TW200908194A - Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device - Google Patents

Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device Download PDF

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Publication number
TW200908194A
TW200908194A TW097113468A TW97113468A TW200908194A TW 200908194 A TW200908194 A TW 200908194A TW 097113468 A TW097113468 A TW 097113468A TW 97113468 A TW97113468 A TW 97113468A TW 200908194 A TW200908194 A TW 200908194A
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Taiwan
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distance
adsorption
moving
transported
movement
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TW097113468A
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Chinese (zh)
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TWI395283B (en
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Akihiko Ito
Akihisa Suda
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Advantest Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A device carrier (310) has :an adsorption head (320) which adsorbs and holds an IC device; a vacuum pressure sensor (330) which detects the presence/absence of adsorption of the IC device by the adsorption head (320); an actuator (318a) which moves the adsorption head (320); and a controller (340) which controls the movement operation of the adsorption head (320). The controller (340) controls the actuator (318a) to move the adsorption head (320) depending on the result of detection by the vacuum pressure sensor (330), or sets the distance between the position (A) of starting movement and the position of the adsorption head (320) after moved to be an optimal distance.

Description

200908194 九、發明說明: 【發明所屬之技術領域】 本毛明係有關於在測試在半導體晶圓、半導體晶元以 及=刷電路板等所形成之積體電路等的電路(以下亦代表 性&為ic元件)之電子元件測試裝置内取放ie元件的元件 搬運裝置、包括該裝置之電子元件測試裝置、以及在元件 搬運裝置使吸附頭的上下動距離變成最佳值之最佳距離的 【先前技術】 在Ic兀件的製程,為了測試在已封裝之狀態的1C元 七:11肊或功能而使用電子元件測試裝置。藉由將收容測 試前之IC元件或需要再測試的1C元件之托盤(以下稱為訂 製托盤)搬入電子元件測試裝置内,而將IC元件搬入電子 元件測試裝置内。 一般利用以吸附頭吸附保持1C元件並搬運的元件搬 運裝置,將被搬入裝置内之訂製托盤所收容的Ic元件換裝 於在電子it件測試裝置内被循環搬運的托盤(以下稱為= 依此方式被收容於測試用托盤的IC元件, π电于7〇件 測試裝置内被施加高溫或低溫的熱應力後,藉由和測 的接觸部以電氣式接觸而被測試。 1 、 在IC 70件之測試結束後,利用元件搬運裝置將測軾A 了之IC兀件從已裝載IC元件之測試用托盤換裝於因應:200908194 IX. Description of the Invention: [Technical Fields of the Invention] The present invention relates to a circuit for testing an integrated circuit formed on a semiconductor wafer, a semiconductor wafer, and a brush circuit board (hereinafter also representative & a component handling device for picking and placing an IE component in an electronic component testing device of the ic device, an electronic component testing device including the device, and an optimum distance for the component handling device to make the up and down distance of the adsorption head an optimum value [Prior Art] In the process of the Ic component, an electronic component test device is used in order to test the 1C element seven: 11 肊 or function in the packaged state. The IC component is carried into the electronic component testing device by loading the IC component before the test or the tray of the 1C component to be retested (hereinafter referred to as a custom tray) into the electronic component testing device. In general, the Ic component housed in the custom tray carried in the loading device is replaced with a tray that is transported in the electronic component testing device by a component conveying device that sucks and holds the 1C component by the adsorption head (hereinafter referred to as = The IC component housed in the test tray in this manner is subjected to high-temperature or low-temperature thermal stress in a 7-piece test device, and is then electrically contacted by the contact portion to be tested. After the test of the IC 70 is completed, the IC device of the test A is replaced with the test tray of the loaded IC component by the component handling device.

2247-9575-PF 5 200908194 測試結果的訂製托盤,並分類成良品或不良品的種類。 在這種電子元件測試裝置,關於在ic元件的吸附動作 之吸附頭的上下動之最佳距離的設定’例如在電子元件測 試裝置之一般運轉的開始前之IC元件的種類切換時,或維 修時等進行。 以往,使用模仿已收容1C元件之托盤的假托盤進行吸 附頭之上下動的最佳距離之設定。即,作業員藉由以目視 , 確認針盤指示量規等的刻度,而量測吸附頭至和假托盤抵 ' 接的距離,再以人工作業輸入所量測的值,而進行最佳距 離的設定。 可是,這種藉人工作業之最佳距離的量測及設定作業 係煩雜且費時。因而,在訂製托盤及測試用托盤上之吸附 頭的動作範圍之全部難進行最佳距離的量測及設定,因為 僅在代表性的位置進行設定,精度未必佳。又,因為使用 假托盤進行量測及設定,所以在假托盤有翹曲或尺寸偏差 (,的情況,有無法進行正確之量測及設定的情況。 【發明内容】 本發明之目的在於提供可高精度而且易於識別吸附手 段之取么的上下動距離之元件搬運裝置、電子元件測試裝 置、以及最佳距離的識別方法。 (1)為了達成该目的,若依據本發明之第1觀點,提供 元件搬運裝置(參照申請專利範圍第丨項),係為了吸 附保持被搬運體後移動而使用,包括:吸附手段,係吸附2247-9575-PF 5 200908194 Customized pallets for test results, and classified into good or defective products. In the electronic component testing device, the setting of the optimum distance for the up and down movement of the adsorption head in the adsorption operation of the ic device is performed, for example, when the type of the IC component before the start of the general operation of the electronic component test device is switched, or repaired. Waiting time. Conventionally, the optimum distance for moving down on the suction head has been set using a dummy tray that mimics the tray in which the 1C component is housed. That is, the operator measures the scale of the dial to the dummy tray by visually checking the scale of the dial indicating gauge, etc., and then inputs the measured value by manual operation to obtain the optimum distance. Settings. However, the measurement and setting of such an optimum distance by manual work is cumbersome and time consuming. Therefore, it is difficult to measure and set the optimum distance for all the operating ranges of the adsorption heads on the custom tray and the test tray, and since the setting is performed only at a representative position, the accuracy is not necessarily good. Further, since the dummy tray is used for measurement and setting, there is a case where warpage or dimensional deviation occurs in the dummy tray. In the case where accurate measurement and setting cannot be performed. [Invention] The object of the present invention is to provide A component transfer device, an electronic component test device, and an optimum distance recognition method that are high-precision and easy to recognize the up-and-down distance of the adsorption means. (1) In order to achieve the object, according to the first aspect of the present invention, The component conveying device (refer to the third paragraph of the patent application) is used to adsorb and move the object to be transported, including: adsorption means, adsorption

2247-9575-PF 200908194 保持該被搬運體;檢 該被搬運體’ ·移動手/手Γ,係檢測該吸附手段有無吸附 手段,係控制使該吸附手段移動,·以及控制 檢測手段的檢測杜果手=移動動作;該控制手段根據該 動該吸附手段,=二Γ動手段控制成該移動手段移 動手段的移動後之,二 將開始移動位置和藉該移 佳距離。 手&的位置之間的距離識別為最 ::發明’控制手段根據該檢測手段 =:::結果,使該移動手段移動該吸附手段,或 別為最佳距離。因而=之及附手長的位置之距離識 的動作距離。 |易於識別吸附手段之最佳 段的==雖未特別限定,該控制手段可根據該檢測手 :之該吸附手段的位置之間的距離設定為最佳距 该吸附手段吸附保持該被搬運體時,該控制手段控制 動手段,以使該移動手段重現所設定之該 照申請專利範圍第2項)。 X 乂佳(參 在該發明雖未特別限定,該控制手段在該檢 ::j:l吸附手段吸附保持該被搬運體的情況,使該= 測;:二者弟]!'向移動第1既定距離,而在該檢測手段檢 〜遠吸附手段已吸附保持該被搬運體的情況,將 移動位置和該檢測手段檢測到該吸附手段已吸附伴::;2247-9575-PF 200908194 Maintaining the object to be transported; Checking the object to be transported' · Moving the hand/handcuff, detecting whether or not the adsorption means has an adsorption means, controlling the movement of the adsorption means, and controlling the detection means The hand=moving action; the control means controls the movement of the moving means by the second moving means according to the moving means, and the second moving position and the moving distance are started. The distance between the positions of the hand & is identified as the most :: invention' control means according to the detection means =::: as a result, the moving means moves the adsorption means, or else the optimum distance. Therefore, the distance between the position of the hand and the position of the hand is determined. The === that is not particularly limited, and the control means can set the distance between the positions of the adsorption means according to the detection hand to be optimally adsorbed and held by the adsorption means. At the time, the control means controls the moving means to cause the moving means to reproduce the second item of the set patent application. X 乂 佳 (In the invention, although the invention is not particularly limited, the control means: the j: l adsorption means adsorbs and holds the object to be transported, so that the = test;: the two brothers!! 1 a predetermined distance, and in the case where the detection means detects that the far-adsorption means has adsorbed and holds the object to be transported, the moving position and the detecting means detect that the adsorption means has been adsorbed with:

搬運體時之㈣手段的位置之間的距離識別為最 2247-9575-PF 200908194 較佳(參照申請專利範圍第3項)。 在該發明雖未特別UP h -.g. . ^ ^疋,該控制手段在該檢測手段未 才双測到该吸附手段吸 手段 著第… I亥被搬運體的情況,使該吸附 丁仅/口者弟1方向移動筮 6 .8|| 5_ 第1既疋距離,而在該檢測手段檢 測到該吸附手段已吸 饱 附保持忒被搬運體的情況,該移動手 ^又使該吸附手段沿荃筮 丁 者第2方向移動第2既定距離後,將 该開始移動位晉牙σ # & 動ι第2既定距離後之該吸附手段的 位置之間的距離識另丨I i &丄 ,,, 遒別為取佳距離較佳(參照申請專利範圍 第4項)。 叫 -在該發明雖未特別限定,該帛2方向係和該第^方向 5 °〆第2既疋距離比該第1既定距離更短較佳(參照 申請專利範圍第5項)。 、,吸附手&彳文開始移動位置移動,在吸附被搬運體後, 猶U私動’以推人被搬運體。然後,控制手段將開始移 動位置和從被搬運體之吸附位置稍微移動的位置之間的距 離識別為最佳距離。因巾,可識別最佳距離,以使吸附手 奴可更確貫地進行被搬運體的吸附。 在該發明雖未特別限定,該第2方向係和該第丨方向 反方向,該第2既定距離比該第1既定距離更短較佳(參照 申請專利範圍第6項)。 在吸附機械強度弱的被搬運體時,若吸附手段之推壓 力作用,被搬運體可能損壞。因而’需要吸附手段未推壓 而吸附被搬運體。 因此’在本發明,在識別最佳距離時,將從開始移動The distance between the positions of the means of the (4) means when transporting the body is identified as the most 2247-9575-PF 200908194 (refer to the third item of the patent application scope). In the invention, although the invention is not particularly UP h -.g. . ^ ^ , the control means does not detect the adsorption means by the means of the detection means that the first means of transporting the body is such that the adsorption is only / mouth of the younger brother 1 direction moves 筮6 .8|| 5_ the first 疋 distance, and the detection means detects that the absorbing means has sucked and holds the 忒 carried object, the moving hand makes the adsorption After moving the second predetermined distance along the second direction of the cultivator, the distance between the positions of the adsorption means after the start of the movement of the tooth σ # & moving the second predetermined distance is 丨I i &amp ;丄,,, Screening is better for better distance (refer to item 4 of the patent application scope). In the invention, the 帛2 direction system and the second direction of the second direction are preferably shorter than the first predetermined distance (refer to the fifth item of the patent application). The absorbing hand & 彳 开始 开始 开始 开始 开始 开始 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附Then, the control means recognizes the distance between the start of the movement position and the position slightly moved from the suction position of the conveyed body as the optimum distance. Due to the towel, the optimum distance can be identified so that the suction hand can more accurately adsorb the object to be transported. In the invention, the second direction system and the second direction are opposite to each other, and the second predetermined distance is shorter than the first predetermined distance (refer to the sixth item of the patent application). When the object to be transported with weak mechanical strength is adsorbed, the object to be transported may be damaged by the pressing force of the adsorbing means. Therefore, it is required that the adsorption means does not push and adsorbs the object to be transported. Therefore, in the present invention, when the optimal distance is recognized, the movement will start from the beginning.

2247^9575-PF 8 200908194 位置至比檢測手段對被搬運體之吸附檢測位置還猶微離開 被搬運體的位置之距離識別為最佳距離。因而,—般運轉 時’吸附手段從開始移動位置移至在吸附手段和被搬運體 之間設置微小的間隔之位置後,利用吸力吸起被搬運體。 因而,可利用吸附手段不推壓被搬運體而吸附被搬運 體,可有效地防止在吸附機械強度弱的被搬運體時發生損 壞。 貝 在該發明雖未特別限定,該控制手段控制該移動手 段,以使該移動手段使該吸附手段朝向和該第丨方向及第 2方向不平行的第3方向移動較佳(參照申請專利範圍第7 項)。 在該發明雖未特別限定 重力方向係平行較佳(參照中請專利範圍第8項)。 在該發明雖未特別限定,在實質上和該第3方向平 勺平面之複數個位置識別該最佳距離較佳(參昭申过直 範圍第9項)。 ‘、、、申明專 藉由作成可在複數個位置識別在被搬運體 之吸附手段的上下動之县杜w祕 7助 之最仏距離,而可在吸附手段 搬運體的吸附動作之P岡μ針遍 ;1下之乾圍的整體識別最佳距離。 在該發明雖未牲Βι| κ0 — 特別限疋,使用用以識別最佳 用的基準體,替代兮β Α I此離之 …員)。…破搬運體較佳(參照申請專利範圍 在該發明雖未对寺 運體接觸的吸附塾》. 別限定 真空源 該吸附手段具有:和該被搬 係產生真空;以及配管,係2247^9575-PF 8 200908194 The position-to-ratio detection means is still slightly away from the position at which the object to be transported is detected. The distance from the position of the object to be transported is recognized as the optimum distance. Therefore, in the normal operation, the adsorption means is moved from the start movement position to the position where the minute interval is provided between the adsorption means and the object to be conveyed, and then the object to be conveyed is sucked up by suction. Therefore, the object to be transported can be adsorbed without being pressed by the object to be transported, and damage can be effectively prevented from occurring when the object to be transported having weak mechanical strength is adsorbed. The present invention is not particularly limited, and the control means controls the moving means such that the moving means moves the adsorption means in a third direction that is not parallel to the second direction and the second direction (refer to the patent application scope). Item 7). Although the invention is not particularly limited, the direction of gravity is preferably parallel (refer to item 8 of the patent scope). Although the invention is not particularly limited, it is preferable to recognize the optimum distance at substantially a plurality of positions in the plane of the third direction plane (see item 9 of the straight range). The ',, and the stipulations can be used to create the maximum distance that can be used to identify the adsorption mechanism of the object to be transported at a plurality of locations. μ needle pass; the overall circumference of the dry circumference of 1 identifies the optimal distance. In the invention, although Β|| κ0 - is particularly limited, the reference body used to identify the best is used instead of 兮β Α I. ...the carrier is better (refer to the patent application scope. In the invention, although the adsorption of the temple body is not contacted), the vacuum source is not limited. The adsorption means has: and the vacuum is generated by the system; and the piping is

2247-9575-PF 200908194 使違吸附墊和該真空源連通; 姑杜^ μ私動手段使該吸附墊移動 較仏(翏照申請專利範圍第1 1項)。 (2)為了達成該目的,若依赫 一 據本發明之第2觀點,提供 一種包括元件搬運裝置之電子开 /、 ^ 千疋件測試裝置(參照申請專 4乾圍第12項),係將被測試電 电于70件壓在測試頭之接騎 4 ’並使該被測試電子元件的輪 ^ 』出入知子和該接觸部以電 氣式接觸,而測試該被測試電 ,a. ^ 卞兀件,忒被搬運體係該被 測試電子元件。 散 在本發明’藉由在電子元件測 _ 卞列忒裝置内之被測試電子 元件的搬運使用本發明之元件搬 版建裝置,而可自動地識別 為吸附手段之上下動的最佳距離。 ^ 口而,取佳距離的識別 作業變得容易’可縮短準備時間。 又’藉由在最佳距離的識別使用係實際之測試對象的 被測試電子元件,而不是假㈣,可進行最佳距離 度的識別及設定。 T為了達成該目的,若依據本發明之第3觀點,提供 一種最佳距離的識別方法(參照申請專利範圍第Μ項),其 在包括吸附保持被搬運體之吸附手段、及使該吸附手段移 動的移動手段之元件搬運裝置’識別在該吸附手段吸二 持該被搬運體時該吸附手段之移動的最佳距離,包括:檢 測步驟’係檢測該吸附手段有無吸附該被搬運體;移動= 驟,係根據在該檢測步驟之檢測結果,使該移動手段移= 該吸附手段;以及識別步驟,係根據在該檢測步驟:檢測 結果,將開始移動位置和藉該移動手段的移動後之該吸附2247-9575-PF 200908194 The absorbing pad is connected to the vacuum source; the smuggling method makes the absorbing pad move relatively 翏 (refer to claim 1 of the patent application scope). (2) In order to achieve this object, according to the second aspect of the present invention, an electronic open/, ^ 疋 测试 test device including a component carrying device is provided (refer to the 12th item of the application 4) The tested electric power is tested on the test head by pressing 70 pieces of the test head 4' and pressing the wheel of the tested electronic component into the contact portion to electrically contact the contact portion, a. ^ 卞兀The piece is tested by the system to be tested with the electronic component. In the present invention, the component mounting apparatus of the present invention is used for the conveyance of the electronic component to be tested in the electronic component measuring device, and the optimum distance for the downward movement of the adsorption means can be automatically recognized. ^ The mouth, the identification of the good distance is easy to work 'can shorten the preparation time. Further, by using the electronic component to be tested which is the actual test object for the identification of the optimum distance, instead of false (four), the optimum distance can be identified and set. In order to achieve the object, according to a third aspect of the present invention, a method for identifying an optimum distance is provided (refer to the third section of the patent application), which comprises an adsorption means for adsorbing and holding a carrier, and the adsorption means The component transporting device of the moving moving means identifies the optimum distance of the movement of the adsorbing means when the adsorbing means sucks the transported object, and includes: detecting step of detecting whether the adsorbing means adsorbs the transported object; = a step of moving the moving means according to the detection result in the detecting step = the adsorbing means; and the identifying step, based on the detecting step: the detecting result, the moving position is started and the moving means is moved The adsorption

2247-9575-PF 10 200908194 手段的位置之間的距離識別為最佳距離。 在本發明,根據在該檢測步 盔之於、'目,丨从田 邛耵被孤運體之吸附的有 …、k測…果,在移動步驟移動吸附手p, , 驟,蔣p M 又’或者在識別步 驟,將处開始移動位置至移動後 距離,別五曼之及附手段的位置之移動 距離識別為攻佳距離。因而 ^ # ^ ^ 自動且易於識別吸附手段 之敢仫的動作距離。 在該發明雖未特別限定, 4 朴料_ A又包括^步驟,其根據在 该檢測步驟的檢測社要 4始㈣位置和藉該移動手 k的移動後之該吸附手 罝之間的距離設定為最佳距 離,f 4吸附手段吸附保持該被搬運體時,該移動手段重 二驟所設定之該最佳距離較佳(參照申請專利 範圍弟1 4項)。 在該發明雖未特別限定,在該檢測步驟未檢測到該吸 附手段吸附保持該被搬運體的情況,在該移動步驟,該移 動手段使該吸附手段沿著第1方向移動第^既定距離;在 该檢測步驟檢測到該吸附手段已吸附保持該被搬運體的情 況將D亥開始移動位置和該檢測手段檢測到該吸附手段已 吸附保持該被搬運體時之該吸附手段的位置之間的距離識 別為最佳距離較佳(參照申請專利範圍第15項)。 在及發明雖未特別限定,在該檢測步驟未檢測到該吸 附手段吸附保持該被搬運體的情況,在該移動步驟,該移 動手段使該吸附手段沿著第1方㈣動第1既定在 該檢測步驟檢測到該吸附手段已吸附保持該被搬運體的情 况,在'^移動步驟,該移動手段又使該吸附手段沿著第22247-9575-PF 10 200908194 The distance between the locations of the means is identified as the optimal distance. In the present invention, according to the detection of the helmet, the 'eyes, the 吸附 from the 邛耵 邛耵 邛耵 孤 孤 孤 孤 、 、 、 、 、 , , , , , , , , , , , , , , , , , , , , , , , , , , In addition, or in the identification step, the position is moved to the distance after the movement, and the moving distance of the position of the other means is recognized as the attack distance. Thus ^ # ^ ^ automatically and easily recognizes the daunting action distance of the adsorption means. Although the invention is not particularly limited, the fourth material _A further includes a step of the distance between the adsorption handcuffs after the movement of the moving hand k and the movement of the moving hand k according to the detection of the detection step. When the optimum distance is set and the f 4 adsorption means adsorbs and holds the object to be transported, the optimum distance set by the moving means is preferably (refer to Patent Application No. 14). Although the invention is not particularly limited, in the detecting step, the adsorption means does not detect the adsorption and holding of the object to be transported, and in the moving step, the moving means moves the adsorption means in the first direction by a predetermined distance; In the detecting step, it is detected that the adsorption means has adsorbed and held the object to be transported, and the position between the start position of the movement and the position of the adsorption means when the detection means detects that the adsorption means has adsorbed and held the object to be transported It is better to recognize the distance as the best distance (refer to item 15 of the patent application scope). Although the invention is not particularly limited, in the detection step, the adsorption means does not detect the adsorption and holding of the object to be transported. In the moving step, the moving means sets the adsorption means along the first side (four) first. The detecting step detects that the adsorption means has adsorbed and holds the object to be transported, and in the '^ moving step, the moving means causes the adsorption means to follow the second

2247-9575-PF 11 200908194 方向移動第2既定距齙 位置和移㈣第2既 識別步驟,將該開始移動 動忒弟2既疋距離後之該吸附手段的位 距離:別為最佳距離較佳(參照中請專利範圍第㈣)曰。, 該發明雖未特別限定,該第2方向係和該第」 门方向’該第2既定距齙 φ s 離比4弟1既定距離更短較佳(參昭 申凊專利範圍第1 7項)。 …、 在檢測步驟檢測到吸附手段對被搬運體的吸附後,在 矛夕動步驟吸附手段稍彳%2247-9575-PF 11 200908194 Directional movement 2nd fixed distance position and shift (4) 2nd identification step, the distance of the adsorption means after starting to move the second brother 2: the best distance Good (refer to the patent scope (4)). The present invention is not particularly limited, and the second direction system and the first door direction 'the second predetermined distance 龅 φ s are shorter than the predetermined distance of the fourth brother 1 (refer to the reference item 17 of the scope of the application) ). ..., after the adsorption step detects the adsorption of the object to be transported by the adsorption means, the adsorption means is slightly lower in the spear-step process.

、 稍从移動,以推入被搬運體。然後,A 識別步驟,將開始蒋動 、 動位置和從被搬運體之吸附檢測位置 軸多動的位置之間的距離識別為最佳距離。 因而’可將吸附手段可更確實地進行被搬運體的吸 之距離識別為最佳距離。 在該發明雖未特別限定,該第2方向係和該第i方向 反方向m既定距離比該第i既^距離更短較佳(參照 申請專利範圍第18項)。 在吸附機械強度弱的被搬運體時,若吸附手段之推壓 力作用,被搬運體可能損壞。因而,需要吸附手段未推^ 而吸附被搬運體。 因此,在識別步驟,將從開始移動位置至比檢測手段 對被搬運體之吸附檢測位置還稍微離開被搬運體的位置之 距離識別為吸附手段之上下動的最佳距離。因而,一般運 轉如,吸附手段從開始移動位置移至在吸附手段和被搬運 體之間設置微小的間隔之位置後,利用吸力吸起被搬運體。 因而,可利用吸附手段不推壓被搬運體而吸附被搬運 2247-9575-PF 12 200908194 體 ’可有效地防止在 壞。 及附機械強度弱的被搬運體時發生才二 可使=該發明雖未特別限定,在該移動步驟,該移動手段 3方ΓΓ附Γ又朝向和該第1方向及第2方向不平行的第 α移動較佳(參照申請專利範圍第1 9項)。 在該發明雖未特別限定,該第〗及第2方向實質上對 方向係平行較佳(參照申請專利範圍第2〇項)。、 的平未特別限定,在實質上和該第3方向平行 複數個位置執行該識別步驟較佳 範圍第21項)。 ’,、、甲6月專利 藉由作成可在複數個位置可進行識別步驟,而可在吸 進行被搬運體的吸附動作之範圍的整體識別上下動 的取佳距離。 厂初 用的明雖未特別限定,使用用以識別最佳距離之專 m準體’替代該被搬運體較佳(參照申請專利範圍第 【實施方式】 、下根據圖面說明本發明之實施形態。 第1圖係表示本發明之眘#彡能 霄細I匕、的电子元件測試裝置 /、思口丨J面圖,繁? — 件測圖係表不本發明之實施形態的電子元 什列4裝置之立體圖, 弟d圖表不在本發明之實施形態的 兀牛測試裝置之托盤的處理方法 , 疫主刀泛之不思圖’第4圖係 义'、$明之實施形態的電子元件測古式梦罟m 屯丁 7L仟凋忒裝置所使用之托盤Move slightly to push the object to be transported. Then, the A recognition step recognizes the distance between the start of the movement, the movement position, and the position at which the axis of the adsorption detection position of the object to be conveyed is multi-moved as the optimum distance. Therefore, the suction means can more reliably recognize the suction distance of the conveyed body as the optimum distance. The present invention is not particularly limited, and the second direction and the ith direction in the opposite direction m are shorter than the ith distance (see item 18 of the patent application). When the object to be transported with weak mechanical strength is adsorbed, the object to be transported may be damaged by the pressing force of the adsorbing means. Therefore, it is necessary that the adsorption means does not push and adsorb the object to be transported. Therefore, in the recognition step, the distance from the start of the movement position to the position at which the suction detecting position of the conveyed body is slightly separated from the position of the object to be conveyed is recognized as the optimum distance for the lowering of the suction means. Therefore, in general, if the adsorption means is moved from the start moving position to a position where a minute interval is provided between the adsorption means and the object to be transported, the object to be transported is sucked up by suction. Therefore, it is possible to effectively prevent the damage by using the adsorption means without adsorbing the conveyed body and adsorbing and transporting the 2247-9575-PF 12 200908194 body. And the case where the object to be transported having a weak mechanical strength is generated can be used. The invention is not particularly limited. In the moving step, the moving means 3 is further aligned with the first direction and the second direction. The α-th moving is preferable (refer to item 19 of the patent application scope). Although the invention is not particularly limited, the first and second directions are substantially parallel to the direction (refer to the second aspect of the patent application). The level of the flat portion is not particularly limited, and the identification step is preferably performed in a plurality of positions substantially parallel to the third direction. The patents of the June, June patents are capable of performing the identification step at a plurality of positions, and can obtain a good distance for moving up and down in the range of the suction movement of the object to be transported. Although the first use of the factory is not particularly limited, it is preferable to use the special body to identify the optimum distance instead of the object to be transported (refer to the patent application scope [Embodiment], and the implementation of the present invention will be described based on the drawings. Fig. 1 is a view showing an electronic component testing device of the present invention, an electronic component testing device, a schematic diagram of a schematic view, and a drawing of an electronic component according to an embodiment of the present invention. The perspective view of the Shih 4 device, the D chart is not in the processing method of the tray of the yak test device according to the embodiment of the present invention, and the electronic device measurement of the embodiment of the invention is omitted. Pallet used in the ancient nightmare m Kenting 7L 仟 仟 device

2247-9575-PF 13 200908194 儲存器的分解立體圖,第5 _ 弟^圖係表不本發明之實施形態的 電子元件測試裝置所栋田+ _1 , i 用之δΤ衣托盤的立體圖,第6圖係 表示本發明之實施形能 心的電子兀件測試裝置所使用之測試 用托盤的分解立體圖,第7 一 弟(圖係表不本發明之實施形態的 元件搬運裝置之剖面圖,第8 弟S圖係表不本發明之實施形態 的元件搬運裝置之控制系統的方塊圖。 ”此外’第3圖係用以理解在本實施形態的電子元件測 :式衣置之托盤的處理方法之圖,實際上亦有在平面上表示 朝上下方向所排列配置 稱仵的邛为。因此,參照第2圖 說明其機械(三維)構造。 本實施形態之電子元件測 ^ 卞列a凌置1 ’係在對ic元件施 加局溫或低溫之溫度庫力的 應力的狀悲,使用測試頭5及測試器 6,測試(檢查)IC元件异不、ώ $ ,L ^ 里时τ _ 否適§地動作’並根據該測試結 果將IC元件分類的裝置。笋 _ 精此電子兀件測試裝置1之I c 元件的測試’從裝載多個成Α 成為測武對象之1C元件的訂製托 盤KST,將1C元件振奘你^杏 ; 处理态1内循環搬運的測試用 托盤TST而執行。 如第1圖所示,空間8讯 ^ 间8 °又置於處理器1的下部,而測 試頭5可交換地配置於此办 此工間8。插座50設置於測試頭5 上,經由電纜7和測續β D 6連接。而,經由形成於處理写 1之裝置基座101的開口邱,枯Tr —丄 為 ]间口邛,使1C兀件和測試頭5上 座5 0以電氣式接觸,可招μ水 斓了根據來自測試器6的電氣信號進行 1C元件之測試。此外,在 丁 換IC兀件之種類時,交換 適合該種類之I c元件的开彡批+ 、战 仟的形狀或接腳數之插座。2247-9575-PF 13 200908194 An exploded perspective view of the storage device, and a fifth perspective view of the δ clothing tray for the electronic component testing device of the embodiment of the present invention. An exploded perspective view of a test tray used in an electronic component testing device of the present invention, and a sectional view of a component handling device according to an embodiment of the present invention, the eighth brother FIG. 3 is a block diagram showing a control system of a component transport device according to an embodiment of the present invention. FIG. 3 is a view for explaining a method of processing a tray for an electronic component in the present embodiment. In fact, there is a plan to indicate that the 仵 is arranged in the vertical direction. Therefore, the mechanical (three-dimensional) structure will be described with reference to Fig. 2. The electronic component of the present embodiment is measured and placed at 1 ' In the case of stress applied to the ic component at a local or low temperature temperature, use the test head 5 and the tester 6 to test (check) the IC component difference, ώ $ , L ^ when τ _ § Ground action' and according to The test result is a device for classifying IC components. The test of the I c component of the electronic component test device 1 'from the loading of a plurality of 订 Α 订 订 订 订 订 订 订 订 订 订 订You are apricot; it is executed in the test tray TST which is transported in the processing state 1. As shown in Fig. 1, the space 8 is placed at the lower part of the processor 1 and the test head 5 is exchangeably arranged. This is the workstation 8. The socket 50 is disposed on the test head 5, and is connected via the cable 7 and the test β D 6. However, via the opening formed in the device base 101 of the write write 1, the Tr is ] The gap between the 1C and the test head 5 is electrically contacted, and the 1C component can be tested according to the electrical signal from the tester 6. In addition, the type of the IC component is changed. At the same time, the socket of the type I c component of this type is exchanged, the shape of the trench or the number of pins is exchanged.

2247-9575-PF 14 200908194 杯f本實施形態之處理器1如第2圖及第3圖所示,包 之構件構成:储存部·,係儲存今後要測試 300係將又將測试完了之丨。元件分類並儲存;裝載部 一。〇’係將從儲存部200所供給之IC元件送入室部 室部⑽,係包含有測試頭5;以及卸載部4〇〇,係 部⑽已進行測試之職完了的IG元件分類並取出。 以下’ δ兒明處理器1之各部。 〈儲存部200&gt; r …存# 200包括:測試前儲存$ 2〇1,係儲存已收容 測試前之1C元件的訂製托盤KST(LDKST);測試完了儲存 器202’係儲存已收容因應於測試結果所分類之π元件的 訂製托盤KST(ULKST);以及托盤移送臂可儲存已收 容測試前及測試完了之Ic元件的訂製托盤KST。 儲存器2(Π、 202 ’如第4圖所示,包括··框形之托 盤支持框203 ;及昇降機204,係從此托盤支持框2〇3之下 部進入並往上部昇降。在托盤支持框2〇3,堆疊複數個訂 製托盤KST,並利用昇降機204僅將此堆疊的訂製托盤KST 上下地移動。此外,在本實施形態之訂製托盤KST,如第5 圖所不,將收容1C元件之收容部排成14列χ13行。 在本實施形態,如第2圖及第3圖所示,將2個儲存 為STK ~ β設置於測試前儲存器2〇 1,並將2個空托盤儲存 器STK — Ε設置於其旁邊。各個空托盤儲存器STK — Ε堆疊 被送至卸載部400之空的訂製托盤KST。 在空托盤儲存器STK — E的旁邊,將8個儲存器stk 2247-9575-PF 15 200908194 1 ' STK — 2' ··· &gt; ctj/ 〇 ^ , — 8設置於測試完了儲存器202,在構 …因應於測試結果最多分成8類並儲存。 此外’因為儲存器STK — B、儲在哭ςτκ 1 〇 托盤儲存 料為STK—Η以及空 之構造相同,所以可因應於需要而適當 地《周t各自的個數。 a移达^ 205在儲存部200和後述之裝載部30 0或 :4〇°之間交換訂製托盤⑽。在訂製托盤KST之交 二愈】4先#,]用托盤移送臂205取出儲存器STK所儲存的 訂製托盤KST。蛀裟Μ # ^ 1 接者,保持訂製托盤KST之托盤移送臂205 ° :部300或卸載部400之窗部370、470下降的設定 板2圖示)上移動。然後,把盤移送臂205從設定板拿起 :二! m,而且將從儲存器STK所取出之訂製托盤KST θ ; °又疋板上。已放置新的訂製牦盤KST之設定板再上 裝載邛300或卸載部400的窗部37〇、47〇,另一方面, 托盤移送臂205從設定板所拿起之訂製托盤KST儲 存於對應的儲存器STK。 〈裝載部3〇〇&gt; :用设置於儲存部2〇〇和裝置基座ι〇ι之間的托盤移 ^ 05將訂製托盤m從裝置基座ι〇ι之下側搬至裝載 :〇之2處的窗部37〇。接著,在此裝載部·,元件搬 ,裝置加將訂製托盤⑽所裝入之1(:元件暫時移至校正2247-9575-PF 14 200908194 Cup f The processor 1 of the present embodiment is as shown in Fig. 2 and Fig. 3, and the components of the package are: storage unit, and the system is to be tested in the future, and the test will be completed. Hey. Component classification and storage; loading section 1. The 〇' is sent from the IC component supplied from the storage unit 200 to the chamber portion (10), and includes the test head 5; and the unloading unit 4, and the IG components that have been tested by the system (10) are sorted and taken out. The following are the parts of the δ 儿明 processor 1. <Storage part 200> r...Save #200 includes: storing $2〇1 before the test, storing the custom tray KST (LDKST) that has received the 1C component before the test; after the test, the storage 202' is stored and stored in response to The custom tray KST (ULKST) of the π component classified by the test result; and the tray transfer arm can store the customized tray KST that has been housed before and after the test of the Ic component. The storage device 2 (Π, 202', as shown in Fig. 4, includes a frame-shaped tray support frame 203; and an elevator 204, which is moved from the lower portion of the tray support frame 2〇3 to the upper portion. 2〇3, a plurality of custom pallets KST are stacked, and only the stacked custom pallets KST are moved up and down by the elevator 204. Further, in the custom pallet KST of the present embodiment, as shown in FIG. The accommodating portions of the 1C elements are arranged in 14 rows and 13 rows. In the present embodiment, as shown in Figs. 2 and 3, two of them are stored as STK ~ β in the pre-test storage 2〇1, and two are The empty tray storage STK - Ε is placed next to it. Each empty tray storage STK - Ε stack is sent to the empty custom tray KST of the unloading section 400. Next to the empty tray storage STK-E, 8 storage Stk 2247-9575-PF 15 200908194 1 'STK — 2' ··· &gt; ctj/ 〇^ , — 8 is set in the test memory 202, in accordance with the test results up to 8 categories and stored. 'Because the storage STK-B, stored in the crying ςτκ 1 〇 tray storage material is STK-Η and Since the structure is the same, the number of each of the weeks t can be appropriately adjusted according to the need. The a transfer 205 exchanges the custom tray (10) between the storage unit 200 and the loading unit 30 0 or 4 〇 ° which will be described later. The custom pallet KST is handed over to the second fork] 4 first #,] the pallet shifting arm 205 is used to take out the custom pallet KST stored in the storage STK. 蛀裟Μ # ^ 1 picker, the pallet shifting arm 205 holding the custom pallet KST °: The portion 300 of the portion 300 or the window portion 370, 470 of the unloading portion 400 is lowered to move up. Then, the disc transfer arm 205 is picked up from the setting plate: two! m, and the customized tray KST θ; ° taken out from the reservoir STK is again on the sill. The setting plate of the new customized tray KST is placed on the loading tray 300 or the window portions 37〇, 47〇 of the unloading portion 400, and on the other hand, the tray transfer arm 205 is stored in the customized tray KST picked up from the setting sheet. In the corresponding storage STK. <Loading Unit 3〇〇>: The customized tray m is moved from the lower side of the apparatus base to the loading by the tray transfer between the storage unit 2〇〇 and the apparatus base ι〇: The window part of the two places is 37〇. Next, in this loading section, the component is moved, and the device is loaded with the 1 (the component is temporarily moved to the correction).

Ser)36〇 ’在此修正iC元件彼此之位置關係。然 後’組件搬運裝置Ή n 戒罝310再使此杈正器360所移送之IC元件 ’並換裝於停在裝载部300的測試用托盤m。Ser) 36〇' Here, the positional relationship of the iC elements to each other is corrected. Then, the component carrier Ή n 罝 310 and the IC component ’ transferred by the aligner 360 are replaced by the test tray m stopped at the loading unit 300.

2247-9575-PF 16 200908194 測試用托盤TST如第6圖所示 間隔地設置於方形框7(n,在這些框條u 702平盯且等 條m相對向之框7G1的邊7Gla— pQ2的兩侧及和框 滿勑Η公狀Μ 各自寺間隔地突出形成 複數片文&amp;片703。利用這地框條 ..7Π1 ^ 一 ^条702之間或框條702和 邊701a之間及2片安裝片7〇 再战插入件收容部7 0 4。 在各插入件收容部7〇4,各自 收谷1個插入件71 〇,使 用固定件705將此插入件71〇以浮 Η 7ης m 予勤狀態安裝於2片安裝 片703。因而,在插入件71〇 λ , 71η %邛,形成用以將該插 入件710文裝於安裝片703的安穿 L ^ c 7女裝孔7〇6。這種插入件710 如弟Θ圖所示,在i個測試用牦 成4列16行。 盤加女裝64個,並排列 此外,將各插入件710設為同一形狀、同一尺寸,將 1“件收容於各個插入件71〇。插入件71 。收容部係 因應於所收容之!。元件的形狀而決定,在第6圖所示之例 子為方形的凹部。 1裝载部300包括2個窗部370 '元件搬運裝置31〇、以 j校正器(preciser)360。而,元件搬運裝置31〇可將位於 囪P 3 70之叮製托盤KST所收容的I c元件暫時移至校正器 360後’換裝於測試用托盤TST。 元件搬運裝置310如第2圖及第7圖所示,包括:2 支彼此平行之Y軸方向軌道311 ,係架設於裝置基座j 〇 j 上;可動臂312,係可利用此2支執道311及未圖示之馬 達在測試用托盤TST和訂製托盤KST之間往復移動(將此方 向設為γ軸方向);以及吸附頭320,係由可動臂312保持2247-9575-PF 16 200908194 The test trays TST are arranged at intervals in the square frame 7 as shown in Fig. 6 (n, in which the frame u 702 is flat and the m is opposite to the side 7G1 - pQ2 of the frame 7G1 The two sides and the frame are full of 勑Η Μ 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自 各自The two mounting pieces 7 are re-played in the insert accommodating portion 704. In each of the insert accommodating portions 7〇4, one insert 71 〇 is received in each of the inserts, and the insert 71 is smashed by the fixing member 705. m The standby state is mounted on the two pieces of mounting pieces 703. Thus, at the inserts 71 〇 λ, 71 η % 邛, an insert is formed for mounting the insert 710 on the mounting piece 703. 〇 6. The insert 710 is shown in the figure of the drawing, and is divided into 4 rows and 16 rows in i test. 64 disks are added and arranged, and in addition, each insert 710 is set to the same shape and the same size. The 1" piece is accommodated in each of the inserts 71. The insert 71. The accommodating part is determined according to the shape of the element to be accommodated, and the example shown in Fig. 6 It is a square recess. 1 The loading unit 300 includes two window portions 370 'the component carrying device 31 〇 and the j corrector 360. The component carrying device 31 将 can be placed on the tray of the chimney P 3 70 The Ic element accommodated in the KST is temporarily moved to the corrector 360 and then replaced with the test tray TST. The component carrying device 310, as shown in Figs. 2 and 7, includes: 2 Y-axis directions 311 parallel to each other. , the system is mounted on the device base j 〇j; the movable arm 312 can reciprocate between the test tray TST and the custom tray KST by using the two supports 311 and a motor (not shown) (this direction is set The γ axis direction); and the adsorption head 320 are held by the movable arm 312

2247-9575-PF 17 200908194 成可沿著x軸方向移動。 如第7圖所示,底座構件315安裝於可動臂的下 部。於此底座構件3’15,設置馬達等之致動器318a,而且 形成貫穿孔315a’而貫穿孔仙貫穿致動器3此的驅動 軸318b。滾珠螺桿接頭31Sc安裝於驅動軸31肋的前端側, 此滾珠螺桿接頭31Sc固定於吸附頭32〇 _又,線性導請之軌道316a固定於底座^ 在軌運31 6a上可沿著z軸方向滑動之滑動構件3! 6b 於吸附頭320的支持構件32〇a。 吸附頭320包括支持構件32〇a “及附藝32〇c以及彈 性構件咖。吸附塾32〇c由大致圓柱形之本體部⑽己及 由合成樹脂材料所構成之柔軟的墊部32〇f構成。於本體部 32〇d之上部,形成外徑比其他的部分更小的小徑部320e。 又,於墊部320f及本體部32〇d,從下側連續地形成内孔 32〇g:此内孔320gg由配管32〇i和真空泵333連通。 貝穿孔3 2 0 b形成於支持構件3 2 〇 a ,本體部3 2 〇 d之小 k邛320e插入此貫穿孔32〇b,吸附墊32〇c由支持構件 3心保持成可上下動。又’彈性構件3·插入支持構件 32 0a和本體部32Qd之間,此彈性構件咄將本體部 對支持構件32〇a向下方向施力。作為彈性構件320h,可 使用金屬製之線圈彈簧或由合成樹脂材料所構成之蛇腹狀 的彈簧構件等。 利用經由配官3 2 0 1和吸附頭3 2 〇之内孔3 2 〇 g連結的 ”泵3 3 3產生吸附頭3 2 0之吸力。而利用設置於配管3 2 〇 i2247-9575-PF 17 200908194 The movement can be moved along the x-axis. As shown in Fig. 7, the base member 315 is attached to the lower portion of the movable arm. The base member 3'15 is provided with an actuator 318a of a motor or the like, and a through hole 315a' is formed to penetrate the drive shaft 318b of the actuator 3 through the hole. The ball screw joint 31Sc is attached to the front end side of the rib of the drive shaft 31, and the ball screw joint 31Sc is fixed to the adsorption head 32〇. Further, the linear guide rail 316a is fixed to the base ^ on the rail 31 6a along the z-axis direction The sliding member 3! 6b is slid to the support member 32A of the adsorption head 320. The adsorption head 320 includes a supporting member 32〇a “and an accessory 32〇c and an elastic member. The adsorption 塾32〇c is composed of a substantially cylindrical body portion (10) and a soft pad portion composed of a synthetic resin material. The small-diameter portion 320e having a smaller outer diameter than the other portions is formed on the upper portion of the main body portion 32〇d. Further, the inner portion 32〇 is continuously formed from the lower side of the pad portion 320f and the main body portion 32〇d. The inner hole 320gg is communicated by the pipe 32〇i and the vacuum pump 333. The bead hole 3 2 0 b is formed on the support member 3 2 〇a , and the small k 邛 320e of the body portion 3 2 〇d is inserted into the through hole 32 〇 b, and is adsorbed. The pad 32〇c is held by the support member 3 to be movable up and down. Further, the 'elastic member 3· is inserted between the support member 32 0a and the body portion 32Qd, and the elastic member 咄 applies the body portion to the support member 32〇a downward. As the elastic member 320h, a coil spring made of metal or a bellows-shaped spring member made of a synthetic resin material or the like can be used. The inner hole 3 2 〇g through the fitting 3 2 0 1 and the adsorption head 3 2 利用The connected "pump 3 3 3" produces a suction of the adsorption head 320. And the use of the pipe set to 3 2 〇 i

2247-9575-PF 18 200908194 之中逆的真空壓力感測器330量測配管32 此判斷吸附頭320有無吸附IC元件。孔% 制裝置340傳达 利用真二壓力感測器33〇所量測之壓力值的資料。 控制裝置340如第8圖所示,可和去丨^ w m rn7r」控制地和元件搬運裝 置310及真空泵333連接。藉由控制裝置州的㈣,而 元件搬運裝置310使吸附頭32〇朝向χγζ方向移=,又利 用控制裝置340控制真空泵333的〇N/〇FF。 〈室部100&gt; 在室部100,測試被收容於上述之測試用托盤TST之 狀態的1C元件。 室部100如第2圖及第3圖所示,由以下之構件構成, soak室110’係對被裝入測試用托盤TST的ic元件,施加 目標之高溫或低溫的温度應力;測試t 12〇,係使處於在 該soak室11〇已施加熱應力之狀態的1(:元件接觸測試頭 5,以及unsoak室130,係從在測試室12〇已測試的IC元 件除去熱應力。 soak至11 〇如第2圖所示,配置成比測試室j 2〇更向 上方突出。而多個測試用托盤TST利用未圖示的垂直搬運 裝置在soak室11〇内下降。此時,在位於測試室ι2〇内之 測試用托盤TST所收容的Ic元件之測試未結束的情況,垂 直搬運裝置停止,在至測試結束之間等待。主要在此等待 中,對IC元件施加高溫或低溫的熱應力。2247-9575-PF 18 200908194 The reverse vacuum pressure sensor 330 measures the pipe 32. This judges whether the adsorption head 320 has an adsorption IC element. The hole % device 340 communicates the data of the pressure value measured by the true second pressure sensor 33. As shown in Fig. 8, the control unit 340 can be connected to the component transporting device 310 and the vacuum pump 333 in a controlled manner with the switch. By the control device state (4), the component handling device 310 shifts the adsorption head 32 toward the χγζ direction, and the control device 340 controls the 〇N/〇FF of the vacuum pump 333. <Room portion 100> In the chamber portion 100, the 1C element accommodated in the above-described test tray TST is tested. As shown in FIGS. 2 and 3, the chamber portion 100 is composed of the following members, and the soak chamber 110' applies a target high-temperature or low-temperature temperature stress to the ic element loaded in the test tray TST; test t 12 〇, the 1 is in a state in which the thermal stress is applied to the soak chamber 11 (the element contacts the test head 5, and the unsoak chamber 130 removes thermal stress from the IC element tested in the test chamber 12〇. soak to 11 is arranged to protrude upward from the test chamber j 2〇 as shown in Fig. 2. The plurality of test trays TST are lowered in the soak chamber 11 by a vertical conveyance device (not shown). In the case where the test of the Ic component housed in the test tray TST in the test chamber ι2 is not completed, the vertical conveyance device is stopped, and waits until the end of the test. Mainly during this waiting, high temperature or low temperature heat is applied to the IC component. stress.

接著’熱應力之施加結束的測試用托盤TST經由上述 之垂直搬運裝置及未圖示的搬運皮帶的搬運,而被送往測 2247-9575-PF 19 200908194 試室120。 於測試室120,將測試頭5配 沉置於其中央部,將 用托盤TST搬至測試頭5的上方,葬由你ΐΓ _ 精由使丨C兀件的輪出入 端子和測試頭5之插座50的接觸端子々 而十以電軋式接觸, 施IC元件的測試。 κ 將此測試的結果記憶於根據對 I對測5式用托盤TST所 之識別號碼及對測試用托盤TST内所扣 所決定之位址。 β所才曰派之1C元件的號碼 u_…30亦和soauu。一樣,配置成比測試 室m更向上方突出,如第3圖之示意圖所示,設置垂直 搬運裝置。在此unsoak室130, 你soak至11 〇已施加离 溫的情況’在利用送風將丨C元件八細二 ° 竹义70件冷郃而回到室温後 已除熱之1C元件搬至卸載部4〇〇。 一 人 11 ΰ已對1C元件施加低、,在soak室 ΤΓ 一… m皿的情况’利用暖風或加熱器等將 IC 70件加熱至不會發生姓 π m…度的溫度後,將該已除敎 的IC 7L件搬至卸載部4〇〇。 .、、、 用以從主基座1 Q 1你 U1搬入測試用托盤TST的入π形成於 soak室11〇之上部。— 取於 樣地,用以將測試用托盤TST搬至 主基座101的出口形忐认 主…ηι 七成於_砧室13。之上部。然後,在 王基座1 0 1,設置用丨t ^ τςτ ^ 以經由這些入口或出口使測試用托般 TST從室部1 〇〇屮λ &amp;上i ^ ^ ^ 1〇2;/丨 乇益搬運裝置1 02。此托盤搬運裝置 1 0 2例如由轉動滾輪耸 衣直 從_-室m所;?成。利用此托盤搬運装置⑽,將 及裝载部_送回_!:測相托盤TST,經由卸載部400 &lt; w s〇ak 室 j1〇 〇Then, the test tray TST after the application of the thermal stress is transferred to the test chamber 120 by the vertical conveyance device and the conveyance belt (not shown). In the test chamber 120, the test head 5 is placed in the center of the test head, and the tray TST is moved to the top of the test head 5, and the wheel is inserted into the terminal and the test head 5 by the _ _ _ The contact terminals of the socket 50 are in contact with each other by electric rolling, and the IC component is tested. κ The result of this test is memorized in accordance with the identification number of the T-type pallet TST and the address determined by the deduction in the test tray TST. The number of the 1C component of the 所 所 u u u u u u u u u u so so so so Similarly, it is arranged to protrude upward from the test chamber m, and as shown in the schematic view of Fig. 3, a vertical transport device is provided. In this unsoak room 130, you soak to 11 〇 has been applied to the unloading part of the 1C component that has been removed from the room after using the air supply to remove the C component eight fine two degrees. 4〇〇. One person 11 ΰ has applied a low level to the 1C component, and in the case of a soak room... a case of 'm dish', heating the IC 70 piece with a warm air or a heater, etc., after the temperature of the surname π m... The 7 IC 7L piece is moved to the unloading section 4〇〇. . , , , and π which are carried into the test tray TST from the main base 1 Q 1 and U1 are formed on the upper portion of the soak chamber 11〇. — Take the sample, and the outlet shape for moving the test tray TST to the main base 101 is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The upper part. Then, at the king base 101, set 丨t^τςτ^ to make the test TST from the chamber 1 〇〇屮λ &amp; i ^ ^ ^ 1 〇 2 via these inlets or outlets; Benefit handling device 1 02. The pallet handling device 1 0 2 is for example rotated by a rotating roller from the _-room m; By using the pallet transport device (10), the loading unit_ is returned to the _!: phase measuring tray TST via the unloading unit 400 &lt; w s〇ak room j1〇 〇

2247-9575-PF 20 200908194 〈卸载部4〇〇&gt; ”部400從被搬至卸載部綱之測試用托盤—將 KST。 的1C凡件換裝於因應於測試結果之訂製托盤 如第2圖所示,在卸載部之主基座 個窗部y m ,”以從儲存部200被搬至卸载部4〇〇的訂製 托盤KST面臨、 Μ面L主基座101之上面的方式配置。又,緩衝部 405。又置於卸載部400的測試用托盤TST和窗部406之間。 卸载部400包括元件搬運裝置41〇,其將測試完了之 1C兀件從測試用托盤TST換裝於訂製托 件搬運裝⑽和前面所說明之元件搬運裝請為:: 樣,所以在此省略其詳細的說明。 第9圖係表示本發明的實施形態之電子元件測試裝置2247-9575-PF 20 200908194 <Unloading unit 4〇〇> The section 400 is moved from the test tray to the unloading section - the 1C of the KST is replaced by the custom pallet according to the test result. As shown in Fig. 2, in the main pedestal window portion ym of the unloading portion, "the order tray KST that has been transported from the storage portion 200 to the unloading portion 4" faces the upper surface of the main surface 101 of the top surface L. . Further, the buffer unit 405. Further, it is placed between the test tray TST of the unloading unit 400 and the window portion 406. The unloading unit 400 includes a component conveying device 41 that replaces the tested 1C component from the test tray TST to the customized carrier handling device (10) and the component handling device described above is: Detailed descriptions thereof are omitted. Figure 9 is a diagram showing an electronic component testing device according to an embodiment of the present invention.

的元件搬運裝置之最佳距M 巨離的識別方法之各步驟的流程Flow of each step of the method for identifying the optimal distance of the component handling device

圖’弟10A圖〜第ι〇Ε_後主-+ L 系表不在本發明的第1實施形態識 別最佳距離時之元件搬運裝置的動作之剖面圖。 其-人’-面參照第9圖〜第1QE圖一面說明在本發明之 第1實施形態的最佳距離之識別方法。在第U施形態, 說明為了可確實地吸附IC亓彼 ^ ^ K疋件’而將吸附頭32〇從1C元 件之吸附感測位置再推入之你里Μ 之位置識別為最佳距離的情況之 例子。Fig. 10A to ι〇Ε_ 后主-+ L is a cross-sectional view showing the operation of the component transporting apparatus when the optimum distance is not recognized in the first embodiment of the present invention. The method of recognizing the optimum distance in the first embodiment of the present invention will be described with reference to Fig. 9 to Fig. 1QE. In the U-shaped embodiment, it is explained that in order to reliably adsorb the IC, the position of the adsorption head 32〇 from the adsorption sensing position of the 1C element is recognized as the optimum distance. An example of the situation.

猎由作業貝之操作而元株故^、笛w η、A J凡件搬運裝置310開始運轉時, 首先’真空泵333開始抽直咖f 具二(步驟S1)。接著,藉由經由 配管320 i向真空泵333吸A DB s/』 ύ及入吸附頭320之内孔32〇g的空When the hunting operation is started by the operation of the work, the original device, the flute w η, and the A J are started to operate. First, the vacuum pump 333 starts to take the second step (step S1). Then, the A DB s/』 ύ is sucked into the vacuum pump 333 via the pipe 320 i and the inner hole 32 〇g of the adsorption head 320 is emptied.

2247-9575-PF 21 200908194 氣,而變成吸附頭 r 接著,控制裝置340判斷吸附頭32〇是否已吸附a _ 件(步驟S2)。在已吸附1C元件的情況,因為即使在空= 未進入内孔32Og之狀態亦藉真空泵333繼續吸氣,所以及 孔320g及配管320i之内部的氣壓大幅度地減少。另—内 面’在未吸附1C元件的情況,因為即使在吸氣中亦向方 320g及配管320 i補充空氣’所以壓力不會大為變 而’在本實施形態,利用真空壓力感測器33Q量測氣壓, 並將所量測之氣壓值傳至控制裝i 34G,而在量測既 定之廢力值Ui臨限值)以下的情況,控制裝置34〇判: 吸附頭320已吸附IC元件。 j斷 _ ^ 另方面,在1測值係既定之 壓力值(第2臨限值)以上的情 之 頭320未吸附IC元件。 控制衣置_判斷吸附 在仏測到未吸附IC元件的情況(在步驟Μ $ . 破置310進仃吸附頭320之第i移動,她4 頭320從開始移動位置人 寸 「昤例如1 0〜20mm(步驟§3)。2247-9575-PF 21 200908194 Gas becomes the adsorption head r Next, the control device 340 judges whether or not the adsorption head 32 has adsorbed a member (step S2). In the case where the 1C element has been adsorbed, the air pressure is continuously increased by the vacuum pump 333 even when the air is not in the state of the inner hole 32Og, and the air pressure inside the hole 320g and the pipe 320i is greatly reduced. On the other hand, when the 1C element is not adsorbed, the air is supplied to the side 320g and the pipe 320 i even during the inhalation, so the pressure does not change greatly. In the present embodiment, the vacuum pressure sensor 33Q is used. When the air pressure is measured and the measured air pressure value is transmitted to the control device i 34G, and the predetermined waste force value Ui threshold value is measured, the control device 34 determines that the adsorption head 320 has adsorbed the IC component. . j is off _ ^ On the other hand, in the head 320 where the measured value is equal to or greater than the predetermined pressure value (second threshold), the IC element is not adsorbed. Control clothing _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ ~20mm (step §3).

元件。至1於移動結束後,回到步驟S2,再檢測有無吸附1C 驟S2及步驟S3 件為止,吸附頭咖重複進行步 炊德 、,母—人在步驟S3逐次下降各10〜20_。 :後’如第⑽圖所示1附頭 步驟S2檢測到 T Ir ^ 止第1移動(步驟S4)。的情況(在步驟S2為YES),停 ^ ^ ^ 4 31 0 ^ ^ ^ ^ ^ 320 如第1 0 C圖戶斤; . _所不,在吸附墊320c和1C元件element. After the end of the movement, the process returns to step S2, and the presence or absence of the adsorption 1C step S2 and the step S3 is detected. The adsorption head repeats the step, and the mother-person successively descends 10 to 20_ in step S3. : After '1' as shown in the (10) figure, the step S2 detects that T Ir ^ stops the first movement (step S4). The case (YES in step S2), stop ^ ^ ^ 4 31 0 ^ ^ ^ ^ ^ 320 as the 1 0 C figure jin; . _ no, in the adsorption pad 320c and 1C components

2247-9575-PF 22 200908194 抵接之狀態’凡件搬運裝置310使支持構件32〇a從吸附檢 測位置B再移至下降例如卜5_的位置(位置〇。 構件魏從錢㈣位置β再向 推入很紐的距離,而吸附頭32〇 壓力變成比吸附檢測時更強。此外,在此推入時= 3·稍微退避至比彈性構件·更上侧。 接者’在步驟S6,控制裝置34〇將從開始移動位 :支持構件320a之最終的位置c之距離識別為最佳距離, 二重=佳距離,預先將此時之致動器〜控制 疋為取L值。設定最佳距離後,停止真空栗333之 :一。驟S7) ’如第1〇D圖所示,吸附頭32〇上昇而回 剎原來之開始移動位置A (步驟s 8 )。 運二:在本實施形態’因為可自動地易於進行元件搬 運衣置㈣之吸附頭320的上下動距離之最佳化,所以可 4去以往之人工作業的煩雜作業’而可縮短準備時間。 又’在本實施形態’因為使用係實際之測試對象的ic 凡件本身設^,所以可將上下動距離高精度地進行最佳化。 以上之動作結束後,吸附頭32〇朝水平方向移動 在訂製托盤LMST之複數個位置重複步驟S3〜s8的動作。 如此,藉由在複數個位置進行最佳距離的設定,而可 在吸附頭3 2 0之動作範圍整體識別最佳距離。2247-9575-PF 22 200908194 Abutment state 'When the workpiece handling device 310 moves the support member 32〇a from the adsorption detection position B to the position where the drop is, for example, 5_ (position 〇. Component Wei from the money (four) position β again When the distance of the suction head 32 is pushed, the pressure of the adsorption head 32 is stronger than that at the time of the adsorption detection. Further, when this is pushed, the pressure is slightly retracted to the upper side than the elastic member. In the step S6, The control device 34〇 recognizes the distance from the start movement position: the final position c of the support member 320a as the optimum distance, and the double=good distance, and presets the actuator to control to the L value in advance. After the good distance, the vacuum pump 333 is stopped: 1. Step S7) 'As shown in Fig. 1D, the adsorption head 32 is raised and the movement start position A is returned to the brake (step s 8). In the second embodiment, since the vertical movement distance of the adsorption head 320 of the component transporting device (4) can be automatically optimized, it is possible to reduce the preparation time by performing the troublesome work of the conventional manual work. Further, in the present embodiment, since the ic individual of the actual test object is used, the vertical movement distance can be optimized with high precision. After the above operation is completed, the adsorption head 32 is moved in the horizontal direction. The operations of steps S3 to S8 are repeated at a plurality of positions of the order tray LMST. Thus, by setting the optimum distance at a plurality of positions, the optimum distance can be recognized as a whole in the operating range of the adsorption head 320.

此外,在本實施形態,雖然說明對訂製托盤LMST之 最佳距離的識別設定,但是在本發明未特別限定如此 可在測試用托盤m或校正器36G上進行吸附頭㈣之上 2247-9575-PF 23 200908194 下動距離的最佳化。 又,在本實施形態,雖然僅說明裝 運裝置310白勺吸附5貝32〇 之兀件搬 •署肚吳士 疋對於卸载部400之元件妒 運#置41 0,亦一樣地進行 搬 距離之設定。 7下動最佳 此外,在本實施形態,雖然將開始移動位置A和第2 移動後的位置C之間的距離識別為最佳距離,但是未二 如此,亦可將未進行第2移 疋未限疋 办罢&quot; 匱況的位置’即開始移動 置二和吸附檢測位置6之間的距離識別為最佳距離。 η第11A ®帛11B圖係表示在本發明的第2實施形態識 別最佳距離時之元件搬運裝置的動作之剖面圖。 。 其次,-面參照第9圖及第liA圖〜第11β圖—面說明 在本發明之第2實施形態的電子元件測試裝置之最佳距離 的識別方法。 薄且機械強度弱之IC元件可能在吸附時利用吸附頭 (32G減而發生損壞。因而,這種ic元件,在吸附時未接 觸吸附s員320,ϋ由從稍微分開之位置利用吸力吸起而進 行吸附保持較佳。Further, in the present embodiment, although the identification setting of the optimum distance of the order tray LMST is described, the present invention is not particularly limited. The suction head (four) may be carried on the test tray m or the corrector 36G. 2247-9575 -PF 23 200908194 Optimization of the down distance. Further, in the present embodiment, only the case in which the shipping device 310 adsorbs 5 ft. 32 〇 is carried out, and the device is transported to the unloading unit 400. set up. In addition, in the present embodiment, although the distance between the start of the movement position A and the position C after the second movement is recognized as the optimum distance, the second movement may not be performed. The position between the position of the situation and the position of the adsorption detection position 6 is recognized as the optimal distance. The η 11A ® 帛 11B is a cross-sectional view showing the operation of the component conveying device when the optimum distance is recognized in the second embodiment of the present invention. . Next, a method of recognizing the optimum distance of the electronic component testing apparatus according to the second embodiment of the present invention will be described with reference to Fig. 9 and the first to the eleventh to eleventh. A thin and mechanically weak IC component may utilize a suction head during adsorption (32G is less damaged). Therefore, the ic element does not contact the adsorption member 320 when adsorbed, and is sucked up by suction from a slightly separated position. The adsorption is preferably maintained.

因而’在本實施形態,在最佳距離的識別時,以從IC 元件之吸附感測地點稍微退回開始移動位置A側的方式進 打第2移動。藉由這樣做,而可將從開始移動位置a至稍 微離開ic元件之位置的距離識別為吸附頭320之上下動的 最佳距離。 在本Λ %形之最佳距離的識別,和第1實施形態相Therefore, in the present embodiment, at the time of the recognition of the optimum distance, the second movement is performed so as to slightly retreat from the suction sensing point of the IC element to the movement start position A side. By doing so, the distance from the start of the movement position a to the position slightly away from the ic element can be recognized as the optimum distance above the adsorption head 320. Identification of the optimal distance of the % shape in the present embodiment, and the first embodiment

2247-9575-PF 24 200908194 異的僅步驟S5。在本實施形態’在步驟S5,如第!! A圖所 不吸附頭3 2 0從吸附檢測位置B向上方移至離開^ c元件 例如僅1〜5mm。 接著在步驟’如第11B圖所示,控制裝置34〇將 從開始移動位置A至第2移動後之位置C的距離識別為吸 附頭32。之上下動的最佳距離。因而,即使係機械強度弱 之1C το件,亦可自動且易於識別可無損壞地吸附保持的 佳距離。 此外’以上所說明之實施形態,係為了易於理解本發 明而記載,不是為了限定本發明而記載。因此,在上述: 實施形態所揭示的各要素係亦包含屬於本發明的技術性範 圍之全部的設計變更或相當物之主旨。 &quot;生乾 在本實施形態,僅使用實際測試之以 取么距離。可是’在本發明未特別限,亦可使用模 广件之假托盤(基準體)進行識別。或者,亦可 離Γ使用實際…件識別 離猎此可更“取佳距離之識別精度。 【圖式簡單說明】 元件測試裝置 的處 之整=圖表示本發明之實施形態的電子 之電子元件測試裝置的立體 1圖的電子元件測試裝置之 第2圖係第1圖 第3圖係表示第 理方法之示意圖。2247-9575-PF 24 200908194 Only step S5 is different. In the present embodiment, in step S5, as in the first! In the figure A, the non-adsorbing head 3 2 0 is moved upward from the adsorption detecting position B to the leaving element, for example, only 1 to 5 mm. Next, in step '11', as shown in Fig. 11B, the control device 34 recognizes the distance from the start of the movement position A to the position C after the second movement as the suction head 32. The best distance to move down. Therefore, even if it is a 1C τ piece having a weak mechanical strength, it is possible to automatically and easily recognize a good distance which can be adsorbed and held without damage. The embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, in the above description, each element disclosed in the embodiments includes all design changes or equivalents belonging to the technical scope of the invention. &quot;Dry to dry In this embodiment, only the actual test is used to take the distance. However, the present invention is not particularly limited, and a dummy tray (reference body) of a molded piece may be used for identification. Alternatively, it is also possible to use the actual object to identify the identification accuracy of the distance. The simple description of the component test device shows the electronic component of the electronic embodiment of the present invention. Fig. 2 is a schematic view showing a first embodiment of the electronic component testing apparatus of the three-dimensional one of the test apparatus.

2247-9575-PF 25 200908194 M丨尔衣示本發明 « π &lt;貝—π敗《V -电千元 所使用之IG儲存器的分解立體圖。 、 置 第圖係表示本發明之實施形態的電子元 所使用之訂製托盤的立體圖。. 置 第6圖係表不本發明之實施形態的電子元件 所使用之測5式用托盤的分解立體圖。 、 第7圖係表不本發明之實施形態的元件搬運裝 面圖。 '直之剖2247-9575-PF 25 200908194 M丨尔衣 shows the invention « π &lt;bei-π defeat "V-electric thousand yuan used in the exploded perspective view of the IG storage. Fig. 1 is a perspective view showing a custom tray used in an electronic unit according to an embodiment of the present invention. Fig. 6 is an exploded perspective view showing a type 5 pallet for use in an electronic component according to an embodiment of the present invention. Fig. 7 is a view showing a component transporting surface of an embodiment of the present invention. 'straight section

C 第8圖係表示本發明之實施形態的 制系統的方塊圖。 元件搬運裝置之控 第9圖係表 的元件搬運裝置C Fig. 8 is a block diagram showing a system of the embodiment of the present invention. Control of component handling device Figure 9 is a component handling device

不本發明的實施形態之電子元件測試裝置 之最佳距離的識別方法之各步驟的流程 第 10Α圖仫主 、、不在本發明的第1貫施形態識別最佳距 離時之元件搬i軍酤$ , / 運裝置的動作之剖面圖(之1)。The flow of each step of the method for recognizing the optimum distance of the electronic component testing device according to the embodiment of the present invention is not limited to the case of identifying the optimum distance in the first embodiment of the present invention. $ , / Sectional view of the operation of the transport device (1).

第10B圖係表不在本發明的第1實施形態識別最佳距 離時之元件搬運裝置的動作之剖面圖(之2)。 第10(]圖#矣一+丄a 货、表不在本發明的第1實施形態識別最佳距 離日守之it件搬運裝置的動作之剖面圖(之3)。 第1 0D圖係表示在本發明的第1實施形態識別最佳距Fig. 10B is a cross-sectional view (No. 2) showing the operation of the component transporting apparatus when the optimum distance is recognized in the first embodiment of the present invention. 10(图图#矣一+丄a) The goods and the table are not in the cross-sectional view (3) of the operation of the device conveying device for identifying the optimal distance of the first embodiment of the present invention. The 1st 0D figure is shown in The first embodiment of the invention identifies the optimal distance

離時之元件搬運I# w I %表置的動作之剖面圖(之4)。 第1 〇Ε圖係表示在本發明的第1實施形態識別最佳距 ^^日Τ之兀件搬運择“ / χ 邊或置的動作之剖面圖(之5)。 第11Α圖係表示在本發明的第2實施形態識別最佳距Sectional view of the action of the component handling I# w I % when leaving the time (4). In the first embodiment of the present invention, a cross-sectional view (5) of the operation of recognizing the "/" edge or the setting of the optimum distance is shown in the first embodiment of the present invention. The second embodiment of the present invention recognizes the optimal distance

2247-9575-PF 26 200908194 離時之元件搬運裝置的動作之剖面圖(之1)。 第11B圖係表示在本發明的第2實施形態識別最佳距 離時之元件搬運裝置的動作之别面圖(之2)。 【主要元件符號說明】 1電子元件測試裝置 1 0 0室部 20 0儲存部 30 0裝載部 31 0元件搬運裝置 320吸附頭 320a支持構件 320b貫穿孔 3 2 0 c吸附頭 320d本體部 320e小徑部 3 2 0 f襯墊 320g内孔 320h彈性構件 320 i配管 330真空壓力感測器 333真空泵 340控制裝置 3 6 0校正器 2247-9575-PF 27 200908194 370窗部 400卸載部 KST訂製托盤 TST測試用托盤 2247-9575-PF 282247-9575-PF 26 200908194 Cross-sectional view of the operation of the component handling device in time (1). Fig. 11B is a plan view (No. 2) showing the operation of the component transporting apparatus when the optimum distance is recognized in the second embodiment of the present invention. [Description of main component symbols] 1 electronic component testing device 1 0 0 chamber portion 20 0 storage portion 30 0 loading portion 31 0 component conveying device 320 adsorption head 320a supporting member 320b through hole 3 2 0 c adsorption head 320d main body portion 320e diameter Part 3 2 0 f pad 320g inner hole 320h elastic member 320 i pipe 330 vacuum pressure sensor 333 vacuum pump 340 control device 3 6 0 corrector 2247-9575-PF 27 200908194 370 window portion 400 unloading portion KST custom tray TST Test tray 2247-9575-PF 28

Claims (1)

200908194 十、申請專利範圍: 1.種元件搬運裝置,為了吸附保持被搬運體後移動 而使用,包括: 吸附手段,係吸附保持該被搬運體; 檢測手段,係檢測該吸附手段有無吸附該被搬運體; 移動手段,係使該吸附手段移動;以及 技制手長,係控制該移動手段的移動動作; 該控制手段根據該檢測手段的檢測結果,將該移動手 段控制成該移動手段移動該吸附手段,或者該控制手段將 開始移動位置和藉該移動手段的移動後之該吸附手段的位 置之間的距離識別為最佳距離。 2. 如申請專利範圍第〗項之元件搬運裝置,其中該控 制手段可根據該檢測手段的檢縣果,將該開始移動^ 和㈣移動手段的移動後之該吸附手段的位置之間的距離 設定為最佳距離’並在該吸附手段吸附保持該被搬運體 時’該控制手段控制該移動手段,以使該移動手段重現所 設定之該最佳距離。 3. 如申請專利範圍第丨項之元件搬運裝置,其中該护 制手段係 Λ I 在該檢測手段未檢測到該吸附手段吸附保持該被搬運 體的情況,使該吸附手段沿著第!方向移動第i既定距離; 在該檢測手段檢測到該吸附手段已吸附保持該被搬運 體的情況’將該開始移動位置和該檢測手段檢測到該吸附 手段已吸附保持該被搬運體時之該吸附手段的位置之間的 2247-9575-PF 29 200908194 距離識別為最佳距離。 4.如申請專利範圍第1項之元件搬運裳置,控 制手段係 〒a衩 在該檢測手段未檢測到該吸附手 ^ AA ^ + 丁奴及附保持該被搬運 體的情況,使該吸附手段沿著第丨方 ^ 、 π移動弟1既定距離; 在该檢測手段檢測到該吸附手段 仅匕及附保持該被搬運 體的情況,該移動手段又使該吸附手段沿著第2方向移動 弟2既定距離後,將該開始移動位置和移動該第2既定距 離後之該吸附手段的位置之間的距離識別為最佳距離。 5. 如申請專利範圍第4項之㈣搬運裝置,其中該第 2方向係和該帛1方向同方向,該第2既定距離比該;i 既定距離更短。 6. 如申請專利範圍第4項之元件搬運裝置,其中該第 2方向係和该帛!方向反方向,該第2既定距離比該第1 既定距離更短。 7·如申请專利範圍第4項之元件搬運裝置,其中該控 制手段控制該移動手段,以使該移動手段使該吸附手段: 向和該第1方向及第2方向不平行的第3方向移動。 8. 如申請專利範圍第4項之元件搬運裝置,其中該第 1及第2方向實質上對重力方向係平行。 9. 如申請專利範圍第7項之元件搬運裝置,其中在實 質上和該第3方向平行的平面之複數個位置識別該最佳 離。 1 〇.如申請專利範圍第1項之元件搬運裝置,其中使用 2247-9575-PF 30 200908194 用以識別最佳距離之專用的基準體,卷 土干瓶朁代該破搬運體。 11.如申請專利範圍第1項之元件 &lt; , 逆裝置,其中該吸 附手段具有: 和該被搬運體接觸的吸附墊; 真空源,係產生真空;以及 配管’係使該吸附墊和該真空源連通. 該移動手段使該吸附墊移動。 /200908194 X. Patent application scope: 1. A component transporting device is used for adsorbing and holding a transported object, including: an adsorption means for adsorbing and holding the object to be transported; and a detecting means for detecting whether the adsorbing means adsorbs the object a moving means for moving the adsorption means; and a technical hand length for controlling a movement of the moving means; the control means controlling the moving means to move the adsorption by the moving means based on the detection result of the detecting means The means, or the control means, identifies the distance between the start of the movement position and the position of the adsorption means by the movement of the moving means as the optimum distance. 2. The component handling device according to the scope of the patent application, wherein the control means can adjust the distance between the position of the adsorption means after the movement of the movement means and the movement of the movement means according to the inspection condition of the detection means When the optimum distance ' is set and the holding means is adsorbed and held by the adsorption means', the control means controls the moving means to cause the moving means to reproduce the set optimal distance. 3. The component handling device according to the ninth aspect of the invention, wherein the protection means is Λ I, wherein the detecting means does not detect that the adsorption means adsorbs and holds the object to be transported, so that the adsorption means is along the first! Moving the ith predetermined distance; the detecting means detects that the absorbing means has adsorbed and held the object to be transported. 'The starting moving position and the detecting means detect that the absorbing means has adsorbed and held the object to be transported The distance between the positions of the adsorption means 2247-9575-PF 29 200908194 is identified as the optimum distance. 4. If the component handling device of the first application of the patent scope is applied, the control means is 未a衩, the adsorption means is not detected by the detecting means, and the holding body is attached to the object to be adsorbed. The means moves the predetermined distance along the second side ^, π; the detecting means detects that the adsorption means only holds and holds the object to be transported, and the moving means moves the adsorption means in the second direction After the predetermined distance is 2, the distance between the start movement position and the position of the adsorption means after moving the second predetermined distance is recognized as the optimum distance. 5. The (4) handling device of claim 4, wherein the second direction is the same direction as the 帛1 direction, and the second predetermined distance is shorter than the i; the predetermined distance is shorter. 6. For the component handling device of claim 4, the second direction and the 帛! In the opposite direction of the direction, the second predetermined distance is shorter than the first predetermined distance. 7. The component handling device of claim 4, wherein the control means controls the moving means such that the moving means moves the adsorption means to a third direction that is not parallel to the first direction and the second direction . 8. The component handling device of claim 4, wherein the first and second directions are substantially parallel to the direction of gravity. 9. The component handling device of claim 7, wherein the optimum distance is identified at a plurality of locations substantially parallel to the plane parallel to the third direction. 1 如. For the component handling device of claim 1 of the patent scope, 2247-9575-PF 30 200908194 is used to identify a dedicated reference body for the optimum distance, and the soil dry bottle is used to replace the carrier. 11. The element of claim 1, wherein the adsorption means has: an adsorption pad in contact with the object to be transported; a vacuum source to generate a vacuum; and a pipe 'to make the adsorption pad and the The vacuum source is connected. The moving means moves the adsorption pad. / 12. —種電子元件測試裝置,將被 、 n⑴戎冤子兀件壓在測 試頭之接觸部,並使該被測試電子元 W干旳輸出入端子和該 接觸部以電氣式接觸,而測試該被測試電子元件, 該被搬運體係該被測試電子元件,並包括申請專利範 圍第1至11項中任一項之元件搬運裝置。 ,丨3· 一種最佳距離的識別方法,其在包括吸附保持被搬 運體之吸附手段、及使該吸附手段移動的移動手段之元件 搬運波置識別在该吸附手段吸附保持該被搬運體時該吸 附手段之移動的最佳距離,包括: 檢測步驟,係檢測該吸附手段有無吸附該被搬運體; 移動步驟,係根據在該檢測步驟之檢測結果,使該移 動手奴移動該吸附手段;以及 '別v驟’係根據在該檢測步驟的檢測結果,將開始 移動位置和藉該移動手段的移動後之該吸附手段的位置之 間的距離識別為最佳距離。 14.如申請專利範圍第13項之最佳距離的識別方法, 其中又包括設定步驟,其根據在該檢測步驟的檢測結果, 2247-9575-PF 31 200908194 將該開始移動位置和藉該移動手段的移動後之該吸附手段 的位置之間的距離設定為最佳距離; 在該吸附手段吸附保持該被搬運體時,該移動手段重 現在該設定步驟所設定之該最佳距離。 、15.如申請專利範圍第13或14項之最佳距離的識別方 法’其中在該檢測步驟未檢測到該吸附手段吸附保持該被 搬運體的情況’在該移動步驟,㈣動手段使該吸附手段 沿著第1方向移動第丨既定距離; 在該檢測步驟檢測到該吸附手段已吸附保持該被搬運 體的清況’於该識別步驟將該開始移動位置和該檢測手段 才双别到a吸附手段已吸附保持該被搬運體時之該吸附手段 的位置之間的距離識別為最佳距離。 16.如申請專利範圍第㈣⑷貝之最佳距離的識別方 相’其中在該檢測步驟未檢測到該吸附手段吸附保持該被 搬運體的情況’在該移動步驟,該移動手段使該吸附手段 沿者第1方向移動第丨既定距離; ^該檢測步驟檢測到該吸附手段已吸附保持該被搬運 在該移動步驟,該移動手段又使該吸附手段沿 始移動位=多動第2既定距離後’在該識別步驟’將該開 :位置和移動該第2既定距轉之該吸时 之間的距離識別為最佳距離。 置 盆中申π月專利乾圍帛16 1員之最佳距離的識別方法, ::=2方向係和該第1方向同方向’該第2既定距離 比邊弟1既定距離更短。 2247-9575-PF 32 200908194 其中=2 =範圍第16項之最佳距離的識別方法, 比該第1既定::::第1方向反方向,該第2〜離 ”:二7專利範圍第】6項之最佳距離的識別h 第1方向及 4㈣段可使該吸附手段朝向和 ?方向;平行的第3方向移動。 或 其甲該第I及帛2 ^㈣16項之最佳㈣賴別方法, U 及弟2方向實質上對重力方向係平行。 ‘ °申清專利範園第i g 其中在實質上和該第3行::距離的識別方法, 該識別步驟。 门+仃的千面之複數個位置執行 2 2.如申請專利範 法,其中使用用以識別最#距離之^最佳距離的識別方 被搬運體。 之專用^基準體’替代該 2247-9575-PF 3312. An electronic component testing device for pressing an n(1) die member against a contact portion of a test head, and causing the tested electronic component W to dry out into the terminal and the contact portion for electrical contact, and testing The electronic component to be tested, the system to be tested, the component to be tested, and the component handling device according to any one of claims 1 to 11.丨3· A method for identifying an optimum distance, wherein the element transporting means including the adsorption means for adsorbing and holding the object to be transported and the moving means for moving the adsorbing means are recognized when the adsorbing means adsorbs and holds the object to be transported The optimal distance of the movement of the adsorption means includes: a detecting step of detecting whether the adsorption means adsorbs the object to be transported; and a moving step of moving the moving hand slave to the adsorption means according to the detection result in the detecting step; And the 'individual' is based on the detection result in the detecting step, and identifies the distance between the start of the movement position and the position of the adsorption means by the movement of the moving means as the optimum distance. 14. The method for identifying an optimum distance according to claim 13 of the patent application, further comprising a setting step, according to the detection result in the detecting step, 2247-9575-PF 31 200908194, starting the moving position and borrowing the moving means The distance between the positions of the adsorption means after the movement is set to an optimum distance; and when the adsorption means adsorbs and holds the object to be transported, the moving means reproduces the optimum distance set by the setting step. 15. The method for identifying an optimum distance of the patent application scope 13 or 14 wherein the adsorption means does not detect the adsorption and holding of the object to be transported in the detecting step, in the moving step, (4) moving means The adsorption means moves the first predetermined distance along the first direction; in the detecting step, it is detected that the adsorption means has adsorbed and maintained the condition of the conveyed body', and the starting movement position and the detecting means are different in the identification step The distance between the positions of the adsorption means when the adsorption means has adsorbed and held the object to be transported is recognized as the optimum distance. 16. The identification phase of the optimal distance of (4) (4) of the patent application scope, wherein the adsorption means does not detect the adsorption and holding of the object to be transported in the detecting step, in the moving step, the moving means makes the adsorption means Moving the first distance along the first direction; ^ the detecting step detects that the adsorption means has adsorbed and holds the carried in the moving step, and the moving means causes the adsorption means to move along the initial position = multi-moving second predetermined distance After the 'identification step', the distance between the position and the movement of the second predetermined distance is recognized as the optimum distance. In the basin, the identification method of the best distance of the 16-member patent shackle, the ::=2 direction system and the first direction in the same direction' is the second predetermined distance shorter than the established distance of the brother. 2247-9575-PF 32 200908194 where =2 = the best method for identifying the range of the 16th item, which is more than the first: :::: the first direction is opposite, the second is from ": 2, 7 patent range 】The identification of the best distance of 6 items h The first direction and the 4th (fourth) segment can move the adsorption means toward the direction of the direction and the parallel direction of the third direction. Or it is the best of the first and fourth (4) 16 items. In other ways, U and 2 are substantially parallel to the direction of gravity. ' ° Shen Qing Patent Fan Park ig where in essence and the third line:: the distance identification method, the identification step. Execution of a plurality of positions 2 2. As in the patent application method, the identification object to be used to identify the best distance is the carrier. The special ^ reference body' replaces the 2247-9575-PF 33
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