200830957 22104twf.doc/e 九、發明說明： 【發明所屬之技術領域】 ^本發明是有關於—種剝離治具及其剝離方法，且特別 是有關於一種適用於線路基板的剝離治具及其剝離線路基 板的方法。 【先前技術】 圖1A至圖1F是圖解習知一種利用壓合的方式來製作 印刷電路板的金屬圖案之流程剖面示意圖。請參閱圖1A， 製作金屬圖案的方法，首先形成一介電質基板11〇，其具 有一上表面110a與一相對上表面110a之下表面u〇b。介 龟貝基板11〇的組成材料通常包括樹脂（resin)以及玻璃 纖維（fiber_glass)。 請參閱圖1B，接著，形成兩片銅箔壓合板12〇。每片 銅、洛壓合板120包括一剝離金屬層122以及一銅箔線路層 124。其中，剝離金屬層122通常是用金屬製成，而銅箔線 路層124的表面上具有多個銅塊圖案124a。這些銅塊圖案 124a是利用微影（ph〇t〇lith〇graphy)與蝕刻以咖啤）製 程所製成，且這些銅塊圖案124a是用來作為印刷電路板的 接墊（pad)及導線（trace)。之後，將兩片銅箔壓合板 120的銅箔線路層124分別朝向上表面n〇a與下表面 110b，並將兩片銅箔壓合板12〇與中間的介電質基板 壓合。 請參閱圖1C，由於介電質基板110的組成材料含有 樹脂’因此兩片銅箔壓合板12〇能與介電質基板11()經壓 5 200830957 22104twf.doc/e 合後而結合成一體。緊接著，請參閱圖1D，將每片銅箔壓 合板120上的剝離金屬層122雜。目前移除這些剝離金 屬層m的方法都是以人卫方式移除，也就是用人手⑽ 離适些剝離金屬層122。因此，需要很多人力來剝離這些 剝離金屬層122。 待剝離所有剝離金屬層122後，如圖ΐβ所示，這些 銅箔線路層124已與介電質基板11〇結合在一起。接著， 將兩銅箔線路層124加以蝕刻，使這些銅塊圖案124a得以 顯露出來，如圖1F所示。如此，具有多個由銅塊圖案124& 所作成的導線（trace)與連接墊（pa(j)之印刷電路板 已大致完成。 然而，從上述得知，由於剝離金屬層122是以人工剝 離的方式來移除，因此印刷電路板1〇〇的品質在移除剝離 金屬層122後會顯得參差不齊。同時，亦無法穩定控制移 除剝離金屬層122的過程。此外，為了提高產率，需要投 入大量的人力來剝離這些剝離金屬層122。如此，將浪費 ，很多人力。 【發明内容】 本發明之目的是提供一種剝離基板的剝離治具，以取 代人工剝離的方式，進而減少人力的浪費。 本發明另一目的是提供一種剝離基板的方法，以穩定 控制移除剝離層的過程以及移除剝離層後的基板之品質。 為達上述或是其他目的，本發明提出一種基板的剝離 治具’適於剝離一基板上之至少一剝離層。基板的剝離治 6 200830957 22104twf.doc/e 具包括一基板吸附裝置、一剝離層移除器以及一驅動裝 置。基板吸附裝置具有一適於吸附基板的吸附面。剝離層 移除器具有至少一剝離層銜接部，其配置於吸附面上方。 剝離層銜接部適於銜接剝離層之一末端。驅動裝置連接剝 離層移除益或基板吸附裝置，且驅動裝置適於使剝離層銜 接部與基板吸附裝置相對移動。 在本發明之一實施例中，上述之剝離層銜接部為一夾 〇 在本發明之一實施例中，上述之基板吸附裝置更具有 至少一真空吸口，此真空吸口位於吸附面。在本發明之一 實施例中，上述之驅動裝置包括一馬達及一齒輪組，其中 馬達適於透過齒輪組驅動剝離層移除器或基板吸附裝置移 動。 在本發明之一實施例中，上述之基板的剝離治具更包 括一基板固定夾具。基板固定夾具配置於基板吸附裝置 上，且適於夾住基板。 在本發明之一實施例中，上述之基板固定夾具的形狀 為L型。 在本發明之一實施例中，上述之基板的剝離治具更包 括一輔2剝離裝置，其包括一固定基板元件與一剝離元 件固疋基板元件配置於基板與剝離層移除器之間，並適 於在剝離層之下方壓住基板。剝離元件與固定基板元件連 接。剝離元件適於在基板與剝離層之間抵住剝離層，並與 基板相對移動。 7 200830957 22104twf.doc/e 在本發明之-實施例中’上述之固定基板元件與驅動 衣置連接，且固定基板元件包括至少一滾輪，其適於在基 板之表面上相對於基板移動。 土 一在本發明之一實施例中，上述之驅動裝置連接固定基 板元件，以適於驅動剝離元件與滾輪移動。 在本發明之一實施例中，上述之剝離治具更包括一驅 動器，其具有一執道，而固定基板元件更包括一移動支架， 其連接剝離元件與滾輪。移動支架配置於軌道上，且移動 支架藉由此軌道可活動地連接驅動器。 本發明又提出一種上述之基板的剝離治具之剝離基 板的方法，其包括下列步驟。首先，吸附基板於基板吸附 裝置之吸附面。接著，當吸附基板時，將剝離層銜接部銜 接剝離層之末端。之後，令剝離層銜接部與基板吸附裝置 相對移動移動剝離層銜接部，以移除剝離層。 在本發明之一實施例中，上述之吸附基板的方法包括 以真空方式吸附基板。 在本發明之一實施例中，上述之剝離層銜接部銜接末 端的方法包括剝離層銜接部夾持末端。 士在本發明之一實施例中，當剝離層銜接部銜接末端 2，更包括以下步驟。將剝離層之末端自基板分離，以暴 露基板之一前端。接著，利用一配置於基板吸附裝置上的 基板固定夾具，將基板的前端夹住，進而加強基板的固定。 、在本發明之一實施例中，上述之基板固定夾具的形狀 為L型。 8 200830957 22104twf.d〇c/e 在本發明之一實施例中，上述之基板的剝離治具更包 括一輔助剝離裝置，其包括一固定基板元件以及一剝離元 件’其中固定基板元件包括至少一滾輪，且固定基板元件 連接驅動裝置，而剝離元件則連接固定基板元件。當剝離 層銜接部銜接剝離層之末端之後，更包括下列步驟。令滚 輪在剝離層之末端之下方壓住基板。接著，將剝離元件放 置於基板與剝離層之間，並抵住剝離層。之後，令滾輪及 剝離元件相對於基板移動，以分離剝離層與基板。 因利用本發明之基板的剝離治具，所以能取代習知人 工剝離的方式來移除剝離層。同時，亦可以穩定控制基板 在移除剝離層後的品質，以及移除剝離層的過程。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 圖2是本發明第一實施例之基板的剝離治具之側視示 意圖。請參閱圖2，基板的剝離治具300a可以用來剝離一 基板210上之至少一剝離層220。其中，剝離層220可以 是由金屬材質所製成，而基板210可以用來製作成單面電 路板（single side circuit board)、雙面電路板（double side circuit board)或其他適當之電路板。當然，基板210亦可 以是構成多層式電路板（multi-layer circuit board )或高密 度電路板（high density interconnection board，HDI board) 的其中之一電路層。基板210包括一介電層212以及至少 9 200830957 22104twf.doc/e “ 圖案層214。圖2所繪示的基板210雖然具有二導 電圖=^214，但圖2僅為舉例說明，並非限定本發明。 I 層212 了以疋由樹月旨、環氧樹脂（叩〇乂乂 π—)、 玻喊維、紙材或其他適當的絕輯料離成，因此介電 層212可以是一種半固化態膠片（prepreg)。導電圖案層 214 ^括一導電層214a與多個導電圖案214b。導電層214a 可以是由銅、鋁、鋁銅合金等導電材料所製成，且導電層 214a 了以先形成於剝離層220的表面上。導電層2i4a的 製作方式可以是濺鍍（sputter)、蒸鍍（evap〇rati〇n)或 其他物理氣相沉積法（physical vap〇r dep〇siti〇n，pVD )， 或者是電鑛（electroplating )、無電電鍍（electr〇less Plating)、化學氣相沉積法（chemical vapor deposition， CVD)或其他適當之化學沉積法（chemicaldep〇siti〇n)所 製成。多個導電圖案214b可以是由微影與蝕刻製程所製 成’而這些導電圖案214b可以作為電路板上的連接墊與導 線（trace)，或是可以形成多層式電路板或高密度電路板 内的内部線路。 請參閱圖2,本發明第一實施例之基板的剝離治具 300a包括一基板吸附裝置31〇a、一剝離層移除器；320以及 一驅動裝置330。 具體而言’基板吸附裝置310a具有一用來吸附基板 210的吸附面312a。其中，基板吸附裝置310a更可以具有 至少一真空吸口 314，其位於吸附面312a。雖然圖2繪示 的真空吸口 314有很多個，但是圖2只是舉例說明，而非 200830957 22104twf.doc/e 限制真空吸口 314的數量。 在本實施例中，基板吸附裝置310a可以包括一抽氣 管316，其一端置於真空吸口 314處，另一端可外接一抽 氣幫浦400。利用抽氣幫浦400抽氣，可以使基板210被 吸附於吸附面312a上。如此，可固定基板210不動，以便 進行剝離層220的剝離工作。 剝離層移除器320具有至少一剝離層銜接部322，其 配置於吸附面312a上方。剝離層銜接部322是用來銜接剝 離層220之一末端220a，所以剝離層銜接部322可以是用 來失住末端220a的夾具（如圖2所示）、刺穿並懸吊剝離 層220的掛勾（未繪示）。因此，圖2所示的剝離層銜接 部322僅為舉例說明，在此非限定本發明。 驅動裝置330連接剝離層移除器320,且驅動裝置330 可以用來驅動剝離層銜接部322移動，進而將剝離層22〇 自基板210移除。當然，驅動裝置330除了連接剝離層銜 接部322之外，在本發明之未繪示的實施例中，驅動裝置 • 330也可以連接基板吸附裝置310a，以驅動基板吸附裝置 310a相對於剝離層銜接部322移動。如此，同樣也能達到 移除剝離層220的功能。因此，圖2所示的驅動裝置33〇 只是舉例說明，而不限定本發明。 另外，驅動裝置330可以包括一馬達332以及—齒輪 組334。倘若驅動裝置33〇與剝離層移除器32〇連接，貝1J 馬達332能透過齒輪組334來驅動剝離層移除器％〇浐 動如果驅動裝i 33〇連接基板吸附裝置31〇a的話，則馬 11 200830957 22104twf.doc/e 達332能透過齒輪組334來驅動基板吸附裝置3i〇a移動。 針對上述實施例之基板的剝離治具施之剝離基板 的方法，以下將配合圖3A至圖犯加以說明。圖3a至圖 3B是圖解本發明-實施例之基板的剝離治具之剝離基板 的方法之流程之侧視示意圖。請參閱圖3A，基板的 具300可以是上述實施例之基板的剝離治具·&，而基才二 的剝離治具300之剝離基板的方法包括以下步驟。 首先，吸附基板210於基板吸附裝置310之吸附面312 上，，而固定基板210不動。由於基板的剝離治具3〇〇可 以是前述實施例之基板的剝離治具3〇〇a，因此基板吸附裝 置310亦可以是基板吸附裝置31〇a(請參照圖2)。如此， 吸附基板210的方法可以是以真空方式吸附基板21〇。 請參閱圖3B，接著，當吸附基板21〇時，將剝離層 移除器320的剝離層銜接部322銜接至剝離層22〇之末^ 220a。其中，由於剝離層銜接部322可以是夾具，因此剝 離層銜接部322銜接末端220a的方法可以是剝離層銜接部 • 322夾持末端220a，例如先以人手或剝離層銜接部322將 剝離層220撥開一角後，使剝離層銜接部322夾住剝離芦 220至少一角。 曰 之後，移動剝離層銜接部322，以移除剝離層22〇。 移動剝離層銜接部322的方法，可以藉由與剝離層移除器 320連接的驅動裝置330來驅動剝離層銜接部322移動。 ，離層銜接部322的移動方向可以沿著一移除方向R，或 是沿著其他適當的方向來移除剝離層22〇,亦即剝離層移 12 200830957 22104twf.doc/e 除口口 320彳以一度空間移動，以適合剝離不同厚度之剝離 層 220。 當然，在本發明未繪示的實施例中，驅動裝置330亦 可以連接基板吸附裝置31〇，進而移動基板吸附裝置31〇 來移除剝離層22〇。因此，圖SA與圖SB皆為舉例說明。 在此強調，本發明不限定以移動剝離層銜接部322之方法 來移除剝離層220。 • 圖4疋本發明第二實施例之基板的剝離治具之側視示 思圖。明參閱圖4，本實施例之基板的剝離治具與上 述實施例相似，故不再重複敘述。然而，基板的剝離治具 300b與上述實施例之不同之處在於，基板的剝離治具 300b 更包括一基板固定夾具340以及一輔助剝離裝置35〇。 基板固疋夾具340的形狀可以是l形，且基板固定夾 具340配置於基板吸附裝置310上。基板固定夾具34〇的 功能是用來夾住基板210，進而將基板210固定。此外， 基板固定夾具340可以是彈性夾具（例如彈簧夾）。 # 當基板被吸附時，可將剝離層220之末端220a 從基板210分離。如此，暴露基板210的前端21〇a。分離 末端220a的方式可以是用手或是剝離層銜接部322剝開剝 離層220的一角。之後，利用基板固定夾具340將前端21〇a 夾住。如此，當剝離層銜接部322移除剝離層220時，可 使基板210不受剝離層220的影響而從吸附面312上脫離。 另外’基板的剝離治具300b所包括的辅助剝離裝置 350，其包括一固定基板元件352與一剝離元件354。固定 13 200830957 22104twf.doc/e 基板元件352配置於基板210與剝離層移除器32〇之間， 且固定基板元件352可在剝離層220之下方壓住基板21〇。 剝離元件354連接固定基板元件352，並且位在基板 210與剝離層220之間。剝離元件354之形狀可為楔形（如 圖4所示）或其他適當的形狀以抵住剝離層22〇，加上剝 離元件354可相對於基板21〇移動，進而能移除剝離層 220。 驅動裝置330可以與固定基板元件352連接，以驅動 固定基板元件352移動，並帶動剝離元件354移動。固定 基板兀件352可包括至少一滾輪352a(圖4僅繪示一個）， 而圖4所不的滚輪352a之數目僅為舉例說明，非限定本發 明。滚輪352a可以是圓柱體或是球體，且滾輪352a在剝 離層220之下方壓住基板21〇，並可在基板21〇之表面上 與基板210相對移動。 當吸附基板210時，可用固定基板元件352在剝離層 220的下方壓住基板21〇。接著’將剝離元件放置於基 • 板210與剝離層220之間，並抵住剝離層220 (如圖4所 示之X處）。之後，驅動裝置330驅動滾輪352a及剝離 元件354相對於基板21〇移動，以輔助剝離層移除器 移除剝離層220。 •驅動裝置330可以藉由内部的馬達（未繪示）搭配齒 輪、、且皮▼、滑輪或其他適當的機械結構（未繪示），使 得剝離元件354能配合剝離層移除器320的作動而移動， 進而使得剝離層移除器320能配合剝離元件354的移動來 14 200830957 22104twf.doc/e 移除剝離層220。 圖5是本發明第三實施例之基板的剝離治具之侧視示 意圖。請參閱圖5，本實施例之基板的剝離治具5〇〇與上 述實施例相似，故不再重複敘述，惟基板的剝離治具5〇〇 與上述實施例之不同之處在於，基板的剝離治具500包括 一辅助剝離裝置550以及一驅動器560。 詳細而言，輔助剝離裝置550所包括的固定基板元件 552，其包括至少一個滚輪552a以及一移動支架552b，而 驅動器560則具有一執道562。移動支架552b配置於執道 562上（如圖5所示之γ處），且移動支架”沘藉由軌道 562可活動地連接驅動器560。此外，移動支架552b延伸 出一端以連接剝離元件354與滾輪552a。因此，移動支架 552b與剝離元件354及滾輪552a連接。 驅動器560包括馬達（未繪示）以及齒輪組、皮帶、 滑輪或其他適當的機械結構（未繪示），其中驅動器560 的馬達能藉由上述之機械結構驅動移動支架552b移動，進 而使剝離元件354與滾輪552a沿著移除方向R移動。如 此’剝離元件354得以將基板210與剝離層22〇分開，以 幫助剝離層移除器320移除剝離層220。 在本實施例中，在剝離治具500移除剝離層220的過 私中’使用者可以隨時個別調整驅動裝置33()的馬達與驅 動益560的馬達之轉速，以將基板210上的剝離層220順 f地移除。此外’使用者也可以在開始移除剝離層22〇之 幻-周整驅動裝置330的馬達與驅動器560的馬達之轉速， 15 200830957 22104twf.doc/e 使這^種馬達轉翻定，進㈣_層22()糊地移除。 紅上所述，本發明之基板的剝離治具因利用基板吸附 裝置固定基板不動，以及剝離層銜接部剝離基板上之剝離 層所以具有移除剝離層的功能。如此，上述之基板的剝 離^具可以取代習知人工剝離的方式來移除剝離層，而具 有節省人力的優點。同時，亦可以穩定控制基板在移除剝 離層的過程，以及基板在移除剝離層後的品質。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習本發明所屬領域之具有通常知識 者，在不脫離本發明之精神和範圍内，當可作些許之更動 與潤飾，因此本發明之保護範圍當視後附之申請專利範圍 所界定者為準。 【圖式簡單說明】 圖1A至圖1F是圖解習知一種利用壓合的方式來製作 印刷電路板的金屬圖案之流程剖面示意圖。 圖2是本發明第一實施例之基板的剝離治具之侧視示 意圖。 圖3A至圖3B是圖解本發明一實施例之基板的剝離治 具之剝離基板的方法之流程之侧視示意圖。 圖4是本發明第二實施例之基板的剝離治具之侧視示 意圖。 圖5是本發明第三實施例之基板的剝離治具之侧視示 意圖。 【主要元件符號說明】 16 200830957 22104twf.doc/e 100 :印刷電路板 110 :介電質基板 110a:上表面 110b :下表面 120 :銅箔壓合板 122 :剝離金屬層 124 :銅箔線路層 124a :銅塊圖案 210 :基板 210a:前端 212 :介電層 214 :導電圖案層 214a :導電層 214b :導電圖案 220 :剝離層 220a :末端 300、300a、300b、500 :基板的剝離治具 310、310a :基板吸附裝置 312、312a :吸附面 314 :真空吸口 316 :抽氣管 320 :剝離層移除器 322 :剝離層銜接部 330 :驅動裝置 17 200830957 22104twf.doc/e 332 :馬達 334 :齒輪組 340 :基板固定夾具 350 :辅助剝離裝置 352、552 :固定基板元件 352a、552a :滾輪 354 :剝離元件 400 ·•抽氣幫浦 • 550 :辅助剝離裝置 552 :固定基板元件 552b :移動支架 560 :驅動器 562 :軌道 Η :人手 R:移除方向200830957 22104twf.doc/e IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a peeling jig and a peeling method thereof, and more particularly to a peeling jig suitable for a circuit substrate and A method of peeling off a circuit substrate. [Prior Art] Figs. 1A to 1F are schematic cross-sectional views showing a conventional process for fabricating a metal pattern of a printed circuit board by press-fitting. Referring to FIG. 1A, a method of fabricating a metal pattern is first formed with a dielectric substrate 11A having an upper surface 110a and a lower surface 110b opposite the upper surface 110a. The constituent material of the turtle shell substrate 11 is usually composed of a resin and a fiber (glass). Referring to FIG. 1B, next, two sheets of copper foil plywood 12 are formed. Each piece of copper and Luo plywood 120 includes a release metal layer 122 and a copper foil circuit layer 124. Among them, the peeling metal layer 122 is usually made of metal, and the copper foil wiring layer 124 has a plurality of copper block patterns 124a on the surface. These copper block patterns 124a are made by using a lithography process and an etching process, and these copper block patterns 124a are used as pads and wires for printed circuit boards. (trace). Thereafter, the copper foil wiring layers 124 of the two copper foil pressing plates 120 are directed toward the upper surface n〇a and the lower surface 110b, respectively, and the two copper foil bonding plates 12A are pressed against the intermediate dielectric substrate. Referring to FIG. 1C, since the constituent material of the dielectric substrate 110 contains a resin, the two copper foil plywood plates 12 can be combined with the dielectric substrate 11 (pressure medium 5) 30, 30, 950, 22, 104, tw. . Next, referring to Fig. 1D, the peeling metal layer 122 on each of the copper foil press plates 120 is mixed. The current method of removing these stripped metal layers m is to remove them in a personal manner, that is, to peel off the metal layer 122 by hand (10). Therefore, a lot of manpower is required to peel off these peeling metal layers 122. After all the peeling metal layers 122 are to be peeled off, as shown in Fig. ΐ, these copper foil wiring layers 124 have been bonded to the dielectric substrate 11A. Next, the two copper foil wiring layers 124 are etched to expose the copper block patterns 124a as shown in Fig. 1F. Thus, the printed circuit board having a plurality of traces and connection pads (pa(j)) made of the copper block patterns 124 & has been substantially completed. However, as described above, since the peeling metal layer 122 is manually peeled off The way to remove, so the quality of the printed circuit board 1 会 will appear jagged after removing the peeling metal layer 122. At the same time, the process of removing the peeling metal layer 122 cannot be stably controlled. In addition, in order to improve the yield It is necessary to invest a large amount of manpower to peel off the peeling metal layer 122. Thus, it will be wasted, a lot of manpower. SUMMARY OF THE INVENTION An object of the present invention is to provide a peeling jig for peeling off a substrate, instead of manual peeling, thereby reducing manpower. Waste of the Invention Another object of the present invention is to provide a method of peeling a substrate to stably control the process of removing the peeling layer and the quality of the substrate after removing the peeling layer. To achieve the above or other objects, the present invention provides a substrate. The peeling fixture is adapted to peel off at least one peeling layer on a substrate. The peeling treatment of the substrate 6 200830957 22104twf.doc/e includes a substrate suction a device, a peeling layer remover and a driving device. The substrate adsorbing device has an adsorption surface adapted to adsorb the substrate. The peeling layer remover has at least one peeling layer engaging portion disposed above the adsorption surface. Suitable for engaging one end of the peeling layer. The driving device is connected to the peeling layer removing benefit or the substrate adsorbing device, and the driving device is adapted to move the peeling layer engaging portion relative to the substrate adsorbing device. In an embodiment of the invention, the above The peeling layer engaging portion is a clip. In an embodiment of the present invention, the substrate adsorbing device further has at least one vacuum suction port, and the vacuum suction port is located on the adsorption surface. In an embodiment of the invention, the driving device comprises A motor and a gear set, wherein the motor is adapted to drive the peeling layer remover or the substrate adsorbing device to move through the gear set. In an embodiment of the invention, the peeling jig of the substrate further comprises a substrate fixing jig. The fixing fixture is disposed on the substrate adsorption device and is adapted to sandwich the substrate. In an embodiment of the invention, the substrate is The shape of the fixing jig is L. In one embodiment of the present invention, the peeling jig of the substrate further includes a secondary peeling device including a fixed substrate component and a peeling component, and the fixed substrate component is disposed on the substrate and The release layer remover is adapted to press the substrate under the release layer. The release member is coupled to the fixed substrate member. The release member is adapted to abut the release layer between the substrate and the release layer and to move relative to the substrate. 7 200830957 22104 twf.doc/e In the embodiment of the invention, the fixed substrate element is connected to the driving garment, and the fixed substrate element comprises at least one roller adapted to move relative to the substrate on the surface of the substrate. In one embodiment of the invention, the drive means is coupled to the stationary substrate member for driving the peeling member and the roller to move. In an embodiment of the invention, the peeling jig further includes a drive having an obedience, and the fixed substrate member further includes a moving bracket connecting the peeling member and the roller. The moving bracket is disposed on the rail, and the moving bracket is movably connected to the driver by the rail. The present invention further provides a method of peeling a substrate of a peeling jig of the above substrate, which comprises the following steps. First, the substrate is adsorbed on the adsorption surface of the substrate adsorption device. Next, when the substrate is adsorbed, the peeling layer engaging portion is joined to the end of the peeling layer. Thereafter, the peeling layer engaging portion is moved relative to the substrate adsorbing means to move the peeling layer engaging portion to remove the peeling layer. In an embodiment of the invention, the method of adsorbing a substrate comprises adsorbing a substrate in a vacuum. In one embodiment of the invention, the method of engaging the distal end of the peeling layer engaging portion includes the peeling layer engaging portion gripping the end. In an embodiment of the invention, when the peeling layer engaging portion engages the end 2, the following steps are further included. The end of the release layer is separated from the substrate to expose one of the front ends of the substrate. Next, the front end of the substrate is sandwiched by a substrate fixing jig disposed on the substrate adsorption device to further strengthen the substrate. In an embodiment of the invention, the substrate fixing jig has an L shape. 8 200830957 22104twf.d〇c/e In an embodiment of the invention, the peeling jig of the substrate further comprises an auxiliary peeling device comprising a fixed substrate component and a peeling component, wherein the fixed substrate component comprises at least one The roller is fixed, and the fixed substrate component is connected to the driving device, and the peeling component is connected to the fixed substrate component. After the peeling layer engaging portion engages the end of the peeling layer, the following steps are further included. The roller is pressed against the substrate below the end of the peeling layer. Next, the release member is placed between the substrate and the release layer and against the release layer. Thereafter, the roller and the peeling member are moved relative to the substrate to separate the peeling layer from the substrate. Since the peeling jig of the substrate of the present invention is used, the peeling layer can be removed in place of the conventional manual peeling. At the same time, it is also possible to stably control the quality of the substrate after removing the peeling layer and the process of removing the peeling layer. The above and other objects, features and advantages of the present invention will become more <RTIgt; [Embodiment] Fig. 2 is a side view showing a peeling jig of a substrate according to a first embodiment of the present invention. Referring to FIG. 2, the substrate peeling fixture 300a can be used to peel off at least one peeling layer 220 on a substrate 210. The peeling layer 220 may be made of a metal material, and the substrate 210 may be used to form a single side circuit board, a double side circuit board, or other suitable circuit board. Of course, the substrate 210 may also be one of the circuit layers constituting a multi-layer circuit board or a high density interconnection board (HDI board). The substrate 210 includes a dielectric layer 212 and at least 9 200830957 22104 twf.doc/e "pattern layer 214. The substrate 210 illustrated in FIG. 2 has two conductive patterns = ^ 214, but FIG. 2 is merely illustrative and not limiting. Invention I layer 212 is formed by enamel, epoxy (叩〇乂乂π—), glass, paper or other suitable material, so dielectric layer 212 can be a semi-cured The conductive pattern layer 214 includes a conductive layer 214a and a plurality of conductive patterns 214b. The conductive layer 214a may be made of a conductive material such as copper, aluminum, aluminum-copper alloy or the like, and the conductive layer 214a is first. Formed on the surface of the peeling layer 220. The conductive layer 2i4a can be formed by sputtering, evaporation, or other physical vapor deposition (physical vap〇r dep〇siti〇n, pVD), or electroplating, electr〇less Plating, chemical vapor deposition (CVD) or other suitable chemical deposition method (chemical dep〇siti〇n). The plurality of conductive patterns 214b may be The shadow and etch processes are made 'and these conductive patterns 214b can be used as connection pads and traces on the board, or can form internal lines in a multilayer circuit board or a high-density circuit board. See Figure 2, The peeling jig 300a of the substrate according to the first embodiment of the present invention includes a substrate adsorbing device 31A, a peeling layer remover, 320, and a driving device 330. Specifically, the substrate adsorbing device 310a has a substrate for adsorbing the substrate. The adsorption surface 312a of the substrate 210. The substrate adsorption device 310a may further have at least one vacuum suction port 314 located on the adsorption surface 312a. Although there are many vacuum suction ports 314 shown in FIG. 2, FIG. 2 is only an example, not 200830957. 22104 twf.doc / e limits the number of vacuum suction ports 314. In this embodiment, the substrate adsorption device 310a may include an air suction pipe 316, one end of which is placed at the vacuum suction port 314, and the other end may be externally connected to a pumping pump 400. The pumping pump 400 draws air, so that the substrate 210 can be adsorbed on the adsorption surface 312a. Thus, the substrate 210 can be fixed without moving, so as to perform the peeling work of the peeling layer 220. The peeling layer remover 320 has at least one peeling layer engaging portion 322 disposed above the adsorption surface 312a. The peeling layer engaging portion 322 is used to engage one end 220a of the peeling layer 220, so the peeling layer engaging portion 322 can be used The clamp of the end 220a is lost (as shown in FIG. 2), and the hook of the peeling layer 220 is pierced and suspended (not shown). Therefore, the peeling layer engaging portion 322 shown in Fig. 2 is merely illustrative, and the present invention is not limited thereto. The driving device 330 is connected to the peeling layer remover 320, and the driving device 330 can be used to drive the peeling layer engaging portion 322 to move, thereby removing the peeling layer 22 from the substrate 210. Of course, in addition to the connection layer 322, the driving device 330 can also be connected to the substrate adsorption device 310a to drive the substrate adsorption device 310a to connect with the peeling layer. The part 322 moves. Thus, the function of removing the peeling layer 220 can also be achieved. Therefore, the driving device 33 shown in Fig. 2 is merely illustrative and does not limit the invention. Additionally, drive unit 330 can include a motor 332 and a gear set 334. If the driving device 33 is connected to the peeling layer remover 32, the shell 1J motor 332 can drive the peeling layer remover to move through the gear set 334. If the driving device is connected to the substrate adsorbing device 31〇a, Then, the horse 11 200830957 22104twf.doc/e 332 can drive the substrate adsorption device 3i〇a to move through the gear set 334. The method of peeling off the substrate to the peeling jig of the substrate of the above embodiment will be described below with reference to Fig. 3A to Fig. 3A. 3a to 3B are side views showing the flow of a method of peeling off a substrate of a peeling jig of a substrate of the present invention. Referring to Fig. 3A, the substrate 300 may be a peeling jig of the substrate of the above embodiment, and the method of peeling the substrate of the peeling jig 300 of the second embodiment includes the following steps. First, the adsorption substrate 210 is on the adsorption surface 312 of the substrate adsorption device 310, and the fixed substrate 210 is not moved. Since the peeling jig 3 of the substrate may be the peeling jig 3〇〇a of the substrate of the above embodiment, the substrate adsorbing device 310 may be the substrate adsorbing device 31〇a (please refer to Fig. 2). As such, the method of adsorbing the substrate 210 may adsorb the substrate 21 by vacuum. Referring to FIG. 3B, next, when the substrate 21 is adsorbed, the peeling layer engaging portion 322 of the peeling layer remover 320 is engaged to the end 220b of the peeling layer 22. The peeling layer engaging portion 322 may be a clamp, and the peeling layer engaging portion 322 may be connected to the end 220a by a peeling layer engaging portion 322. For example, the peeling layer 220 may be firstly removed by a human hand or a peeling layer engaging portion 322. After the corner is opened, the peeling layer engaging portion 322 is sandwiched by at least one corner of the peeling reed 220. Thereafter, the peeling layer engaging portion 322 is moved to remove the peeling layer 22A. The method of moving the peeling layer engaging portion 322 can drive the peeling layer engaging portion 322 to move by the driving device 330 connected to the peeling layer remover 320. The direction of movement of the delamination interface 322 may be along a removal direction R or along other suitable directions to remove the delamination layer 22, ie, the delamination layer 12 200830957 22104 twf.doc/e The crucible is moved in a space to fit the peeling layer 220 of different thicknesses. Of course, in the embodiment not shown in the present invention, the driving device 330 can also be connected to the substrate adsorption device 31, and then the substrate adsorption device 31 can be moved to remove the peeling layer 22A. Therefore, both the map SA and the diagram SB are exemplified. It is emphasized herein that the present invention is not limited to removing the peeling layer 220 by moving the peeling layer engaging portion 322. Fig. 4 is a side elevational view showing the peeling jig of the substrate of the second embodiment of the present invention. Referring to Fig. 4, the peeling jig of the substrate of the present embodiment is similar to the above embodiment, and therefore will not be described again. However, the peeling jig 300b of the substrate is different from the above embodiment in that the peeling jig 300b of the substrate further includes a substrate fixing jig 340 and an auxiliary peeling device 35A. The shape of the substrate fixing jig 340 may be an l shape, and the substrate fixing jig 340 is disposed on the substrate adsorption device 310. The function of the substrate fixing jig 34 is for sandwiching the substrate 210 and fixing the substrate 210. Further, the substrate fixing jig 340 may be a flexible jig (for example, a spring clip). # When the substrate is adsorbed, the end 220a of the peeling layer 220 can be separated from the substrate 210. Thus, the front end 21〇a of the substrate 210 is exposed. The end 220a may be separated by peeling a corner of the peeling layer 220 by hand or the peeling layer engaging portion 322. Thereafter, the front end 21〇a is sandwiched by the substrate fixing jig 340. Thus, when the peeling layer engaging portion 322 removes the peeling layer 220, the substrate 210 can be detached from the adsorption surface 312 without being affected by the peeling layer 220. Further, the auxiliary peeling device 350 included in the peeling jig 300b of the substrate includes a fixed substrate member 352 and a peeling member 354. Fixing 13 200830957 22104twf.doc/e The substrate element 352 is disposed between the substrate 210 and the peeling layer remover 32A, and the fixed substrate member 352 can press the substrate 21A under the peeling layer 220. The peeling member 354 is attached to the fixed substrate member 352 and is positioned between the substrate 210 and the peeling layer 220. The stripping element 354 can be wedge shaped (as shown in Figure 4) or other suitable shape to resist the release layer 22, plus the stripping element 354 can be moved relative to the substrate 21 to remove the release layer 220. The driving device 330 can be coupled to the fixed substrate member 352 to drive the fixed substrate member 352 to move and to drive the peeling member 354 to move. The fixed substrate member 352 can include at least one roller 352a (only one is shown in FIG. 4), and the number of rollers 352a in FIG. 4 is merely illustrative and not limiting. The roller 352a may be a cylinder or a ball, and the roller 352a presses the substrate 21A under the peeling layer 220, and is movable relative to the substrate 210 on the surface of the substrate 21A. When the substrate 210 is adsorbed, the substrate 21A can be pressed under the peeling layer 220 by the fixed substrate member 352. Next, the peeling member is placed between the base plate 210 and the peeling layer 220 and against the peeling layer 220 (as shown at X in Fig. 4). Thereafter, the drive unit 330 drives the roller 352a and the peeling member 354 to move relative to the substrate 21 to assist the peeling layer remover in removing the peeling layer 220. The driving device 330 can be coupled with the gear, the skin, the pulley, or other suitable mechanical structure (not shown) by an internal motor (not shown), so that the peeling member 354 can cooperate with the peeling layer remover 320. Moving, thereby allowing the peel layer remover 320 to cooperate with the movement of the peeling element 354, removes the peeling layer 220. Fig. 5 is a side elevational view showing a peeling jig of a substrate according to a third embodiment of the present invention. Referring to FIG. 5, the peeling jig 5 of the substrate of the present embodiment is similar to the above embodiment, and therefore will not be repeatedly described. However, the peeling jig 5 of the substrate is different from the above embodiment in that the substrate is The peeling jig 500 includes an auxiliary peeling device 550 and a driver 560. In detail, the auxiliary stripping device 550 includes a fixed substrate member 552 that includes at least one roller 552a and a moving bracket 552b, and the driver 560 has an obstruction 562. The moving bracket 552b is disposed on the road 562 (as shown in FIG. 5), and the moving bracket ” is movably connected to the driver 560 by the rail 562. In addition, the moving bracket 552b extends one end to connect the stripping member 354 with Roller 552a. Thus, moving bracket 552b is coupled to stripping element 354 and roller 552a. Actuator 560 includes a motor (not shown) and a gear set, belt, pulley or other suitable mechanical structure (not shown), wherein the motor of drive 560 The movement of the moving bracket 552b can be driven by the mechanical structure described above, thereby moving the peeling member 354 and the roller 552a in the removal direction R. Thus, the 'separating member 354 separates the substrate 210 from the peeling layer 22 to help peel the layer. The stripper 220 removes the peeling layer 220. In the present embodiment, in the case where the peeling jig 500 removes the peeling layer 220, the user can individually adjust the motor of the driving device 33 () and the motor of the driving benefit 560 at any time. The rotation speed is used to remove the peeling layer 220 on the substrate 210. In addition, the user can also start to remove the motor of the peeling layer 22 and the motor of the driving device 330. The rotational speed of the motor of the actuator 560, 15 200830957 22104twf.doc/e, the motor is turned over, and the (4) _ layer 22 () is removed. The red peeling jig of the substrate of the present invention is The substrate holding device fixes the substrate without moving, and the peeling layer engaging portion peels off the peeling layer on the substrate, thereby having the function of removing the peeling layer. Thus, the above-mentioned substrate peeling device can replace the peeling layer instead of the conventional manual peeling method. At the same time, it is also possible to stably control the process of removing the peeling layer of the substrate and the quality of the substrate after removing the peeling layer. Although the invention has been disclosed above in the preferred embodiment, it is not used In order to limit the present invention, any person skilled in the art to which the invention pertains will be able to make some modifications and refinements without departing from the spirit and scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [A brief description of the drawings] FIGS. 1A to 1F are diagrams illustrating a flow of manufacturing a metal pattern of a printed circuit board by press-fitting. 2 is a side view showing a peeling jig of a substrate according to a first embodiment of the present invention. FIGS. 3A to 3B are side views showing a flow of a method of peeling a substrate of a peeling jig of a substrate according to an embodiment of the present invention. Figure 4 is a side elevational view of a peeling jig of a substrate according to a second embodiment of the present invention. Figure 5 is a side elevational view of a peeling jig of a substrate according to a third embodiment of the present invention. 200830957 22104twf.doc/e 100 : Printed circuit board 110: dielectric substrate 110a: upper surface 110b: lower surface 120: copper foil plywood 122: peeled metal layer 124: copper foil wiring layer 124a: copper block pattern 210: substrate 210a: front end 212: dielectric layer 214: conductive pattern layer 214a: conductive layer 214b: conductive pattern 220: peeling layer 220a: end 300, 300a, 300b, 500: substrate peeling jig 310, 310a: substrate adsorbing device 312, 312a: adsorption surface 314: vacuum suction port 316: exhaust pipe 320: peeling layer remover 322: peeling layer engaging portion 330: driving device 17 200830957 22104twf.doc/e 332: motor 334: gear set 340: substrate fixing jig 350: Auxiliary Peeling device 352, 552: fixed substrate member 352a, 552a: roller 354: peeling member 400 • pumping pump 550: auxiliary peeling device 552: fixed substrate member 552b: moving bracket 560: driver 562: track Η: human hand R : removal direction
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