TW200833827A - Method for purifying chemical added with chelating agent - Google Patents

Method for purifying chemical added with chelating agent

Info

Publication number
TW200833827A
TW200833827A TW096146106A TW96146106A TW200833827A TW 200833827 A TW200833827 A TW 200833827A TW 096146106 A TW096146106 A TW 096146106A TW 96146106 A TW96146106 A TW 96146106A TW 200833827 A TW200833827 A TW 200833827A
Authority
TW
Taiwan
Prior art keywords
chelating agent
chemical
chemical added
purifying chemical
purifying
Prior art date
Application number
TW096146106A
Other languages
English (en)
Other versions
TWI428435B (zh
Inventor
Masamitsu Iiyama
Mitsugu Abe
Original Assignee
Nomura Micro Science Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nomura Micro Science Kk filed Critical Nomura Micro Science Kk
Publication of TW200833827A publication Critical patent/TW200833827A/zh
Application granted granted Critical
Publication of TWI428435B publication Critical patent/TWI428435B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J41/00—Anion exchange; Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
    • B01J41/04—Processes using organic exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D15/00—Separating processes involving the treatment of liquids with solid sorbents; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J41/00—Anion exchange; Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
    • B01J41/04—Processes using organic exchangers
    • B01J41/07—Processes using organic exchangers in the weakly basic form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J47/00—Ion-exchange processes in general; Apparatus therefor
    • B01J47/10—Ion-exchange processes in general; Apparatus therefor with moving ion-exchange material; with ion-exchange material in suspension or in fluidised-bed form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J47/00—Ion-exchange processes in general; Apparatus therefor
    • B01J47/12—Ion-exchange processes in general; Apparatus therefor characterised by the use of ion-exchange material in the form of ribbons, filaments, fibres or sheets, e.g. membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J47/00—Ion-exchange processes in general; Apparatus therefor
    • B01J47/12—Ion-exchange processes in general; Apparatus therefor characterised by the use of ion-exchange material in the form of ribbons, filaments, fibres or sheets, e.g. membranes
    • B01J47/127—Ion-exchange processes in general; Apparatus therefor characterised by the use of ion-exchange material in the form of ribbons, filaments, fibres or sheets, e.g. membranes in the form of filaments or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Treatment Of Water By Ion Exchange (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Treatment Of Liquids With Adsorbents In General (AREA)
TW096146106A 2006-12-04 2007-12-04 A method for the purification of the drug solution TWI428435B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006327624 2006-12-04

Publications (2)

Publication Number Publication Date
TW200833827A true TW200833827A (en) 2008-08-16
TWI428435B TWI428435B (zh) 2014-03-01

Family

ID=39492031

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096146106A TWI428435B (zh) 2006-12-04 2007-12-04 A method for the purification of the drug solution

Country Status (7)

Country Link
US (1) US8278219B2 (zh)
EP (1) EP2100666A4 (zh)
JP (1) JP5412115B2 (zh)
KR (1) KR101422876B1 (zh)
CN (1) CN101547741B (zh)
TW (1) TWI428435B (zh)
WO (1) WO2008069136A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311227B2 (ja) * 2009-08-05 2013-10-09 野村マイクロ・サイエンス株式会社 陰イオン交換体、その前処理方法及び再生方法並びにアルカリ水溶液の精製方法及び精製装置
JP6737284B2 (ja) * 2015-10-21 2020-08-05 富士フイルム和光純薬株式会社 安定化剤および安定化方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216775A (ja) 1982-05-28 1983-12-16 Kurita Water Ind Ltd 重金属およびキレ−ト剤を含む水のイオン交換方法
JPS6197096A (ja) 1984-10-19 1986-05-15 Hitachi Ltd 濾過脱塩装置
JPS63272460A (ja) 1987-04-28 1988-11-09 Mitsubishi Monsanto Chem Co ウエハ−用研磨剤組成物
JP4222582B2 (ja) * 1999-03-04 2009-02-12 日本化学工業株式会社 高純度シリカゾルの製造方法
JP2001096272A (ja) 1999-09-28 2001-04-10 Japan Organo Co Ltd 水の製造方法
JP4643085B2 (ja) * 2001-09-19 2011-03-02 日本化学工業株式会社 研磨剤用高純度コロイダルシリカの製造方法
JP4608856B2 (ja) * 2003-07-24 2011-01-12 信越半導体株式会社 ウエーハの研磨方法
JP4442722B2 (ja) 2003-09-30 2010-03-31 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 キレート剤添加装置、キレート剤添加方法、ウェーハ研磨システム及びウェーハ研磨方法
JP4551167B2 (ja) * 2004-09-14 2010-09-22 日本化学工業株式会社 半導体ウェーハの研磨装置及びこれを用いた研磨方法
JP4852302B2 (ja) * 2004-12-01 2012-01-11 信越半導体株式会社 研磨剤の製造方法及びそれにより製造された研磨剤並びにシリコンウエーハの製造方法

Also Published As

Publication number Publication date
JPWO2008069136A1 (ja) 2010-03-18
US20100078589A1 (en) 2010-04-01
US8278219B2 (en) 2012-10-02
TWI428435B (zh) 2014-03-01
JP5412115B2 (ja) 2014-02-12
EP2100666A1 (en) 2009-09-16
WO2008069136A1 (ja) 2008-06-12
KR101422876B1 (ko) 2014-07-23
CN101547741A (zh) 2009-09-30
KR20090087046A (ko) 2009-08-14
CN101547741B (zh) 2012-02-01
EP2100666A4 (en) 2013-03-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees