TW200824831A - Compound processing method of solid-liquid interdiffusion bonding and superplastic forming - Google Patents
Compound processing method of solid-liquid interdiffusion bonding and superplastic forming Download PDFInfo
- Publication number
- TW200824831A TW200824831A TW95145462A TW95145462A TW200824831A TW 200824831 A TW200824831 A TW 200824831A TW 95145462 A TW95145462 A TW 95145462A TW 95145462 A TW95145462 A TW 95145462A TW 200824831 A TW200824831 A TW 200824831A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- metal layer
- superplastic forming
- thin film
- solid
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 26
- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 150000001875 compounds Chemical class 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 112
- 239000002184 metal Substances 0.000 claims abstract description 112
- 239000010409 thin film Substances 0.000 claims abstract description 38
- 230000005496 eutectics Effects 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 5
- 230000008023 solidification Effects 0.000 claims abstract 2
- 238000007711 solidification Methods 0.000 claims abstract 2
- 238000009792 diffusion process Methods 0.000 claims description 38
- 239000002131 composite material Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 6
- 239000010408 film Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- MUBKMWFYVHYZAI-UHFFFAOYSA-N [Al].[Cu].[Zn] Chemical compound [Al].[Cu].[Zn] MUBKMWFYVHYZAI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 239000011120 plywood Substances 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 238000011109 contamination Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 208000029154 Narrow face Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95145462A TW200824831A (en) | 2006-12-06 | 2006-12-06 | Compound processing method of solid-liquid interdiffusion bonding and superplastic forming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95145462A TW200824831A (en) | 2006-12-06 | 2006-12-06 | Compound processing method of solid-liquid interdiffusion bonding and superplastic forming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200824831A true TW200824831A (en) | 2008-06-16 |
| TWI310327B TWI310327B (https=) | 2009-06-01 |
Family
ID=44771649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95145462A TW200824831A (en) | 2006-12-06 | 2006-12-06 | Compound processing method of solid-liquid interdiffusion bonding and superplastic forming |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200824831A (https=) |
-
2006
- 2006-12-06 TW TW95145462A patent/TW200824831A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI310327B (https=) | 2009-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |