200847773 九、發明說明： 【發明所屬之技術領域】 都化係關於影像攝取裝置，特別係關於-種小 型化影像攝取裝置。 # 【先前技術】 影料取裝置係數值攝像産品中最重要之組 件，其〉貝進對數位攝像产σ 、、' 響，隨著數位攝像產品#㈣定^影 標準，高品質及小尺數位攝像産品 -作爲數位攝像產品核心組件之 :::取衣置更是首當其衝地朝小尺 向！：，而影像攝取裳置中之影像感測器封裝之 ㊁：貝則疋决定影像攝取裝置之尺寸及品質之重要 馬提南影像攝取裝置之成像品質，將一些被動 ::==Γ整合成—體’來减少影像感測器於 °“虎切換及傳輪過程中産生之雜訊串音。 明 > 閱圖1，現有之—種整合有 感測器封裝1卜其包括—基體！、-支^之2 影像感測晶片3、兩個被動元件4 手 所述支撑件2設置於所述基…與其欠板容腔 「所述影像感測晶片3容置於該容腔少 6 1 電性及結構性連接。兩個被動元件4也容置^述 200847773 容腔6内與所述基體1電性及結構性連接。所述透明 蓋板5固設於所述支撑件2上將所述容腔6密封。該 影像感測器將被動元件4與影像感測晶片3整合於同 一封裝體内，從而達到改善訊號傳輸質量之目的，但 是’此種封裝結構需於基體1上爲被動元件4之安裝 預留一定之空間，因此使得整個影像感測器封裝之體 積增大，從而致使應用此種影像感測器封裝之影像攝 取裝置之體積龐大，不利於輕量化及小型化之發展。 【發明内容】 有鑒於此，有必要提供一種小型化之影像攝取裝 置。 一影像攝取裝置，其包括〆鏡頭；一影像感測器 封裝，該影像感測封裝與所述鏡頭對正設置之；該影 像感測器封裝包括：一基體，該基體上形成有一凹槽； 至乂被動凡件，該被動元件設置於所述基體之凹槽 内，一填充材料，該填充材料填充於所述基體之凹槽 内，覆蓋所述被動元件；—影像崩晶片，該影像感 測晶片由所述填充材料支撑於所述被動元件上方且 二所述基體電性連接；—第_點接材料，第—枯接材 料塗佈於所述影像感測日曰日片邊緣；及-蓋板，該蓋板 由所述第-黏接材料支撑於影像感測晶片上方。 〜像攝取裝置，其包括:-鏡頭;-影像感測器 封衣，該影像感測封裝與所述鏡頭對正設置；該影像 7 200847773 感測器封I包括：一基體’該基體上形成有至少一凹 ^至少-被動元件，該被動元件對應設置於所述基 =之凹槽内;-密封材料，該密封材料填充於所述基 肢之凹槽内，覆蓋所述被動元件；_影像感測晶片， 該影像感測晶片由所述密封材料支撑於所述被動元 件上方且與所述基體電性連接；—第—枯接材料，第 一粘接材料塗佈於所述影像感測晶片邊緣；及一蓋 板’該蓋板由所述第^黏接材料支撑於影像感測晶片 上方。 相較於先前技術’該影像攝取裝置采用將被動元 件設置於基體之凹槽内從而節省空間，减小影像攝取 裝置之體積，從而適應輕量化及小型化之發展趨勢。 【實施方式.】 請參閱圖2,本發明影像攝取襞置之較佳實施 例’該影像攝取裝置1〇〇包括一影像感測器封裝11〇 及一鏡頭模組13〇。所述影像感測器封裝110與鏡頭 相:組13 0對正設置。 所述衫像感測為封裝U 〇包括有一美濟容 個被動元件U4、填充材料ι15、_影1像感測晶片 116、多條導線m、第一粘接材料118、及一蓋板 119。 1 所述基體112用於承載所述影像感測晶片116 專電氣元件。該基體112包括一頂面1122及一與所 述上表面對應之底面1124。於該基體112之頂面1122 上開設有一凹槽1121。優選地，該凹槽之之尺 8 200847773 • 寸大於所述影像感測晶片116之尺寸並用以容置所 述被動元件114。所述凹槽1121内還可設置有可與 外部電路相電連接之包路（圖未不）。該基體U 2之頂 面1122上還設置有多個圍繞所述凹槽1121用於傳輸 訊號之輸入端1123，於其下表面上1124設置有多: 對應於所述輸入端1123之輸出端ι125，所述輪入端 1123與輸出端1125通過設置於該基體U2内部之電 路相電連接。所述設置於凹槽1121内之電路通過^ 置於該基體112上之輸入端1123及輸出端1125與外 部電路相電連接。可以理解，所述凹槽1 i 21亦可以係 由多個凹槽的组合。 所述被動元件114是用以改善影像感測訊號傳 輸品質之元件，其可以是電感元体、電容元件或者電 阻元件。該被動元件114收容於所述基體112之凹槽 1121内並與所述基體電性連接。 曰 填充材料115可爲樹脂等高分子聚合物。該填充 材料115填充於所述基體112之凹槽1121内，將設 • 凹槽1121内之被動元件114包覆，並將所述影 像感測晶片116支撑於所述被動元件116之上方。可 以理解該填充材料115可將該凹槽1121完全填充， f該填充材料115之表面與基體112之頂面1124之 $度一致，從形成一具有平整表面之基體ιι2。此 卜，该填充材料115也可填充部分凹槽HU，從而 邱Γ^121留出部分空間，將所述影像感測晶片出 :2谷ί該凹槽1121内，從而降低該影像感測封 = 之尚度。該填充材料115亦可由其它密封在料 9 200847773 影像感測晶片116爲一光敏元件，可將光訊贫 化爲電訊號，該影像感測晶片116有一上♦ ^ 及一下表面H64,其上表面1162設置有1 1165及環繞該感測區1165之多個晶片焊墊^ 影像感測晶片116通過其下表面1164固設於所= 充材料115上。可以理解於該影像晶片116之下面 ，所填充材料115之間可設置絕緣、隔熱或者電磁屏 敝層，也可以設置上述三者或者任意兩者組合形成之 设合層，從而防止於使用過程中由設置於其下部之被 動元件産生之熱量及電磁波對影像感測晶片ιΐ6之 正常工作造成影響’從而提高該影像攝取裝置之可靠 性。 ―、胃導線117爲導電性佳、抗氧化材料構成，所述每 :導線117之一端連接於影像感測晶片116之晶片焊 上1167上，另一端連接於基體之輸入端 。’、從而將影像感測晶片116電連接至基體112上。 =以理解所述影像感測晶片U 6也可通過導電片電 接，或者於所述基體112上設置電連接架，采用 =曰曰連接之方式將所述影像感測晶 ΐ6 電性連接。 之所述第一點接材料118塗佈於影像感測晶片116 + =緣側壁及其上表面1162之四周邊緣上，並進一 伸至影像感測晶片116周圍之基體112之上表面 之。曰遠第一點接材料118覆蓋所述影像感測晶片116 112曰^片焊塾1167及設置於基體112上之輸入端 /並包覆所述連接晶片焊墊η67及輸入端1123 之導線117。 200847773 透光蓋板ii9設置於所述第—粘接材料118上， =所述第一钻接材料m支撑於影像感測晶片ιΐ6 =方，並與該第-枯接材料11δ—同將影像感測晶 j 116之感測區1165密封，與基體112 一同將影 感測晶片Π6密封，從而將影像感測晶片116盥外部 環境隔離，提高影像感測晶片116之可靠性。/、 ^所述鏡頭13〇包括一鏡筒132、一鏡座134及一 第二粘接材料136，所述鏡筒132爲—中空柱體，其200847773 IX. Description of the invention: [Technical field to which the invention pertains] The chemistry system relates to an image pickup device, and more particularly to a small-sized image pickup device. # [Prior Art] The most important component of the camera product coefficient camera product, its >Beinto digital camera production σ,, ' 响, with digital camera products # (four) fixed shadow standard, high quality and small feet Digital camera products - as the core components of digital camera products::: Take the clothes is the first to face the small size! :, and the image sensor package in the image capture device: Bei Zeyi determines the size and quality of the image capture device. The image quality of the Mattinan image capture device is integrated into some passive::==Γ - Body' to reduce the image sensor's noise crosstalk generated during the tiger switching and passing process. Ming > Read Figure 1, the existing one is integrated with a sensor package 1 including its - base! 2, image sensing wafer 3, two passive components 4, the support member 2 is disposed on the base ... and its underlying cavity "the image sensing wafer 3 is accommodated in the cavity 6 1 Electrical and structural connection. The two passive components 4 are also arranged to electrically and structurally connect with the base body 1 in the cavity 47. The transparent cover plate 5 is fixed on the support member 2. Sealing the cavity 6. The image sensor integrates the passive component 4 and the image sensing die 3 in the same package, thereby improving the quality of the signal transmission, but the package structure needs to be on the substrate 1. Reserve a certain amount of space for the installation of the passive component 4, thus making the entire image The volume of the detector package is increased, so that the image capturing device using such an image sensor package is bulky, which is disadvantageous for the development of weight reduction and miniaturization. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a miniaturization. An image capturing device, comprising: a lens; an image sensor package, the image sensing package being disposed opposite to the lens; the image sensor package comprising: a substrate on the substrate Forming a recess; the passive component is disposed in the recess of the base body, a filling material, the filling material is filled in the recess of the base body to cover the passive component; a wafer, the image sensing wafer is supported by the filling material over the passive component and the substrate is electrically connected; a first-point material, a first bonding material is applied to the image sensing sundial a cover sheet, and a cover plate supported by the first adhesive material over the image sensing wafer. The image capture device includes: - a lens; - an image sensor seal, The image sensing package is aligned with the lens; the image 7 200847773 sensor cover 1 includes: a substrate 'the substrate is formed with at least one concave ^ at least passive component, and the passive component is correspondingly disposed on the base = a sealing material filled in the groove of the base limb to cover the passive component; an image sensing wafer supported by the sealing material in the passive Above the component and electrically connected to the substrate; a first bonding material, a first bonding material is applied to the edge of the image sensing wafer; and a cover plate is formed by the second bonding material Supported on the image sensing wafer. Compared with the prior art, the image capturing device adopts the passive component in the groove of the substrate to save space and reduce the volume of the image capturing device, thereby adapting to the development of lightweight and miniaturization. trend. [Embodiment.] Referring to Figure 2, a preferred embodiment of the image capture device of the present invention, the image capture device 1 includes an image sensor package 11A and a lens module 13A. The image sensor package 110 and the lens phase: group 130 are aligned. The shirt image sensing package U 〇 includes a Meiji capacitive component U4, a filling material ι15, a shadow image sensing wafer 116, a plurality of wires m, a first bonding material 118, and a cover 119. . 1 The base body 112 is configured to carry the image sensing chip 116 electrical component. The base 112 includes a top surface 1122 and a bottom surface 1124 corresponding to the upper surface. A recess 1121 is defined in the top surface 1122 of the base 112. Preferably, the dimension of the groove 8 200847773 is larger than the size of the image sensing wafer 116 and is used to accommodate the passive component 114. A recessed circuit (not shown) that can be electrically connected to an external circuit can also be disposed in the recess 1121. The top surface 1122 of the base U 2 is further provided with a plurality of input ends 1123 for transmitting signals around the recesses 1121, and a plurality of 1124 are disposed on the lower surface thereof: corresponding to the output end ι 125 of the input end 1123 The wheel terminal 1123 and the output terminal 1125 are electrically connected by a circuit disposed inside the base body U2. The circuit disposed in the recess 1121 is electrically connected to the external circuit through an input terminal 1123 and an output terminal 1125 disposed on the base 112. It can be understood that the groove 1 i 21 can also be a combination of a plurality of grooves. The passive component 114 is an component for improving the quality of the image sensing signal transmission, and may be an inductor element, a capacitor element or a resistance element. The passive component 114 is received in the recess 1121 of the base 112 and electrically connected to the base.曰 The filling material 115 may be a high molecular polymer such as a resin. The filling material 115 is filled in the recess 1121 of the base 112, encloses the passive component 114 in the recess 1121, and supports the image sensing wafer 116 above the passive component 116. It can be understood that the filling material 115 can completely fill the groove 1121, and the surface of the filling material 115 conforms to the degree of the top surface 1124 of the substrate 112 to form a substrate ιι2 having a flat surface. Therefore, the filling material 115 can also fill a part of the groove HU, so that the space is left, and the image sensing chip is out of the groove 1121, thereby reducing the image sensing seal. = the degree of success. The filling material 115 can also be sealed by other materials 9 200847773. The image sensing wafer 116 is a photosensitive element, which can deplete optical signals into electrical signals. The image sensing wafer 116 has an upper surface and a lower surface H64. 1162 is provided with 1 1165 and a plurality of wafer pads surrounding the sensing region 1165. The image sensing wafer 116 is fixed on the filling material 115 through the lower surface 1164 thereof. It can be understood that under the image wafer 116, an insulating, heat insulating or electromagnetic screen layer may be disposed between the filling materials 115, or a combination layer formed by combining the above three or any combination of the two may be provided to prevent the use process. The heat generated by the passive components disposed at the lower portion thereof and the electromagnetic waves affect the normal operation of the image sensing wafer ΐ6, thereby improving the reliability of the image pickup device. The stomach lead 117 is made of a highly conductive and anti-oxidation material, and each of the wires 117 is connected to the wafer soldering 1167 of the image sensing wafer 116, and the other end is connected to the input end of the substrate. The image sensing wafer 116 is thereby electrically connected to the substrate 112. In order to understand that the image sensing wafer U 6 can also be electrically connected through a conductive sheet, or an electrical connection frame is disposed on the substrate 112, the image sensing transistor 6 is electrically connected by means of a 曰曰 connection. The first point material 118 is applied to the periphery of the image sensing wafer 116 + the edge sidewall and the upper surface 1162 thereof and extends to the upper surface of the substrate 112 around the image sensing wafer 116. The first point bonding material 118 covers the image sensing wafer 116 112 and the soldering pad 1167 and the input end disposed on the substrate 112 and covering the connecting wafer pad η67 and the input terminal 1123. . 200847773 The transparent cover ii9 is disposed on the first bonding material 118, and the first drilling material m is supported on the image sensing wafer ι6 = square, and the image is combined with the first bonding material 11δ The sensing region 1165 of the sensing crystal 116 is sealed, and the image sensing wafer 6 is sealed together with the substrate 112 to isolate the image sensing wafer 116 from the external environment, thereby improving the reliability of the image sensing wafer 116. The lens 13A includes a lens barrel 132, a lens holder 134 and a second bonding material 136. The lens barrel 132 is a hollow cylinder.
内部設置有至少一鏡片1323及一濾波片UN，用^ ，所需之光線穿過’該鏡筒132之一端容置於鏡座 134 内。 鏡座134爲呈中空狀，其包括—筒部1342及一 座部1344’所述筒部1342呈中空圓柱狀，該筒部1342 收容所述鏡筒132。所述座部1344位於所述筒部1342 之一端，並與所述筒部1342相連接。所述筒部1342 及座β 1344之連接處形成一肩部1345。 该鏡頭130罩設於所述影像感測器封裝11〇上， •其中，鏡座134罩設於影像感測器封裝110之透光芸 板m上，鏡座m之肩部1345之底面通過 透光蓋板119頂面周緣之第二粘接材料136固設於所 述透光盍板119之頂面。可以理解，所述鏡座13〇 通過鏡座134之肩部1345設置於所述影像感測封裝 110上，因此，其鏡座134之對應於所述影像感測器 封叙110之基體112之頂面1122之端部可僅與所述 基體112之頂面ι122相接觸，或者與所述基體112 之頂面1122相分離。此外，爲加强所述鏡座134與 所述影像感測器封裝11〇之粘接强度，也可於所述鏡 11 200847773 座ί34之端部與所述基體112之頂面1122之間添加 粘接材，，從而提高其粘接可靠性。 119 施例中，通過於影像感測器封裝U0之基體 上故置凹槽1121，將被動元件114設置於該凹槽 描古了旦/二而於基體n2上爲被動元件再預留空間， 像感測器封裝110之封袭密度，從而减小影 德播術壯里封體貝，同時也相應之减小影At least one lens 1323 and a filter UN are disposed inside, and the desired light is passed through the one end of the lens barrel 132 to be placed in the lens holder 134. The lens holder 134 is hollow, and includes a cylindrical portion 1342 and a seat portion 1344'. The cylindrical portion 1342 has a hollow cylindrical shape, and the cylindrical portion 1342 accommodates the lens barrel 132. The seat portion 1344 is located at one end of the tubular portion 1342 and is coupled to the tubular portion 1342. A joint 1345 is formed at the junction of the tubular portion 1342 and the seat β 1344. The lens 130 is disposed on the image sensor package 11A, wherein the lens holder 134 is disposed on the light-transmissive plate m of the image sensor package 110, and the bottom surface of the shoulder portion 1345 of the lens holder m passes through A second bonding material 136 on the periphery of the top surface of the transparent cover 119 is fixed on the top surface of the transparent iridium plate 119. It can be understood that the lens holder 13 is disposed on the image sensing package 110 through the shoulder 1345 of the lens holder 134. Therefore, the lens holder 134 corresponds to the base 112 of the image sensor seal 110. The end of the top surface 1122 may only be in contact with the top surface ι 122 of the substrate 112 or be separated from the top surface 1122 of the substrate 112. In addition, in order to enhance the bonding strength between the lens holder 134 and the image sensor package 11 , a bonding between the end of the mirror 11 200847773 and the top surface 1122 of the substrate 112 may be added. The material is joined to improve the bonding reliability. 119 In the embodiment, the recessed component 1121 is disposed on the base of the image sensor package U0, and the passive component 114 is disposed in the recessed surface, and the passive component is reserved on the base n2. Like the seal density of the sensor package 110, thereby reducing the shadow of the cockroach, and also reducing the shadow
衣100之體積，達到小型化影像攝取裝置 丄UU之9的〇 可以理解，於本發明中設置於基體112之頂面 1122之凹槽1121也可設置於該基體ιΐ2之底面UK 上’所述被動元件114設置於所述凹槽1121内，影 像感測晶片116對應於所述被動元件114設置於所述 基體112之頂面1122上並與所述基體112相電連 接。從而使得於使用過程中由被動元件114所產生之 熱量由基體U2之下部向外擴散，從而减少因被動元 件産生之熱對該影像攝取裝置1〇〇之成像品質之影 綜上所述，本發明符合發明專利要件，爰依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施 本發明之範圍並不以上述實施方式為限，舉凡 熟習本案技藝之人士援依本發明之精神所作之等效 修飾或變化，皆應涵蓋於以下申請專利範圍内。> 【圖式簡單說明】 圖1係現有之一種影像感測器之剖視圖。 12 200847773 圖2係本發明影像攝取裝置較佳實施例之剖視 圖。 【主要元件符號說明】 (習知） 基體 1 影像感測晶片 3 透明蓋板 5 影像感測器封裝 10 (本發明） 影像攝取裝置 100 基體 112 頂面 1122 底面 1124 被動元件 114 影像感測晶片 116 下表面 1164 晶片焊墊 1167 第一粘接材料 118 鏡頭 130 鏡片 1323 鏡座 134 座部 1344 支撑件 2 被動元件 4 容腔 6 影像感測器封裝 110 凹槽 1121 輸入端 1123 輸出端 1125 填充材料 115 上表面 1162 感測區 1165 導線 117 透光蓋板 119 鏡同 132 遽波片 1324 筒部 1342 肩部 1345 13The volume of the garment 100 is up to the size of the miniaturized image capture device 丄UU9. It can be understood that the groove 1121 disposed on the top surface 1122 of the base 112 can also be disposed on the bottom surface UK of the substrate ι2 in the present invention. The passive component 114 is disposed in the recess 1121 , and the image sensing wafer 116 is disposed on the top surface 1122 of the base 112 and electrically connected to the base 112 corresponding to the passive component 114 . Therefore, the heat generated by the passive component 114 during use is diffused outward from the lower portion of the substrate U2, thereby reducing the imaging quality of the image pickup device 1 by the heat generated by the passive component. The invention meets the requirements of the invention patent, and the patent application is filed according to law. However, the scope of the present invention is not intended to limit the scope of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention should be included. It is within the scope of the following patent application. > [Simple description of the drawing] Fig. 1 is a cross-sectional view of a conventional image sensor. 12 200847773 Figure 2 is a cross-sectional view of a preferred embodiment of the image capture device of the present invention. [Main Component Symbol Description] (General) Base 1 Image Sensing Wafer 3 Transparent Cover 5 Image Sensor Package 10 (Invention) Image Pickup Device 100 Base 112 Top Surface 1122 Bottom Surface 1124 Passive Element 114 Image Sensing Wafer 116 Lower surface 1164 wafer pad 1167 first bonding material 118 lens 130 lens 1323 mirror holder 134 seat 1344 support 2 passive component 4 cavity 6 image sensor package 110 groove 1121 input 1123 output 1125 filling material 115 Upper surface 1162 Sensing area 1165 Conductor 117 Light transmissive cover 119 Mirror with 132 Chopper plate 1324 Cylinder 1342 Shoulder 1345 13