TW200827049A - Regeneration method for recycling thin film transistor substrate - Google Patents

Regeneration method for recycling thin film transistor substrate Download PDF

Info

Publication number
TW200827049A
TW200827049A TW95147486A TW95147486A TW200827049A TW 200827049 A TW200827049 A TW 200827049A TW 95147486 A TW95147486 A TW 95147486A TW 95147486 A TW95147486 A TW 95147486A TW 200827049 A TW200827049 A TW 200827049A
Authority
TW
Taiwan
Prior art keywords
thin film
film transistor
transistor substrate
layer
recovered
Prior art date
Application number
TW95147486A
Other languages
English (en)
Chinese (zh)
Other versions
TWI304363B (enExample
Inventor
Kun-Huang Wu
You-Ren Chen
Original Assignee
Glass Grind Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Glass Grind Technology Co Ltd filed Critical Glass Grind Technology Co Ltd
Priority to TW95147486A priority Critical patent/TW200827049A/zh
Publication of TW200827049A publication Critical patent/TW200827049A/zh
Application granted granted Critical
Publication of TWI304363B publication Critical patent/TWI304363B/zh

Links

Landscapes

  • Thin Film Transistor (AREA)
  • ing And Chemical Polishing (AREA)
TW95147486A 2006-12-18 2006-12-18 Regeneration method for recycling thin film transistor substrate TW200827049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95147486A TW200827049A (en) 2006-12-18 2006-12-18 Regeneration method for recycling thin film transistor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95147486A TW200827049A (en) 2006-12-18 2006-12-18 Regeneration method for recycling thin film transistor substrate

Publications (2)

Publication Number Publication Date
TW200827049A true TW200827049A (en) 2008-07-01
TWI304363B TWI304363B (enExample) 2008-12-21

Family

ID=44817084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95147486A TW200827049A (en) 2006-12-18 2006-12-18 Regeneration method for recycling thin film transistor substrate

Country Status (1)

Country Link
TW (1) TW200827049A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207709A (zh) * 2019-07-12 2021-01-12 三星显示有限公司 化学机械抛光设备和方法及制造显示装置的方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201444118A (zh) * 2013-05-03 2014-11-16 Univ Dayeh 具有氮化鎵磊晶層的藍寶石基板的回收方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207709A (zh) * 2019-07-12 2021-01-12 三星显示有限公司 化学机械抛光设备和方法及制造显示装置的方法
CN112207709B (zh) * 2019-07-12 2025-01-17 三星显示有限公司 化学机械抛光设备和方法及制造显示装置的方法

Also Published As

Publication number Publication date
TWI304363B (enExample) 2008-12-21

Similar Documents

Publication Publication Date Title
TWI429606B (zh) The etching method of glass substrate
JP2006216807A (ja) Soi基板の製造方法
TW200918664A (en) Wafer reclamation compositions and methods
Meuris et al. Implementation of the IMEC-cleaning in advanced CMOS manufacturing
TW201001529A (en) Cleaning process of silicon boat, silicon boat, heat treating method of silicon wafer, and silicon wafer
TW200524031A (en) Silicon wafer reclamation method and reclaimed wafer
JP2011071494A5 (ja) 半導体基板の再生方法
TWI235407B (en) Wafer and the manufacturing and reclaiming method therefor
JP2009200360A (ja) シリコン部材の表面処理方法
TW200827049A (en) Regeneration method for recycling thin film transistor substrate
TW200509241A (en) Method for fabricating semiconductor device
TW201113955A (en) Display panel and rework method of gate insulating layer of thin film transistor
JPH09227170A (ja) ガラス基板の洗浄方法
CN102443769B (zh) Pvd假片的回收方法
CN110064984A (zh) 一种晶圆处理方法及装置
TWI245317B (en) Method of wafer reclaiming, the wafer and producing method of the same
KR102514017B1 (ko) 태양전지 기판의 습식 텍스쳐링 방법
JP3997310B2 (ja) シリコン製品の浄化方法
JP2002158207A (ja) 銅膜付着シリコン単結晶ウエーハの再生方法および再生ウエーハ
EP2432586B1 (fr) Procede de gravure d'un materiau en presence d'un gaz
CN115184124A (zh) 一种锗锑碲合金的金相腐蚀方法及金相组织显示方法
JP2005079389A (ja) 貼り合わせウェーハの分離方法及びその分離用ボート
CN101266917B (zh) 贴合晶片的制造方法
KR101014789B1 (ko) 반도체 웨이퍼(Wafer) 재생방법
CN108231956B (zh) 一种黑硅电池片的清洗槽工艺

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees