200825687 九、發明說明： 【發明所屬之技術領域】 特別係一種用於電子元件 本發明涉及一種散熱裝置 散熱之散熱裝置。 【先前技術】200825687 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device for dissipating heat of a heat dissipating device. [Prior Art]
Ik著電子貧訊業不斷發展，電子元件（尤 理器）運行速度不斷提升。作係 /…、、免 τ 你阿頻尚速使電子元株吝 生之熱量隨之增多，使得其溫度 不分杜喋―成lL 又个鯽升冋，嚴重威脅著電 子兀件運仃時之性能，為確保電子元件能正常運行，必須 及時排出電子元件所產生之大量熱量。 、 為此，業界通常使用—種散熱器進行散熱，該等散熱 益-般包括-底座和設在底座上之複數散減片，該散敎 底座底面為平滑之實體金屬’係供貼設在中央處理器： 面。而隨著中央處理器體積越來越小，其發熱也更加集中， 因局限於金屬之傳熱性能，散熱底座中心處之熱量往往過 於术中，而無法有效傳遞到散熱裝置四周，從而嚴重影響 整體散熱效果，使得中央處理器之性能下降，無法保持有 效工作。 為克服上述問題，採用熱管之散熱裝置日益增多，熱 官係在金屬管體内設置毛細結構物（如粉末燒結物、溝槽 結構、絲網結構等），並密封裝入工作液體（如水、酒精 等）’然後抽至真空狀態，依賴工作液體受熱後進行液氣 兩相變化而吸收、釋放熱量工作，由於熱管傳熱速度快、 200825687 不定向且傳熱距離長，而 s ^ 而對散熱裝置性能有較大之提升。 月1吊 …、官散熱裝置-般包括-與熱源接觸之鋁 :製底板、複數水平間隔堆4於底板上之W和將底板和轉 片熱連接之三U形熱管。該等熱管包括均勻嵌置在底板上之 吸熱部和從該吸熱部兩端向上垂直延伸並穿置在鱗片兩端 之放熱部。該等熱管之吸熱部從底板吸收熱量傳導到放敛 部、，再從放熱部傳遞給'讀片，從而將熱量散發到周圍環境 中達到冷部電子兀件之效果。然而，熱傳導率高之金屬材 料一般密度較大且價格較高，例如銅；熱傳導率低之 一般密度比較小且價格較低，例如銘。因此，該底板如果 由熱傳導相對較低之紹材製成，將會限制散熱效率之提 向，但如果採用熱傳導率較高之銅製底板來提高效率，又 會極大地提高散熱裝置之成本及重量。 【發明内容】 〜有鑒於此，有必要提供一種以相對較低成本而獲得較 鬲性能之熱管型散熱裝置。 -種散熱裝置’包括一底座、複數散熱鰭片以及至少 一連接底座與散熱鰭片之熱管，該底座包括一第一導熱基 板和第一導熱基板，該第一基板採用之材料較第二基板 之材料之熱傳導率高，該熱管與該第一基板連接。 _上述散熱裝置第一基板與第二基板結合形成之底座在 问熱區使用熱傳導率高之材料，而在其周圍使用成本及重 200825687 T相對較低之材料，從而使該底座在不顯著增加成本及重 •置之情況下具有較佳之熱傳導性能，進而提升整個散熱裝 、置之性能。 t β【實施方式】 請參閱圖1和2，本發明較佳實施例中之一散熱裝置用 於電子元件政熱，其包括一底座、一組熱管2〇、分別固定 於底座兩側之兩扣板4〇、一鰭片組5〇及位於鰭片組％頂部 Γ之一頂板60。該底座包括一第一基板1〇及與該第一基板扨 配合夾置該熱管組2〇之一第二基板3〇。 上述第一基板10由導性熱性能較好之金屬如銅製成， 其大致為一方形板體。該第一基板10之上表面設有一第一 溝槽11和二第二溝槽13。該第一溝槽η呈“一，，字形其位 於第一基板10中間；該第二溝槽13呈“V”形，分別位二第 一溝槽11兩侧，並相對該第一溝槽丄丄對稱分佈，且該二第 —溝槽13開口朝外。 / 上述熱管組20包括一第一熱管22和二第二熱管24。該 第一熱官22呈U形，其包括一與第一基板1〇之第一凹槽η 配合之吸熱部221及分別從該吸熱部221兩端垂直向上延伸 之兩放熱部223。該第二熱管24包括一呈V形彎曲並後置在 底座10第二凹槽13内之吸熱部241及分別從該吸熱部241兩 知垂直向上延伸之兩放熱部243。該等熱管22、24兩端之放 熱部223、243分別穿置在鰭片組5〇靠近兩端處。 請一併參閱圖3，上述第二基板3〇由導熱性能弱於底板 8 200825687 10且價格相對較低之材料如鋁製成，該第二基板30具有一 大致呈矩形框體31及橫跨該框體31中部之結合板35，該框 /體31之中部開設一矩形開口 33，該開口33大小與第一基板 ‘ 10相同，正好將第一基板10容置在其中。該開口 33之四個 對角沿著對角線方向向外凹伸形成凹陷部330，該凹陷部 330用於容置連接第二熱管24吸熱部241和放熱部243之彎 曲。該結合板35跨設在該開口 33中部上，其底面中間開設 有一直凹槽351和位於直凹槽351兩侧之V形曲凹槽353，該 直凹槽351和曲凹槽353分別與第一基板10之第一、第二凹 槽11、13對應配合，以將第一、二熱管22、24之吸熱部221、 241容置在第一基板10和結合板35之間。該框體31之相對兩 外側緣之中部向其本體方向内凹形成二凹口 311，於每一凹 口 311之兩侧設有用於固定扣板40之二固定孔3110。該第二 基板30之相對兩端中部近邊緣處分別設有一定位孔313，以 將第二基板30固定到電子元件上。 ι 上述扣板40具有一大致呈矩形之結合部41，該結合部 41底部端角設有二透孔45，二螺釘100穿過該二透孔45螺鎖 於第一基板30兩侧凹口 311兩端之二固定孔3110内，從而該 扣板40固定至該凹口 311之外侧。該扣板40從其上述側緣處 向内垂直延伸出一定位部43，該定位部43位於該第二基板 30上方。 上述鰭片組50包括豎直堆疊之複數鰭片51，相鄰鰭片 間形成氣流通道。該鰭片組50設有三組貫穿其上下之通道 510，以供上述三熱管22、24之放熱部223、243穿置。每一 9 200825687 鰭片51在通道51之周緣形成環狀折邊512，來增加與熱管 22、24之接觸面積。該鰭片組50之底部對應上述扣板40處 :設有一切槽530，該切槽530與該第二基板30之凹口 310相 '通，該扣板40之定位板43收容於該鰭片組50之切槽530内並 與鰭片組50焊接，以起到輔助固定鰭片組50之作用。 上述頂板60緊貼至該鰭片組50頂部。該頂板60之底部 設有凹陷部位，以收容熱管22、24之吸熱部223、243穿過 f 鰭片組50之突出部分。Ik is constantly evolving in the electronic poverty industry, and the electronic components (expressor) are running faster. The system is /...,, and free of τ. The speed of the A-frequency is increasing, so that the heat generated by the electronic element is increased, so that the temperature does not divide the rhododendron into a lL and rises, which seriously threatens the electronic components. The performance, in order to ensure the normal operation of electronic components, must discharge the large amount of heat generated by the electronic components in time. For this reason, the industry usually uses a kind of heat sink for heat dissipation, and the heat dissipation includes a base and a plurality of diffusing sheets disposed on the base, and the bottom surface of the diffusing base is a smooth solid metal Central Processing Unit: Face. As the central processor becomes smaller and smaller, its heat is more concentrated. Due to the heat transfer performance of the metal, the heat at the center of the heat sink base is often too much in the process, and cannot be effectively transmitted to the periphery of the heat sink, thus seriously affecting The overall heat dissipation effect makes the performance of the central processing unit declining and it is impossible to maintain effective operation. In order to overcome the above problems, heat-dissipating devices using heat pipes are increasing, and the thermal system is provided with capillary structures (such as powder sintered materials, groove structures, wire mesh structures, etc.) in the metal pipe body, and is sealed and filled with working fluids (such as water, Alcohol, etc.' then pumped to a vacuum state, depending on the working liquid is heated, the liquid-gas two-phase change absorbs and releases heat. Because the heat pipe heat transfer speed is fast, 200825687 is not oriented and the heat transfer distance is long, and s ^ The performance of the device has been greatly improved. The month 1 suspension ..., the official heat sink - generally includes - aluminum in contact with the heat source: a bottom plate, a plurality of horizontally spaced stacks 4 on the bottom plate and a triple U-shaped heat pipe that thermally connects the bottom plate and the rotor. The heat pipes include a heat absorbing portion uniformly embedded on the bottom plate, and a heat radiating portion extending vertically upward from both ends of the heat absorbing portion and penetrating at both ends of the scale. The heat absorbing portions of the heat pipes are radiated from the bottom plate to the condensing portion, and then transferred from the heat radiating portion to the 'reading sheet, so that heat is radiated to the surrounding environment to achieve the effect of the cold portion electronic components. However, metal materials with high thermal conductivity are generally dense and expensive, such as copper; low thermal conductivity is generally low in density and low in price, such as Ming. Therefore, if the bottom plate is made of a material with relatively low heat conduction, it will limit the heat dissipation efficiency. However, if a copper base plate with a high thermal conductivity is used to improve the efficiency, the cost and weight of the heat sink can be greatly improved. . SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat pipe type heat sink which achieves relatively low performance at a relatively low cost. The heat dissipating device includes a base, a plurality of heat dissipating fins, and at least one heat pipe connecting the base and the heat dissipating fin, the base comprising a first heat conducting substrate and a first heat conducting substrate, wherein the first substrate is made of a material smaller than the second substrate The material has a high thermal conductivity, and the heat pipe is connected to the first substrate. The base formed by the combination of the first substrate and the second substrate of the heat dissipating device uses a material having a high thermal conductivity in the hot region, and uses a material having a relatively low cost and a weight of 200825687 T, so that the base is not significantly increased. The cost and the weight of the device have better thermal conductivity, which improves the performance of the entire heat dissipation device. Referring to FIGS. 1 and 2, in a preferred embodiment of the present invention, a heat dissipating device is used for electronic component heating, which comprises a base, a set of heat pipes 2, and two fixed on both sides of the base. The gusset 4 〇, a fin set 5 〇 and a top plate 60 located at the top of the fin set %. The base includes a first substrate 1 〇 and a second substrate 3 夹 sandwiching the heat pipe group 2 与 with the first substrate 扨. The first substrate 10 is made of a metal having a good thermal conductivity such as copper, and is substantially a square plate. A first trench 11 and two second trenches 13 are disposed on the upper surface of the first substrate 10. The first trench η has a shape of "one," which is located in the middle of the first substrate 10; the second trench 13 has a "V" shape, and is located on both sides of the first trench 11 and opposite to the first trench. The first ridges 13 are open to the outside. The heat pipe group 20 includes a first heat pipe 22 and two second heat pipes 24. The first heat officer 22 has a U shape, which includes a first The first recess η of the substrate 1 is matched with the heat absorbing portion 221 and the two heat releasing portions 223 respectively extending vertically upward from opposite ends of the heat absorbing portion 221. The second heat pipe 24 includes a V-shaped bent portion and is disposed at the base 10 The heat absorbing portion 241 in the second groove 13 and the two heat releasing portions 243 extending perpendicularly upward from the heat absorbing portion 241. The heat releasing portions 223 and 243 at both ends of the heat pipes 22 and 24 are respectively disposed on the fin group 5 Referring to FIG. 3 together, the second substrate 3 is made of a material having a lower thermal conductivity than the bottom plate 8 200825687 10 and having a relatively low price, such as aluminum, and the second substrate 30 has a substantially rectangular shape. a frame 31 and a connecting plate 35 extending across the middle of the frame 31. A rectangular opening 33 is defined in the middle of the frame/body 31. The size of 33 is the same as that of the first substrate '10, and the first substrate 10 is accommodated therein. The four opposite corners of the opening 33 are outwardly recessed in the diagonal direction to form a recess 330, which is used for the recess 330 The bending of the heat absorbing portion 241 and the heat releasing portion 243 of the second heat pipe 24 is accommodated. The bonding plate 35 is spanned in the middle of the opening 33, and the bottom surface of the second heat pipe 24 is provided with a straight groove 351 and a V shape on both sides of the straight groove 351. The curved groove 353, the straight groove 351 and the curved groove 353 respectively cooperate with the first and second grooves 11 and 13 of the first substrate 10 to connect the heat absorbing portions 221 of the first and second heat pipes 22 and 24, The 241 is disposed between the first substrate 10 and the bonding plate 35. The middle portions of the opposite outer edges of the frame 31 are concavely formed in the body direction to form two notches 311, and are provided on both sides of each notch 311 for Two fixing holes 3110 are fixed to the fixing plate 40. A positioning hole 313 is respectively disposed at a near edge of the opposite ends of the second substrate 30 to fix the second substrate 30 to the electronic component. a rectangular joint portion 41, the bottom end corner of the joint portion 41 is provided with two through holes 45, two screws 100 The two through holes 45 are screwed into the two fixing holes 3110 at both ends of the notch 311 on both sides of the first substrate 30, so that the gusset 40 is fixed to the outer side of the notch 311. The gusset 40 is from the side thereof A positioning portion 43 extends vertically inwardly from the edge, and the positioning portion 43 is located above the second substrate 30. The fin group 50 includes a plurality of fins 51 stacked vertically, and an air flow channel is formed between the adjacent fins. The sheet set 50 is provided with three sets of passages 510 extending therethrough for the heat radiating portions 223, 243 of the three heat pipes 22, 24 to be placed. Each of the 9 200825687 fins 51 forms an annular flange 512 at the periphery of the passage 51 to increase the contact area with the heat pipes 22, 24. The bottom of the fin set 50 corresponds to the gusset 40: a slot 530 is defined, and the slot 530 is permeable to the recess 310 of the second substrate 30. The positioning plate 43 of the gusset 40 is received in the fin. The slots 530 of the set 50 are welded to the fin set 50 to assist in securing the fin set 50. The top plate 60 is attached to the top of the fin set 50. The bottom of the top plate 60 is provided with a recessed portion for accommodating the heat absorbing portions 223, 243 of the heat pipes 22, 24 to pass through the protruding portion of the f fin group 50.
I 上述銅製之第一基板10底面與電子元件接觸以吸收其 熱量，該第一基板10容置在第二基板30之開口33内且第一 基板10頂面與第二基板30結合板35底面焊接固定。該第 一、二熱管22、24之放熱部223、243通過第二基板30穿孔 33對角上之凹陷部330，穿置在鰭片組50通道510之内。該 第一基板10與第二基板30結合將從電子元件吸收之熱量傳 導到熱管吸熱部221、241，再通過熱管放熱部223、243均 . 勻分佈到鰭片組50上，第一基板10與第二基板30結合形成 之底座在高熱區使用熱傳導率高之金屬材料，而在其周圍 使用成本及重量相對較低之金屬材料，從而使該底座在不 顯著增加成本及重量之情況下具有較佳之熱傳導性能，進 而提升整個散熱裝置之性能。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 200825687 【圖式簡單說明】 圖1係本發明一較佳實施例中散熱裝置之立體組裝圖。 、 圖2係圖1中散熱裝置之立體分解圖。 圖3係圖2中基座之倒置放大圖。 主要元件符號說明 ] 第一基板 10 第一溝槽 11 第二溝槽 13 熱管組 20 第一熱管 22 吸熱部 221、241 放熱部 223 > 243 第二熱管 24 第二基板 30 框體 31 凹口 311 固定孑L 3110 定位孔 313 開口 33 凹陷砉P 330 結合板 35 直凹槽 351 曲凹槽 353 扣板 40 結合部 41 定位部 43 透孔 45 鰭片組 50 縛片 51 通道 510 折邊 512 切槽 530 頂板 60 螺釘 100 11I. The bottom surface of the first substrate 10 made of copper is in contact with the electronic component to absorb the heat. The first substrate 10 is received in the opening 33 of the second substrate 30 and the top surface of the first substrate 10 and the bottom surface of the second substrate 30 are combined with the bottom surface of the plate 35. Solder fixed. The heat radiating portions 223, 243 of the first and second heat pipes 22, 24 are pierced through the recesses 330 on the diagonally opposite sides of the second substrate 30, and are disposed in the channels 510 of the fin group 50. The first substrate 10 and the second substrate 30 are combined to transfer the heat absorbed from the electronic component to the heat pipe heat absorption portions 221 and 241, and then distributed to the fin group 50 through the heat pipe heat release portions 223 and 243. The first substrate 10 is uniformly distributed to the fin group 50. The base formed in combination with the second substrate 30 uses a metal material having a high thermal conductivity in a high heat region, and a metal material having a relatively low cost and weight is used around the base material, so that the base has a significant increase in cost and weight. Better thermal conductivity, which in turn improves the performance of the entire heat sink. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a heat dissipating device in accordance with a preferred embodiment of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. Figure 3 is an enlarged view of the inverted base of Figure 2. Explanation of main component symbols] First substrate 10 First trench 11 Second trench 13 Heat pipe group 20 First heat pipe 22 Heat absorbing portion 221, 241 Heat releasing portion 223 > 243 Second heat pipe 24 Second substrate 30 Frame 31 Notch 311 fixed 孑 L 3110 locating hole 313 opening 33 recessed 砉 P 330 coupling plate 35 straight groove 351 curved groove 353 gusset 40 joint portion 41 positioning portion 43 through hole 45 fin group 50 gusset 51 channel 510 hem 512 cut Slot 530 top plate 60 screw 100 11