CN108881676A - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN108881676A CN108881676A CN201710471832.5A CN201710471832A CN108881676A CN 108881676 A CN108881676 A CN 108881676A CN 201710471832 A CN201710471832 A CN 201710471832A CN 108881676 A CN108881676 A CN 108881676A
- Authority
- CN
- China
- Prior art keywords
- packaging body
- camera module
- sensitive chip
- module according
- interconnecting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention relates to a kind of camera modules, including：Circuit board；Sensitive chip, setting is on circuit boards；Packaging body is arranged on circuit boards and encapsulates at least partly structure of sensitive chip；And lens, including interconnecting piece and optical effect portion, the interconnecting piece be fixedly connected on packaging body, the optical effect portion is by forming gap between interconnecting piece and sensitive chip.Lens are set up directly on packaging body by above-mentioned camera module, can omit the bracket of fixed lens, can not only reduce the overall volume of camera module, can also simplify assembling process.
Description
This application claims submitting on May 10th, 2017, application No. is 201710326770.9, entitled " camera shootings
The priority of the Chinese patent application of mould group ".
Technical field
The present invention relates to field of camera technology, more particularly to a kind of camera module.
Background technique
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Vehicle field, medical domain etc., such as camera module have become for portable electronic devices such as smart phone, tablet computers
One of standard fitting.The camera module for being applied to portable electronic device can not only obtain image, but also can help
Portable electronic device realizes the functions such as instant video call.With the increasingly lightening development trend of portable electronic device and
User requires higher and higher imaging to the overall dimensions and camera module of camera module for the image quality of camera module
Ability is proposed harsher requirement.That is, the development trend of portable electronic device requires camera module subtracting
Imaging capability is further increased and strengthened on the basis of few size.
Summary of the invention
The present invention is intended to provide one kind can get smaller size of camera module.
A kind of camera module, including：
Circuit board；
Sensitive chip, setting is on circuit boards；
Packaging body is arranged on circuit boards and encapsulates at least partly structure of sensitive chip；And
Lens, including interconnecting piece and optical effect portion, the interconnecting piece are fixedly connected on packaging body, the optical effect
Portion is by forming gap between interconnecting piece and sensitive chip.
It in one of the embodiments, further include optical filter, the optical filter is arranged in the gap, the interconnecting piece
Inward flange form step, the optical filter is fixed on the step.By the connection that optical filter is set up directly on to lens
In portion, it is not necessary that the carriers such as bracket of carrying optical filter are additionally arranged, be conducive to the miniaturization of camera module.
The optical filter is adhesively fixed on the step by colloid in one of the embodiments, the optical filter
With the step glue width be 0.15-0.35mm.Above-mentioned glue width can consolidate installation optical filter while will not generate excessive
Glue.
The distance between the optical filter and the sensitive chip are 0.2-0.3mm in one of the embodiments,.It is above-mentioned
Distance can avoid the generation of " petal " type hot spot, and can play the effect of adequately filtering light.
Spacing is formed between the bottom surface of the optical filter and the top surface of the packaging body in one of the embodiments,.Such as
This can prevent optical filter and packaging body during installation from generating interference, it is impaired avoid optical filter, while being also beneficial to lens
Fixation.
The outer edge of the interconnecting piece and the outside wall surface of packaging body are substantially aligned in one of the embodiments,.Lens
The outer edge of interconnecting piece is aligned with the outside wall surface of packaging body, also this means that the interconnecting piece of lens not will increase camera module vertical
Directly in the size on the optical axis direction in optical effect portion, packaging body except carrying lens interconnecting piece in addition to, woth no need in addition be arranged
For fixing the bracket etc. of lens, so that lens is taken up space with packaging body and more rationalize, miniaturise the camera shooting mould
Group.
The interconnecting piece is directly bonded on the top surface of packaging body by colloid in one of the embodiments,.Lens
Interconnecting piece is directly formed with packaging body by colloid and is connected, in addition to the medium for being used to form adhesive effect, interconnecting piece and packaging body
Between be not necessarily to other physical feature, can reduce the number of elements of camera module, simplify the assembling process of camera module.
In one of the embodiments, the top surface of the interconnecting piece and the packaging body glue width be 0.25-
0.55mm.Above-mentioned glue width can consolidate mounted lens, while will not generate excessive glue.
The width of the top surface of the packaging body is 0.69-1.74mm in one of the embodiments,.The width of above-mentioned top surface
Design can meet the needs of stable lens, and combine the Miniaturization Design of camera module.
The height of the packaging body is 0.36-0.46mm in one of the embodiments,.Above-mentioned height design can be simultaneously
Meet encapsulation requirement and Miniaturization Design.
In one of the embodiments, the optical effect portion have an optical axis, the optical axis substantially with the photosensitive core
The center of piece is aligned.
The marginal portion of the surrounding of the sensitive chip is encapsulated in circuit by the packaging body in one of the embodiments,
On plate.Packaging body is packaged the marginal portion of sensitive chip, can avoid intermediate production link to sensitive chip and circuit board
Between connection caused by impact and destroy, ensure sensitive chip and circuit board connection reliability.
In one of the embodiments, the edge of the photosensitive area of the bottom end and sensitive chip of the inner wall of the packaging body it
Between distance be 0.16-0.18mm.The setting of above-mentioned distance is so that camera module takes between the two in miniaturization and image quality
It obtains and preferably balances.
The sensitive chip is electrically connected by conducting wire and circuit board in one of the embodiments, and the conducting wire is by institute
State packaging body package.
Electronic component is set on the circuit board in one of the embodiments, and the electronic component is by the packaging body
Package.
A kind of camera module, including：
Circuit board has circuit and electronic component on the circuit board；
Packaging body wraps up the electronic component, sets cavity in the packaging body；
Sensitive chip is electrically connected with the circuit, and the marginal portion of the sensitive chip is wrapped up by the packaging body, institute
It sets in the cavity the middle section for stating sensitive chip；
Lens are fixedly connected on the top surface of the packaging body；And
Optical filter is directly connected to the lens, be arranged above the cavity and with the sensitive chip face.
Lens are set up directly on packaging body by above-mentioned camera module, can omit the bracket of fixed lens, can not only reduce
The overall volume of camera module can also simplify assembling process.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view for the camera module that one embodiment of the invention provides；
Fig. 2 is the schematic cross-sectional view of the other direction of structure shown in Fig. 1.
Specific embodiment
As depicted in figs. 1 and 2, a kind of camera module that one embodiment of the invention provides, including circuit board 10, sensitive chip
20, packaging body 30, lens 40 and optical filter 50.
Circuit board 10 can be printed circuit board, and in some embodiments, circuit board 10 can be flexible circuit board.Circuit board
Circuit is formed on 10, and by electronic equipment (such as the mobile terminals such as mobile phone) applied by these circuits and camera module
Other component, which is formed, to be electrically connected.As shown in Fig. 2, circuit board 10 includes two substrates 101,102 and connection in some embodiments
The flexible piece 103 of two substrates 101,102, the elements such as sensitive chip 20, packaging body 30, lens 40 and optical filter 50 are arranged at it
In on a substrate 101.Also settable electronic component 104 on another substrate 102, electronic component 104 can be resistance, electricity
Appearance, diode, triode, potentiometer, relay or driver.It is appreciated that as shown in Figure 1, may also set up electricity on substrate 101
Subcomponent 104, electronic component 104 can be resistance, capacitor, diode, triode, potentiometer, relay or driver.It is flexible
The also settable reinforcement glue 105 in junction of part 103 and substrate 101, for reinforcing the structural strength of flexible piece 103, prevents flexibility
Part 103 and the connection of substrate 101 are broken or lose.
Sensitive chip 20 is arranged on the circuit board 10.Sensitive chip 20 is electrically connected with the circuit on circuit board 10.
Sensitive chip 20 has on the upper surface of the lower surface sensitive chip 20 of the upper surface and fitting circuit board 10 of circuit board 10
Equipped with the photosensitive area 201 positioned at middle section to receive optical signal, sensitive chip 20 converts optical signals to electric signal, and through electricity
Road plate 10 is transmitted to external image processing apparatus or image memory device.It is additionally provided on the upper surface of sensitive chip 20 positioned at side
The non-photo-sensing area 203 of edge point.Sensitive chip 20 is electrically connected by conducting wire 202 and circuit board 10, specifically, conducting wire 202
One end is connect with the contact on the marginal portion of sensitive chip 20, the other end of conducting wire 202 and the corresponding contacts on circuit board 10
Connection.In addition in some embodiments, sensitive chip 20 can also be directly electrically connected with the contact on circuit board 10 by welding
Without by conducting wire 202.
Packaging body 30 is arranged on the circuit board 10 and by at least partly construction packages of sensitive chip 20 on the circuit board 10.
Packaging body 30 is used to protect being connected to manufacture, not invaded and harassed by the external world in intermediate links for sensitive chip 20 and circuit board 10, with guarantor
Hinder the connection reliability of sensitive chip 20 and circuit board 10.In one embodiment, the packaging body 30 is by the sensitive chip 20
The marginal portion encapsulation of surrounding is on the circuit board 10.It is first fixed on large stretch of circuit board 10 to connect in batch making production process
Sensitive chip 20 is connect, packaging body 30 is re-formed, independent unit then is formed to the segmentation of large stretch of circuit board 10, due to packaging body 30
Protection, can avoid sensitive chip 20 in cutting procedure and the electric connection of circuit board 10 destroyed.
It is being formed in the embodiment to electrically conduct between sensitive chip 20 and circuit board 10 with conducting wire 202, the conducting wire
202 can be wrapped up by the packaging body 30.
The electronic component 104 being arranged on the circuit board 10 can also be wrapped up by the packaging body 30.
The packaging body 30 is annular in shape, has sequentially connected outside wall surface 301, top surface 302 and inner wall 303, Ke Yili
It is annular in shape to solve outside wall surface 301, top surface 302 and inner wall 303.In one embodiment, packaging body 30 has square frame structure,
Outside wall surface 301, top surface 302 and inner wall 303 include four parts being sequentially connected end to end.Each of described outside wall surface 301
And horizontal plane part is substantially vertical, i.e.,.In four parts of the outside wall surface 301 except it is corresponding with substrate 102 that
Part is outer, other three parts are substantially flushed with the side wall of substrate 101, thus packaging body 30 can be made to take up space with circuit board 10
Miniaturization.
The top surface 302 is substantially parallel to the horizontal plane, and the top surface 302 is for carrying lens 40.In some embodiments, institute
The width for stating top surface 302 is greater than the width of the lens 40 and 302 contact portion of top surface.
The inner wall 303, which encloses, to be set to form a cavity 304.The middle section of the sensitive chip 20 is placed in the cavity
In 304, and the part formed between of photosensitive area 201, thus be exposed in cavity 304, with the optical signal outside reception.The sense
It is wrapped up by the packaging body 30 marginal portion of optical chip 20.The inner wall 303 is from the direction of circuit board 20 towards top surface 302
Direction to outside wall surface 301 tilt, make cavity 304 have up big and down small structure.
Lens 40 are fixedly connected on the top surface 302 of the packaging body 30.The focusing that external optical signal passes through lens 40
It is received by sensitive chip 20.In one embodiment, lens 40 include integrally formed interconnecting piece 41 and optical effect portion 42, wherein institute
Interconnecting piece 41 is stated to be fixedly connected on packaging body 30.Interconnecting piece 41 is a part of lens 40, by lens 40 itself and encapsulation
Body 30 forms connection, supports, fixes lens 40 without additional bracket or other similar element, can make camera module
Volume more minimizes.Meanwhile lens 40 are secured directly in packaging body 30, can reduce the assembling work of the intermediary elements such as bracket
Sequence simplifies the assembling process of camera module.In some embodiments, the interconnecting piece 41 of lens 40 and optical effect portion 42 can also divide
It is body formed, such as interconnecting piece 41 can be made of non-transparent material, interconnecting piece 41 is cylindrical in shape, inside setting optical path channel.Light
It learns service portion 42 to be then made of transparent material, such as may include one or more eyeglasses.After interconnecting piece 41 is made, optical effect portion
42 are loaded to interconnecting piece 41 again is formed by optical path channel.
In one embodiment, the interconnecting piece 41 is directly bonded on the top surface 302 of packaging body 30 by colloid 401.
Further, the outer edge of the interconnecting piece 41 and the outside wall surface 301 of packaging body 30 are substantially aligned, thus reduce envelope
Fill volume occupied by body 30, lens 40.
The optical effect portion 42, which passes through, forms gap 43 between interconnecting piece 41 and sensitive chip 20.The gap 43 and encapsulation
The cavity 304 that body 30 is formed is connected to.The optical effect portion 42 focuses to optical signal, and the optical effect portion 42 has one
Optical axis I, the optical axis I are aligned with the center of the sensitive chip 20.
The optical filter 50 be arranged in the gap 43 between the lens 40 and sensitive chip 20 and with the lens 40
It is fixedly connected.The optical filter 50 and 20 face of sensitive chip and 304 top of cavity that the packaging body 30 is set.Institute
Part light, such as infrared light can be filtered out from the optical signal that lens 40 penetrate by stating optical filter 50.Optical signal after filtering again by
Sensitive chip 20 receives.
In one embodiment, the inward flange of the interconnecting piece 41 forms step 411, and the optical filter 50 is fixed on described
On rank 411.
After optical filter 50 can first be formed a fixed connection with lens 40 by colloid, then consolidating via lens 40 and packaging body 30
It connects calmly and completes assembling.After assembling, between being formed between the bottom surface of the optical filter 50 and the top surface 302 of the packaging body 30
Away from.It can so prevent optical filter 50 and packaging body 30 during installation from generating interference, avoid optical filter 50 impaired, while
Be conducive to the fixation of lens 40.
In one embodiment, the width W1 of the top surface 302 of the packaging body 30 is 0.69-1.74mm, preferably 1.65mm.
The width W1 of the top surface 302 refers to edge that the top surface 302 is connect with outside wall surface 301 to the top surface 302 and inner wall
The distance at the edge of 303 connections.The top surface 302 is for carrying lens 40, although the width W1 increase of top surface 302 can make to hold
The contact surface for carrying lens 40 increases, so that the installation stable degree of lens 40 is promoted, but width W1 crosses senior general and increases camera module
Overall volume, cannot achieve Miniaturization Design.The width W1 design of above-mentioned top surface 302 both can satisfy the need of stable lens 40
It asks, and has combined the Miniaturization Design of camera module.
In one embodiment, the height H1 of the packaging body 30 is 0.36-0.46mm, preferably 0.41mm.The encapsulation
The height H1 of body 30 refers to that the edge that the lateral surface 301 is connect with circuit board 10 is connect to the lateral surface 301 with top surface 302
Edge vertical range.The height H1 of the packaging body 30 should consider can at least partly structure to sensitive chip 20 with
And other electronic components on circuit board 10 form encapsulation, consider that the volume of camera module will not be increased in the direction optical axis I again.
Above-mentioned height H1 design can meet encapsulation requirement and Miniaturization Design simultaneously.
The photosensitive area 201 of the sensitive chip 20 is all exposed in cavity 304.In one embodiment, the packaging body 30
The bottom end of inner wall 303 and the distance between the edge of photosensitive area 201 L1 of sensitive chip 20 be 0.16-0.18mm, preferably
It is 0.17mm.If the distance L1 at 303 bottom end of inner wall of packaging body 30 to 201 edge of photosensitive area of sensitive chip 20 is too small,
The risk of the photosensitive area 201 of the foreign materials aways such as potting resin sensitive chip 20 increases in encapsulation process, and on photosensitive area 201
Foreign matter will affect the effect that photosensitive area 201 receives incident light, and then influence image quality.If 303 bottom of inner wall of packaging body 30
It holds the distance L1 to 201 edge of photosensitive area of sensitive chip 20 excessive, increases the volume of camera module, be unfavorable for
On the other hand miniaturization can also make 203 stray light of non-photo-sensing area on sensitive chip 20 more and influence image quality.It is above-mentioned
The setting of distance L1 is so that camera module obtains preferable balance in miniaturization and image quality between the two.
In one embodiment, the external diameter of a circle d that the point where the outermost of the lens 40 is formed is 7.5mm.Such as Fig. 1
Shown in, the point where the outermost of the lens 40 is located at the outer edge of the interconnecting piece 41.The height H2 of the lens 40
For 7.25mm.The height H2 of the lens 40 refers to horizontal plane and the optical effect portion where 41 lowermost end of interconnecting piece
The distance between horizontal plane where 42 tops.
The top surface 302 of the interconnecting piece 41 of the lens 40 and the packaging body 30 glue width W2 be 0.25-0.55mm.
If glue width W2 it is too small, lens 40, which can not consolidate, to be mounted on packaging body 30, if glue width W2 it is excessive, by generate excessive glue lead
Other elements such as circuit board 10, sensitive chip 20, optical filter 50 is caused to be potentially contaminated.Above-mentioned glue width W2 can consolidate peace
Lens 40 are filled, while excessive glue will not be generated.
In one embodiment, the thickness T of the optical filter 50 is 0.3mm.The above-mentioned thickness T setting of optical filter 50 can meet light
The requirement of line transmitance.The distance between the optical filter 50 and the sensitive chip 20 L2 are 0.2-0.3mm.Optical filter 50 with
If the distance L2 setting of sensitive chip 20 is excessive, whole light can not be filtered, cause non-filtered light (infrared light) to reach photosensitive
Face influences image quality；If too small, incident ray reaches 201 back reflection of photosensitive area of sensitive chip 20 to optical filter 50, then instead
It is emitted back towards photosensitive area 201, after multiple roundtrip, " petal " type hot spot is generated, influences image quality.By verifying, it is above-mentioned away from
From the generation that L2 can avoid " petal " type hot spot, and the effect of adequately filtering light can be played.The optical filter 50 with it is described
The step 411 of interconnecting piece 41 glue width W3 be 0.15-0.35mm.It is same that above-mentioned glue width W3 can consolidate installation optical filter 50
Shi Buhui generates excessive glue.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (16)
1. a kind of camera module, which is characterized in that including：
Circuit board；
Sensitive chip, setting is on circuit boards；
Packaging body is arranged on circuit boards and encapsulates at least partly structure of sensitive chip；And
Lens, including interconnecting piece and optical effect portion, the interconnecting piece are fixedly connected on packaging body, and the optical effect portion is logical
It crosses and forms gap between interconnecting piece and sensitive chip.
2. camera module according to claim 1, which is characterized in that further include optical filter, the optical filter is arranged in institute
It states in gap, the inward flange of the interconnecting piece forms step, and the optical filter is fixed on the step.
3. camera module according to claim 2, which is characterized in that the optical filter is adhesively fixed on described by colloid
On step, the optical filter and the step glue width be 0.15-0.35mm.
4. camera module according to claim 2, which is characterized in that between the optical filter and the sensitive chip away from
From for 0.2-0.3mm.
5. camera module according to claim 2, which is characterized in that the top of the bottom surface of the optical filter and the packaging body
Spacing is formed between face.
6. camera module according to claim 1, which is characterized in that the outer edge of the interconnecting piece and the outer wall of packaging body
Face is substantially aligned.
7. camera module according to claim 1, which is characterized in that the interconnecting piece is directly bonded in encapsulation by colloid
On the top surface of body.
8. camera module according to claim 7, which is characterized in that the top surface of the interconnecting piece and the packaging body
Glue width is 0.25-0.55mm.
9. camera module according to claim 7, which is characterized in that the width of the top surface of the packaging body is 0.69-
1.74mm。
10. camera module according to claim 1, which is characterized in that the height of the packaging body is 0.36-0.46mm.
11. camera module according to claim 1, which is characterized in that the optical effect portion has an optical axis, the light
Axis is substantially aligned with the center of the sensitive chip.
12. camera module according to claim 1, which is characterized in that the packaging body is by the surrounding of the sensitive chip
Marginal portion encapsulation on circuit boards.
13. camera module according to claim 12, which is characterized in that the bottom end of the inner wall of the packaging body with it is photosensitive
The distance between edge of photosensitive area of chip is 0.16-0.18mm.
14. camera module according to claim 12, which is characterized in that the sensitive chip passes through conducting wire and circuit board electricity
Property connection, the conducting wire wrapped up by the packaging body.
15. camera module according to claim 12, which is characterized in that electronic component is set on the circuit board, it is described
Electronic component is wrapped up by the packaging body.
16. a kind of camera module, it is characterised in that including：
Circuit board has circuit and electronic component on the circuit board；
Packaging body wraps up the electronic component, sets cavity in the packaging body；
Sensitive chip is electrically connected with the circuit, and the marginal portion of the sensitive chip is wrapped up by the packaging body, the sense
It sets in the cavity the middle section of optical chip；
Lens are fixedly connected on the top surface of the packaging body；And
Optical filter is directly connected to the lens, be arranged above the cavity and with the sensitive chip face.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2017103267709 | 2017-05-10 | ||
| CN201710326770 | 2017-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108881676A true CN108881676A (en) | 2018-11-23 |
Family
ID=60827377
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710471832.5A Withdrawn CN108881676A (en) | 2017-05-10 | 2017-06-20 | Camera module |
| CN201720721878.3U Active CN206865598U (en) | 2017-05-10 | 2017-06-20 | Camera module |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720721878.3U Active CN206865598U (en) | 2017-05-10 | 2017-06-20 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108881676A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112584005A (en) * | 2019-09-30 | 2021-03-30 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322632B (en) * | 2018-02-28 | 2020-09-08 | Oppo广东移动通信有限公司 | Camera module, electronic device and camera module manufacturing method |
-
2017
- 2017-06-20 CN CN201710471832.5A patent/CN108881676A/en not_active Withdrawn
- 2017-06-20 CN CN201720721878.3U patent/CN206865598U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112584005A (en) * | 2019-09-30 | 2021-03-30 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN206865598U (en) | 2018-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11627239B2 (en) | Photosensitive assembly and camera module and manufacturing method thereof | |
| US11223751B2 (en) | Photosensitive assembly and camera module and manufacturing method thereof | |
| CN105847645B (en) | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof | |
| US10979610B2 (en) | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | |
| US10708481B2 (en) | Camera module and photosensitive assembly thereof | |
| CN107566691B (en) | Photosensitive assembly, camera module and manufacturing method thereof | |
| US10750072B2 (en) | Camera module and photosensitive assembly thereof | |
| US8248514B1 (en) | Camera module having image sensing module with passive components | |
| CN206865596U (en) | Camera module and its photosensory assembly | |
| US20080309805A1 (en) | Image sensor package | |
| CN101295707A (en) | Image capturing device | |
| CN105744131A (en) | Array photographing module, circuit board assembly of the array photographing module and manufacturing method of the circuit board assembly of the array photographing module | |
| CN206977550U (en) | Camera module and its photosensory assembly | |
| CN109510922A (en) | Camera module and its photosensory assembly | |
| KR20200079441A (en) | Identification unit and electronic device for under-screen optical fingerprint | |
| CN101271913A (en) | Optical device, camera module, mobile phone, digital still camera, and medical endoscope | |
| CN206922900U (en) | Camera module | |
| CN108881676A (en) | Camera module | |
| CN206865578U (en) | Camera module and its photosensory assembly | |
| CN111081656A (en) | Chip packaging structure and forming method thereof | |
| CN104333679A (en) | Camera module | |
| CN206865584U (en) | Camera module | |
| CN108039355A (en) | A kind of encapsulating structure and method for packing of optical finger print chip | |
| CN209746567U (en) | ultra-thin fingerprint identification subassembly and electronic equipment | |
| CN206865583U (en) | Camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181123 |