TWI321432B - - Google Patents
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- Publication number
- TWI321432B TWI321432B TW96119086A TW96119086A TWI321432B TW I321432 B TWI321432 B TW I321432B TW 96119086 A TW96119086 A TW 96119086A TW 96119086 A TW96119086 A TW 96119086A TW I321432 B TWI321432 B TW I321432B
- Authority
- TW
- Taiwan
- Prior art keywords
- drilling
- printed circuit
- depth
- machine
- control device
- Prior art date
Links
- 238000005553 drilling Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- MZZINWWGSYUHGU-UHFFFAOYSA-J ToTo-1 Chemical compound [I-].[I-].[I-].[I-].C12=CC=CC=C2C(C=C2N(C3=CC=CC=C3S2)C)=CC=[N+]1CCC[N+](C)(C)CCC[N+](C)(C)CCC[N+](C1=CC=CC=C11)=CC=C1C=C1N(C)C2=CC=CC=C2S1 MZZINWWGSYUHGU-UHFFFAOYSA-J 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Landscapes
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96119086A TW200847864A (en) | 2007-05-29 | 2007-05-29 | Deep-drilling method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96119086A TW200847864A (en) | 2007-05-29 | 2007-05-29 | Deep-drilling method for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200847864A TW200847864A (en) | 2008-12-01 |
| TWI321432B true TWI321432B (https=) | 2010-03-01 |
Family
ID=44823647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96119086A TW200847864A (en) | 2007-05-29 | 2007-05-29 | Deep-drilling method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200847864A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105643711A (zh) * | 2014-12-03 | 2016-06-08 | 北大方正集团有限公司 | Pcb的背钻方法和钻机 |
| TWI610604B (zh) * | 2016-08-17 | 2018-01-01 | 健鼎科技股份有限公司 | 電路板鑽孔保護結構及具有此鑽孔保護結構之印刷電路板製造方法 |
| CN110831326B (zh) * | 2019-10-21 | 2021-07-09 | 鹤山市世安电子科技有限公司 | 压接孔公差的控制方法、装置、设备及存储介质 |
| TWI785820B (zh) * | 2021-09-29 | 2022-12-01 | 欣興電子股份有限公司 | 去除孔壁局部金屬之方法及鑽針 |
-
2007
- 2007-05-29 TW TW96119086A patent/TW200847864A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200847864A (en) | 2008-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |