TW200847864A - Deep-drilling method for printed circuit board - Google Patents

Deep-drilling method for printed circuit board Download PDF

Info

Publication number
TW200847864A
TW200847864A TW96119086A TW96119086A TW200847864A TW 200847864 A TW200847864 A TW 200847864A TW 96119086 A TW96119086 A TW 96119086A TW 96119086 A TW96119086 A TW 96119086A TW 200847864 A TW200847864 A TW 200847864A
Authority
TW
Taiwan
Prior art keywords
drilling
printed circuit
circuit board
drill
standard
Prior art date
Application number
TW96119086A
Other languages
English (en)
Chinese (zh)
Other versions
TWI321432B (https=
Inventor
Guo-Cheng Xu
Original Assignee
Wus Printed Circuit Kunshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wus Printed Circuit Kunshan Co Ltd filed Critical Wus Printed Circuit Kunshan Co Ltd
Priority to TW96119086A priority Critical patent/TW200847864A/zh
Publication of TW200847864A publication Critical patent/TW200847864A/zh
Application granted granted Critical
Publication of TWI321432B publication Critical patent/TWI321432B/zh

Links

Landscapes

  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW96119086A 2007-05-29 2007-05-29 Deep-drilling method for printed circuit board TW200847864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96119086A TW200847864A (en) 2007-05-29 2007-05-29 Deep-drilling method for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96119086A TW200847864A (en) 2007-05-29 2007-05-29 Deep-drilling method for printed circuit board

Publications (2)

Publication Number Publication Date
TW200847864A true TW200847864A (en) 2008-12-01
TWI321432B TWI321432B (https=) 2010-03-01

Family

ID=44823647

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96119086A TW200847864A (en) 2007-05-29 2007-05-29 Deep-drilling method for printed circuit board

Country Status (1)

Country Link
TW (1) TW200847864A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105643711A (zh) * 2014-12-03 2016-06-08 北大方正集团有限公司 Pcb的背钻方法和钻机
TWI610604B (zh) * 2016-08-17 2018-01-01 健鼎科技股份有限公司 電路板鑽孔保護結構及具有此鑽孔保護結構之印刷電路板製造方法
CN110831326A (zh) * 2019-10-21 2020-02-21 鹤山市世安电子科技有限公司 压接孔公差的控制方法、装置、设备及存储介质
TWI785820B (zh) * 2021-09-29 2022-12-01 欣興電子股份有限公司 去除孔壁局部金屬之方法及鑽針

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105643711A (zh) * 2014-12-03 2016-06-08 北大方正集团有限公司 Pcb的背钻方法和钻机
TWI610604B (zh) * 2016-08-17 2018-01-01 健鼎科技股份有限公司 電路板鑽孔保護結構及具有此鑽孔保護結構之印刷電路板製造方法
CN110831326A (zh) * 2019-10-21 2020-02-21 鹤山市世安电子科技有限公司 压接孔公差的控制方法、装置、设备及存储介质
CN110831326B (zh) * 2019-10-21 2021-07-09 鹤山市世安电子科技有限公司 压接孔公差的控制方法、装置、设备及存储介质
TWI785820B (zh) * 2021-09-29 2022-12-01 欣興電子股份有限公司 去除孔壁局部金屬之方法及鑽針

Also Published As

Publication number Publication date
TWI321432B (https=) 2010-03-01

Similar Documents

Publication Publication Date Title
CN100531519C (zh) 印刷电路板深度钻孔方法
US9827616B2 (en) Method for implementing high-precision backdrilling stub length control
CN105430913B (zh) 一种印刷电路板的钻孔方法
CN100566897C (zh) 使用单面敷铜板作为背钻盖板的钻孔方法
US20140093321A1 (en) Printed circuit board, and method and apparatus for drilling printed circuit board
TW200847864A (en) Deep-drilling method for printed circuit board
WO2015021775A1 (zh) 一种pcb板背钻方法和系统
CN101352858A (zh) Pcb板的背钻方法
CN108541145B (zh) 一种pcb上钻孔的方法
CN114877821B (zh) 一种pcb板的背钻深度检测系统及方法
KR20220035453A (ko) Pcb 단차홈 바닥에 니켈/금을 증착하는 가공 방법
CN110278660A (zh) 一种pcb板背钻装置及系统
CN104640380B (zh) 一种带孔环的非沉铜孔及印刷电路板制作方法
CN115413124B (zh) 电路板的加工方法及加工设备、计算机可读存储介质
JP5691762B2 (ja) プリント基板の製造方法
CN112654158A (zh) 一种提升阻抗精度的控制方法
CN106341960B (zh) 提高信号传输性能的电路板的制作方法
CN112804825B (zh) 控深钻孔的补偿方法和钻孔设备
CN115884501A (zh) 一种pcb板背钻内层铜检测结构及检测方法
KR102790026B1 (ko) 다층 회로 기판의 백드릴링 방법 및 회로 기판 제조 시스템
JP2609825B2 (ja) 多層配線基板の製造方法
CN116567935A (zh) Pcb背钻方法、控制器及设备
CN116017857B (zh) 一种提高背钻mapping效率的方法、计算机存储介质和背钻机
CN104281008B (zh) 曝光图像补偿方法
CN116170968A (zh) 线路板无铅喷锡检测方法、装置、计算机设备和存储介质

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees