JP2005217278A5

JP2005217278A5 -

Info

Publication number: JP2005217278A5
Application number: JP2004023685A
Authority: JP
Filing date: 2004-01-30
Publication date: 2006-01-26
Anticipated expiration: 2024-01-30

Claims

Preparing a long ceramic green sheet held on a long carrier film;
While holding the long ceramic green sheet held on the long carrier film on a holding roll that can rotate and hold the ceramic green sheet, the carrier film is removed from the ceramic green sheet. A peeling step;
Separating the ceramic green sheet held by the holding roll from the holding roll, and laminating at a lamination part, and obtaining a mother laminate; and
Cutting the mother laminate to obtain a laminate of individual multilayer ceramic electronic component units from the mother laminate;
The manufacturing method of a multilayer ceramic electronic component provided with the process of baking the laminated body obtained by cutting | disconnection.

In the step of peeling the carrier film from the ceramic green sheet while holding the ceramic green sheet on the holding roll, the ceramic green sheet is first held on the holding roll, and any of the positions within the range where the ceramic green sheet is held The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein peeling of the carrier film is started at that position.

The steps of holding the ceramic green sheet, peeling the carrier film, and peeling the ceramic green sheet from the holding roll for lamination are performed simultaneously or continuously on the outer peripheral surface of the holding roll. A method for producing a multilayer ceramic electronic component according to 1 or 2.

The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-3 whose said holding | maintenance roll is a suction roll or the adhesion roll in which an outer peripheral surface has adhesiveness.

The lamination in the laminated part of the ceramic green sheet is performed by temporarily pressing the ceramic green sheet with a holding roll in the laminated part, and then peeling from the holding roll. The manufacturing method of the multilayer ceramic electronic component of description.

The ceramic green sheets are temporarily bonded to each other by a pressure-bonding roll other than the holding rolls after the ceramic green sheets are peeled off from the holding rolls and stacked in the laminated portion. The manufacturing method of the multilayer ceramic electronic component of description.

The method for producing a multilayer ceramic electronic component according to claim 1, wherein the multilayer part is heated, and a plurality of ceramic green sheets are thermocompression bonded in the multilayer part.

The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-7 by which the ceramic green sheet currently hold | maintained at the said holding roll is cooled.

The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-8 in which the said some holding | maintenance roll is used with respect to one laminated part.

10. The method for manufacturing a multilayer ceramic electronic component according to claim 9, wherein among the plurality of holding rolls, a stacking direction by an odd-numbered holding roll is different from a stacking direction by an even-numbered holding roll by 180 °.

C> A>, where A (Pa) is the pressing force during lamination in the lamination part, B (Pa) is the adhesion between the green sheets after lamination, and C (Pa) is the minimum pressure to deform the laminate. The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-10 made into B.

The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-11 with which the said lamination | stacking part has a lamination roll by which a ceramic green sheet is laminated | stacked on an outer peripheral surface.

The method for manufacturing a multilayer ceramic electronic component according to claim 12, wherein a peripheral speed of the holding roll and a peripheral speed of the multilayer roll are the same.

14. The multilayer ceramic electronic according to claim 12, wherein in the length direction of the ceramic green sheet, the tension of the ceramic green sheet is gradually increased according to an increase in curvature of a portion to which the ceramic green sheet is pressed. A manufacturing method for parts.

The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-11 with which the said laminated part is comprised using the flat laminated stage.

The stacking stage is configured to be moved along the length direction of the ceramic green sheet, and the moving speed of the stacking stage is equal to the peripheral speed of the holding roll. The manufacturing method of the multilayer ceramic electronic component of description.

A laminated ceramic electronic component manufacturing apparatus for obtaining a laminated body by laminating long ceramic green sheets held on a long carrier film,
A holding roll that is rotatably provided and holds the ceramic green sheet on its outer peripheral surface;
The holding roll and the outer peripheral surface are provided so as to be in contact with each other via the ceramic green sheet, receive the ceramic green sheet from the holding roll on the outer peripheral surface, and receive the ceramic green sheet on the outer peripheral surface. An apparatus for producing a multilayer ceramic electronic component, comprising: a multilayer roll that is continuously laminated on a ceramic green sheet laminated on an upper surface or an outer peripheral surface.

The holding roll and the outer peripheral surface are rotatably provided so as to contact each other via the carrier film and the ceramic green sheet, and the carrier film is held on the outer peripheral surface and held by the holding roll. The manufacturing apparatus of the multilayer ceramic electronic component of Claim 17 further provided with the peeling roll which peels the said carrier film from a ceramic green sheet.

A multilayer ceramic electronic component manufacturing apparatus for stacking ceramic green sheets held on a long carrier film to obtain a laminate,
A holding roll that is rotatably provided and holds the ceramic green sheet on its outer peripheral surface;
The holding roll is provided so that the outer peripheral surface of the holding roll comes into contact with the main surface thereof via the ceramic green sheet, and the ceramic green sheet is received on the main surface from the holding roll, and the ceramic green sheet is supplied to the main surface. A multilayer ceramic electronic component manufacturing apparatus comprising: a multilayer table that is laminated on a ceramic green sheet laminated on a surface or a main surface.

The holding roll and the outer peripheral surface are provided so as to be in contact with each other through the ceramic green sheet and the carrier film, the carrier film is held on the outer peripheral surface, and the holding roll is held by the holding roll. The manufacturing apparatus of the multilayer ceramic electronic component of Claim 19 further equipped with the peeling roll which peels the said carrier film from a ceramic green sheet.