五、新型說明： 【新型所屬之技術領域】 影像=有關於，細·，尤指-㈣型化 【先前技銜】 近年來由於多媒體的蓬勃 趨頻繁，相對應地，許多影像。像的使用已愈 c現今許多數位影像產品中，勺衣置的品求也愈來愈多 照相機，甚至光學掃描器及影電腦網路攝影機，數位 測器來擷取影像。—般來％，屯6舌等，皆是經由影像感 元件影像感測晶片或互補式金Ί践測器可以是電荷輕合 可靈敏地接收待操取物所發出t導體影像感測晶片，其 為數位訊號。由於這些影像二並將此光線轉換 其封裝方式與一般電子產品有需要接收光源，因此V. New description: [New technology field] Image = related, fine, especially - (four) type [previous technical title] In recent years, due to the booming of multimedia, correspondingly, many images. The use of images has become more and more. In many digital imaging products today, there are more and more products for scooping. Cameras, even optical scanners and video network cameras, digital cameras are used to capture images. - the average of the %, the 屯6 tongue, etc., are through the image sensing device image sensing chip or the complementary metal Ί 器 可以 可以 可以 可以 可以 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , It is a digital signal. Since these images and the light are converted to the package and the general electronic products need to receive the light source,
傳統影像感測晶片所使 P 塑膠無接腳承載哭4、、裝技術大部分是採用 術》簡以^。1㈣喊域腳承餘封裝技 晶片封裝結技術為例，傳統的影像感測 =成。影像感測晶片配置於基座上，並透過打二 使影像感測晶片與基座產生電性連接。此：： “裝基=-封=間來容納影 可穿:破蹲，與導線’而光線則 過二此測晶片封裝結構的整體厚度仍然 度已成為該項事鞏二影像威都晶月封裝結構的整體厚 、条人士所欲解決的重要課題。 【新型内容】 可應::::施例在於提供-種薄型化影像擷取模組，其 、具有薄型化空間的電子產品内。 本总1 :-基板單福鑛供—_型化影_取·，其包括 頭單元。基=一影像榻取單元、一固定耀單元、及一鏡 基板本體了^早兀包括一中空基板本體、多個設置於中空 底端的底端導:::導”塾、多個設置於中空基板本體 中的至少連接於上述多_端導電焊塾 間。的至少一個之 接於基板單元的旦^ v一谷置於容置空間内且電性連 容置空間内且/1=取晶片。固定膠單元包括-填充於 的固定膠體。於二-tf基板本體與影像操取晶片之間 鏡頭單元包括置於中空基板本體的頂端上，且 擷取晶片的透鏡群1。；影像揭取晶片上方且對應於影像 組，= 實!例所提供的薄型化影像操取模 且電性連接於基板/d像擷取晶片容置於容置空間内 間内且固定於中介其也〃、將固定膠體填充於容置空 影像擷取晶片相;;影像掏取晶片之間， 以固定 得本創作的_化％=基板本體的位置，，的設計，以使 目的，而且也可上像=模組不僅可以達到薄型化的 為使能更進瞭./、薄型化空間的電子產品内。 閱以下有關本創作之二”本創作之特徵及技術内容，請參 砰細說明與附圖，然而所附圖式僅提 4/16 供參考與說明用，並非用來對本創作加以限制者c 【實施方式】 〔第一實施例〕 請參閱圖1、圖2A至圖2H、及圖3A至圖3C所示， 本創作第一實施例提供一種薄型化影像擷取模組的製作 方法，其至少包括下列幾個步驟： 步驟S100為：首先，配合圖1與圖2A所示，將至少 一雙面黏著件Η貼附在一承載板B上，以用於定位雙面黏 著件Η。再者，雙面黏著件Η具有兩個相反的黏著面Η10 ，且雙面黏著件Η的其中一黏著面Η10貼附在承載板Β 上。舉例來說，雙面黏著件Η可為一雙面黏著膠帶，且雙 面黏著件Η的最高耐熱溫度可界於190°C至210°C之間， 然而本創作所使用的雙面黏著件Η不以上述所舉的例子為 限。 步驟S102為：接著，配合圖1與圖2Β所示，將至少 一影像擷取晶片20貼附在雙面黏著件Η上(影像擷取晶片 20貼附在雙面黏著件Η的另外一黏著面Η10上），以用於 定位影像擷取晶片20。再者，影像擷取晶片20的頂端具 有多個電性導通焊墊200。舉例來說，影像擷取晶片20可 為一用於擷取影像的影像感測晶片。 步驟S104為：然後，配合圖1與圖2C所示，將一基 板單元1貼附在雙面黏著件Η上，其中基板單元1包括一 貼附在雙面黏著件Η上且圍繞影像擷取晶片20的中空基 板本體10，中空基板本體10具有至少一用於容置影像擷 取晶片20的容置空間100,且容置空間100貫穿中空基板 本體10。再者，配合圖2C、及圖3Α至圖3C所示，基板 ^道^進v包括多個设置於中空基板本體10頂端的 焊塾11、多個設置於中空基板本體10底端的底 ^电焊塾12、及多_埋於中空基板本體]Q _内埋 電執跡13 ’且每—個内埋式導電轨跡 =個頂端導電焊塾”⑽-個與上述多：端 塾12中的至少—個之間。舉例來說，依據不同的 下需求，基板單元1可為喊基板、BT(Bismaleimide naZ=基板、或任何的電路基板，然而本創作所使用的 土扳單兀1不以上述所舉的例子為限。 晶 …步驟S106為：接下來，配合圖卜2C與圖2D所示， 形成-固定膠體3G於中空基板本體1〇與影像擷取晶片2〇 之間’以固定影像擷取晶片2〇相對於中空基板本體1〇的 位置。換言之’以中空基板本體1〇、影像擷取晶片20、 及固定膠體30三者彼此的結獅絲討論，由於固定膠 體30可為一穩固地容置於容置空間1〇〇内，且固定於中 空基板本體10與影像擷取晶片2〇之間的圍繞狀固定膠體 ，所以固定膠體30可圍繞且緊貼影像擷取晶片2〇。再者 由於中空基板本體10可為一圍繞狀的基板本體，所以 中空基板本體10可圍繞且緊貼固定膠體30。舉例來說 可先填充液態膠(圖未示)於中空基板本體1〇與影像擷取 片20之間，然後再固化液態膠，以形成上述位於容置空 間100内且固定於中空基板本體1〇與影像擷取晶片2〇之 間的固定膠體30。再者，依據不同的使用需求，固定膠齄The traditional image sensing chip enables the P plastic to carry the crying without the pin 4, and most of the mounting techniques are based on the technique. 1 (four) shouting the domain foot bearing packaging technology chip encapsulation technology as an example, the traditional image sensing = Cheng. The image sensing chip is disposed on the pedestal, and electrically connected to the image sensing chip and the pedestal through the second. This:: "Installation base = - seal = between to accommodate the shadow can be worn: broken, with the wire 'and the light is over the second measure of the overall thickness of the chip package structure has become the matter of the two images Weidu Jingyue The overall thickness of the package structure and the important issues that the person wants to solve. [New content] The application:::: The example is to provide a thin image capture module, which has a thin space in the electronic product. The total 1 :- substrate single bucks for the _ type of shadow _ take ·, including the head unit. Base = an image reclining unit, a fixed glare unit, and a mirror substrate body ^ early includes a hollow substrate The main body and the plurality of bottom end guides disposed at the bottom end of the hollow end are connected to at least the plurality of galvanic conductive pads. At least one of the substrate cells is placed in the accommodating space and electrically connected to the space and /1 = the wafer is taken. The fixing glue unit comprises a fixing gel filled in. Between the two-tf substrate body and the image manipulation wafer The lens unit includes a lens group 1 placed on the top end of the hollow substrate body and drawing the wafer. The image is taken over the wafer and corresponds to the image group, and the thinned image processing mode provided by the example is electrically connected to the substrate/d image capturing wafer and placed in the accommodating space and fixed in the medium. The 胶 〃 将 将 将 将 填充 填充 填充 填充 填充 填充 填充 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; It is also possible to use the image=module not only to be thinner, but also to enable electronic products that have been made into a thinner space. Read the following description of the characteristics and technical content of this creation. Please refer to the detailed description and the drawings. However, the drawings only refer to 4/16 for reference and explanation, and are not intended to limit the creation. [Embodiment] [First Embodiment] Referring to FIG. 1, FIG. 2A to FIG. 2H, and FIG. 3A to FIG. 3C, a first embodiment of the present invention provides a method for fabricating a thinned image capturing module. The method includes the following steps: Step S100 is: First, as shown in FIG. 1 and FIG. 2A, at least one double-sided adhesive member Η is attached to a carrier B for positioning the double-sided adhesive member. The double-sided adhesive member has two opposite adhesive faces 10, and one of the adhesive faces 10 of the double-sided adhesive member is attached to the carrier plate 。. For example, the double-sided adhesive member can be a double-sided adhesive Adhesive tape, and the highest heat-resistant temperature of the double-sided adhesive member can be between 190 ° C and 210 ° C. However, the double-sided adhesive member used in the present invention is not limited to the above examples. Step S102 is : Next, as shown in FIG. 1 and FIG. 2A, at least one image is taken from the wafer 2 0 is attached to the double-sided adhesive member (the image capture wafer 20 is attached to the other adhesive surface 10 of the double-sided adhesive member) for positioning the image capture wafer 20. Further, the image capture wafer The top of the 20 has a plurality of electrical conductive pads 200. For example, the image capturing wafer 20 can be an image sensing wafer for capturing images. Step S104 is: then, as shown in FIG. 1 and FIG. 2C A substrate unit 1 is attached to the double-sided adhesive member, wherein the substrate unit 1 includes a hollow substrate body 10 attached to the double-sided adhesive member and surrounding the image capturing wafer 20, the hollow substrate body 10 having at least An accommodating space 100 for accommodating the image capturing wafer 20, and the accommodating space 100 is inserted through the hollow substrate body 10. Further, as shown in FIG. 2C and FIG. 3A to FIG. 3C, the substrate includes a plurality of soldering holes 11 disposed at the top end of the hollow substrate body 10, a plurality of soldering holes 12 disposed at the bottom end of the hollow substrate body 10, and a plurality of buried electrodes 12' embedded in the hollow substrate body Q__ —a buried conductive track=one top conductive pad” (10)-one with the above: At least 12 - months between. For example, depending on different requirements, the substrate unit 1 may be a substrate, a BT (Bismaleimide naZ=substrate, or any circuit substrate. However, the soil slab 1 used in the present creation is not based on the above-mentioned example. Step S106 is as follows: Next, in conjunction with FIG. 2C and FIG. 2D, a forming-fixing colloid 3G is formed between the hollow substrate body 1 and the image capturing wafer 2' to capture the wafer 2 with a fixed image. Relative to the position of the hollow substrate body 1 。. In other words, the hollow slab body 1 〇, the image capture wafer 20, and the fixed colloid 30 are discussed with each other, since the fixed colloid 30 can be firmly accommodated. The accommodating space is 1 ,, and is fixed to the surrounding fixed colloid between the hollow substrate body 10 and the image capturing wafer 2 ,, so the fixing colloid 30 can surround and closely follow the image capturing wafer 2 〇. The substrate body 10 can be a surrounding substrate body, so that the hollow substrate body 10 can surround and adhere to the fixed colloid 30. For example, liquid glue (not shown) can be first filled on the hollow substrate body 1 and the image capturing sheet. 20 And then cured liquid glue, to form the accommodating space positioned and fixed to the hollow body 1〇 substrate and fixing the image capture colloidal wafer 100 between the 2〇 30. Further, according to different needs, gluing Zha
30 可由 ABLEBOND 2035SOLOCTITE 3128、或 LOCTITI 2204…等材料來製作，然而本創作所使用的固定膠體3( 不以上述所舉的例子為限。 6/16 M416115 再者，配合圖2D、圖3A、及圖3C所示，中空基板 本體10的内表面上具有至少一形成於容置空間1〇〇内且 被固定膠體30所覆蓋的圍繞狀凸部。透過圍繞狀凸部 101的使用，固定膠體3〇接觸中空基板本體1〇内表面的 面積可以被有效地增加，所以固定膠體3〇可以被更稃固 地緊貼在中空基板本體1〇的内表面上，且更穩固地固定 於中空基板本體10與影像擷取晶片2〇之間。當然，單個 的圍繞狀凸部101亦可換替成多個形成於中空基板本體⑴ 的内表面上且彼此分離一預定距離的微凸部（圖未示），亦 即使用單個的圍繞狀凸部101或多個微凸部，都可以達 ，固地g影像_晶片2G相對於中絲板本體]0的位 =此^中空基板本體1G的底面、影_取晶片 底面、及固定膠體30的底實 取晶片20的厚声hI可==上可以齊平，且影像操 m L 子度hI可小於中空基板本體10的厚戶h2， 因此影像擷取晶片20可 入 又h2 。 了以凡王被谷納於容置空間1〇〇内 步驟S]08為：緊接荽人 像榻取晶片2〇電性連接於i與圖2£所示，將影 像操取晶片2。的頂舉例來說，由於影 像榻取晶片20的多個電性導通二^通卜墊細，所以影 導電線W以分別電性連接 ：_ 200可分別透過多個30 can be made of materials such as ABLEBOND 2035SOLOCTITE 3128, or LOCTITI 2204..., however, the fixed colloid 3 used in this creation is not limited to the above examples. 6/16 M416115 Furthermore, with Figure 2D, Figure 3A, and As shown in FIG. 3C, the inner surface of the hollow substrate body 10 has at least one surrounding convex portion formed in the accommodating space 1A and covered by the fixing colloid 30. The fixed colloid 3 is fixed by the use of the surrounding convex portion 101. The area of the inner surface of the crucible contacting the hollow substrate body 1 can be effectively increased, so that the fixing colloid 3 can be more firmly adhered to the inner surface of the hollow substrate body 1 and more firmly fixed to the hollow substrate body. 10 and the image capturing wafer 2 。. Of course, the single surrounding convex portion 101 can also be replaced by a plurality of micro convex portions formed on the inner surface of the hollow substrate body (1) and separated from each other by a predetermined distance (Fig. Illustratively, that is, using a single surrounding convex portion 101 or a plurality of micro convex portions, the position of the solid image _ wafer 2G with respect to the middle wire plate body 0 = the bottom surface of the hollow substrate body 1G Film The thick sound hI of the surface of the wafer 30 and the bottom of the fixed colloid 30 can be flushed, and the image processing angle hI can be smaller than the thickness h2 of the hollow substrate body 10, so that the image capturing wafer 20 can be Into the h2. In the case of Van Wang was placed in the space of the room 1 step S] 08: next to the portrait of the couch to take the chip 2 〇 electrically connected to i and Figure 2 £, the image is taken For example, in the top of the wafer 2, since the plurality of electrical conduction of the wafer 20 is thin, the shadow conductive wires W are respectively electrically connected: _200 can be respectively transmitted through multiple
塾】】，以使得影像操取晶片=的多個頂端導電桿 。換言之，影像操取晶片2 $性連接於基板單元I 連接於基板單元】。 可以透過打線的方式以電性 早心定位於中空基板本 =圖$所不’將鏡頭 〇的頂蠕上，其中鏡頭單元4 7/16 M416115 包括-設置於影像触⑸20上方且對應於影像擷取晶 片2〇的透鏡群組4〇，其可由多個透鏡所組成。舉例來說 ’鏡頭單元4包括一外殼體4】’外殼體41的底部具有一 圍繞狀固定架410，且圍繞狀固定架4丨〇可透過一圍繞狀 黏著體A1以定位於中空基板本體】〇的頂端上。再者，依 據不同的使用需求，圍繞狀黏著體A1可由l〇CTITE3128 或LOCTITE 2204...等材料所製作，然、而本創作所使用的 圍繞狀黏著體A1不以上述所舉的例子為限。 乂驟S112為.接著，配合圖】、2F與圖所示，移 除承載板B，以露出雙面黏著件H。 步驟S114為.最後，配合圖1與圖2H所示，將基板 置於—主電路板Μ上，其中雙面黏著件Η的其 咖同時貼附於中空基板本體1G的底面上、 片2G的底面上、及固轉體3G的底面上，雙 二Γ另外—黏著面_貼附於主電路板^1上， 電二二焊塾12可分別透過多^ 體A2也可以用主電路板M。當然，上述多個導電 film，ACF)來取代"性導電膠帶(AnisotroPic conduCtive 帶時，基板單元〗2言之’當本創作制異方性導電膠 性導電勝帶以分^ ^底端導電焊墊12即可透過異方 域(圖未示）。 I性連接於主電路板Μ的不同導電區 清再次參閱圖一 的製作流程後，太❾戶斤示，經過上述步驟⑽0至SU4 像操取模組，其」作第—實施例可以提供—種_化影 、一固定膠單:I括：—基板單元1、一影像擷取單元2 ^疋3、及一鏡頭單元〇 8/16 百疋，基板單元 於中空基板本體^頂=二本㈣、多個設置 5空基板本體10底端的底端導雷、多個設置於 :ϊ=10内的内埋式導‘:ΐίΤ: =本植10具有至少—容置空間⑽ 、中，中空基 執跡η電性連接於上述多個;母—㈣埋式導電 個與上述多個底端導電料，的至少- ，中空基板本體10的内表面:=::<間。舉例 置工間100内的圍繞狀凸部1〇]，且;；，=、形成於容 空基板本體10。 今呈二間丨0〇貫穿中 再者’影像擷取單元2包括、—^ 内且電性連接於聽單元】的影_^^1空間100 於影像練晶片2G的頂端具有多 °舉例來說 •类所以影像操取晶片20的多個電性導 ζ通焊墊200 透過多個導電線W以分別電性連接於Α板單0〇可分別 =電_1，以使得影像操取以'；^；；^個頂 基板單元】。換t夕，旦/游& ^ 电性連接於 式以電性連接於。基板單^操取晶片2〇可以透過打線的方 固定1匕1卜’固定勝單元3包括一填充於容置空間】〇〇内且 體30; 1工基板本體10與影像擷取晶片20之間的固定膠 W列來說’固定勝體30可圍繞且緊貼影像掏取晶 去、j且令空基板本體⑺可圍繞且緊貼固定膠體30。再 其;*過圍繞狀凸部】〇1的使用，固定膠體30接觸中空 二二1()、__面積可以被有效地增加’所以固定 :版T以被更穩固地緊貼益中空基板本體】〇的内表面 且更％固地固定於中空基板本體10與影像擷取晶片20 之間。當然，單個的圍繞狀凸部10]亦可換替成多個形成 於中空基板本體10的内表面上且彼此分離一預定距離的 微凸部（圖未示）’亦即使用單個的圍繞狀凸部101或多個 微凸部，都可以達到穩固地定位影像擷取晶片20相對於 中二基板本體1〇的位置。此外，中空基板本體1〇的底面 〜像恸取晶片20的底面、及固定膠體3〇的底面實質上 了 乂 θ平，且景夕像操取晶片2〇的厚度hi可小於中空基板 本體10的厚度h2’因此影像擷取晶片20可以完全被容納 於容置空間1〇〇内。 、 另外，鏡頭單元4設置於中空基板本體10的頂端上 '兄頭單元4包括—設置於影像擷取晶片2〇上方且對 應於影像齡W 2〇⑽鏡频W。糊來說，鏡頭單 =包括-外殼體4卜外殼體41的底部具有一圍繞狀固 疋木41G，且圍繞狀固定架㈣透過—圍繞狀黏著體 以定位於中空基板本體10的頂端上。 从此外，本創作第—實施例更進—步包括：至少一雙面 L其具有兩個相反的黏著面hig ’其中雙面點著 的中一黏著面Hl〇同時貼附於中空基板本體1〇的 氏面上、影像操取晶片2〇的底面上、及固定膠體30的底 且雙面黏著件H的另外—黏著面剛貼附於一主電 上二#中空基板本體10設置於主電路板Μ Α2以底端導電焊塾12可分別透過多個導電體 π ^連接於主電路板Μ。當·然，上述多個導電體Α2 ACF)來取^ 谧士 電知帶(AniS〇tr叩iC C〇nduCtive fllm ’ 基板個底Μ料墊12料透過異方性導電 10/16 W π从/刀、别電性連接於主電 示）e 攸」的不同導電區域（圖未 〔第二實施例〕 請參_4、及圖5A至圖 例提供一種薄型化影像操 不本創作第二實施 1的比較可知，第二實_=^作方法4圖4與圖 —實施例的步驟S100至§112^驟S200至S212分別與第 貫施例最大的不同在於：在井相同而第二實施例與第一 ，第二實施例的薄型化影像=/212(如圖2G戶斤示)之後 包括： 軸取模组的製作方法更進-步 步驟S214為：配合圖4、 雙面黏著件H，以同時霖 θ 2(3、與圖5A所示，移除 擷取晶片20的底面、及固定:二反本體1〇的底面、影像 步驟切6為：配合圖4二，〇的底面。 設置於-主電路板乂上，^圖所示，將基板單元1 可分別透過多個導電體八2=干上述多個底端導電焊墊12 此，由圖5Β與圖2Η的比争性連接於主電路板Μ。因 像擷取模組可以省略螯可头第一貫施例的薄型化影 〔實施例的可能功效〕者件_使用。 综上所述，本創作實 驗，其可透過“將至少二务斤提供的薄型化影像擷取模 及電性連接於基板單元” 1像_晶片容置於容置空間内 巧固定於中空基板本體與於容置空 得象操取晶片相對於中空基板本體的位置二以固定 目創作的薄型化影像擷取_不僅可，以使 的’而且也可以應用於具有薄型化空間，=的 .11/16 M416115 以上所述僅為本創作之較佳可行實施例，非因此侷限 本創作之專利範圍，故舉凡運用本創作說明書及圖式内容 所為之等效技術變化，均包含於本創作之範圍内。 【圖式簡單說明】 圖1為本創作製作方法的第一實施例的流程圖； 圖2A為本創作第一實施例步驟S100的側視剖面示意圖； 圖2B為本創作第一實施例步驟S102的側視剖面示意圖； 圖2C為本創作第一實施例步驟S104的側視剖面示意圖； 圖2D為本創作第一實施例步驟S106的側視剖面示意圖； 圖2E為本創作第一實施例步驟S108的側視剖面示意圖； 圖2F為本創作第一實施例步驟SUO的側視剖面示意圖； 圖2G為本創作第一實施例步驟S112的側視剖面示意圖； 圖2H為本創作第一實施例步驟S114的側視剖面示意圖； 圖3A為本創作第一實施例基板單元的側視剖面示意圖； 圖3B為本創作第一實施例基板單元的上視示意圖； 圖3C為本創作第一實施例基板單元的底視示意圖； 圖4為本創作製作方法的第二實施例的流程圖； 圖5A為本創作第二實施例步驟S214的側視剖面示意圖； 以及 圖5B為本創作第二實施例步驟S216的側視剖面示意圖。 【主要元件符號說明】 基板單元 1 中空基板本體 1〇 容置空間 100 圍繞狀凸部 101 ' 頂端導電焊墊 11 底端導電焊墊 12 12/16 M416115 • · 内埋式導電執跡 13 影像擷取單元 2 影像擷取晶片 20 電性導通焊墊 200 固定膠單元 Λ 固定膠體 30 鏡頭單元 4 透鏡群組 40 外殼體 41 圍繞狀固定架 410 圍繞狀黏著體 Α1 導電體 Α2 承載板 Β 雙面黏著件 Η 黏著面 H10 主電路板 Μ 導電線 W 厚度 hi、h2 13/16塾]], so that the image is operated by the wafer = a plurality of top conductive rods. In other words, the image processing chip 2 is connected to the substrate unit I to be connected to the substrate unit. The lens can be positioned on the hollow substrate by means of wire bonding. The lens unit 4 7/16 M416115 includes - is disposed above the image touch (5) 20 and corresponds to the image 撷A lens group 4A of the wafer 2 is taken, which may be composed of a plurality of lenses. For example, the 'lens unit 4 includes an outer casing 4'. The bottom of the outer casing 41 has a surrounding fixing frame 410, and the surrounding fixing frame 4 is permeable to a surrounding adhesive body A1 to be positioned on the hollow substrate body. On the top of the cockroach. Furthermore, depending on the needs of use, the surrounding adhesive body A1 can be made of materials such as l〇CTITE3128 or LOCTITE 2204..., however, the surrounding adhesive body A1 used in the present invention is not based on the above-mentioned example. limit. Step S112 is as follows. Next, in conjunction with the drawings, 2F and the figure, the carrier plate B is removed to expose the double-sided adhesive member H. Step S114 is. Finally, as shown in FIG. 1 and FIG. 2H, the substrate is placed on the main circuit board, wherein the double-sided adhesive member is attached to the bottom surface of the hollow substrate body 1G at the same time, and the sheet 2G is attached. On the bottom surface and on the bottom surface of the solid body 3G, the double-twisted-adhesive surface _ is attached to the main circuit board ^1, and the electric second-welded soldering 12 can be respectively transmitted through the multi-body A2 or the main circuit board M. . Of course, the above-mentioned plurality of conductive films, ACF) are used to replace the "conductive tape" (AnisotroPic conduCtive tape, the substrate unit is said to be 'in the sense of 'in this case, the anisotropic conductive conductive conductive tape is divided into ^ ^ bottom conductive The solder pad 12 can pass through the hetero-domain (not shown). The different conductive areas connected to the main circuit board are cleaned. Referring to the production process of Figure 1, again, after the above steps (10) 0 to SU4 The operation module can be provided as a first embodiment to provide a type of film, a fixed glue sheet: I include: - a substrate unit 1, an image capturing unit 2 ^ 疋 3, and a lens unit 〇 8 / 16 hundred 疋, the substrate unit is in the hollow substrate body ^ top = two (four), a plurality of 5 empty substrate body 10 at the bottom end of the mine guide, a plurality of embedded guides set in: ϊ = 10: ΐ Τ Τ: The plant 10 has at least an accommodating space (10), and a hollow base θ is electrically connected to the plurality of; the mother-(four) buried conductive material and the plurality of bottom conductive materials, at least - the hollow substrate body The inner surface of 10: =:: < between. For example, the surrounding convex portion 1 in the work space 100], and;;, =, formation The space of the substrate body 10 is now two in the middle of the 〇0〇 through the 'image capturing unit 2 includes, -^ and electrically connected to the listening unit 】 ^ ^ 1 space 100 in the image training wafer 2G The top end has a plurality of types. For example, the plurality of electrically conductive conductive pads 200 of the image processing chip 20 are electrically connected to the single plate through the plurality of conductive wires W, respectively, and can be respectively electrically _1. In order to make the image operate as ';^;; ^ top substrate unit]. For t, ‧ / 游 & ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The square fixed 1 匕 1 卜 'fixed win unit 3 includes a fill in the accommodating space 〇〇 且 and body 30; 1 fixed substrate between the substrate body 10 and the image capture wafer 20 The body 30 can be surrounded and adhered to the image, and the empty substrate body (7) can surround and adhere to the fixed colloid 30. Further; * use of the surrounding convex portion], the fixed colloid 30 contacts the hollow two The two 1 (), __ area can be effectively increased 'so fixed: version T to be more firmly attached to the inner surface of the hollow substrate body 〇 〇 And more fixedly fixed between the hollow substrate body 10 and the image capturing wafer 20. Of course, the single surrounding convex portion 10] may be replaced by a plurality of formed on the inner surface of the hollow substrate body 10 and separated from each other. A predetermined distance micro-protrusion (not shown), that is, using a single surrounding convex portion 101 or a plurality of micro-convex portions, can stably position the image capturing wafer 20 relative to the middle two substrate body 1 In addition, the bottom surface of the hollow substrate body 1 to the bottom surface of the drawing wafer 20 and the bottom surface of the fixed colloid 3 are substantially 乂 θ flat, and the thickness hi of the wafer 2 操 can be smaller than the hollow substrate. The thickness h2 of the body 10 is such that the image capturing wafer 20 can be completely accommodated in the accommodating space 1 。. Further, the lens unit 4 is disposed on the top end of the hollow substrate body 10. The "head unit 4 includes" disposed above the image capturing wafer 2A and corresponds to the image age W 2 (10) image frequency W. For the paste, the lens sheet includes the outer casing 4, and the outer portion of the outer casing 41 has a surrounding solid mulch 41G, and the surrounding fixing frame (four) is permeable to the surrounding adhesive to be positioned on the top end of the hollow substrate body 10. In addition, the second embodiment of the present invention further includes: at least one double-sided L having two opposite adhesive faces hig' wherein the double-sided adhesive surface H1 is simultaneously attached to the hollow substrate body 1 The surface of the crucible, the bottom surface of the image processing wafer 2, and the bottom of the fixed colloid 30, and the other adhesive surface of the double-sided adhesive H is attached to a main electric power. The hollow substrate body 10 is disposed on the main body. The circuit board Μ 2 has a bottom conductive pad 12 connected to the main circuit board by a plurality of conductors π ^ , respectively. When, the above plurality of electrical conductors A2 ACF) are taken to obtain a gentleman's electrical knowledge belt (AniS〇tr叩iC C〇nduCtive fllm ' substrate bottom material mat 12 material through anisotropic conduction 10/16 W π / knife, not electrically connected to the main conductive display) e 攸" different conductive areas (Figure 2 [second embodiment] Please refer to _4, and Figure 5A to the illustration provides a thin image of the operation of the second implementation of the creation The comparison between 1 and 2 shows that the second method is the same as the second embodiment of the steps S100 to § 112, S200 to S212 of the embodiment, respectively. After the thinning image=/212 (as shown in FIG. 2G) of the first embodiment and the second embodiment, the method includes: the manufacturing method of the shaft taking module is further advanced, and step S214 is: matching with FIG. 4, the double-sided adhesive member H, at the same time, θ 2 (3, and shown in FIG. 5A, remove the bottom surface of the capture wafer 20, and fix: the bottom surface of the second reverse body 1 、, the image step is cut as 6: with the bottom surface of the 〇 Provided on the main circuit board ,, as shown in the figure, the substrate unit 1 can be respectively transmitted through a plurality of electrical conductors 八=drying the plurality of bottom conductive pads 12, Figure 5A and Figure 2Η are connected to the main circuit board Μ. Because the image capture module can omit the thinning effect of the first embodiment of the squeezing head [the possible function of the embodiment] _ use. According to the creation experiment, the thin image of the thinned image provided by at least two jins is electrically connected to the substrate unit. The image is placed in the accommodating space and fixed on the hollow substrate body. The thinned image capture created by the fixed position of the wafer relative to the hollow substrate body is not only possible, but also can be applied to a thinned space, =11/ 16 M416115 The above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patents of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the scope of this creation. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a first embodiment of a creative production method; FIG. 2A is a side cross-sectional view of a first embodiment of a first embodiment; FIG. S102 2C is a side cross-sectional view of step S104 of the first embodiment of the present invention; FIG. 2D is a side cross-sectional view of step S106 of the first embodiment of the present invention; FIG. 2E is a step S108 of the first embodiment of the present invention. 2F is a side cross-sectional view of the step SUO of the first embodiment of the present invention; FIG. 2G is a side cross-sectional view of the step S112 of the first embodiment of the present invention; FIG. 2H is a step S114 of the first embodiment of the present invention. 3A is a side cross-sectional view of the substrate unit of the first embodiment of the present invention; FIG. 3B is a top view of the substrate unit of the first embodiment; FIG. 3C is a substrate unit of the first embodiment of the present invention. Figure 4 is a side view of a second embodiment of the second embodiment of the present invention; and Figure 5B is a second embodiment of the second embodiment of the second step S216 A side view of the schematic view. [Description of main component symbols] Substrate unit 1 Hollow substrate body 1 accommodating space 100 Recessed convex portion 101 'Top conductive pad 11 Bottom conductive pad 12 12/16 M416115 • · Buried conductive trace 13 Image 撷Take unit 2 Image capture wafer 20 Electrical conduction pad 200 Fixing glue unit 固定 Fixing gel 30 Lens unit 4 Lens group 40 Outer housing 41 Retaining frame 410 Reinforced body Α1 Conductor Α2 Carrier plate 双面 Double-sided adhesive Piece 黏 Adhesive surface H10 Main circuit board 导电 Conductive wire W Thickness hi, h2 13/16