TWI310327B - - Google Patents
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- Publication number
- TWI310327B TWI310327B TW95145462A TW95145462A TWI310327B TW I310327 B TWI310327 B TW I310327B TW 95145462 A TW95145462 A TW 95145462A TW 95145462 A TW95145462 A TW 95145462A TW I310327 B TWI310327 B TW I310327B
- Authority
- TW
- Taiwan
- Prior art keywords
- thin film
- diffusion bonding
- metal
- metal plate
- metal layer
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 45
- 238000009792 diffusion process Methods 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 230000005496 eutectics Effects 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95145462A TW200824831A (en) | 2006-12-06 | 2006-12-06 | Compound processing method of solid-liquid interdiffusion bonding and superplastic forming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95145462A TW200824831A (en) | 2006-12-06 | 2006-12-06 | Compound processing method of solid-liquid interdiffusion bonding and superplastic forming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200824831A TW200824831A (en) | 2008-06-16 |
| TWI310327B true TWI310327B (https=) | 2009-06-01 |
Family
ID=44771649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95145462A TW200824831A (en) | 2006-12-06 | 2006-12-06 | Compound processing method of solid-liquid interdiffusion bonding and superplastic forming |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200824831A (https=) |
-
2006
- 2006-12-06 TW TW95145462A patent/TW200824831A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200824831A (en) | 2008-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |