TW200907562A - Template having a silicon nitride, silicon carbide or silicon oxynitride film - Google Patents

Template having a silicon nitride, silicon carbide or silicon oxynitride film Download PDF

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Publication number
TW200907562A
TW200907562A TW097120233A TW97120233A TW200907562A TW 200907562 A TW200907562 A TW 200907562A TW 097120233 A TW097120233 A TW 097120233A TW 97120233 A TW97120233 A TW 97120233A TW 200907562 A TW200907562 A TW 200907562A
Authority
TW
Taiwan
Prior art keywords
thickness
template
outer cover
patterned layer
lithography template
Prior art date
Application number
TW097120233A
Other languages
English (en)
Chinese (zh)
Inventor
Douglas J Resnick
Mario J Meissl
Kosta S Selinidis
Frank Y Xu
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of TW200907562A publication Critical patent/TW200907562A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW097120233A 2007-05-30 2008-05-30 Template having a silicon nitride, silicon carbide or silicon oxynitride film TW200907562A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94073707P 2007-05-30 2007-05-30

Publications (1)

Publication Number Publication Date
TW200907562A true TW200907562A (en) 2009-02-16

Family

ID=40094021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097120233A TW200907562A (en) 2007-05-30 2008-05-30 Template having a silicon nitride, silicon carbide or silicon oxynitride film

Country Status (5)

Country Link
US (2) US20090004319A1 (https=)
JP (1) JP2010537395A (https=)
KR (1) KR20100031570A (https=)
TW (1) TW200907562A (https=)
WO (1) WO2008150499A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10456111B2 (en) * 2006-12-07 2019-10-29 Samsung Medison Co., Ltd. Ultrasound system and signal processing unit configured for time gain and lateral gain compensation
SG174889A1 (en) * 2009-03-23 2011-11-28 Intevac Inc A process for optimization of island to trench ratio in patterned media
CN101629663B (zh) * 2009-08-18 2011-01-05 河北亚大汽车塑料制品有限公司 一种直插式快插接头
WO2014145634A2 (en) * 2013-03-15 2014-09-18 Canon Nanotechnologies, Inc. Nano imprinting with reusable polymer template with metallic or oxide coating
US12405537B2 (en) * 2021-07-27 2025-09-02 Canon Kabushiki Kaisha Devices, systems, and methods for the transformation and cropping of drop patterns

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997006012A1 (en) * 1995-08-04 1997-02-20 International Business Machines Corporation Stamp for a lithographic process
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6274393B1 (en) * 1998-04-20 2001-08-14 International Business Machines Corporation Method for measuring submicron images
US6207570B1 (en) * 1999-08-20 2001-03-27 Lucent Technologies, Inc. Method of manufacturing integrated circuit devices
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
EP1303792B1 (en) * 2000-07-16 2012-10-03 Board Of Regents, The University Of Texas System High-resolution overlay alignement methods and systems for imprint lithography
US6284653B1 (en) * 2000-10-30 2001-09-04 Vanguard International Semiconductor Corp. Method of selectively forming a barrier layer from a directionally deposited metal layer
US6387787B1 (en) 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
JP2003281791A (ja) * 2002-03-22 2003-10-03 Toshiba Corp 片面２層光ディスク及びその製造方法及び装置
US7083880B2 (en) * 2002-08-15 2006-08-01 Freescale Semiconductor, Inc. Lithographic template and method of formation and use
US7083860B2 (en) * 2002-08-16 2006-08-01 Emitec Gesellschaft Fuer Emissionstechnologie Mbh Metallic honeycomb body having at least partially perforated sheet-metal layers
US6936194B2 (en) * 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
US8349241B2 (en) * 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US20040065252A1 (en) * 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US6755984B2 (en) * 2002-10-24 2004-06-29 Hewlett-Packard Development Company, L.P. Micro-casted silicon carbide nano-imprinting stamp
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US20050098534A1 (en) * 2003-11-12 2005-05-12 Molecular Imprints, Inc. Formation of conductive templates employing indium tin oxide
TWI277815B (en) * 2004-01-16 2007-04-01 Hannstar Display Corp Liquid crystal display and manufacturing method of liquid crystal display including substrate
US7140861B2 (en) * 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
US7768624B2 (en) * 2004-06-03 2010-08-03 Board Of Regents, The University Of Texas System Method for obtaining force combinations for template deformation using nullspace and methods optimization techniques
US20060067650A1 (en) * 2004-09-27 2006-03-30 Clarence Chui Method of making a reflective display device using thin film transistor production techniques
US20060266916A1 (en) * 2005-05-25 2006-11-30 Molecular Imprints, Inc. Imprint lithography template having a coating to reflect and/or absorb actinic energy
JP2007058172A (ja) * 2005-07-28 2007-03-08 Mitsubishi Electric Corp 遮光膜付き基板、カラーフィルタ基板及びこれらの製造方法、並びに遮光膜付き基板を備えた表示装置。
US8850980B2 (en) * 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography

Also Published As

Publication number Publication date
US20090004319A1 (en) 2009-01-01
WO2008150499A1 (en) 2008-12-11
JP2010537395A (ja) 2010-12-02
US20100040718A1 (en) 2010-02-18
US7874831B2 (en) 2011-01-25
KR20100031570A (ko) 2010-03-23

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