A, and the reinforcing member 1970 in this embodiment are substantially the same as those of the substrate piece 1510, the frame 1520, the fixing screw 1550, and the reinforcing member 1570 described in detail with reference to FIGS. 28 to 29. the same. The support strip 1930 can include a first strip 1932 and a second strip 1934. The structure and configuration of the support bar 1930 are substantially the same as those of the support bar 1530 described with reference to FIGS. 28 to 10, except that the support bar of the present embodiment extends to the boundary region between the second frame 1934 and the substrate piece 191, and the substrate piece. The upper surface of the 1910, thereby supporting the side surface of the substrate piece 191〇. Therefore, a detailed description of the support bar 1930 is omitted hereinafter. In one embodiment, the adjustment screw 1940 can serve as an adjustment member and the relative position of the substrate piece 1910 relative to the support strip 1930 can be adjusted. The adjustment screw 1940 can be positioned on the support bar 193, and includes a first screw 1942 for adjusting the position of the substrate in the vertical direction and a second screw 1944 for adjusting the position of the substrate in the horizontal direction. The structure and configuration of the adjusting screw 1940 in this embodiment are the same as those of the adjusting screw 154A in the fifteenth embodiment described with reference to FIGS. 28 to 33 except that the second screw is located on the side of the supporting substrate piece 191〇. The position of the substrate piece 1910 is adjusted in the direction parallel to the upper surface of the substrate piece 1910. Thus, a more detailed description of the adjustment screw 194 省略 is omitted. In one embodiment, the second sub-frame 1924 includes an opening that exposes the head of the second screw 1944 to thereby facilitate tightening and loosening the second screw, 1944. The structure and configuration of the insert I960 of the present example are the same as those of the adjusting screw 154 of the fifteenth embodiment described with reference to FIGS. 28 to 33 except that the second insertion portion 1964 is interposed between the support bar 1930 and the substrate piece 1910. Between the sides and between the sides of the substrate piece 1910 adjacent to each other. Thus, a more detailed description of the insert 1960 is omitted. The electronic detecting device 1900 may also not mount the frame 192A. The position of the substrate piece 191 is adjusted by the support bar 1930 and the adjusting screw 1940 in a direction perpendicular and parallel to the upper surface of the substrate piece 1910. Figure 47 is a cross-sectional view showing an electronic detecting device in accordance with a twentieth embodiment of the present invention. Referring to Fig. 47, the electronic detecting device 2' according to the twentieth embodiment includes a first substrate structure 2010 and a second substrate structure 2020, a connector 2030, a coupling member 2040, and a flatness controller 2050. In an embodiment, the first substrate structure 2〇1() may include a plurality of substrate sheets, a frame, a plurality of support bars, a plurality of adjustment screws, a plurality of fixing screws, a plurality of inserts, and a plurality of reinforcing members. The structure and configuration of the first substrate structure 2 is substantially the same as the device 1500 described with reference to Figs. 28 to 33. Furthermore, the structure and configuration of the first substrate structure 2010 can also be substantially the same as the apparatus described with reference to Figures 34-46, and thus replaced by the apparatus shown in Figures 34-46. 65 200912348 ^The substrate structure is positioned on the first substrate structure, and (4) its internal signal line (not shown) and a plurality of connection holes 2022 electrically connected thereto. The conductive layer 2〇24 is formed on the = face of the connection 2 . Conductive layer 2024 includes a first electrically conductive material, such as copper (cu). The signal line is electrically connected to the additional tester. The second substrate structure 2_ may include a printed circuit board (PCB) and a multilayer substrate. The first substrate structure 2010 and the second substrate structure 2〇2 are connected by 2030. For example, the conductive layer 2024 on the inner surface of the connection hole 2 is electrically connected to the electron 藉 (not shown) by the connecting member 2_. ^ Connector 2030 can comprise a second electrically conductive material, such as a metal. The first end portion of the connector 2030 is electrically connected to the junction 201. Electronic 塾. For example, the first end portion 2. 32 contacts the electron or is fixed to the electron cymbal. The second portion 2〇34 of the connector 2030 with respect to the first end portion 2032 is inserted into the connection hole 2〇22 of the second substrate structure 2020. For example, the second portion 2034 can contact the conductive layer on the inner surface of the connection hole or the fixed two conductive layer 2024. ' . In an embodiment, a wiring member such as a flexible circuit (FPC) is used in place of the connecting member 2〇3〇, and thus the first substrate structure is electrically connected to each other by the wiring member. Two substrate structure 2020. ^ The first substrate structure 2010 and the second substrate structure 2〇2 are mechanically coupled to each other by the coupling members 2^40. In the embodiment, the coupling member 2〇4〇 may include a first reinforcing member 2041, a second reinforcing member 2〇42, a spring piece 2〇44, and a plurality of 66 200912348 bolts. The first reinforcing member 2041 is formed in a dish shape and is located on the second substrate structure 2020. The second reinforcing member 2〇42 is formed in a ring shape and disposed along an edge portion of the second substrate structure 2020. The first reinforcing member 2〇41, the second substrate junction, the 2〇2〇e, and the second reinforcing member 2042 are fixed to each other by the first bolt 2045. The reed can contact the second reinforcing member 2042 and the first substrate structure 2010 [罙. The first reinforcing member 2042 is fixed to the magazine piece 2〇44 by the second bolt 2046 and the spring piece is fixed to the frame by the third bolt 2047. The flatness controller 2050 penetrates the first reinforcement member 2〇41 and the second substrate member 2020, and thus contacts the upper surface of the first substrate structure. The thickness of the first substrate structure 2010 may vary in the longitudinal direction according to the process conditions and environment for fabricating the first substrate structure 2〇1〇, and thus although the first substrate structure 2010 and the second substrate structure 2〇2〇 are arranged in parallel with each other, The tips of the probes of the second substrate structure 2_ are not located on the same-coplanar surface. The flatness controller 2〇5〇 contacting the upper surface of the first substrate structure 2010 can control the lower surface of the first substrate structure 2010 by controlling the touch intensity between the flatness controller and the first substrate structure_ The flatness is such that the probe tips are disposed on the same coplanar surface. The face controller 2050 does not have to be disposed in the electronic detecting device 2A. The substrate piece of the first substrate structure 2_ is adjusted by the first adjusting screw in the vertical direction of the top surface of the opposite substrate piece, so that the first substrate structure 2〇1〇 is controlled by adjusting the lion instead of the flatness controller 2050. Flatness or horizontal angle. Therefore, the position of the substrate piece can be adjusted by the first adjusting screw in the direction perpendicular to the upper surface of the substrate 67 200912348 or by the first adjusting screw in the direction parallel to the upper surface of the substrate piece. Figure 48 is a cross-sectional view of an electronic detecting device in accordance with a twenty-first embodiment of the present invention. The electronic detecting device 21' according to the twenty-first embodiment includes a first substrate structure 2110, a second substrate structure 212A, and a coupling member 2130. The structure and arrangement of the first substrate structure 211A and the second substrate structure 2120 of the present embodiment are substantially the same as the first substrate structure 2010 and the second substrate structure 2〇2 in the twentieth embodiment described with reference to FIG. 47. The same, and thus a more detailed description of the first substrate structure 211 and the second substrate structure 212, are omitted. The first substrate structure 2110 and the second substrate structure 2120 are electrically connected by a connecting member 2130. For example, the first substrate structure 211 and the second substrate structure 2120 are fixed to each other by the coupling member 2130 such that the upper surface of the first substrate structure 2110 is electrically connected to the lower surface of the second substrate structure 212. The adapter 2130 can include a stiffener 2131 and a plurality of bolts 2132. The reinforcing plate 2131 is formed in a dish shape and is located on the second substrate structure 212A. The bolt 2132 can penetrate the reinforcing plate 2131 and the second substrate structure 2120 and be joined to the first substrate structure 211 . The bolt 2132 can penetrate the second substrate structure 2120 without the reinforcing plate 2131 and be joined to the first substrate structure 211. Therefore, the position of the substrate piece can be adjusted in the direction perpendicular to the upper surface of the substrate piece by the bolt 2132 of the first substrate structure 2110. 68 200912348 Further, the position of the substrate piece is adjusted in the direction perpendicular to the upper surface of the substrate sheet by the adjusting screw of the first substrate structure 2110 before the first substrate structure 2110 and the second substrate structure 2120 are coupled to each other. Figure 49 is a cross-sectional view showing an electronic detecting device in accordance with a twenty-second embodiment of the present invention. Referring to Fig. 49, an electronic detecting device 22A according to a twenty-second embodiment includes a first substrate structure 2210 and a second substrate structure 2220. The structures and configurations of the first substrate structure 2210 and the second substrate structure 2220 in this embodiment are substantially the same as the first substrate structure 2010 and the second substrate structure 2020 in the twentieth embodiment described with reference to FIG. 47, and thus A more detailed description of the first substrate structure 2210 and the second substrate structure 2220 is omitted. The first substrate structure 2210 and the second substrate structure 2220 are fixed to each other such that the upper surface of the first substrate structure 2210 directly contacts the lower surface of the second substrate structure 2220 to electrically connect the first substrate structure 2210 and the second substrate structure 2220 . The first substrate structure 221 and the second substrate structure 222 are fixed to each other by a bonding member (not shown) such as a soldering member or an adhesive. Therefore, the position of the substrate piece is adjusted in a direction perpendicular to and parallel to the upper surface of the substrate piece by the adjusting screw of the first substrate structure 221〇 before the first substrate structure 2210 and the second substrate structure 222 are coupled to each other. Figure 50 is a cross-sectional view showing an electronic detecting device in accordance with a twenty-third embodiment of the present invention. Referring to FIG. 50, the electronic detecting device 23〇〇69 200912348 according to the twenty-third embodiment includes a first substrate structure 2310, a second substrate structure 2320, a third substrate structure 2330, a first connecting member 2340, and a second connecting member 2350. , a coupling 2360 and a flatness controller 2370. The structure and configuration of the first substrate structure 2310 and the second substrate structure 2320 are substantially the same as those of the first substrate structure 201 and the second substrate structure 2020 described with reference to FIG. In one embodiment, the third substrate structure 2330 is interposed between the first substrate structure 2310 and the second substrate structure 2320, and may include a substrate 2332 and a support member 2334 supporting the side and lower surfaces of the substrate 2332. A signal line (not shown) is located within the substrate 2332 of the third substrate structure 2330. Examples of the substrate 2332 may include a printed circuit board (PCB) and a multilayer substrate. The first connecting member 2340 is electrically connected to the first substrate structure 231A and the third substrate structure 2330. The first end 2342 of the first connector 2340 contacts the first substrate structure 2310 or is fixed to the first substrate structure 231A. The second end portion 2342 of the first connecting member 2340 with respect to the first end portion 2342 contacts the third substrate structure 2330 or is fixed to the third substrate structure 233A. In an embodiment, a wiring member such as a flexible printed circuit board (FPC) is used in place of the first connecting member 234G, and thus the first substrate structure 2310 and the third substrate structure are electrically connected to each other by the wiring member. 2330. The second connecting member 2350 is electrically connected to the second substrate structure 232A and the third, plate structure 2330. In the embodiment of the invention, the second connecting member 235 is electrically connected to the conductive layer 2324 on the inner surface of the connecting hole 2322 and the third beautiful electronic cymbal. The first end portion 2352 of the second connector contacts the second substrate structure 2330 or is fixed to the third substrate structure 233A. Phase 200912348 The second end 2354 of the second connector 235() of the first end contacts or is secured to the conductive layer of the third substrate structure 2320. A wiring member such as a flexible printed circuit board (Fpc) is used in place of the second connecting member 235G, and thus the second substrate structure 232G and the third substrate structure 233 are electrically connected to each other by wiring members. Hey. The consuming members 2360 are mutually _first, second, and third substrate structures 2310, 2320, and 2330. In the embodiment, the adapter 236 can include a first reinforcement 236, a second reinforcement 2362, a third reinforcement phantom, a spring tab 2364, and a plurality of bolts. The first reinforcing member 2361 is formed in a dish shape and is located on the upper surface of the second substrate structure 2320. The second reinforcing member 2362 is formed in a ring shape and disposed along an edge portion of the second f-plate structure 2320. The third reinforcing member 2363 is formed in a ring shape and disposed along an edge portion of the second substrate structure 2330 such that the third reinforcing member 2363 is disposed along the frame 2334 of the third substrate structure 233A. The first bolt 2365 of the coupling member 2360 can fix the first reinforcing member 2361, the second substrate structure 2320, and the second reinforcing member 2362 to each other. The spring tabs 2364 connect the second reinforcement member 2362 and the frame 2334 of the third substrate structure 2330 to each other such that a portion of the spring tab 2364 presses the upper surface of the substrate 2332 and thus supports the substrate 2332 by the frame 2334. The second bolt 2366 can secure the spring tab 2364 to the second reinforcement member 2362, and the third bolt 2367 can secure the spring tab 2364 to the frame 2334 of the third substrate structure 2330. The fourth thread 2368 can secure the frame 2334 to the third reinforcement 2363, and the fifth bolt 2369 can secure the third reinforcement 2363 to the frame of the first substrate structure 2310. Additional spring piece 71 200912348
(未繪不）更安裝於第三補強件2363與第一基板結構2310 的框架之間，使得第一基板結構測之基板片的上表面由 附加彈簧片彈性按壓，以藉此將基板片固定於第一基板結 構2310的框架。 #一儘官本實施例揭示了第一基板結構2310的框架可與 第三補強件2363分開配置，並且因而第一基板結構2310 的框架以及第三補強件由第五螺栓23 69彼此固定，框架和 第三補強件2369可在不使用第五螺栓2369的情況下一體 形成。 平面度控制器2370穿透第一補強件2361和第二基板 結構2320,並且因而接觸第三基板結構233〇的上表面。 第了基板結構2310的厚度可根據製造第一基板結構231〇 的製知條件和環境沿縱向方向發生變化，因而儘管第一基 板結構2310平行於第二基板結構2320配置，第一基板、ς 構2310的探針尖端不位於同一共面表面。接觸第三基板結 構2330之上表面的平面度控制器237〇可藉由控制平面度 控制2370與第二基板結構2330之間的接觸強度來控制 第一基板結構2310的水平角度，使得探針尖端配置於同一 共面表面。因而，第一基板結構231〇之下表面上的探針的 尖端定位於同一共面表面。 可不配置平面度控制器2370於電子檢測裝置23⑻ 内。藉由第一調節螺絲在相對基板片之頂面的垂直方向上 調節第一基板結構2310的基板片，使得可藉由調節螺絲替 代平面度控制器2370來控制第一基板結構231〇之下表面 72 200912348 的平面度或水平角度。 此外’第二調節螺絲還可在平行於基板片頂面的方向 上調節第一基板結構2310中之基板片的位置。 圖51是根據本發明第二十四實施例的電子檢測裝置 的橫截面圖。 參照圖51，根據第二十四實施例的電子檢測裝置24〇〇 包括第一基板結構2410、第二基板結構242〇、第三基板結 構2430、連接件2440、耦接件2450以及平面度控制器 2460。 ° 第一基板結構2410和第二基板結構242〇的結構和配 置與參照圖47描述的第一和第二基板結構實質上相同。 本實施例中的第三基板結構2430、連接件2440以及 :面f控制器2460的結構和配置與參照圖5〇詳細描述的 刖一貫施例的第三基板結構2330、第二連接件235〇以及 平面度控制器2370實質上相同。 搞接件2450彼此固定第一、第二以及第三基板結構 2410、2420和2430，以使第一基板結構241〇之上表面直 接接觸第二基板結構2430的下表面。於—實施例中，轉接 件2450可包括第-補強件細、帛二補強件：脱、彈菁 片2454以及多個螺栓。 广 第-補強件245!定形成碟狀並且位於第二基板結構 2420的上表面上。第二補強件2452絲成環狀並且沿第 一基板結構2420的邊緣部份配置。轉接件245〇的第一螺 检期可使得第-補強件取、第二基板結構期以及 73 200912348 第二補強件2452彼此固定。彈簧片2454連接第二補強件 2452與第三基板結構2430的框架2434。第二螺栓2456 可將彈簧片2454固定於第二補強件2452，並且第三螺栓 2457可將彈簧片2454固定於第三基板結構243〇的框架 2434。 彈簧片2454彼此連接第二補強件2452與第三基板結 構2430的框架2434’以使彈簧片2454的一部份按壓基板 2432的上表面並因而將基板2432固定於框架2432上。 第四螺栓2458將第三基板結構2430的框架2434固定 於，一基板結構2410的框架上，使得第一基板結構241〇 和第三基板結構2430由第四螺栓2458彼此電性連接。另 外，第一基板結構2410上的電子墊（未繪示）以及第三基 板結構2430上的另一電子墊（未繪示）藉由結合製程彼此 接合’因而第一和第三基板結構可彼此電性連接。 因此’可藉由第四螺栓2458在垂直於基板片頂面的方 向上調節基板片的位置。 於一實施例中’第一基板結構2410和第三基板結構 2430藉由連接件2440的間接接觸而彼此電性連接，而第 二基板結構2420和第三基板結構2430藉由直接接觸而彼 此電性連接。 因此’在第一基板結構2410和第三基板結構2430彼 此耗接之前藉由調節螺絲在垂直以及平行於基板片之上表 面的方向上調節基板片的位置。 圖52疋纟會示了圖28至圖46所示電子檢測裝置之組袭 74 200912348 方法的製程步驟的流程圖。圖53A至圖53E是繪示與圖 2所示之製程步驟對應的電子檢測裝置的平面圖。 圖28至圖46中揭示的電子檢測裝置具有類似的結構 和配置，因而下文基於圖28至圖33所揭示的裝置描述電 子檢測裝置的組裝方法。 參照圖52和圖53A，至少二基板片151〇配置成使得 基板片1510彼此相鄰定位，並因而其側面彼此面對。各基 板片具有第—表面區域（步驟S310)。下文中，由基板片 1510組裝而成的最終基板被稱為大型基板，以區別 片 1510 。 參照圖52和53B，多個支撐條153〇位於基板片151〇 上（步驟S320)。 、第二支撐條1532可在第一方向上配置於大型基板 上，亚且第二支標條1534在垂直於第一方向的第二方 配置於第一支撐條1532上。 參，圖52和圖53C，基板片151〇和支樓们53〇藉由 第一調節螺絲1542彼此固定（步驟S330)。 第一調節螺絲1542的第一牽引螺絲1542&穿透第— 撐，1532並因而接合於基板片⑽。第—調節螺絲 的第一推動螺絲1542b向下旋擰經過第一支撐條1532二大 而與基板丨151G的上表面接觸。隨後，藉由固定 = 彼此固定第一支撐條1532和第二支撐條1534。… 藉由第一調節螺絲1542調節基板片151〇相 八 1530的相對位置（步驟S34〇)。 又塚條 75 200912348 於一實施例中，藉由第一牽引螺絲1542a和第一推動 螺絲1542b來牽引或推動各基板片，並因而藉由第一螺絲 1542來調節基板片1510與支撐條1532之間的第一間隙距 離。因此，可在垂直於基板片151〇之上表面的方向上調節 基板片的位置。 於一實施例中，支撐條1530定位於基板片側面及其上 表面上，並且第一調節螺絲1542可將第一支撐條1532固 定於基板片1510的側面。因而，藉由第一牽引螺絲1542a 和第一推動螺絲1542b在平行於基板片1510之上表面的方 向上調節基板片的位置。 於另一實施例中’支撐條1530定位於基板片的側面及 其上表面上’並且第一調節螺絲1542可將第一支撐條1532 固定於基板片1510的上表面，並且第二調節螺絲1544將 第一支撐條1532固定於基板片151〇的侧面。因而，藉由 第一螺絲1542和第二螺絲1544在垂直及平行於基板片 1510之上表面的方向上來調節基板片的位置。 參照圖52至圖53D，將基板片1510定位於框架152〇 内（步驟S350)。 固定有支撐條1530的基板片1510安裝於框架152〇 内，並因而由框架1520支持基板片的側面以及上表面或下 表面。 於一實施例中，藉由第一調節螺絲1542在相對支撐條 1530的垂直方向上調節基板片ΜΗ)的位置’並且隨後將 組裝的基板片1510安裝於框架1520内。 76 200912348 在另一實施例中’藉由第一調節螺絲1542將支#條 1530固定於組裝的基板片1510上，並且隨後將組裝的基 板片1510安裝於框架1520内。 參照圖52至圖53E，將第二調節螺絲1544安裝於框 架1520内（步驟S360)。 第二調節螺絲1544的第二牽引螺絲1544a穿透框架 1520的第二子框架1524並因而接合於基板片151〇上。第 二調節螺絲1544的第二推動螺絲1544b向内旋擰經過第二 子框架1524並因而與基板片1510的侧面接觸。在插入件 1560的第二插入部1564介於基板片151〇與第二子框架 1524之間後將第二調節螺絲1544安裝於第二子框架1524 上。 藉由第二調節螺絲1544在平行於框架152〇的方向上 調節基板片1510的位置（步驟S370)。 藉由第二牽引螺絲1544a和第二推動螺絲1544b來牽 引或推動各基板片1510，並因而藉由第二螺絲1544來調 節基板片1510與第二子框架1524之間的第二間隙距離。 因此，可在平行於基板片1510之上表面的方向上調節基板 片的位置。… 於一實施例中，在彼此相鄰配置基板片151〇之前，將 可與檢測目標直接接觸的多個探針安裝於各基板片151〇。 於一實施例中，在藉由調節螺絲154〇相對支撐條153〇 調節基板Μ位置之後，將可與_目標直祕觸的探針 U12安裝於基板片1510上。 77 200912348 於一實施例中’在藉由胡於 · 1510之上表面的方向上相對°』，絲154G在垂直於基板片 之後，將可與檢測目標直接二^條1530調節基板片位置 1510上。 接接觸的探針⑸2安裝於基板片 於一實施例中，在藉由锏铲 测之上表面的方向上1540在平行於基板片 之後，將可與檢測目標直接1530調節基板片位置 151〇上。 直接接觸的探針1512安裝於基板片 於只她例中，在藉由調節螺絲154 之上表面的方向上相對框架152q調節基板片;^ =將可與檢測目標直接接觸的探針1512安裝於基板片 1510 上。 於-貫施例巾’在藉由調節螺絲〗在平行於基板片 1510之上表面的方向上相對框架152〇調節基板片位置之 後，將可與制目標直接賴龍針1512絲於基板片 1510 上。 於-實施例中，在將組裝之基板片151〇定位於框架 1520内之後，將可與檢測目標直接接觸的探針1512安裝 於基板片1510上。 < 圖54是繪示了圖47至圖51所示電子檢測裝置之組裝 方法的製程步驟的流程圖。 圖47至圖51中揭示的電子檢測裝置具有類似的結構 和配置，因而下文基於圖47所揭示的裝置2〇〇〇描述電子 檢測裝置的組裝方法。 78 200912348 …多’’、、圖54 ♦匡木、基板片、支撐條以及調節螺絲組裝 成弟一基板結構2010 (步驟S410)。 於貝粑例_，基板片彼此相鄰配置並且支撐條定位 於基板片上。藉由第-調節螺絲將切條岐於基板片 上，並且隨後將基板片定位於框架内。第二調節螺絲旋摔 於框架内。 配置基板片、定位支撐條、安裳第一調節螺絲、定位 基板片於框架以及安裝帛二鮮螺絲的製程步驟與參照圖 52以及圖53A至圖5犯描述的製程步驟幻1〇至幻6〇相 同。 隨後，將第二基板結構2020接合於第一基板結構2〇1〇 上，以使第一基板結構2010和第二基板結構2〇2〇彼此電 性連接（步驟S420)。 於一實施例中，第一基板結構2〇1〇和第二基板結構 2020藉由連接件2030彼此電性連接。隨後，藉由耦接件 2040將第二基板結構2〇2〇固定於第一基板結構2〇ι〇。平 面度控制器2050穿透第二基板結構2〇2〇，並且與第一基 板結構2010的上表面接觸。 於一實施例中，不安裝平面度控制器2〇5〇於電子檢測 裝置2000内。 於一實施例中，第一基板結構201〇和第二基板結構 2020藉由直接接觸而彼此電性連接。 藉由調節螺絲來調節基板片2010與支撐條之間的第 一間隙距離以及基板片201〇與框架之間的第二間隙距離 79 200912348 (步驟 S430 )。 於一實施例中，第一調節螺絲在垂直方向上調節基板 片相，支撐條的相對位置，並且第二調節螺絲在水平方向 上調節基板片相對框架的相對位置。 在垂直和水平方向上調節基板片位置的製程步驟與參 照圖52以及圖53A至圖53E描述的步驟S34〇以及S37〇 實質上相同。 因此，可藉由利用調節螺絲控制第—和第二間隙距離 來調節基板片的相對位置。 圖55是根據本發明第二十五實施例的電子檢測裝置 之平面圖，而圖56是沿圖55之電子檢測裝置的線p_p，的 橫截面圖。 參照圖55和圖56，根據第二十五實施例的電子檢測 裝置2500可包括基板片2510、支撐件2530以及調節件。 於一實施例中’支撐件包括支撐板2532和支撐柱 2534，並且可支撐基板片以使基板片彼此相鄰定位。調節 件可包括多個螺栓2520、多個螺母2540、多個螺栓蓋2550 以及多個螺絲2560並且可調節基板片251〇相對支撐件的 相對位置。 多個探針2512定位於各基板片2510上。基板片2510 的結構和配置與參照圖1和圖2描述的基板片實質上相同。 螺拴2520在垂直於基板片2510之上表面的方向上接 合到基板片2510上。例如，螺栓2520藉由結合劑（諸如 環氧樹脂）結合於基板片2510的上表面，或者與基板片 200912348 2510—體形成。 於一實施例中，支撐件2530可包括板狀物2532和柱 狀物2534。 支樓板2532可定形成平板狀，並且與基板片2510之 上表面接觸。支撐板2532包括多個暴露基板片251〇上之 電子墊的開口。 支樓柱2534突出於支撐板2532的表面且彼此間隔一 柱狀物間隙距離，柱狀物間隙距離實質上與鄰近螺检2^20 之間的螺栓間隙距離相同。例如，支樓柱2534可具有圓柱 形或方柱形。 支稽件2530還包括穿透支撐板2532以及支擇柱2534 的多個貫孔2536，並且貫孔2536可包括第一孔2536a以 及第二孔2536b。 第一孔2536a定位於支撐板2532以及一部份支撐柱 2534上。第二孔2536b可連接於第一孔2536a且定位於支 撐柱2534的剩餘部份上。 第一孔2536a的直徑大於螺栓2520的直徑，並且因而 螺栓2520可輕易地經第一孔2536a插入支撐板2532 〇此 外，螺栓2520在相對支撐板2532的水平方向上移動，同 時螺栓2520插入支撐板2532。 於一實施例中，第一孔2536a短於第二孔2536b，並 且因而螺栓2520可經第一孔2536a和第二孔2536b插入支 撐板2532。 第二孔2536b的直徑大於第一孔2536a的直徑，並且 81 200912348 —~ - π·· 螺絲螺紋形成於由支撐柱2534定義之第二孔2536b的内表 面上。 螺母2540分別耦接位於第二孔2536b内的螺栓 2520。螺母2540的外徑大於第一孔2536a的直徑並且小於 弟二孔2536b的直徑。 擰緊和鬆開螺母2540可允許螺栓2520在相對支撐板 2532的垂直方向上上下移動，並且由於基板片251〇固定 於螺栓2520上’螺栓2520的移動使基板片2510在垂直方 向上移動。也就是，藉由擰緊和鬆開螺母254〇來調節基板 片2510的位置。 螺栓蓋2550可插入第二孔2536並且接合到支撐柱 2534。螺栓蓋2550施加壓力到螺栓2520的頭部且保持螺 栓2520和基板片2510之所調節的垂直位置。 螺絲2560穿透支撐柱2534的側壁，且與第一孔2536a 内的螺栓2520接觸。例如，四個螺絲彼此成直角地穿過支 撐柱2534並且與位於第一孔2536a内的單個螺拴2520接 觸。也就是說，四個螺絲2560在彼此垂直的四個不同方向 上與位於第一孔2536a内的螺栓2520接觸。 可藉由撺緊或鬆開螺絲2560而在平行於支樓板2532 之上表面的水平方向上調節螺栓2520的位置。由於螺检 2520固定於基板片2510上，螺栓2520的水平調節引起美 板片2510的水平調節。 ^ 於一實施例中’螺絲孔位於螺絲2560所通過之支撐柱 2534的側壁。例如，螺絲孔定形成橢圓形，其長軸平行於 82 200912348 支撐柱2534的軸。 於一實施例中，螺絲孔的直徑與螺絲256〇的直徑實質 上一致，且在容許的製程容限内。 因此’藉由在螺絲接觸螺栓25 60的情況下擰緊和鬆開 螺母2540來調節螺栓2520的垂直位置。 幵 由於第一孔2536a的直徑大於螺栓2520的直徑，且螺 母2540的外徑大於第一孔2536a的直徑且小於第二孔 2536b的直徑，所以可藉由在螺絲與螺栓256〇接觸的情況 下擰緊和鬆開螺母2540在平行於基板片251〇之上表面的 水平方向上調節螺栓2520的位置。 因此’藉由螺栓2520之垂直及水平位置的調節來在垂 直和水平方向上調節基板片2510的位置。 圖57是根據本發明第二十六實施例的電子檢測裝置 的平面圖。 參照圖5 5 ’根據第二十六實施例的電子檢測裝置2_ 包括第一基板結構2610和第二基板結構262〇、連接件 2630、耦接件2640以及平面度控制器265〇。 於-實施例中’第-基板結構261〇可包括多個基板 片、螺栓、螺母、螺栓蓋和螺絲。第一基板結構261〇的结 構和配置與參照圖55至圖56描述的裝置25〇〇實質上相 同。 第二基板結構2620定位於第一基板結構261〇上，並 且可包括位於其㈣的訊號線（未繪示）以及電性連接到 訊號線的多個連接孔2622。導電層篇形成於連接孔繼 S3 200912348 的内表面。導電層2624包括第一導電材質，例如鋼（cu)。 訊號線電性連接至附加測試器。第二基板結構期可包括 印刷電路板（PCB)以及多層基板。 第一基板結構2610和第二基板結構262〇藉由連接件 2630 +電性連接。例如，連接孔2622之内表面上的導電層 2624藉由連接件263〇電性連接至電子塾（未緣示） 接件2630可包括第二導電材質，例如金屬。(not shown) is further installed between the third reinforcing member 2363 and the frame of the first substrate structure 2310, such that the upper surface of the substrate piece measured by the first substrate structure is elastically pressed by the additional spring piece, thereby fixing the substrate piece The frame of the first substrate structure 2310. The present embodiment discloses that the frame of the first substrate structure 2310 can be disposed separately from the third reinforcing member 2363, and thus the frame of the first substrate structure 2310 and the third reinforcing member are fixed to each other by the fifth bolt 23 69, the frame And the third reinforcing member 2369 can be integrally formed without using the fifth bolt 2369. The flatness controller 2370 penetrates the first reinforcement 2361 and the second substrate structure 2320, and thus contacts the upper surface of the third substrate structure 233A. The thickness of the first substrate structure 2310 may vary in the longitudinal direction according to the known conditions and environment for fabricating the first substrate structure 231, and thus the first substrate structure 2310 is disposed parallel to the second substrate structure 2320, the first substrate, the structure The probe tip of the 2310 is not located on the same coplanar surface. The flatness controller 237 that contacts the upper surface of the third substrate structure 2330 can control the horizontal angle of the first substrate structure 2310 by controlling the contact strength between the flatness control 2370 and the second substrate structure 2330, so that the probe tip Configured on the same coplanar surface. Thus, the tips of the probes on the lower surface of the first substrate structure 231 are positioned on the same coplanar surface. The flatness controller 2370 may not be disposed in the electronic detecting device 23 (8). The substrate piece of the first substrate structure 2310 is adjusted in a vertical direction of the top surface of the opposite substrate piece by the first adjusting screw, so that the lower surface of the first substrate structure 231 can be controlled by adjusting the screw instead of the flatness controller 2370. 72 200912348 Flatness or horizontal angle. Further, the second adjusting screw can adjust the position of the substrate piece in the first substrate structure 2310 in a direction parallel to the top surface of the substrate piece. Figure 51 is a cross-sectional view of an electronic detecting device in accordance with a twenty-fourth embodiment of the present invention. Referring to FIG. 51, the electronic detecting device 24A according to the twenty-fourth embodiment includes a first substrate structure 2410, a second substrate structure 242, a third substrate structure 2430, a connector 2440, a coupling member 2450, and flatness control. 2460. The structure and configuration of the first substrate structure 2410 and the second substrate structure 242 are substantially the same as those of the first and second substrate structures described with reference to FIG. The structure and arrangement of the third substrate structure 2430, the connector 2440, and the surface controller 2460 in this embodiment are the third substrate structure 2330 and the second connector 235 of the conventional embodiment described in detail with reference to FIG. And the flatness controller 2370 is substantially identical. The mating members 2450 secure the first, second, and third substrate structures 2410, 2420, and 2430 to each other such that the upper surface of the first substrate structure 241 is directly in contact with the lower surface of the second substrate structure 2430. In an embodiment, the adapter 2450 can include a first-reinforcing member, a second reinforcing member: a detaching, an elastic crest sheet 2454, and a plurality of bolts. The wide-reinforcing member 245! is formed in a dish shape and is located on the upper surface of the second substrate structure 2420. The second reinforcing member 2452 is wire-shaped and disposed along an edge portion of the first substrate structure 2420. The first screwing period of the adapter 245A may cause the first reinforcing member, the second substrate structural period, and the 73 200912348 second reinforcing member 2452 to be fixed to each other. The spring piece 2454 connects the second reinforcement 2452 with the frame 2434 of the third substrate structure 2430. The second bolt 2456 can secure the spring piece 2454 to the second reinforcement 2452, and the third bolt 2457 can secure the spring piece 2454 to the frame 2434 of the third substrate structure 243A. The spring tabs 2454 connect the second reinforcement member 2452 and the frame 2434' of the third substrate structure 2430 to each other such that a portion of the spring tab 2454 presses the upper surface of the substrate 2432 and thereby secures the substrate 2432 to the frame 2432. The fourth bolt 2458 secures the frame 2434 of the third substrate structure 2430 to the frame of a substrate structure 2410 such that the first substrate structure 241 and the third substrate structure 2430 are electrically connected to each other by the fourth bolt 2458. In addition, the electronic pads (not shown) on the first substrate structure 2410 and the other electronic pads (not shown) on the third substrate structure 2430 are bonded to each other by a bonding process. Thus, the first and third substrate structures can be mutually connected to each other. Electrical connection. Therefore, the position of the substrate piece can be adjusted by the fourth bolt 2458 in a direction perpendicular to the top surface of the substrate piece. In one embodiment, the first substrate structure 2410 and the third substrate structure 2430 are electrically connected to each other by indirect contact of the connectors 2440, and the second substrate structure 2420 and the third substrate structure 2430 are electrically connected to each other by direct contact. Sexual connection. Therefore, the position of the substrate piece is adjusted by adjusting the screw in a direction perpendicular and parallel to the upper surface of the substrate sheet before the first substrate structure 2410 and the third substrate structure 2430 are respectively consumed. Figure 52A is a flow chart showing the process steps of the method of the raid 74 200912348 of the electronic detecting apparatus shown in Figures 28 to 46. 53A to 53E are plan views showing the electronic detecting device corresponding to the process steps shown in Fig. 2. The electronic detecting device disclosed in Figs. 28 to 46 has a similar structure and configuration, and thus the assembling method of the electronic detecting device will be described below based on the devices disclosed in Figs. 28 to 33. Referring to Figures 52 and 53A, at least two substrate sheets 151 are disposed such that the substrate sheets 1510 are positioned adjacent to each other, and thus their sides face each other. Each of the substrate sheets has a first surface area (step S310). Hereinafter, the final substrate assembled from the substrate piece 1510 is referred to as a large substrate to distinguish the sheet 1510. Referring to Figures 52 and 53B, a plurality of support bars 153 are positioned on the substrate piece 151A (step S320). The second support strip 1532 can be disposed on the large substrate in the first direction, and the second branch strip 1534 is disposed on the first support strip 1532 in a second direction perpendicular to the first direction. Referring to Fig. 52 and Fig. 53C, the substrate piece 151 and the louvers 53 are fixed to each other by the first adjusting screw 1542 (step S330). The first pull screw 1542& of the first adjustment screw 1542 penetrates the first leg, 1532 and thus engages the substrate piece (10). The first push screw 1542b of the first adjusting screw is screwed down through the first support bar 1532 to be in contact with the upper surface of the substrate 丨 151G. Subsequently, the first support bar 1532 and the second support bar 1534 are fixed to each other by fixing =. The relative position of the substrate piece 151 〇 phase 八 1530 is adjusted by the first adjustment screw 1542 (step S34 〇). In the embodiment, the first traction screw 1542a and the first push screw 1542b are used to pull or push the substrate pieces, and thus the substrate piece 1510 and the support bar 1532 are adjusted by the first screw 1542. The first gap distance between. Therefore, the position of the substrate piece can be adjusted in a direction perpendicular to the upper surface of the substrate piece 151. In one embodiment, the support strip 1530 is positioned on the side of the substrate sheet and its upper surface, and the first adjustment screw 1542 can fix the first support strip 1532 to the side of the substrate sheet 1510. Thus, the position of the substrate piece is adjusted in the direction parallel to the upper surface of the substrate piece 1510 by the first pulling screw 1542a and the first pushing screw 1542b. In another embodiment, the 'support strip 1530 is positioned on the side of the substrate sheet and its upper surface' and the first adjustment screw 1542 can fix the first support strip 1532 to the upper surface of the substrate piece 1510, and the second adjustment screw 1544 The first support strip 1532 is fixed to the side surface of the substrate piece 151〇. Thus, the position of the substrate piece is adjusted by the first screw 1542 and the second screw 1544 in a direction perpendicular and parallel to the upper surface of the substrate piece 1510. Referring to Figures 52 to 53D, the substrate piece 1510 is positioned within the frame 152' (step S350). The substrate piece 1510 to which the support bar 1530 is fixed is mounted in the frame 152, and thus the side surface and the upper surface or the lower surface of the substrate piece are supported by the frame 1520. In one embodiment, the position of the substrate sheet ’ is adjusted by the first adjustment screw 1542 in the vertical direction relative to the support strip 1530 and the assembled substrate sheet 1510 is then mounted within the frame 1520. 76 200912348 In another embodiment, the support strip 1530 is secured to the assembled substrate piece 1510 by a first adjustment screw 1542, and the assembled substrate sheet 1510 is then mounted within the frame 1520. Referring to Figures 52 to 53E, the second adjusting screw 1544 is mounted in the frame 1520 (step S360). The second pull screw 1544a of the second adjustment screw 1544 penetrates the second sub-frame 1524 of the frame 1520 and thus engages the substrate piece 151. The second push screw 1544b of the second adjustment screw 1544 is screwed inwardly through the second sub-frame 1524 and thus in contact with the side of the substrate piece 1510. The second adjustment screw 1544 is mounted to the second sub-frame 1524 after the second insertion portion 1564 of the insert 1560 is interposed between the substrate piece 151'' and the second sub-frame 1524. The position of the substrate piece 1510 is adjusted in the direction parallel to the frame 152'' by the second adjusting screw 1544 (step S370). The substrate pieces 1510 are pulled or pushed by the second pulling screw 1544a and the second pushing screw 1544b, and thus the second gap distance between the substrate piece 1510 and the second sub-frame 1524 is adjusted by the second screw 1544. Therefore, the position of the substrate sheet can be adjusted in a direction parallel to the upper surface of the substrate piece 1510. In one embodiment, a plurality of probes that can be in direct contact with the detection target are attached to the respective substrate sheets 151A before the substrate sheets 151 are disposed adjacent to each other. In one embodiment, after the substrate Μ position is adjusted relative to the support bar 153 by adjusting the screw 154, the probe U12 that can be touched with the target is mounted on the substrate piece 1510. 77 200912348 In an embodiment, 'in the direction opposite the surface of the surface of the Hu 15120, the wire 154G, after being perpendicular to the substrate piece, will be able to adjust the substrate piece position 1510 with the detection target directly 1515. . The contact probe (5) 2 is mounted on the substrate sheet. In an embodiment, the substrate sheet position 151 can be adjusted directly with the detection target 1530 after the substrate 1540 is parallel to the substrate sheet by the shovel. . The directly contacting probe 1512 is mounted on the substrate piece in the case of the other, and the substrate piece is adjusted relative to the frame 152q by adjusting the upper surface of the screw 154; ^ = the probe 1512 which can directly contact the detection target is mounted on On the substrate piece 1510. After adjusting the position of the substrate piece relative to the frame 152 方向 in the direction parallel to the upper surface of the substrate piece 1510 by the adjusting screw, the target can be directly attached to the substrate piece 1510. on. In the embodiment, after the assembled substrate piece 151 is positioned in the frame 1520, the probe 1512 which is in direct contact with the detection target is mounted on the substrate piece 1510. < Fig. 54 is a flow chart showing the manufacturing steps of the assembling method of the electronic detecting device shown in Figs. 47 to 51. The electronic detecting device disclosed in Figs. 47 to 51 has a similar structure and configuration, and thus the assembling method of the electronic detecting device will be described below based on the device 2 disclosed in Fig. 47. 78 200912348 ... multi-', Fig. 54 ♦ 匡 wood, substrate piece, support bar and adjusting screw are assembled into a one-substrate structure 2010 (step S410). In U.S., the substrate sheets are disposed adjacent to each other and the support strips are positioned on the substrate sheets. The slit is placed on the substrate piece by the first adjustment screw, and then the substrate piece is positioned in the frame. The second adjustment screw is screwed into the frame. The process steps of arranging the substrate piece, positioning the support bar, the first adjusting screw of the Anshang, positioning the substrate piece on the frame and installing the squeezing screw, and the manufacturing steps described with reference to FIG. 52 and FIG. 53A to FIG. 5 are illusory to illusion 6 The same is true. Subsequently, the second substrate structure 2020 is bonded to the first substrate structure 2〇1〇 to electrically connect the first substrate structure 2010 and the second substrate structure 2〇2〇 to each other (step S420). In one embodiment, the first substrate structure 2〇1〇 and the second substrate structure 2020 are electrically connected to each other by the connecting member 2030. Subsequently, the second substrate structure 2〇2〇 is fixed to the first substrate structure 2〇 by the coupling member 2040. The flatness controller 2050 penetrates the second substrate structure 2〇2〇 and is in contact with the upper surface of the first substrate structure 2010. In one embodiment, the flatness controller 2 is not installed in the electronic detecting device 2000. In one embodiment, the first substrate structure 201 and the second substrate structure 2020 are electrically connected to each other by direct contact. The first gap distance between the substrate piece 2010 and the support strip and the second gap distance between the substrate piece 201〇 and the frame are adjusted by the adjustment screw 79 200912348 (step S430). In one embodiment, the first adjustment screw adjusts the relative orientation of the substrate sheet phase, the support strips in the vertical direction, and the second adjustment screw adjusts the relative position of the substrate sheet relative to the frame in the horizontal direction. The process steps of adjusting the position of the substrate in the vertical and horizontal directions are substantially the same as steps S34 and S37 described with reference to Fig. 52 and Figs. 53A to 53E. Therefore, the relative positions of the substrate pieces can be adjusted by controlling the first and second gap distances by means of the adjusting screws. Figure 55 is a plan view of an electronic detecting device according to a twenty-fifth embodiment of the present invention, and Figure 56 is a cross-sectional view of the line p_p of the electronic detecting device of Figure 55. Referring to Figures 55 and 56, an electronic detecting device 2500 according to a twenty-fifth embodiment may include a substrate piece 2510, a support member 2530, and an adjustment member. In one embodiment, the support member includes a support plate 2532 and a support post 2534, and can support the substrate sheets to position the substrate sheets adjacent to one another. The adjustment member can include a plurality of bolts 2520, a plurality of nuts 2540, a plurality of bolt covers 2550, and a plurality of screws 2560 and can adjust the relative position of the substrate piece 251 〇 relative to the support member. A plurality of probes 2512 are positioned on each of the substrate pieces 2510. The structure and configuration of the substrate piece 2510 are substantially the same as those of the substrate piece described with reference to FIGS. 1 and 2. The thread 2520 is joined to the substrate piece 2510 in a direction perpendicular to the upper surface of the substrate piece 2510. For example, the bolt 2520 is bonded to the upper surface of the substrate piece 2510 by a bonding agent such as an epoxy resin, or formed integrally with the substrate piece 200912348 2510. In one embodiment, the support 2530 can include a plate 2532 and a post 2534. The floor panel 2532 can be formed into a flat shape and is in contact with the upper surface of the substrate piece 2510. The support plate 2532 includes a plurality of openings that expose the electronic pads on the substrate sheets 251. The pillars 2534 protrude from the surface of the support plate 2532 and are spaced apart from each other by a pillar gap distance which is substantially the same as the bolt gap distance between the adjacent bolts 2^20. For example, the pedestal column 2534 can have a cylindrical or square cylindrical shape. The fulcrum member 2530 further includes a plurality of through holes 2536 penetrating the support plate 2532 and the support post 2534, and the through hole 2536 can include a first hole 2536a and a second hole 2536b. The first hole 2536a is positioned on the support plate 2532 and a portion of the support post 2534. The second aperture 2536b can be coupled to the first aperture 2536a and positioned over the remainder of the support post 2534. The diameter of the first hole 2536a is larger than the diameter of the bolt 2520, and thus the bolt 2520 can be easily inserted into the support plate 2532 via the first hole 2536a. Further, the bolt 2520 is moved in the horizontal direction relative to the support plate 2532 while the bolt 2520 is inserted into the support plate. 2532. In one embodiment, the first aperture 2536a is shorter than the second aperture 2536b, and thus the bolt 2520 can be inserted into the support plate 2532 via the first aperture 2536a and the second aperture 2536b. The diameter of the second hole 2536b is larger than the diameter of the first hole 2536a, and 81 200912348 —~ - π·· The screw thread is formed on the inner surface of the second hole 2536b defined by the support post 2534. The nut 2540 is coupled to the bolt 2520 located in the second hole 2536b, respectively. The outer diameter of the nut 2540 is larger than the diameter of the first hole 2536a and smaller than the diameter of the second hole 2536b. Tightening and loosening the nut 2540 allows the bolt 2520 to move up and down in the vertical direction relative to the support plate 2532, and since the substrate piece 251 is fixed to the bolt 2520, the movement of the bolt 2520 causes the substrate piece 2510 to move in the vertical direction. That is, the position of the substrate piece 2510 is adjusted by tightening and loosening the nut 254. Bolt cover 2550 can be inserted into second aperture 2536 and joined to support post 2534. The bolt cover 2550 applies pressure to the head of the bolt 2520 and maintains the adjusted vertical position of the bolt 2520 and the substrate piece 2510. The screw 2560 penetrates the side wall of the support post 2534 and is in contact with the bolt 2520 in the first hole 2536a. For example, four screws pass through the support post 2534 at right angles to each other and contact a single thread 2520 located within the first aperture 2536a. That is, the four screws 2560 are in contact with the bolts 2520 located in the first holes 2536a in four different directions perpendicular to each other. The position of the bolt 2520 can be adjusted in a horizontal direction parallel to the upper surface of the floor panel 2532 by tightening or loosening the screw 2560. Since the thread check 2520 is fixed to the substrate piece 2510, the horizontal adjustment of the bolt 2520 causes the horizontal adjustment of the sheet 2510. In an embodiment, the screw holes are located on the side walls of the support posts 2534 through which the screws 2560 pass. For example, the screw holes are formed in an elliptical shape with a long axis parallel to the axis of the support column 2534 of 82 200912348. In one embodiment, the diameter of the screw holes is substantially the same as the diameter of the screw 256 turns and is within acceptable process tolerances. Therefore, the vertical position of the bolt 2520 is adjusted by tightening and loosening the nut 2540 with the screw contacting the bolt 25 60.幵 Since the diameter of the first hole 2536a is larger than the diameter of the bolt 2520, and the outer diameter of the nut 2540 is larger than the diameter of the first hole 2536a and smaller than the diameter of the second hole 2536b, the screw can be contacted with the bolt 256〇. The tightening and loosening nut 2540 adjusts the position of the bolt 2520 in a horizontal direction parallel to the upper surface of the substrate piece 251. Therefore, the position of the substrate piece 2510 is adjusted in the vertical and horizontal directions by the adjustment of the vertical and horizontal positions of the bolts 2520. Figure 57 is a plan view showing an electronic detecting device in accordance with a twenty-sixth embodiment of the present invention. Referring to Fig. 5 5', the electronic detecting device 2_ according to the twenty-sixth embodiment includes a first substrate structure 2610 and a second substrate structure 262, a connecting member 2630, a coupling member 2640, and a flatness controller 265A. In the embodiment, the 'first substrate structure 261' may include a plurality of substrate sheets, bolts, nuts, bolt covers, and screws. The structure and configuration of the first substrate structure 261 is substantially the same as the device 25A described with reference to Figs. 55 to 56. The second substrate structure 2620 is positioned on the first substrate structure 261, and may include a signal line (not shown) at (4) thereof and a plurality of connection holes 2622 electrically connected to the signal line. The conductive layer is formed on the inner surface of the connecting hole following S3 200912348. Conductive layer 2624 includes a first electrically conductive material, such as steel (cu). The signal line is electrically connected to the additional tester. The second substrate structure period may include a printed circuit board (PCB) and a multilayer substrate. The first substrate structure 2610 and the second substrate structure 262 are electrically connected by a connector 2630+. For example, the conductive layer 2624 on the inner surface of the connection hole 2622 can be electrically connected to the electronic 塾 (not shown) via the connecting member 263, and the second conductive material, such as metal, can be included.
連接件2630的第-端部2632可電性連接於第一基板 結構2610的電子墊。例如，第一端部2632 固定於電子墊。 X ，對於第一端部2632的連接件263〇的第二部份2634 插入第二基板結構期的連接孔2622。例如，第二部份 2634可接觸連接孔2622之内表面上的導電層2似或 於導電層2624。 —於-實施例中，諸如撓性印刷電路板（Fpc)的配線 =件，以替代連接件2630，並因而藉由配線元件彼此電性 連接第-基板結構2610和第二基板結構262〇。 第-基板結構261G和第二基板結構2㈣藉由麵接件 ί40彼此機械轉接。於一實施例中，搞接件2640可包括 弟一補強件264卜第二補強件购、彈菁片測以 個螺栓。 第—補強件、2641 ^形成碟狀並且位於第二基板結構 上。第—補強件2642定形成環狀並且沿第二基板結 構2020的邊緣部份配置。第一補強件2641、第二基板結 84 200912348 構2620以及第二補強件2642藉由第一螺栓2645彼此固 定。彈簧片可接觸第二補強件2642和第一基板結構261〇 的框架。第二補強件2642藉由第二螺栓2644固定於彈簧 片2646並且彈簧片藉由第三螺栓2647固定於框架。 平面度控制器2650穿透第一補強件2641和第二基板 結構2620’並且因而與第一基板結構261〇的上表面接觸。 第一基板結構2610的厚度可根據製造第一基板結構％ 1〇 的製程條件和環境沿縱向方向發生變化，因而儘管第一基 板結構2610和第二基板結構2620彼此平行配置，第一基 板結構2610之探針的尖端不位於同一共面表面。接觸第一 基板結構2610之上表面的平面度控制器265〇可藉由控制 平面度控制器2650與第一基板結構26丨〇之間的接觸強度 來控制第一基板結構201 〇之下表面的平面度，使得探針= 端配置於同一共面表面。 I不配置平面度控制器265()於電子檢測裝置細〇 内。藉由第-調節螺絲在相對基板片之頂面的垂直方向上 ^調節第-基板結構2610的基板片，使得可藉由調節螺絲 替代平面度控制器2650來控制第一基板結構261〇之下 面的平面度或水平角度。 因此，基板片的位置藉由第—調節螺絲在垂直於基相 片之上表面的方向上進行調節或者藉由第—調節螺絲在今 行於基板片上表面的方向上進行調節。 的橫^是根據本發㈣二十七實施例的電子檢測裝運 85 200912348 參照圖58’根據第二十七實施例的電子檢測裝置27〇〇 包括第一基板結構2710、第二基板結構2720、第三基板結 構2730、第一連接件2740、第二連接件2750、耦接件2760 以及平面度控制器2770。 第一基板結構2710和第二基板結構2720的結構和配 置與參照圖57描述的第一基板結構2610和第二基板結構 2620貫質上相同。 於一實施例中，第三基板結構2730介於第一基板結構 2710和第二基板結構272〇之間，且可包括基板2732以及 支撐基板2734之側面和下表面的支撐件2732。訊號線（未 緣示）位於第二基板結構2732的基板2730内。基板2732 的實例可包括印刷電路板（PCB)以及多層基板。 第一連接件2740電性連接第一基板結構271〇和第三 基板結構2730。第一連接件2740的第一端部2742接觸第 一基板結構2710或固定於第一基板結構271〇。相對於第 一端部2742之第一連接件2740的第二端部2744接觸第三 基板結構2730或固定於第三基板結構273〇。 第二連接件2750電性連接第二基板結構272〇和第三 基板結構2730。於本實施例中，第二連接件275〇電性連 接位於連接孔2722之内表面上的導電層2724以及第三基 板結構U30的電子墊。第二連接件275〇的第一端部2752 接觸第二基板結構2730或固定於第三基板結構273〇。相 對於第一端部之弟二連接件275〇的第二端部2754接觸或 固定於第二基板結構2720的導電層。 86 200912348 —於只施例中’諸如撓性印刷電路板（Fpc)的配線 元件用以替代第-連接件274G和第二連接件275〇，並因 而藉由配線元件彼此紐連接第—基板結構27iG和第三 基板結構迎以及第二基板結構删和第三基板 2730。 輕接件2760彼此輕接第一基板結構271〇、第二基板 、、、。構2720和第二基板結構273〇。於一實施例中，耦接件 2760可包括第-補強件276卜第二補強件、第三補 強件2763、彈簧片2764以及多個螺栓。 第補強件2761定形成碟狀並且位於第二基板結構 2720的上表面上。第二補強件2762定形成環狀並且沿第 二^板結構272G的邊緣部份配置。第三補強件2763定形 成，狀並且可弟二基板結構2730的邊緣部份配置，使 得第三補強件2763沿第三基板結構273G的框架2734配 置。麵接件2760的第一螺拴2765可使得第一補強件 2^1、第一基板結構272〇以及第二補強件2762彼此固定。 彈簀片2764彼此連接第二補強件觀與第三基板結構 2730的框架2734,以使彈簧片2764的一部份按壓基板 2732之上表面並因而由框架2734支撐基板27%。 第二螺栓2766可將彈簧片2764固定於第二補強件 2762，並且第三螺栓2767可將彈簧片2764固定於第三基 板結構2730的框架2734。第四螺栓2768可將框架273^ 固定於第三補強件2763，並且第五螺栓2769可將第三補 強件2763固疋於苐一基板結構2710的框架。附加彈簧片 87 200912348 (未繪示）更安裝於第三補強件2763與第一基板結構2710 的框架之間’使得第一基板結構2710之基板片的上表面由 附加彈簧片彈性按壓，以藉此將基板片固定於第一基板結 構2710的框架上。 儘管本實施例揭示了第一基板結構2710的框架可獨 立於苐一補強件2763配置，並且因而第一基板結構2710 的框架以及第三補強件由第五螺栓2769彼此固定，框架和 第三補強件2769可在不使用第五螺栓2769的情況下一體 形成。 平面度控制器2770穿透第一補強件2761和第二基板 結構2720’並且因而與第三基板結構273〇的上表面接觸。 第了基板結構2710的厚度可根據製造第一基板結構271〇 的製程條件和環境沿縱向方向發生變化，並且因而儘管第 一基板結構2710平行於第二基板結構2720配置，第一基 板結構2710的探針尖端不位於同一共面表面。接觸第三基 板結構2730之上表面的平面度控制器277〇可藉由控制平 面度控制器2770與第三基板結構2730之間的接觸強度來 控制弟基板結構2710的水平角度’使得探針尖端配置於 同一共面表面。因而，第一基板結構271〇之下表面上的探 針尖端定位於同一共面表面。 不配置平面度控制器2770於電子檢測裝置2700内。 藉由第一調節螺絲在相對基板片之頂面的垂直方向上調節 第一基板結構2710的基板片，使得可藉由調節螺絲替代平 面度控制器2770來控制第一基板結構2710之下表面的平 88 200912348 面度或水平角度。 此外，第二調節螺絲還可在平行於基板片頂面的方向 上調節第一基板結構2710中之基板片的位置。 圖59疋根據本發明第二十八實施例的電子檢測裝置 的橫截面圖。 參照圖59’根據第二十八實施例的電子檢測裝置28〇〇 包括基板片2810、耦接件 '調節件、基板結構286〇以及 連接件2865。 於一貫施例中，耦接件包括支撐部283〇和補強部 ^870，並且基板片可由耦接件支撐，使得基板片彼此相鄰 定位。調節件可包括多個螺栓2820、多個第一螺母284〇、 多個螺絲2850、多個第二螺母2880以及多個螺栓蓋2890 並可調節基板片相對輕接件的相對位置。 基板片2810、螺栓2820、支撐部2830以及螺絲2850 的結構及配置與參照圖55和圖56詳細描述的第二十五實 施例中的基板片2510、螺栓2520、支撐件253〇以及螺絲 2560實質上相同。 第一螺母2840可與螺栓2820耦接，並且因而藉由螺 栓和螺母2820和2840將支撐部2830固定到基板片2810。 根據檢測條件和環境，可不安裝第一螺母284〇於本實施例 的檢測裝置2800上。 基板結構2860和連接件2865的結構和配置與參照圖 57詳細描述的第二十六實施例中的第二基板結構262〇和 連接件2630相同，除了基板結構286〇包括貫孔2863，螺 89 200912348 栓2820插入貫孔2863且其直徑等於或大於螺栓282〇的直 徑。 補強部2870定位於基板結構2860上且包括螺栓所插 入的上貫孔2872。 上貫孔2872包括第三孔2872a和第四孔2872b。 第三孔2872a位於補強部2870的下部，而第四孔 2872b位於補強部2870的上部且連接至第三孔2872a。 第三孔2872a的直徑大於螺栓2820的直徑，而第四孔 2872b的直徑大於第三孔2872a的直徑。螺絲螺紋形成於 由補強部2870定義之第四孔2872b的内表面上。 第一螺母2880和螺栓蓋2890的結構和配置與參照圖 55詳細描述的第二十五實施例中的螺母254〇和螺栓蓋 2550相同，除了第二螺母288〇接合於位於第四孔2872b 中之螺栓2820的頭部，而螺栓蓋2890插入第四孔2872b 且固定於補強部2870。 因此’藉由螺栓2820之垂直及水平位置的調節來在垂 直和水平方向上調節基板片2810的位置。 圖60是根據本發明第二十九實施例的電子檢測裝置 的橫截面圖。 參照圖60,根據第二十九實施例的電子檢測裝置2900 可包括基板片2910、支撐件、調節件、基板結構2930以 及連接件2940。 於一實施例中，支撐件可包括補強部2950 ’而調節件 可包括多個螺栓2920、多個螺絲2960、多個螺母2970以 200912348 及多個螺栓蓋2980。 基板片2910和螺栓2920的結構及配置與參照圖55 和圖56詳細描述的第二十五實施例中的基板片2510和螺 栓2520實質上相同。 基板結構2930和連接件294〇的結構及配置與參照圖 59詳細描述的第二十八實施例中的基板結構286〇和連接 件2865相同’除了基板結構2930與基板片2910間隔開。 於一實施例中，補強件2950可包括板狀物2951和柱 狀物2952。 支樓板2951可定形成平板狀，並且與基板片2930之 上表面接觸。柱狀物2952突出於板狀物2951的表面且彼 此間隔一柱狀物間隙距離，柱狀物間隙距離實質上與鄰近 螺栓2920之間的螺栓間隙距離相同。例如，柱狀物2952 可具有圓柱形或方柱形。 補強部2950還可包括穿透板狀物2951以及柱狀物 2952的多個貫孔2953，並且貫孔2953可包括第一孔2953a 以及第二孔2953b。 第一孔2953a定位於板狀物2951以及一部份柱狀物 2952上。第二孔2953b可連接於第一孔2953a且定位於柱 狀物2952的剩餘部份上。 第一孔2953a的直徑大於螺栓2920的直徑，並且因而 螺栓2920可經第-孔2953a輕易地插入板狀物295卜此 外，螺栓2920相對在支撐板2951的水平方向上移動，同 時螺栓2920接觸支撐板2951。 91 200912348 第二孔2953b的直徑大於第一孔2953a的直徑，並且 螺絲螺紋形成於由柱狀物2952定義的第二孔2953b的内表 面上。 補強部2950藉由固定件2954固定於基板結構2930。 由於基板結構2930固定於補強部2950,基板結構2930可 與基板片2910間隔。 螺絲2960、螺母2970以及螺栓蓋2980的結構和配置 可以與參照圖55和圖56詳細描述的第二十五實施例的螺 絲2560、螺母2540以及螺栓蓋2550相同，除了螺絲296〇 可牙透柱狀物2952的側壁並與第一孔2953a内的螺才全 2920接觸，螺母2970可與第二孔2953b内的螺栓2920耦 接，並且螺栓蓋2980可插入於第二孔2953b内並且接合到 柱狀物2952上。 口 因此，藉由螺栓2920之垂直及水平位置的調節來在垂 直和水平方向上調節基板片2910的位置。 圖61是根據本發明第三十實施例的電子檢測裝置的 橫截面圖。 參照圖61，根據第三十實施例的電子檢測裝置3〇〇〇 可包括基板片3010、基板結構3030、支擇件以及調節件。 於一實施例中，支撐件包括補強部3040並且可支撐基 板片3010以使基板片3010彼此相鄰配置。調節件可包括 多個螺栓3020、多個螺絲3050、多個螺母3〇6〇以及多個 螺栓蓋3070並且可調節基板片3010相對支撐件的位置。 基板片3010、螺检3020、基板結構3〇3〇、補強部3〇40、 92 200912348 •V w W 太龙^ ▲▲ 螺絲3050、螺母3060以及螺栓蓋3070的結構和配置可與 參照圖60詳細描述的二十九實施例中的基板片2910、螺 栓2920、基板結構2930、補強部2950、螺絲2960、螺母 2970及螺栓蓋2980相同，除了基板片3010可直接接觸基 板結構3030。 圖62是根據本發明第三十一實施例的電子檢測裝置 的橫截面圖。 參照圖62’根據第三十一實施例的電子檢測裝置31〇〇 可包括基板片3110、基板結構3150、連接件3155、耦接 件以及調節件。 於一實施例中’耦接件包括支撐部3120和補強部 3160，並且基板片3110由耦接件支撐，使得基板片3110 彼此相鄰定位。調節件可包括多個螺栓313〇、多個第一螺 母3140、多個螺絲3170、多個第二螺母3180以及多個螺 栓蓋3190並可調節基板片3110相對耦接件的相對位置。 基板片3110、基板結構3150、連接件3155、補強部 v 3160、螺絲3170、第二螺母3180以及螺栓蓋3190的結構 和配置與參照圖60詳細描述的第二十九實施例的基板片 2910、基板結構2930、連接件2940、補強部2950、螺絲 2960、螺母2970以及螺栓蓋298〇相同。 支標部3120和第一螺母3140的結構和配置與參照圖 59洋細描述的第二十八實施例中的支撐部和第一螺 母2840實質上相同，除了支撐部312〇包括僅位於柱狀物 3122的開口 3123來替代貫孔並藉由固定件3124固定於基 93 200912348 板片3110上。 基板片3110可藉由螺栓3130彼此固定，使得螺栓 3130插入支撐部3120的開口 3123。也就是說，螺栓3123 不插入基板片3110。螺栓3123藉由諸如黏膠等結合劑連 接到基板片3110。此外，螺检3130可與支撐部3120 —體 形成。第一螺母3140可固定於螺栓313〇和支撐部312〇 二者上。 由於基板片3110固定於支撐部3120上且支撐部312〇 固疋於螺栓3130上，基板片3110、支撐部3120以及螺栓 3130彼此固定於一起。因此，藉由螺栓313〇之垂直及水 平位置的調節來在垂直和水平方向上調節基板片311〇的 位置。 圖63是繪示組裝圖55和圖62所示之電子檢測裝置 2500之製程步驟的流程圖。 圖55至圖62中揭示的電子檢測裝置具有類似的結構 和配置，因而下文基於圖55至圖56所揭示的裝置2500 描述電子檢測裝置的組裝方法。 參照圖63,固定於基板片2510的螺栓2520可插入支 撐件2530的貫孔2536 (步驟S510)。 螺母2540接合於貫孔2536内的螺栓2520的頭部（步 驟S520)。藉由接合螺栓和螺母252〇和254〇彼此固定支 撐件2530和基板片2510。 螺絲2560可向内旋擰經過支撐柱2534(步驟S53〇)。 於一實施例中，螺絲2560旋擰穿透支撐柱2534之侧 94 200912348 ，上的第-孔2536a，且因而與貫孔2536内的螺栓勘 接觸。於本實施例中，四個螺絲旋擰過支撐柱2534。 藉由擰緊和鬆開螺絲256〇在垂直及平行於基板251〇 之上表面的方向上來調節基板片251〇的位置（步驟s54〇)。 可藉由擰緊或鬆開與貫孔2536内的支樓柱接觸 之螺絲2560可在平行於支樓板加之上表面的水平方向 上調節螺栓252G的位置。由於螺栓252()固定於基板片 =10上’螺栓2520的水平調節引起基板片251〇的水平調 節。 螺母2540可與第二孔2536b内的螺栓2520耦接，且 螺母2540的外徑大於第一孔253如的直徑並且小於第二孔 2536b的直徑。因此’擰緊和鬆開螺母254〇可允許螺栓252〇 在相對支撐板2532的垂直方向上上下移動，並且由於基板 片2510固定於螺栓2520’螺栓252〇的移動使基板片251〇 在垂直方向上移動。也就是，藉由在垂直方向上擰緊和鬆 開螺母2540來調節基板片2510的位置（步驟S55〇)。 螺栓蓋2550可插入第二孔2536b並且接合到支撐柱 2534。螺栓蓋2550施加壓力到螺栓2520的頭部且保持螺 栓2520和基板片2510之所調節的垂直位置。也就是，藉 由螺栓蓋2550來避免基板片2510的調節位置發生變化， 藉此固定基板片2510的調節位置（步驟S560)。 根據本發明的實施例，支撐基板片，以使基板片彼此 相鄰地配置於框架内，並且因而將基板片形成大型基板。 藉由調節螺絲在垂直和平行於基板片之上表面的方向上調 95 200912348 架之間的間隙距離。因此，在水平和垂直方 向上如電子檢測裝置的大型基板。 平方向:調安裝於基板片上，並且可在垂直和水 與框架之間的支撐條之間的間隙距離以及基板片 士欲雖、丨本發明已以實施例揭露如上，然:其並非用以定 明，任何所屬技術 ^ 二 範圍内，當可作不脫離 因此 範圍所界定者為 ^發明之保護範圍當視後社申請專利 罕。 【圖式簡單說明】 圖。圖1疋根據本發明第—實施例的電子檢測裝置的平面 圖。。&口圖1所不的電子檢測裝置之線Α-Α，的橫截面 圖3疋圖1所示的框架的透視圖。 ®54 ί: 1所示的框架之修改的透視圖。 的平面圖〜相1所示的電子檢測裝置内之基板片調節 的橫Si纷示圖2所示的電子檢測裝置内之基板片調節 圖 疋根據本發明第二實施例的電子檢測褒置的平面 圖8是沿圏7所示的電子制裝置之線諸的橫截面 96 200912348 圖。 圖9是根據本發明第三實施例的電子檢測裝置的平面 圖。 圖10是沿圖9所示的電子檢測裝置之線C-C’的橫截 面圖。 圖11是根據本發明第四實施例的電子檢測裝置的平 面圖。 圖12是沿圖11所示的電子檢測裝置之線D-D’的橫截 面圖。 圖13是根據本發明第五實施例的電子檢測裝置的平 面圖。 圖14是沿圖13所示的電子檢測裝置之線E-E’的橫截 面圖。 圖15是根據本發明第六實施例的電子檢測裝置的平 面圖。 圖16是沿圖15所示的電子檢測裝置之線F-F’的橫截 面圖。 圖17是根據本發明第七實施例的電子檢測裝置的平 面圖。 圖18是沿圖17所示的電子檢測裝置之線G-G’的橫截 面圖。 圖19是根據本發明第八實施例的電子檢測裝置的橫 截面圖。 圖20是根據本發明第九實施例的電子檢測裝置的橫 97 200912348The first end 2632 of the connector 2630 can be electrically connected to the electronic pad of the first substrate structure 2610. For example, the first end 2632 is fixed to the electronic pad. X, the second portion 2634 of the connector 263A of the first end portion 2632 is inserted into the connection hole 2622 of the second substrate structure period. For example, the second portion 2634 can contact the conductive layer 2 on the inner surface of the connection hole 2622 or the conductive layer 2624. In the embodiment, a wiring member such as a flexible printed circuit board (Fpc) is used in place of the connector 2630, and thus the first substrate structure 2610 and the second substrate structure 262 are electrically connected to each other by the wiring member. The first substrate structure 261G and the second substrate structure 2 (4) are mechanically transferred from each other by the face piece ί40. In one embodiment, the engaging member 2640 can include a reinforcing member 264, a second reinforcing member, and a bolt for measuring the elastic piece. The first reinforcing member, 2641^, is formed in a dish shape and is located on the second substrate structure. The first reinforcing member 2642 is formed in a ring shape and disposed along an edge portion of the second substrate structure 2020. The first reinforcing member 2641, the second substrate member 84 200912348, and the second reinforcing member 2642 are fixed to each other by the first bolt 2645. The spring leaf can contact the second reinforcement member 2642 and the frame of the first substrate structure 261〇. The second reinforcing member 2642 is fixed to the spring piece 2646 by the second bolt 2644 and the spring piece is fixed to the frame by the third bolt 2647. The flatness controller 2650 penetrates the first reinforcing member 2641 and the second substrate structure 2620' and thus contacts the upper surface of the first substrate structure 261A. The thickness of the first substrate structure 2610 may vary along the longitudinal direction according to process conditions and environment for fabricating the first substrate structure % 1 , such that although the first substrate structure 2610 and the second substrate structure 2620 are disposed in parallel with each other, the first substrate structure 2610 The tips of the probes are not located on the same coplanar surface. The flatness controller 265 that contacts the upper surface of the first substrate structure 2610 can control the surface of the lower surface of the first substrate structure 201 by controlling the contact strength between the flatness controller 2650 and the first substrate structure 26? Flatness, so that the probe = end is placed on the same coplanar surface. I does not configure the flatness controller 265() in the electronic detection device. The substrate piece of the first substrate structure 2610 is adjusted in the vertical direction of the top surface of the opposite substrate piece by the first adjusting screw, so that the lower surface of the first substrate structure 261 can be controlled by adjusting the screw instead of the flatness controller 2650 Flatness or horizontal angle. Therefore, the position of the substrate piece is adjusted by the first adjusting screw in the direction perpendicular to the upper surface of the base film or by the first adjusting screw in the direction of the upper surface of the substrate piece. The horizontal detection is an electronic detection shipment according to the twenty-fourth embodiment of the present invention. (2009) 348. Referring to FIG. 58', the electronic detection device 27 according to the twenty-seventh embodiment includes a first substrate structure 2710, a second substrate structure 2720, The third substrate structure 2730, the first connector 2740, the second connector 2750, the coupling 2760, and the flatness controller 2770. The structure and configuration of the first substrate structure 2710 and the second substrate structure 2720 are substantially the same as those of the first substrate structure 2610 and the second substrate structure 2620 described with reference to FIG. In one embodiment, the third substrate structure 2730 is interposed between the first substrate structure 2710 and the second substrate structure 272, and may include a substrate 2732 and a support 2732 supporting the side and lower surfaces of the substrate 2734. A signal line (not shown) is located within the substrate 2730 of the second substrate structure 2732. Examples of the substrate 2732 may include a printed circuit board (PCB) and a multilayer substrate. The first connecting member 2740 is electrically connected to the first substrate structure 271 and the third substrate structure 2730. The first end portion 2742 of the first connector 2740 contacts the first substrate structure 2710 or is fixed to the first substrate structure 271A. The second end portion 7444 of the first connector 2740 with respect to the first end portion 2742 contacts the third substrate structure 2730 or is fixed to the third substrate structure 273. The second connector 2750 is electrically connected to the second substrate structure 272 and the third substrate structure 2730. In the present embodiment, the second connecting member 275 is electrically connected to the conductive layer 2724 on the inner surface of the connecting hole 2722 and the electronic pad of the third substrate structure U30. The first end portion 2752 of the second connector 275A contacts the second substrate structure 2730 or is fixed to the third substrate structure 273. The second end portion 2754 of the second connector 275A is contacted or fixed to the conductive layer of the second substrate structure 2720 with respect to the first end portion. 86 200912348 - In the example only, a wiring member such as a flexible printed circuit board (Fpc) is used in place of the first connector 274G and the second connector 275, and thus the wiring member is connected to each other by the wiring member. The 27iG and the third substrate structure and the second substrate structure are deleted from the third substrate 2730. The light connectors 2760 are lightly connected to each other by the first substrate structure 271, the second substrate, and the second substrate. Structure 2720 and second substrate structure 273. In one embodiment, the coupling member 2760 can include a first reinforcing member 276, a second reinforcing member, a third reinforcing member 2763, a spring piece 2764, and a plurality of bolts. The first reinforcing member 2761 is formed in a dish shape and is located on the upper surface of the second substrate structure 2720. The second reinforcing member 2762 is formed in a ring shape and disposed along an edge portion of the second plate structure 272G. The third reinforcing member 2763 is shaped and configured to have an edge portion of the second substrate structure 2730 such that the third reinforcing member 2763 is disposed along the frame 2734 of the third substrate structure 273G. The first thread 2765 of the facet 2760 can cause the first reinforcement member 221, the first substrate structure 272A, and the second reinforcement member 2762 to be secured to each other. The magazines 2764 are coupled to the second reinforcement member and the frame 2734 of the third substrate structure 2730 such that a portion of the spring tab 2764 presses the upper surface of the substrate 2732 and thus supports the substrate 27% by the frame 2734. The second bolt 2766 can secure the spring tab 2764 to the second reinforcement member 2762, and the third bolt 2767 can secure the spring tab 2764 to the frame 2734 of the third substrate structure 2730. The fourth bolt 2768 can secure the frame 273^ to the third reinforcement member 2763, and the fifth bolt 2769 can secure the third reinforcement member 2763 to the frame of the first substrate structure 2710. The additional spring piece 87 200912348 (not shown) is further mounted between the third reinforcing member 2763 and the frame of the first substrate structure 2710 'so that the upper surface of the substrate piece of the first substrate structure 2710 is elastically pressed by the additional spring piece to borrow This fixes the substrate piece to the frame of the first substrate structure 2710. Although the present embodiment discloses that the frame of the first substrate structure 2710 can be configured independently of the first reinforcement 2763, and thus the frame of the first substrate structure 2710 and the third reinforcement are fixed to each other by the fifth bolt 2769, the frame and the third reinforcement The piece 2769 can be integrally formed without using the fifth bolt 2769. The flatness controller 2770 penetrates the first reinforcing member 2761 and the second substrate structure 2720' and thus contacts the upper surface of the third substrate structure 273A. The thickness of the first substrate structure 2710 may vary in the longitudinal direction according to the process conditions and environment for fabricating the first substrate structure 271, and thus the first substrate structure 2710 is configured in parallel to the second substrate structure 2720, the first substrate structure 2710 The probe tips are not on the same coplanar surface. The flatness controller 277 that contacts the upper surface of the third substrate structure 2730 can control the horizontal angle ' of the substrate structure 2710 by controlling the contact strength between the flatness controller 2770 and the third substrate structure 2730 such that the probe tip Configured on the same coplanar surface. Thus, the probe tips on the lower surface of the first substrate structure 271 are positioned on the same coplanar surface. The flatness controller 2770 is not disposed within the electronic detection device 2700. The substrate piece of the first substrate structure 2710 is adjusted in a vertical direction of the top surface of the opposite substrate piece by the first adjusting screw, so that the lower surface of the first substrate structure 2710 can be controlled by adjusting the screw instead of the flatness controller 2770.平88 200912348 Face or horizontal angle. Further, the second adjusting screw can also adjust the position of the substrate piece in the first substrate structure 2710 in a direction parallel to the top surface of the substrate piece. Figure 59 is a cross-sectional view of an electronic detecting device in accordance with a twenty-eighth embodiment of the present invention. Referring to Fig. 59', the electronic detecting device 28' according to the twenty-eighth embodiment includes a substrate piece 2810, a coupling member "adjusting member, a substrate structure 286", and a connecting member 2865. In a consistent embodiment, the coupling member includes a support portion 283A and a reinforcement portion 870, and the substrate piece can be supported by the coupling member such that the substrate sheets are positioned adjacent to each other. The adjustment member may include a plurality of bolts 2820, a plurality of first nuts 284, a plurality of screws 2850, a plurality of second nuts 2880, and a plurality of bolt covers 2890 and may adjust the relative positions of the substrate pieces relative to the light members. The structure and arrangement of the substrate piece 2810, the bolt 2820, the support portion 2830, and the screw 2850 are substantially the same as those of the substrate piece 2510, the bolt 2520, the support member 253, and the screw 2560 in the twenty-fifth embodiment described in detail with reference to FIGS. 55 and 56. Same on the same. The first nut 2840 can be coupled to the bolt 2820, and thus the support portion 2830 is secured to the substrate piece 2810 by bolts and nuts 2820 and 2840. Depending on the detection conditions and environment, the first nut 284 may not be attached to the detecting device 2800 of the present embodiment. The structure and configuration of the substrate structure 2860 and the connector 2865 are the same as those of the second substrate structure 262 and the connector 2630 of the twenty-sixth embodiment described in detail with reference to FIG. 57 except that the substrate structure 286 includes the through hole 2863, the screw 89 200912348 The bolt 2820 is inserted into the through hole 2863 and has a diameter equal to or greater than the diameter of the bolt 282A. Reinforcing portion 2870 is positioned on substrate structure 2860 and includes an upper through hole 2872 into which the bolt is inserted. The upper through hole 2872 includes a third hole 2872a and a fourth hole 2872b. The third hole 2872a is located at a lower portion of the reinforcing portion 2870, and the fourth hole 2872b is located at an upper portion of the reinforcing portion 2870 and is connected to the third hole 2872a. The diameter of the third hole 2872a is larger than the diameter of the bolt 2820, and the diameter of the fourth hole 2872b is larger than the diameter of the third hole 2872a. A screw thread is formed on the inner surface of the fourth hole 2872b defined by the reinforcing portion 2870. The structure and configuration of the first nut 2880 and the bolt cover 2890 are the same as those of the nut 254 and the bolt cover 2550 in the twenty-fifth embodiment described in detail with reference to FIG. 55 except that the second nut 288 is engaged in the fourth hole 2872b. The head of the bolt 2820 is inserted into the fourth hole 2872b and fixed to the reinforcing portion 2870. Thus, the position of the substrate piece 2810 is adjusted in the vertical and horizontal directions by adjustment of the vertical and horizontal positions of the bolt 2820. Figure 60 is a cross-sectional view showing an electronic detecting device in accordance with a twenty-ninth embodiment of the present invention. Referring to FIG. 60, the electronic detecting device 2900 according to the twenty-ninth embodiment may include a substrate piece 2910, a support member, an adjusting member, a substrate structure 2930, and a connecting member 2940. In one embodiment, the support member can include a reinforcement portion 2950' and the adjustment member can include a plurality of bolts 2920, a plurality of screws 2960, a plurality of nuts 2970 to 200912348, and a plurality of bolt covers 2980. The structure and arrangement of the substrate piece 2910 and the bolt 2920 are substantially the same as those of the substrate piece 2510 and the bolt 2520 in the twenty-fifth embodiment described in detail with reference to Figs. 55 and 56. The structure and arrangement of the substrate structure 2930 and the connector 294 are the same as those of the substrate structure 286 and the connector 2865 in the twenty-eighth embodiment described in detail with reference to Fig. 59 except that the substrate structure 2930 is spaced apart from the substrate sheet 2910. In one embodiment, the reinforcement member 2950 can include a plate 2951 and a column 2952. The floor panel 2951 can be formed into a flat shape and is in contact with the upper surface of the substrate piece 2930. The pillars 2952 protrude from the surface of the plate 2951 and are spaced apart from each other by a column gap distance which is substantially the same as the bolt gap distance between adjacent bolts 2920. For example, the pillar 2952 can have a cylindrical or square cylindrical shape. The reinforcement 2950 can also include a plurality of through holes 2953 that penetrate the plate 2951 and the posts 2952, and the through holes 2953 can include a first hole 2953a and a second hole 2953b. The first hole 2953a is positioned on the plate 2951 and a portion of the column 2952. The second aperture 2953b can be coupled to the first aperture 2953a and positioned over the remainder of the post 2952. The diameter of the first hole 2953a is larger than the diameter of the bolt 2920, and thus the bolt 2920 can be easily inserted into the plate 295 via the first hole 2953a. Further, the bolt 2920 moves relative to the horizontal direction of the support plate 2951 while the bolt 2920 contacts the support. Board 2951. 91 200912348 The diameter of the second hole 2953b is larger than the diameter of the first hole 2953a, and the screw thread is formed on the inner surface of the second hole 2953b defined by the pillar 2952. The reinforcing portion 2950 is fixed to the substrate structure 2930 by a fixing member 2954. Since the substrate structure 2930 is fixed to the reinforcing portion 2950, the substrate structure 2930 can be spaced apart from the substrate piece 2910. The structure and configuration of the screw 2960, the nut 2970, and the bolt cover 2980 may be the same as the screw 2560, the nut 2540, and the bolt cover 2550 of the twenty-fifth embodiment described in detail with reference to FIGS. 55 and 56 except for the screw 296 〇 permeable column The side wall of the 2952 is in contact with the screw 2920 in the first hole 2953a, the nut 2970 can be coupled with the bolt 2920 in the second hole 2953b, and the bolt cover 2980 can be inserted into the second hole 2953b and joined to the column On the 2952. Port Thus, the position of the substrate piece 2910 is adjusted in the vertical and horizontal directions by adjustment of the vertical and horizontal positions of the bolt 2920. Figure 61 is a cross-sectional view of an electronic detecting device in accordance with a thirtieth embodiment of the present invention. Referring to Fig. 61, an electronic detecting device 3A according to a thirtieth embodiment may include a substrate piece 3010, a substrate structure 3030, a support member, and an adjustment member. In one embodiment, the support member includes a reinforcing portion 3040 and can support the substrate sheet 3010 such that the substrate sheets 3010 are disposed adjacent to each other. The adjustment member may include a plurality of bolts 3020, a plurality of screws 3050, a plurality of nuts 3〇6〇, and a plurality of bolt covers 3070 and the position of the substrate piece 3010 relative to the support member may be adjusted. Substrate sheet 3010, screw inspection 3020, substrate structure 3〇3〇, reinforcing portion 3〇40, 92 200912348 • V w W Tailong ^ ▲▲ The structure and arrangement of the screw 3050, the nut 3060, and the bolt cover 3070 can be compared with FIG. The substrate piece 2910, the bolt 2920, the substrate structure 2930, the reinforcing portion 2950, the screw 2960, the nut 2970, and the bolt cover 2980 in the twenty-ninth embodiment described in detail are the same except that the substrate piece 3010 can directly contact the substrate structure 3030. Figure 62 is a cross-sectional view of an electronic detecting device in accordance with a thirty-first embodiment of the present invention. Referring to Fig. 62', the electronic detecting device 31' according to the thirty-first embodiment may include a substrate piece 3110, a substrate structure 3150, a connecting member 3155, a coupling member, and an adjusting member. In one embodiment, the coupling member includes a support portion 3120 and a reinforcing portion 3160, and the substrate piece 3110 is supported by the coupling member such that the substrate sheets 3110 are positioned adjacent to each other. The adjustment member may include a plurality of bolts 313, a plurality of first nuts 3140, a plurality of screws 3170, a plurality of second nuts 3180, and a plurality of screw caps 3190 and may adjust the relative positions of the substrate sheets 3110 relative to the coupling members. The structure and arrangement of the substrate piece 3110, the substrate structure 3150, the connecting member 3155, the reinforcing portion v 3160, the screw 3170, the second nut 3180, and the bolt cover 3190 are the substrate piece 2910 of the twenty-ninth embodiment described in detail with reference to FIG. The substrate structure 2930, the connector 2940, the reinforcing portion 2950, the screw 2960, the nut 2970, and the bolt cover 298 are the same. The structure and configuration of the branch portion 3120 and the first nut 3140 are substantially the same as those of the support portion and the first nut 2840 in the twenty-eighth embodiment described in detail with reference to FIG. 59 except that the support portion 312 includes only the columnar shape The opening 3123 of the object 3122 replaces the through hole and is fixed to the base 93 200912348 plate 3110 by a fixing member 3124. The substrate sheets 3110 can be fixed to each other by bolts 3130 such that the bolts 3130 are inserted into the openings 3123 of the support portions 3120. That is, the bolt 3123 is not inserted into the substrate piece 3110. The bolt 3123 is attached to the substrate piece 3110 by a bonding agent such as an adhesive. Further, the thread check 3130 may be formed integrally with the support portion 3120. The first nut 3140 can be fixed to both the bolt 313 〇 and the support portion 312 。. Since the substrate piece 3110 is fixed to the support portion 3120 and the support portion 312 is fixed to the bolt 3130, the substrate piece 3110, the support portion 3120, and the bolt 3130 are fixed to each other. Therefore, the position of the substrate piece 311 is adjusted in the vertical and horizontal directions by the adjustment of the vertical and horizontal positions of the bolt 313. Figure 63 is a flow chart showing the steps of assembling the electronic detecting device 2500 shown in Figures 55 and 62. The electronic detecting device disclosed in Figs. 55 to 62 has a similar structure and configuration, and thus the assembling method of the electronic detecting device will be described below based on the device 2500 disclosed in Figs. 55 to 56. Referring to Fig. 63, a bolt 2520 fixed to the substrate piece 2510 can be inserted into the through hole 2536 of the support member 2530 (step S510). The nut 2540 is engaged with the head of the bolt 2520 in the through hole 2536 (step S520). The support member 2530 and the substrate piece 2510 are fixed to each other by the joint bolts and nuts 252 and 254. The screw 2560 can be screwed inwardly through the support column 2534 (step S53). In one embodiment, the screw 2560 is threaded through the first hole 2536a on the side 94 200912348 of the support post 2534 and thus in contact with the bolt in the through hole 2536. In the present embodiment, four screws are screwed through the support post 2534. The position of the substrate piece 251 is adjusted by tightening and loosening the screw 256 〇 in a direction perpendicular and parallel to the upper surface of the substrate 251 ( (step s54 〇). The position of the bolt 252G can be adjusted in a horizontal direction parallel to the upper surface of the branch floor plus the screw 2560 which is screwed or loosened in contact with the branch column in the through hole 2536. Since the bolt 252() is fixed to the substrate piece = 10, the horizontal adjustment of the bolt 2520 causes horizontal adjustment of the substrate piece 251. The nut 2540 can be coupled to the bolt 2520 in the second bore 2536b, and the outer diameter of the nut 2540 is greater than the diameter of the first bore 253 and smaller than the diameter of the second bore 2536b. Therefore, 'tightening and loosening the nut 254 〇 allows the bolt 252 上下 to move up and down in the vertical direction with respect to the support plate 2532, and the substrate piece 251 is 垂直 in the vertical direction due to the movement of the substrate piece 2510 fixed to the bolt 2520'. mobile. That is, the position of the substrate piece 2510 is adjusted by tightening and loosening the nut 2540 in the vertical direction (step S55). Bolt cover 2550 can be inserted into second aperture 2536b and joined to support post 2534. The bolt cover 2550 applies pressure to the head of the bolt 2520 and maintains the adjusted vertical position of the bolt 2520 and the substrate piece 2510. That is, the adjustment position of the substrate piece 2510 is prevented from being changed by the bolt cover 2550, whereby the adjustment position of the substrate piece 2510 is fixed (step S560). According to an embodiment of the present invention, the substrate sheets are supported such that the substrate sheets are disposed adjacent to each other in the frame, and thus the substrate sheets are formed into a large substrate. Adjust the gap distance between the shelves of 200912348 by adjusting the screws in the direction perpendicular and parallel to the upper surface of the substrate. Therefore, in the horizontal and vertical directions, a large substrate such as an electronic detecting device. The flat direction is adjusted to be mounted on the substrate sheet, and the gap distance between the vertical and the support strip between the water and the frame and the substrate are desired. However, the present invention has been disclosed in the above embodiments, but it is not used. It is stated that within the scope of any technical technology, if it can be used without distinction, the scope defined by the scope is the scope of protection of the invention. [Simple diagram of the diagram] Figure. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view of an electronic detecting device according to a first embodiment of the present invention. . Cross section of the wire Α-Α of the electronic detecting device which is not shown in Fig. 1 Fig. 3 is a perspective view of the frame shown in Fig. 1. ®54 ί: A modified perspective view of the frame shown in 1. Plan view of the substrate sheet in the electronic detecting device shown in the phase 1. The substrate sheet in the electronic detecting device shown in FIG. 2 is a plan view of the electronic detecting device according to the second embodiment of the present invention. 8 is a cross-sectional view of the line of the electronic device shown in 圏7, 96 200912348. Figure 9 is a plan view of an electronic detecting device in accordance with a third embodiment of the present invention. Figure 10 is a cross-sectional view along line C-C' of the electronic detecting device shown in Figure 9 . Figure 11 is a plan view of an electronic detecting device in accordance with a fourth embodiment of the present invention. Figure 12 is a cross-sectional view along line D-D' of the electronic detecting device shown in Figure 11 . Figure 13 is a plan view of an electronic detecting device in accordance with a fifth embodiment of the present invention. Figure 14 is a cross-sectional view along line E-E' of the electronic detecting device shown in Figure 13 . Figure 15 is a plan view of an electronic detecting device in accordance with a sixth embodiment of the present invention. Figure 16 is a cross-sectional view along line F-F' of the electronic detecting device shown in Figure 15 . Figure 17 is a plan view of an electronic detecting device in accordance with a seventh embodiment of the present invention. Figure 18 is a cross-sectional view along line G-G' of the electronic detecting device shown in Figure 17 . Figure 19 is a cross-sectional view of an electronic detecting device in accordance with an eighth embodiment of the present invention. Figure 20 is a cross-sectional view of an electronic detecting device according to a ninth embodiment of the present invention.
截面圖。 圖21是根據本發明第十實施例的電子檢測裝置的橫 截面圖。 圖22是根據本發明第十一實施例的電子檢測裝置的 橫截面圖。 圖23是根據本發明第十二實施例的電子檢測裝置的 橫截面圖。 圖24是根據本發明第十三實施例的電子檢測裝置的 橫截面圖。 圖25是根據本發明第十四實施例的電子檢測裝置的 橫截面圖。 圖26繪示圖1至圖18所示之電子檢測裝置的組裝方 法的製程步驟的流程圖。 圖27繪示圖19至圖25所示之電子檢測裝置的組裝 方法的製程步驟的流程圖。 圖28是根據本發明第十五實施例的電子檢測裝置的 平面圖。 圖29是沿圖28的線H-H’的橫截面圖。 圖30是沿圖28的線Ι-Γ的橫截面圖。 圖31是圖28所不的基板片的平面圖。 圖32是沿圖31所示的基板片之線J-Γ的橫截面圖。 圖33是繪示圖28所示之電子檢測裝置的框架的透視 圖。 圖34是基板片調節後之圖28至圖32所示的電子檢 98 200912348 測裝置的平面圖。 圖35是圖34所示的電子檢測裝置的橫截面圖。 圖36是根據本發明第十六實施例的電子檢測裝置的 平面圖。 圖37是沿圖36所示的檢測裝置之線K-K’的橫截面 圖。 圖38是繪示圖36所示之電子檢測裝置的框架的透視 圖。 圖39是根據本發明第十七實施例的電子檢測裝置的 平面圖。 圖40是沿圖39所示的檢測裝置之線L-L’的橫截面 圖。 圖41是根據本發明第十八實施例的電子檢測裝置的 平面圖。 圖42是沿圖41所示的檢測裝置之線M-M’的橫截面 圖。 圖43是圖41所示的電子檢測裝置的基板片的平面 圖。 圖44是沿圖43的線N-N’的橫截面圖。 圖45是根據本發明第十九實施例的電子檢測裝置的 平面圖。 圖46是沿圖45所示的檢測裝置之線0-0’的橫截面 圖。 圖47是根據本發明第二十實施例的電子檢測裝置的 99 200912348 橫截面圖。 圖48是根據本發明第二十一實施例的電子檢測裝置 的橫截面圖。 圖49是根據本發明第二十二實施例的電子檢測裝置 的橫截面圖。 圖50是根據本發明第二十三實施例的電子檢測裝置 的橫截面圖。 圖51是根據本發明第二十四實施例的電子檢測裝置 的橫截面圖。 圖52繪示圖28至圖46所示之電子檢測裝置之組裝 方法的製程步驟的流程圖。 圖53A至圖53E是繪示與圖52所示之製程步驟對應 的電子檢測裝置的平面圖。 圖54繪示圖47至圖51所示之電子檢測裝置之組裝 方法的製程步驟的流程圖。 圖55是根據本發明第二十五實施例的電子檢測裝置 的平面圖。 圖56是沿圖55的線P-P’的橫截面圖。 圖57是根據本發明第二十六實施例的電子檢測裝置 的平面圖。 圖58是根據本發明第二十七實施例的電子檢測裝置 的橫截面圖。 圖59是根據本發明第二十八實施例的電子檢測裝置 的橫截面圖。 100 200912348 圖60是根據本發明第二十九實施例的電子檢測裝置 的橫截面圖。 圖61是根據本發明第三十實施例的電子檢測裝置的 橫截面圖。 圖62是根據本發明第三十一實施例的電子檢測裝置 的橫截面圖。 圖63是繪示組裝圖55和圖62所示之電子檢測裝置 2500的製程步驟的流程圖。 【主要元件符號說明】 100 :電子檢測裝置 Π0 :基板片 112 :探針 120 :框架 122 :第一子框架 124 :第二子框架 130 :調節螺絲 132 :第一螺絲 132a :第一牽引螺絲 132b :第一推動螺絲 134 :第二螺絲 134a :第二牽引螺絲 134b:第二推動螺絲 140 :插入件 142 :第·一插入部 101 200912348 144 ： 第二插入部 200 ： 電子檢測裝置 210 ： 基板片 220 ： 框架 222 ： 第一子框架 230 ： 調節螺絲 232 ： 第一螺絲 240 ： 插入件 300 ： 電子檢測裝置 310 ： 基板片 312 ： 探針 320 ： 框架 330 : 調節螺絲 340 ： 插入件 400 ： 電子檢測裝置 410 ： 基板片 420 : 框架 422 ： 第一子框架 424 ： 第二子框架 430 ： 調節螺絲 432 ： 第一螺絲 432a :第一牽引螺絲 434 ： 第二螺絲 434a :第二牽引螺絲 200912348 440 插入件 450 補強件 452 第一補強部 454 第二補強部 500 電子檢測裝置 510 基板片 512 主體 514 輔助件 515 探針 520 框架 530 調節螺絲 540 插入件 600 電子檢測裝置 610 基板片 620 框架 622 第一子框架 624 第二子框架 630 調節螺絲 632 第一螺絲 634 第二螺絲 640 插入件 642 第一插入部 644 第二插入部 710 基板片 200912348 712 :探針 720 :單元框架 722 :第一子框架 724 :第二子框架 726 :突起 728 :凹陷 730 :調節螺絲 740 :插入件 800 :電子檢測裝置 810 :第一基板結構 820 :第二基板結構 822 :連接孔 824 :導電層 830 :連接件 832 :第一端部 834 :第二部份 840 ·耗接件 841 :第一補強件 842 ··第二補強件 844:彈簧片 845 :第一螺栓 846 :第二螺栓 847 :第三螺栓 850 :平面度控制器 200912348 900 :電子檢測裝置 910 :第一基板結構 920 :第二基板結構 930 :耦接件 931 :補強件 932 :螺栓 1000 :電子檢測裝置 1010 :第一基板結構 1020 :第二基板結構 1100 :電子檢測裝置 1110 :第一基板結構 1120 :第二基板結構 1122 :連接孔 1124 :導電層 1130 :第三基板結構 1132 :基板 1134 :支撐件 1140 :第一連接件 1142:第一端部 1144 :第二端部 1150:第二連接件 1152 :第一端部 1154:第二端部 1160 ·搞接件 200912348 1161 1162 1163 1164 1165 1166 1167 1168 1169 1170 1200 1210 1220 1230 1232 1234 1240 1250 1251 1252 1254 1255 1256 1257 第一補強件 第二補強件 第三補強件 彈簧片 第一螺栓 第二螺栓 第三螺栓 第四螺栓 第五螺栓 平面度控制器 電子檢測裝置 第一基板結構 第二基板結構 第三基板結構 基板 支撐件 連接件 耦接件 第一補強件 第二補強件 彈簧片 第一螺栓 第二螺栓 第三螺栓 200912348 1258 第四螺栓 1260 平面度控制器 1300 電子檢測裝置 1310 第一基板結構 1320 第二基板結構 1330 第三基板結構 1340 第一連接件 1350 第二連接件 1360 耦接件 1370 平面度控制器 1400 電子檢測裝置 1410 第一基板結構 1420 第二基板結構 1430 第三基板結構 1440 連接件 1450 搞接件 1460 平面度控制器 1500 電子檢測裝置 1510 基板片 1512 探針 1520 框架 1522 第一子框架 1524' 第二子框架 1530 支撐條 200912348 1532 :第一條狀物 1534 :第二條狀物 1540 :調節螺絲 1542 :第一調節螺絲 1542a :第一牽引螺絲 1542b :第一推動螺絲 1544 :第二調節螺絲 1544a :第二牽引螺絲 1544b :第二推動螺絲 1550 :耦接件 1560 :插入件 1562 :第一插入部 1564 :第二插入部 1570 :補強件 1572 :第一補強部 1574 :第二補強部 1600 :電子檢測裝置 1610 :基板片 1620 :框架 1622 :第一框架 1624 :第二子框架 1630 :支撐條 1634 :第二條狀物 1640 :調節螺絲 108 200912348 1650 :耦接件 1652 :第一固定螺絲 1654 :第二固定螺絲 1654a :第三牽引螺絲 1654b :第三推動螺絲 1660 :插入件 1670 :補強件 1672 :第一補強部 1674 :第二補強部 1700 :電子檢測裝置 1710 :基板片 1720 :框架 1730 :支撐條 1734 :第二條狀物 1740 :調節螺絲 1750 :耦接件 1752 :第一固定螺絲 1760 :插入件 1770 :補強件 1772 :第一補強部 1774 ·•第二補強部 1776 :第三補強部 1800 :電子檢測裝置 1810 :基板片 200912348 1812 ： 1812a 1812b 1814 ： 1815 ： 1820 ： 1830 ： 1840 ： 1850 ： 1860 ： 1900 : 1910 ： 1920 ： 1930 ： 1932 ： 1934 ： 1940 ： 1942 ： 1944 ： 1950 ： 1960 : 1970 : 2000 ： 2010 ： 主體 :第一主體 :第二主體 輔助件 探針 框架 支撐條 調節螺絲 搞接件 插入件 電子檢測裝置 基板片 框架 支撐條 第一條狀物 第二條狀物 調節螺絲 第一螺絲 第二螺絲 輛接件 插入件 補強件 電子檢測裝置 第一基板結構 200912348 2020 第二基板結構 2022 連接孔 2024 導電層 2030 連接件 2032 第一端部 2034 第二部份 2040 輛接件 2041 第一補強件 2042 第二補強件 2044 彈簧片 2045 第一螺栓 2046 第二螺栓 2047 第三螺栓 2050 平面度控制器 2100 電子檢測裝 2110 第一基板結構 2120 第二基板結構 2130 搞接件 2131 補強板 2132 螺栓 2200 電子檢測裝置 2210 第一基板結構 2220 第二基板結構 2300 電子檢測裝置 200912348 2310 第一基板結構 2320 第二基板結構 2322 連接孔 2324 導電層 2330 第三基板結構 2332 基板 2334 支撐件 2340 第一連接件 2342 第一端部 2350 第二連接件 2352 第一端部 2354 第二端部 2360 耦接件 2361 第一補強件 2362 第二補強件 2363 第三補強件 2364 彈簧片 2365 第一螺栓 2366 第二螺栓 2367 第三螺栓 2368 第四螺栓 2369 第五螺栓 2370 平面度控制器 2400 電子檢測裝置 112 200912348 2410 ： 第一基板結構 2420 ： 第二基板結構 2430 ： 第三基板結構 2432 ： 基板 2434 ： 框架 2440 : 連接件 2450 ： 库馬接件 2451 ： 第一補強件 2452 ： 第二補強件 2454 ： 彈簧片 2455 ： 第一螺栓 2456 ： 第二螺栓 2457 ： 第三螺栓 2458 ： 第四螺栓 2460 ： 平面度控制器 2500 ： 電子檢測裝置 2510 ： 基板片 2512 ： 探針 2520 ： 螺栓 2530 ： 支撐件 2532 ： 支撐板 2534 ： 支樓柱 2536 ： 貫孔 2536a :第一孔 200912348 2536b :第二孔 2540 :螺母 2550 :螺栓蓋 2560 :螺絲 2600 :電子檢測裝置 2610 :第一基板結構 2620 :第二基板結構 2622 :連接孔 2624 :導電層 2630 :連接件 2632 :第一端部 2634 :第二部份 2640 :耦接件 2641 :第一補強件 2642 :第二補強件 2644:彈簧片 2645 :第一螺栓 2646 :彈簧片 2647 :第三螺栓 2650 :平面度控制器 2700 :電子檢測裝置 2710 :第一基板結構 2720 :第三基板結構 2722 :連接孔 200912348 2724 :導電層 2730 :第三基板結構 2732 :基板 2734 :框架 2740 :第一連接件 2742 :第一端部 2744:第二端部 2750 :第二連接件 2752 :第一端部 2754 :第二端部 2760 :耦接件 2761 :第一補強件 2762 :第二補強件 2763 :第三補強件 2764 :彈簧片 2765 :第一螺栓 2766:第二螺栓 2767 :第三螺栓 2768 ··第四螺栓 2769 :第五螺栓 2770 :平面度控制器 2800 :電子檢測裝置 2810 :基板片 2820 :螺栓 200912348 2830 :支撐部 2840 :第一螺母 2850 :螺絲 2860 :基板結構 2863 :貫孔 2865 ··連接件 2870 :補強部 2872 :上貫孔 2872a :第三孔 2872b :第四孔 2880 :第二螺母 2890 :螺栓蓋 2900 :電子檢測裝置 2910 :基板片 2920 :螺栓 2930 :基板結構 2950 :補強部 2951 :板狀物 2952 :柱狀物 2953 :貫孔 2953a :第一孔 2953b :第二孔 2954 :固定件 2960 :螺絲 200912348 2970 :螺母 2980 :螺栓蓋 3000 :電子檢測裝置 3010 :基板片 3020 :螺栓 3030 :基板結構 3040 :補強部 3050:螺絲 3060 :螺母 3070 :螺栓蓋 3100 :電子檢測裝置 3110 :基板片 3120 :支撐部 3122 :柱狀物 3123 :開口 3124 :固定件 3130 :螺栓 3140 :第一螺母 3150 :基板結構 3155 :連接件 3160 :耦接件 3170 :螺絲 3180:第二螺母 A-A’ ：線 117 200912348 B-B， :線 C-C， :線 D-D， :線 Ε·Ε， :線 F-F， 線 G-G， :線 H-H， :線 Ι-Γ ： 線 J-J，： 線 K-K5 :線 L-L， :線 M-M， :線 N-N， :線 0_0, :線 P-P， 線 S110。 -S130 步驟 S21(l· -S230 步驟 S310, ‘S370 步驟 S410-S430 步驟 S510〜S560 步驟Sectional view. Figure 21 is a cross-sectional view of an electronic detecting device in accordance with a tenth embodiment of the present invention. Figure 22 is a cross-sectional view of an electronic detecting device in accordance with an eleventh embodiment of the present invention. Figure 23 is a cross-sectional view showing an electronic detecting device in accordance with a twelfth embodiment of the present invention. Figure 24 is a cross-sectional view showing an electronic detecting device in accordance with a thirteenth embodiment of the present invention. Figure 25 is a cross-sectional view showing an electronic detecting device in accordance with a fourteenth embodiment of the present invention. Figure 26 is a flow chart showing the process steps of the assembly method of the electronic detecting device shown in Figures 1 through 18. Figure 27 is a flow chart showing the process steps of the assembly method of the electronic detecting device shown in Figures 19 through 25. Figure 28 is a plan view showing an electronic detecting device in accordance with a fifteenth embodiment of the present invention. Figure 29 is a cross-sectional view taken along line H-H' of Figure 28. Figure 30 is a cross-sectional view taken along line Ι-Γ of Figure 28. Figure 31 is a plan view of the substrate piece shown in Figure 28. Figure 32 is a cross-sectional view along line J-Γ of the substrate piece shown in Figure 31. Figure 33 is a perspective view showing the frame of the electronic detecting device shown in Figure 28. Figure 34 is a plan view showing the electronic test 98 200912348 measuring device shown in Figures 28 to 32 after the substrate sheet is adjusted. Figure 35 is a cross-sectional view of the electronic detecting device shown in Figure 34. Figure 36 is a plan view showing an electronic detecting device in accordance with a sixteenth embodiment of the present invention. Figure 37 is a cross-sectional view along line K-K' of the detecting device shown in Figure 36. Figure 38 is a perspective view showing the frame of the electronic detecting device shown in Figure 36. Figure 39 is a plan view showing an electronic detecting device in accordance with a seventeenth embodiment of the present invention. Figure 40 is a cross-sectional view along line L-L' of the detecting device shown in Figure 39. Figure 41 is a plan view showing an electronic detecting device in accordance with an eighteenth embodiment of the present invention. Figure 42 is a cross-sectional view along line M-M' of the detecting device shown in Figure 41. Figure 43 is a plan view showing a substrate piece of the electronic detecting device shown in Figure 41. Figure 44 is a cross-sectional view taken along line N-N' of Figure 43. Figure 45 is a plan view showing an electron detecting apparatus according to a nineteenth embodiment of the present invention. Figure 46 is a cross-sectional view along line 0-0' of the detecting device shown in Figure 45. Figure 47 is a cross-sectional view of 99 200912348 of an electronic detecting device in accordance with a twentieth embodiment of the present invention. Figure 48 is a cross-sectional view showing an electronic detecting device in accordance with a twenty-first embodiment of the present invention. Figure 49 is a cross-sectional view showing an electronic detecting device in accordance with a twenty-second embodiment of the present invention. Figure 50 is a cross-sectional view showing an electronic detecting device in accordance with a twenty-third embodiment of the present invention. Figure 51 is a cross-sectional view of an electronic detecting device in accordance with a twenty-fourth embodiment of the present invention. Figure 52 is a flow chart showing the manufacturing steps of the assembling method of the electronic detecting device shown in Figures 28 to 46. 53A to 53E are plan views showing the electronic detecting device corresponding to the process steps shown in Fig. 52. Figure 54 is a flow chart showing the manufacturing steps of the assembling method of the electronic detecting device shown in Figures 47 to 51. Figure 55 is a plan view of an electronic detecting device in accordance with a twenty-fifth embodiment of the present invention. Figure 56 is a cross-sectional view along line P-P' of Figure 55. Figure 57 is a plan view showing an electronic detecting device in accordance with a twenty-sixth embodiment of the present invention. Figure 58 is a cross-sectional view of an electronic detecting device in accordance with a twenty-seventh embodiment of the present invention. Figure 59 is a cross-sectional view showing an electronic detecting device in accordance with a twenty-eighth embodiment of the present invention. 100 200912348 Figure 60 is a cross-sectional view of an electronic detecting device in accordance with a twenty-ninth embodiment of the present invention. Figure 61 is a cross-sectional view of an electronic detecting device in accordance with a thirtieth embodiment of the present invention. Figure 62 is a cross-sectional view of an electronic detecting device in accordance with a thirty-first embodiment of the present invention. Figure 63 is a flow chart showing the process steps of assembling the electronic detecting device 2500 shown in Figures 55 and 62. [Description of main component symbols] 100: electronic detecting device Π 0 : substrate piece 112 : probe 120 : frame 122 : first sub-frame 124 : second sub-frame 130 : adjusting screw 132 : first screw 132 a : first pulling screw 132 b : first push screw 134 : second screw 134a : second pull screw 134b : second push screw 140 : insert 142 : first insertion portion 101 200912348 144 : second insertion portion 200 : electronic detection device 210 : substrate piece 220 : Frame 222 : First sub-frame 230 : Adjustment screw 232 : First screw 240 : Insert 300 : Electronic detection device 310 : Substrate sheet 312 : Probe 320 : Frame 330 : Adjustment screw 340 : Insert 400 : Electronic detection Device 410: substrate piece 420: frame 422: first sub-frame 424: second sub-frame 430: adjustment screw 432: first screw 432a: first traction screw 434: second screw 434a: second traction screw 200912348 440 insert 450 reinforcing member 452 first reinforcing portion 454 second reinforcing portion 500 electronic detecting device 510 substrate piece 512 main body 514 Auxiliary 515 Probe 520 Frame 530 Adjustment screw 540 Insert 600 Electronic detection device 610 Substrate sheet 620 Frame 622 First sub-frame 624 Second sub-frame 630 Adjustment screw 632 First screw 634 Second screw 640 Insert 642 First insertion Portion 644 second insertion portion 710 substrate piece 200912348 712: probe 720: unit frame 722: first sub-frame 724: second sub-frame 726: protrusion 728: recess 730: adjustment screw 740: insert 800: electronic detection device 810 : first substrate structure 820 : second substrate structure 822 : connection hole 824 : conductive layer 830 : connector 832 : first end portion 834 : second portion 840 · consumable member 841 : first reinforcement member 842 · · Two reinforcing members 844: spring pieces 845: first bolts 846: second bolts 847: third bolts 850: flatness controller 200912348 900: electronic detecting device 910: first substrate structure 920: second substrate structure 930: coupling 931: reinforcing member 932: bolt 1000: electronic detecting device 1010: first substrate structure 1020: second substrate structure 1100: electronic detecting device 1110: first substrate structure 1120: second substrate 1122: connection hole 1124: conductive layer 1130: third substrate structure 1132: substrate 1134: support 1140: first connector 1142: first end 1144: second end 1150: second connector 1152: first End 1154: second end 1160 · Engagement 200912348 1161 1162 1163 1164 1165 1166 1167 1168 1169 1170 1200 1210 1220 1230 1232 1234 1240 1250 1251 1252 1254 1255 1256 1257 First reinforcement second reinforcement third reinforcement Spring plate first bolt second bolt third bolt fourth bolt fifth bolt flatness controller electronic detecting device first substrate structure second substrate structure third substrate structure substrate support member coupling member first reinforcing member second Reinforcing member spring piece first bolt second bolt third bolt 200912348 1258 fourth bolt 1260 flatness controller 1300 electronic detecting device 1310 first substrate structure 1320 second substrate structure 1330 third substrate structure 1340 first connecting member 1350 second Connector 1360 coupling 1370 flatness controller 1400 electronic detection device 1410 first substrate structure 1420 second substrate junction Structure 1430 Third substrate structure 1440 Connector 1450 Engagement member 1460 Flatness controller 1500 Electronic detection device 1510 Substrate sheet 1512 Probe 1520 Frame 1522 First sub-frame 1524' Second sub-frame 1530 Support strip 200912348 1532: First 1534: second strip 1540: adjusting screw 1542: first adjusting screw 1542a: first pulling screw 1542b: first pushing screw 1544: second adjusting screw 1544a: second pulling screw 1544b: second pushing screw 1550 : coupling member 1560 : insert 1562 : first insertion portion 1564 : second insertion portion 1570 : reinforcement member 1572 : first reinforcement portion 1574 : second reinforcement portion 1600 : electronic detection device 1610 : substrate piece 1620 : frame 1622 : First frame 1624: second sub-frame 1630: support bar 1634: second strip 1640: adjustment screw 108 200912348 1650: coupling piece 1652: first fixing screw 1654: second fixing screw 1654a: third pulling screw 1654b : third push screw 1660 : insert 1670 : reinforcing member 1672 : first reinforcing portion 1674 : second reinforcing portion 1700 : electronic detecting device 1710 : substrate piece 1720 : frame 1730 : branch Strut 1734: second strip 1740: adjusting screw 1750: coupling member 1752: first fixing screw 1760: insert 1770: reinforcing member 1772: first reinforcing portion 1774 · second reinforcing portion 1776: third reinforcing Part 1800 : electronic detecting device 1810 : substrate piece 200912348 1812 : 1812a 1812b 1814 : 1815 : 1820 : 1830 : 1840 : 1850 : 1860 : 1900 : 1910 : 1920 : 1930 : 1932 : 1934 : 1940 : 1942 : 1944 : 1950 : 1960 : 1970 : 2000 : 2010 : Main body : First main body : Second main body auxiliary part Probe frame support bar Adjustment screw Engagement insert Electronic detection device Substrate sheet frame Support strip First strip Second strip adjustment screw First Screw Second Screw Connector Insert Reinforcement Electronic Detection Device First Substrate Structure 200912348 2020 Second Substrate Structure 2022 Connection Hole 2024 Conductive Layer 2030 Connector 2032 First End 2034 Second Part 2040 Car Connector 2041 First reinforcing member 2042 second reinforcing member 2044 spring piece 2045 first bolt 2046 second bolt 2047 third bolt 2050 plane Controller 2100 electronic detecting device 2110 first substrate structure 2120 second substrate structure 2130 engaging member 2131 reinforcing plate 2132 bolt 2200 electronic detecting device 2210 first substrate structure 2220 second substrate structure 2300 electronic detecting device 200912348 2310 first substrate structure 2320 Second substrate structure 2322 connection hole 2324 conductive layer 2330 third substrate structure 2332 substrate 2334 support 2340 first connector 2342 first end 2350 second connector 2352 first end 2354 second end 2360 coupling 2361 First reinforcing member 2362 Second reinforcing member 2363 Third reinforcing member 2364 Spring piece 2365 First bolt 2366 Second bolt 2367 Third bolt 2368 Fourth bolt 2369 Fifth bolt 2370 Flatness controller 2400 Electronic detecting device 112 200912348 2410 : First substrate structure 2420 : second substrate structure 2430 : third substrate structure 2432 : substrate 2434 : frame 2440 : connecting member 2450 : Kuma connector 2451 : first reinforcing member 2452 : second reinforcing member 2454 : spring piece 2455 : First bolt 2456 : number Two bolts 2457 : Third bolt 2458 : Fourth bolt 2460 : Flatness controller 2500 : Electronic detection device 2510 : Substrate sheet 2512 : Probe 2520 : Bolt 2530 : Support 2532 : Support plate 2534 : Branch column 2536 : Through Hole 2536a: first hole 200912348 2536b: second hole 2540: nut 2550: bolt cover 2560: screw 2600: electronic detecting device 2610: first substrate structure 2620: second substrate structure 2622: connecting hole 2624: conductive layer 2630: connection 2632: first end 2634: second part 2640: coupling piece 2641: first reinforcing piece 2642: second reinforcing piece 2644: spring piece 2645: first bolt 2646: spring piece 2647: third bolt 2650: Flatness controller 2700: electronic detection device 2710: first substrate structure 2720: third substrate structure 2722: connection hole 200912348 2724: conductive layer 2730: third substrate structure 2732: substrate 2734: frame 2740: first connector 2742: First end portion 2744: second end portion 2750: second connecting member 2752: first end portion 2754: second end portion 2760: coupling member 2761: first reinforcing member 2762: second reinforcing member 2763: Third reinforcing member 2764: spring piece 2765: first bolt 2766: second bolt 2767: third bolt 2768 · fourth bolt 2769: fifth bolt 2770: flatness controller 2800: electronic detecting device 2810: substrate piece 2820 : Bolt 200912348 2830 : Support portion 2840 : First nut 2850 : Screw 2860 : Substrate structure 2863 : Through hole 2865 · Connection piece 2870 : Reinforcing portion 2872 : Upper through hole 2872a : Third hole 2872b : Fourth hole 2880 : Two nuts 2890: bolt cover 2900: electronic detecting device 2910: substrate piece 2920: bolt 2930: substrate structure 2950: reinforcing portion 2951: plate 2952: column 2953: through hole 2953a: first hole 2953b: second hole 2954: fixing member 2960: screw 200912348 2970: nut 2980: bolt cover 3000: electronic detecting device 3010: substrate piece 3020: bolt 3030: substrate structure 3040: reinforcing portion 3050: screw 3060: nut 3070: bolt cover 3100: electronic detecting device 3110: substrate piece 3120: support portion 3122: pillar 3123: opening 3124: fixing member 3130: bolt 3140: first nut 3150: substrate structure 3155: connecting member 3160: coupling member 3170: screw 3180: second nut A-A': Line 117 200912348 BB, : Line CC, : Line DD, : Line Ε·Ε, : Line FF, Line GG, : Line HH, : Line Ι-Γ : Line JJ,: Line K-K5 : Line LL, : line MM, : line NN, : line 0_0, : line PP, line S110. -S130 Step S21 (l·-S230 Step S310, ‘S370 Step S410-S430 Step S510~S560 Step