200823408 · % ， 九、發明說明： ’【發明所屬之技術領域】 ^ 本發明係涉及一種發光二極體燈具，尤係涉及一 種結合有散熱結構之發光二極體燈具。 【先前技術】 隨著科學技術之不斷進步以及人們節能意識之 不斷提高’發光二極體（light emitting diode, LED) ⑩ 由於具有體積小、效率高等優點而逐漸被廣泛應用於 照明領域中。 目前，發光二極體燈具受限於其發光特性，當其 工作溫度過高時會産生色變、光衰之現象，且其壽命 大幅縮減，故，如何將發光二極體燈具之工作溫度保 持在一定範圍内以避免上述現象之發生，係人們目前 急需解決之問題。習知發光二極體燈具一般採用傳統 之鋁制散熱器進行散熱，此種散熱方式僅適用於小功 • 率之發光二極體燈具散熱；在發光二極體燈具之功率 較大之情形下，一般採用普通熱管（heat pipe)、回路熱 管(loop heat pipe)、均熱板(vapor chamber)等傳熱元 件，以自身自然冷卻或搭配散熱器之方式對發光二極 體燈具進行散熱，但這些傳熱元件單位面積之熱通量 (heat flux)較小，在熱傳量過大時有可能會出現乾涸 (dry out)之現象，導致發光二極體燈具之散熱效果不 甚理想’且一般回路熱管、均熱板之製造成本亦過 高，量産性不易，故需加以改進。 200823408 【發明内容】 有鑒於此，有必要一種散熱效果較佳且成本亦較 低廉之發光二極體燈具。 一種發光二極體燈具，包括基板、發光二極體燈 泡、散熱器及脈動式熱管，所述發光二極體燈泡電連 接至基板上，該脈動式熱管同時與該發光二極體燈泡 及散熱器熱連接，使發光二極體燈泡産生之熱量能夠 經由該脈動式熱管傳遞至散熱器進行散發。 • 一種發光二極體燈具，包括散熱器、脈動式熱管 及至少一發光二極體燈泡，該脈動式熱管連續彎折形 成爲多重u型管體之組合，該脈動式熱管之其中一部 分區域形成爲蒸發區，另一部分區域形成爲冷凝區， 所述發光二極體燈泡連接至該脈動式熱管之蒸發 區所述散熱器連接於該脈動式熱管之冷凝區，使所 述發光二極體燈泡産生之熱量經由該脈動式熱管傳 泰 遞至散熱器進行散發。 與驾知發光二極體燈具相比，上述發光二極體燈 二中：：動式熱官之熱阻小，使其單位面積熱通量較 且田熱傳置越大時熱阻越小，可降低熱管乾涸現 之發生，有利於提高發光二極體燈具之散熱效果， 且脈動式熱管之製造成本較低、易量産。· 【實施方式】 下面參恥附圖結合實施例對本發明作進一步說 200823408 圖1A至圖1B所示爲本發明發光二極體燈具10之 第一較佳實施例，該發光二極體燈具1〇包括一基板 (substrate) 11、電連接至該基板η上之複數發光二極體 燈泡13、用於傳熱之一脈動式熱管15、一燈罩17及一 散熱器19。 該散熱器19之作用係將脈動式熱管15從發光二 極體燈泡13傳遞之熱量進行及時散發，本發明中對該 散熱器19之形狀及結構不作任何限制。本實施例中， • 該散熱器19包括一平板型之基座192及由該基座192 向上伸出之複數散熱鰭片191。 該基板11爲由導熱性良好之材料製成之電路基 板’並可内設金屬材料（metal based)以增加導熱性 月b ’比如採用金屬芯印製板(metal core printed circuit board，MCPCB)等。 該脈動式熱管15設於基板11與散熱器19之基座 192間，以將基板η與脈動式熱管15及散熱器19三者熱 * 連接，該燈罩17可採用與散熱器19之基座192—體成 型之方式，該燈罩17亦可由導熱性能良好之材料製 成’並可在燈罩17之表面上直接設置散熱鰭片等散熱 結構以代替散熱器19或者作爲對散熱器19之進一步 增強散熱。該燈罩17大致呈杯狀，其中間形成收容基 板11與發光二極體燈泡13之一收容空間173,該燈罩17 之内壁具有反光與聚光作用，其上設有一開口 172, 該發光二極體燈泡13發出之光經燈罩17反射並聚光 200823408 ^ 後由該開口 172射出。本發明對燈罩17之形狀及設置 位置不作限制，如圖1C所示之第二較佳實施例中，燈 罩17可設於基板11、發光二極體燈泡13、脈動式熱管 >15及散熱器19組成之系統之外圍，如圖1D所示之第三 較佳實施例中，該燈罩17上亦可對應散熱器19之散熱 鰭片191設穿孔（圖未示），以使該散熱器19之散熱鰭 片191通過所述穿孔穿設於燈罩17之外。 圖2至圖4爲圖1B所示脈動式熱管15之示意圖，該 • 脈動式熱管15爲平板型以與散熱器19之基座192相匹 配，其包括一連續彎折之細長毛細管151、一可撓性 編織脈管152以及適量可冷凝之工作流體153 (如圖3 所示），該脈管152置於該毛細管151内，該工作流體 153填充於該毛細管151與脈管152内。該毛細管151之 内壁爲平滑表面，其通過連續彎折而形成爲多重U型 管體組合。 在本實施例中，該毛細管151形成封閉之回路型 _ ( close loop)，其具有複數直線形之吸熱段154及於兩 端彎折形成之複數U型之放熱段155，這些吸熱段154 與放熱段155間隔設置，所述吸熱段154設於圖中虛線 所示之吸熱區Η並與發光二極體燈泡13之基板11相對 應，所述放熱段155設於圖中虛線所示之兩放熱區C並 與散熱器19之基座192熱連接，如圖1Β與圖2所示，本 實施例中之脈動式熱管15之吸熱區Η位於中間，而其 放熱區C則位於兩端。該毛細管151相互連通形成一封 200823408 閉式之回路型通道，以供該工作流體153於其中流 動。該毛細管151之兩端亦可間隔開並各自密封，以 形成如圖5所示之一開路型通道（0pen i〇0p)。 該毛細管151於一端之放熱區C設有一填充管 158，當該毛細管151内被抽至真空後，適量之工作流 體153由填充管158填充至該毛細管151内，由於該毛 細管151之管徑足夠小，該工作流體153在毛細管151 之毛細作用力下，於毛細管151内形成間隔分佈之複 參 數液柱156，同時，每相鄰之兩液柱156之間形成汽柱 (汽泡）157，即液柱156與汽柱157間隔分佈，使該 工作流體153受熱後在毛細管151内作往復之振蕩運 動。 另，在回路型之脈動式熱管15中，還可設置一個 或多個小型之壓敏單向閥159 (如圖2所示），以使該 工作流體153在毛細管151内沿一特定之方向循環，當 設置多個單向閥159時，工作流體153之循環將變得強 _ 烈、而又迅速。 該脈管152爲一細長管，其貼附於該毛細管151之 内壁，並沿其長度方向設於整個毛細管151内（如圖2 所示），該脈管152亦可分爲複數小段，並分佈於毛細 管151之部分區域（如圖5所示）。該脈管152由複數可 撓性細線160編織而成，該細線160可爲纖維、纖維 束、銅絲或不銹鋼絲等。如圖4所示，該脈管152爲中 空狀，其具有一環形之橫戴面，以於脈管152内部形 200823408 成一中空通道161，同時，該脈管152之外徑小於該毛 細管151之内徑，使該脈管152之外壁與毛細管151之 内壁之間形成供汽柱157與液柱156流動之間隙162， 該中空通道161與間隙162可供工作流體153之儲存與 輸送。該脈管152之編織管壁形成毛細結構，並産生 毛細力以促使工作流體153在毛細管151内流動。 上述發光二極體燈具10中，發光二極體燈泡13産 生之熱量藉由基板11傳至脈動式熱管15之吸熱區Η之 各吸熱段154，位於吸熱段154内之液柱156吸熱蒸 發，導致汽柱157膨脹，同時産生蒸氣壓力推動液柱 156經毛細管151内之間隙162以及脈管152内之中空 通道161向放熱區C之各放熱段155流動，在這些放熱 段155處釋放熱量冷凝爲液體，使放熱區c處之汽柱 之體積縮小，産生負向壓力，即吸引力，蒸氣壓 力與吸引力共同作用形成作用於液柱156之推動力。 由於毛細管151爲連續彎折狀且其内之液柱156與汽 柱157交錯分佈，因而使汽、液柱;[57、156在毛細管 151内産生強烈之往復振蕩運動，若通過設置單向閥 165 ’則可使該往復振蕩形成單向運動，在振蕩運動 過程中，該工作流體153從吸熱段154吸收熱量到放熱 段155釋放熱量，釋放之熱量傳至散熱器19上，並散 發到周圍之空氣中。藉由這種方式，工作流體153在 脈動式熱管15内反復蒸發、冷凝，不斷地吸熱、放熱， 從而藉由工作流體153之相變化作用而達到良好之熱 V❻ 11 200823408 交換之目的。 與習知發光二極體燈具相比，上述發光二極體燈 具10中的脈動式熱管15之熱阻小，使其單位面積之熱 通量較大’且當熱傳量越大時熱阻越小，可降低熱管 乾涸（dry out)現象之發生，有利於提高發光二極體燈 具10之散熱效果，且脈動式熱管15採用平滑毛細管， 製造成本較低、易量産’另，上述脈動式熱管豎直 放置時，其脈管152之管壁産生之毛細力可驅使工作 ⑩流體153在毛細管151内流動，以使該脈動式熱管15之 抗重能力較強，可搭配不同之應用條件，解決抗重力 之問題，從而進一步提高發光二極體燈具1〇之散熱效 果及運用範圍。 另外’該基板11之位置亦不是固定不變的，如圖 6A至圖6B所示，爲本發明發光二極體燈具6〇之第四較 佳實施例，該發光二極體燈具60與第一較佳實施例中 之發光二極體燈具ίο之不同之處在於：該基板η設於 _ 脈動式熱管15之一端，在這種情形下，該脈動式熱管 15靠近該基板11之一端形成爲吸熱區Μ，其另一端則 形成爲放熱區Ν。 當然，本發明發光二極體燈具亦不僅僅局限於上 述實施方式，其中散熱器、燈罩及脈動式熱管可根據 空間等不同之需求，設計成不同之形狀以進行合理之 搭配，如以下實施例。 圖7Α至圖7 Β爲本發明發光二極體燈具7〇之第五 12 200823408 較佳實施例，該燈罩77亦呈杯狀，其具有一平板狀之 接觸up772及一開口 771，該發光二極體燈泡73設於該 基板71上，該基板71與該燈罩77之接觸部772之内表 面接觸，該發光二極體燈泡73發出之光經燈罩77反射 並聚光後由該開口 771射出，該散熱器79之基座792呈 ϋ型，該燈罩77設於該U型基座792内，即該燈罩77之 開口方向與該散熱器79之υ型基座792之朝向方向相 同。該U型基座792之外表面向外長出複數散熱籍片 791 ’其内表面上貼設有脈動式熱管75，該脈動式熱 管75呈U型，其通過連續彎折而形成爲多重υ型管體組 合’該脈動式熱管75之内部結構及工作原理與圖2或 者圖5所示之脈動式熱管15相同，其中間爲吸熱段 754，兩端爲放熱段755，該燈罩77之接觸部772之外 表面與吸熱段754緊密結合。上述發光二極體燈具7〇 中，發光二極體燈泡73産生之熱量由基板71傳至燈罩 77上，使得一部分熱量藉由燈罩77散發，而另一部分 熱量經過燈罩77傳至該脈動式熱管75之吸熱段754， 並接著傳遞至該脈動式熱管75兩端放熱段755之散熱 鰭片791上，藉由散熱器79散發到周圍之空氣中，從 而可增加散熱面積，提高散熱效果。本實施例中，該 燈罩77亦可以省去接觸部772，從而使裝設發光二極 體燈泡73之基板71直接與該脈動式熱管75之吸熱段 754緊密結合，從而降低熱阻。 圖7Α至圖7Β所示之發光二極體燈具70中之脈動 13 200823408 式熱管75、燈罩7了及散熱器79之位置關係亦可變化， 如圖8A至圖8B所示爲本發明發光二極體燈具8〇之第 六較佳實施例’其中該脈動式熱管85貼設於該散熱器 89之ϋ型基座892之外表面，燈罩87則位於散熱器89之 上方，並藉由脈動式熱管85與散熱器89熱連接，即該 燈罩77之開口方向與該散熱器89之1型基座892之朝 向正好相反。 圖9Α至圖9D所示爲本發明發光二極體燈具9〇之 ❿ 第七較佳實施例，其中該脈動式熱管95之輪廓呈杯 狀’其俯視圖大致呈向外輕射之花瓣狀（如圖％至9D 所示），該脈動式熱管95中心爲吸熱區，周緣爲放熱 區，該脈動式熱管95貼設於該杯狀燈罩97之内表面， 該發光二極體燈泡93設於該基板91上，該基板91與該 脈動式熱管95之吸熱區緊密結合，以將由發光二極體 燈泡93吸收之熱量傳至燈罩97之外殼上，然後散發到 周圍之空氣中，即該燈罩97除了充當反光作用外，還 • &當上述散熱器19、79、沾之散熱角色’據此將散熱 器與燈罩集成一體，使整體結構更加模組化。本實施 例中’還可在燈罩97之外表面設置散熱·鰭片991(如圖 9B所不）以增加燈罩97之整體散熱面積及散熱效果。 當然，該脈動式熱管95可爲圖9C所示之封閉之回路 型，亦可爲圖9D所示之開路型。 綜上所述，本發明符合發明專利之要件，爰依法 提出專利申請。惟以上所述者僅為本發明之較佳實施 200823408 例，舉凡熟悉本案技藝之人士，在爰依本發明精神所 作之等效修飾或變化，皆應涵蓋於以下之申請專利範 圍内。 ‘【圖式簡單說明】 圖1A爲本發明發光二極體燈具第一較佳實施例 之剖面示意圖。 圖1B爲圖1A所示發光二極體燈具中基板與脈動 式熱管結合之平面視圖。 _ 圖1C爲本發明發光二極體燈具第二較佳實施例 之剖面示意圖。 圖1D爲本發明發光二極體燈具第三較佳實施例 之剖面示意圖。 圖2爲圖1B所示發光二極體燈具中之脈動式熱管 之内部結構示意圖。 圖3爲圖2所示脈動式熱管中圈III部分之放大示 意圖。 ⑩ 圖4爲圖2所示脈動式熱管沿IV-IV線之剖視圖。 圖5爲圖2所示脈動式熱管另一實施例之内部結 構不意圖。 圖6A爲本發明發光二極體燈具第四較佳實施例 之剖面示意圖。 圖6B爲圖6A所示發光二極體燈具中基板與脈動 式熱管結合之平面視圖。 圖7A爲本發明發光二極體燈具第五較佳實施例 £ϋ： 15 200823408 之正面示意圖。 圖7B爲圖7A所示發光二極體燈具之俯視圖。 圖8A爲本發明發光二極體燈具第六較佳實施例 之正面示意圖。 圖8B爲圖8A所示發光二極體燈具之俯視圖。 圖9 A爲本發明發光二極體燈具第七較佳實施例 之正面示意圖。 圖9B爲圖9A所示發光二極體燈具結合散熱鰭片 φ 後之俯視圖。 圖9C爲圖9A所示發光二極體燈具移去基板後之 俯視圖。 圖9D爲圖9A所示發光二極體燈具移去基板後之 另一實施例之俯視圖。 【主要元件符號說明】 發光二極體燈具 10、 60、70、80、90 基板 11 ^ 71 、 81 、 91 發光二極體燈泡 13 ^ 73、83、93 脈動式熱管 15、 75、85 > 95 毛細管 151 脈管 152 工作流體 153 吸熱段 154、754 放熱段 155 、755 液柱 156 汽柱 157 填充管 158 單向閥 159 細線 160 中空通道 161 間隙 162 16 200823408200823408 · % , 九, invention description: ‘[Technical field to which the invention belongs] ^ The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp incorporating a heat-dissipating structure. [Prior Art] With the continuous advancement of science and technology and the increasing awareness of people's energy conservation, the light emitting diode (LED) 10 has been widely used in the field of illumination due to its small size and high efficiency. At present, the illuminating diode lamp is limited by its illuminating characteristics. When its operating temperature is too high, it will cause color change and light decay, and its life is greatly reduced. Therefore, how to maintain the operating temperature of the illuminating diode lamp In order to avoid the above phenomenon within a certain range, it is an urgent problem to be solved. Conventional light-emitting diode lamps generally use a conventional aluminum heat sink for heat dissipation. This heat dissipation method is only suitable for low-power LED light-emitting diode lamps; in the case of large power of light-emitting diode lamps Generally, a heat pipe such as a heat pipe, a loop heat pipe, or a vapor chamber is used to dissipate the light-emitting diode lamp by itself or by means of a heat sink, but The heat flux per unit area of these heat transfer elements is small, and dry out may occur when the heat transfer amount is too large, resulting in a poor heat dissipation effect of the light-emitting diode lamp. The manufacturing cost of the loop heat pipe and the soaking plate is also too high, and mass production is not easy, so it needs to be improved. 200823408 SUMMARY OF THE INVENTION In view of the above, there is a need for a light-emitting diode lamp having a better heat dissipation effect and a lower cost. A light-emitting diode lamp includes a substrate, a light-emitting diode bulb, a heat sink and a pulsating heat pipe, wherein the light-emitting diode bulb is electrically connected to the substrate, and the pulsating heat pipe simultaneously emits light with the light-emitting diode bulb The device is thermally connected so that the heat generated by the LED bulb can be transmitted to the heat sink via the pulsating heat pipe for dissipation. A light-emitting diode lamp comprising a heat sink, a pulsating heat pipe and at least one light-emitting diode bulb, wherein the pulsating heat pipe is continuously bent into a combination of multiple u-shaped tubes, and a part of the pulsating heat pipe is formed Another evaporation zone is formed as a condensation zone, and the light-emitting diode bulb is connected to the evaporation zone of the pulse heat pipe. The heat sink is connected to the condensation zone of the pulse heat pipe to make the light-emitting diode bulb The generated heat is transferred to the radiator through the pulsating heat pipe for distribution. Compared with the light-emitting diode lamp, the above-mentioned light-emitting diode lamp has the following advantages: the thermal resistance of the dynamic heat officer is small, and the heat flux per unit area is larger than that of the field heat transfer. It can reduce the occurrence of heat pipe drying, which is beneficial to improve the heat dissipation effect of the light-emitting diode lamp, and the manufacturing cost of the pulse heat pipe is low and mass production. [Embodiment] The following is a brief description of the present invention in conjunction with the embodiments. 200823408. FIG. 1A to FIG. 1B show a first preferred embodiment of the light-emitting diode lamp 10 of the present invention. The substrate includes a substrate 11, a plurality of light-emitting diode bulbs 13 electrically connected to the substrate η, a pulsating heat pipe 15 for heat transfer, a lamp cover 17 and a heat sink 19. The heat sink 19 functions to dissipate the heat transferred from the pulsating heat pipe 15 from the light-emitting diode bulb 13 in time. The shape and structure of the heat sink 19 are not limited in the present invention. In this embodiment, the heat sink 19 includes a flat-type base 192 and a plurality of heat-dissipating fins 191 extending upward from the base 192. The substrate 11 is a circuit substrate made of a material having good thermal conductivity and may be provided with a metal material to increase thermal conductivity. For example, a metal core printed circuit board (MCPCB) or the like is used. . The pulsating heat pipe 15 is disposed between the substrate 11 and the base 192 of the heat sink 19 to thermally connect the substrate η with the pulsating heat pipe 15 and the heat sink 19, and the lamp cover 17 can be used as a base with the heat sink 19. In the 192-body forming manner, the lamp cover 17 can also be made of a material having good thermal conductivity, and a heat dissipating structure such as a heat dissipating fin can be directly disposed on the surface of the lamp cover 17 instead of the heat sink 19 or as a further enhancement to the heat sink 19. Cooling. The lampshade 17 has a substantially cup shape, and a receiving space 173 is formed between the receiving substrate 11 and the light-emitting diode bulb 13. The inner wall of the lampshade 17 has a reflective and condensing effect, and an opening 172 is disposed on the light-emitting diode. The light emitted by the bulk bulb 13 is reflected by the lamp cover 17 and concentrated by the light 200823408 ^ and then emitted from the opening 172. The shape and arrangement position of the lamp cover 17 are not limited. In the second preferred embodiment shown in FIG. 1C, the lamp cover 17 can be disposed on the substrate 11, the light-emitting diode bulb 13, the pulsating heat pipe > 15 and the heat dissipation. In the third preferred embodiment of the system of the device 19, the heat shield fin 191 of the heat sink 19 can be provided with a perforation (not shown) to make the heat sink. The heat dissipation fins 191 of 19 are disposed outside the lamp cover 17 through the through holes. 2 to 4 are schematic views of the pulsating heat pipe 15 shown in FIG. 1B. The pulsating heat pipe 15 is of a flat type to match the base 192 of the heat sink 19, and includes a continuously bent elongated capillary 151, a The flexible braided vessel 152 and a suitable amount of condensable working fluid 153 (shown in FIG. 3) are disposed within the capillary 151, and the working fluid 153 is filled within the capillary 151 and the vessel 152. The inner wall of the capillary 151 is a smooth surface which is formed into a multiple U-tube assembly by continuous bending. In the present embodiment, the capillary 151 forms a closed loop type, which has a plurality of linear heat absorbing sections 154 and a plurality of U-shaped heat releasing sections 155 which are bent at both ends, and the heat absorbing sections 154 and The heat-dissipating sections 155 are disposed at intervals, and the heat-absorbing sections 154 are disposed in the heat-absorbing zone 所示 indicated by a broken line in the figure and correspond to the substrate 11 of the LED bulb 13. The heat-dissipating section 155 is disposed at two of the dotted lines in the figure. The heat release zone C is thermally connected to the base 192 of the heat sink 19. As shown in FIG. 1 and FIG. 2, the heat absorption zone 脉 of the pulsating heat pipe 15 in the present embodiment is located in the middle, and the heat release zone C is located at both ends. The capillary tubes 151 are interconnected to form a closed loop circuit of the 200823408 for the working fluid 153 to flow therein. The ends of the capillary 151 may also be spaced apart and sealed to form an open path (0pen i〇0p) as shown in FIG. The capillary tube 151 is provided with a filling tube 158 at the heat releasing portion C of one end. After the capillary tube 151 is evacuated to the vacuum, an appropriate amount of the working fluid 153 is filled into the capillary tube 151 by the filling tube 158, since the diameter of the capillary tube 151 is sufficient. Small, the working fluid 153 forms a spaced-apart complex parameter liquid column 156 in the capillary 151 under the capillary force of the capillary 151, and a steam column (bubble) 157 is formed between each adjacent two liquid column 156. That is, the liquid column 156 is spaced apart from the steam column 157, so that the working fluid 153 is heated and reciprocated in the capillary 151. In addition, in the loop type pulsating heat pipe 15, one or more small pressure sensitive check valves 159 (shown in FIG. 2) may be disposed to cause the working fluid 153 to follow a specific direction within the capillary 151. Cycling, when a plurality of one-way valves 159 are provided, the circulation of the working fluid 153 will become strong and rapid. The vessel 152 is an elongated tube attached to the inner wall of the capillary 151 and disposed along the length of the capillary 151 (as shown in FIG. 2). The vessel 152 can also be divided into a plurality of segments, and It is distributed in a partial area of the capillary 151 (as shown in FIG. 5). The vessel 152 is woven from a plurality of flexible threads 160 which may be fibers, fiber bundles, copper wires or stainless steel wires or the like. As shown in FIG. 4, the vessel 152 is hollow, and has a circular cross-face to form a hollow passage 161 in the inner shape of the vessel 152. At the same time, the outer diameter of the vessel 152 is smaller than that of the capillary 151. The inner diameter forms a gap 162 between the outer wall of the vessel 152 and the inner wall of the capillary 151 for the flow of the steam column 157 and the liquid column 156. The hollow channel 161 and the gap 162 are for storage and transportation of the working fluid 153. The braided tube wall of the vessel 152 forms a capillary structure and creates capillary forces to cause the working fluid 153 to flow within the capillary 151. In the above-mentioned light-emitting diode lamp 10, the heat generated by the light-emitting diode bulb 13 is transmitted to the respective heat absorption sections 154 of the heat absorption zone 脉 of the pulsating heat pipe 15 through the substrate 11, and the liquid column 156 located in the heat absorption section 154 absorbs heat and evaporates. The steam column 157 is caused to expand, and the vapor pressure is generated to push the liquid column 156 to flow through the gap 162 in the capillary 151 and the hollow passage 161 in the vessel 152 to the respective heat releasing sections 155 of the heat releasing zone C, and heat is released at these heat releasing sections 155. As a liquid, the volume of the steam column at the exothermic zone c is reduced, creating a negative pressure, i.e., attractive force, which acts in conjunction with the attractive force to form a driving force acting on the liquid column 156. Since the capillary 151 is continuously bent and the liquid column 156 and the steam column 157 are alternately distributed, the steam and liquid columns are caused; [57, 156 generates a strong reciprocating oscillation motion in the capillary 151, if a check valve is provided 165' can cause the reciprocating oscillation to form a one-way motion. During the oscillating motion, the working fluid 153 absorbs heat from the heat absorption section 154 to the heat releasing section 155 to release heat, and the released heat is transmitted to the heat sink 19 and distributed to the surroundings. In the air. In this manner, the working fluid 153 is repeatedly evaporated and condensed in the pulsating heat pipe 15 to continuously absorb heat and release heat, thereby achieving good heat by the phase change of the working fluid 153. V❻ 11 200823408 Exchange purpose. Compared with the conventional light-emitting diode lamp, the pulsating heat pipe 15 in the above-mentioned light-emitting diode lamp 10 has a small heat resistance, so that the heat flux per unit area is large, and the heat resistance is larger when the heat transfer amount is larger. The smaller the temperature, the lower the dry out phenomenon of the heat pipe, the better the heat dissipation effect of the light-emitting diode lamp 10 is adopted, and the pulsating heat pipe 15 adopts a smooth capillary tube, and the manufacturing cost is low and the mass production is easy. When the heat pipe is placed vertically, the capillary force generated by the wall of the vessel 152 can drive the working fluid 10 to flow in the capillary 151, so that the pulsating heat pipe 15 has strong anti-stress ability and can be matched with different application conditions. Solve the problem of anti-gravity, so as to further improve the heat dissipation effect and application range of the light-emitting diode lamp. In addition, the position of the substrate 11 is not fixed, as shown in FIG. 6A to FIG. 6B, which is a fourth preferred embodiment of the LED lamp 6 of the present invention, the LED lamp 60 and the first The illuminating diode lamp of a preferred embodiment is different in that the substrate η is disposed at one end of the pulsating heat pipe 15, and in this case, the pulsating heat pipe 15 is formed near one end of the substrate 11. As the heat absorption zone, the other end is formed as a heat release zone. Of course, the light-emitting diode lamp of the present invention is not limited to the above embodiment, and the heat sink, the lamp cover and the pulsating heat pipe can be designed into different shapes according to different needs of space, such as the following embodiments. . FIG. 7A to FIG. 7 are the fifth embodiment of the light-emitting diode lamp 7 of the present invention. The lamp cover 77 also has a cup shape, and has a flat contact 772 and an opening 771. The polar bulb 73 is disposed on the substrate 71. The substrate 71 is in contact with the inner surface of the contact portion 772 of the lamp cover 77. The light emitted by the LED bulb 73 is reflected by the lamp cover 77 and concentrated, and then emitted from the opening 771. The base 792 of the heat sink 79 is of a ϋ type, and the lamp cover 77 is disposed in the U-shaped base 792, that is, the opening direction of the lamp cover 77 is the same as the direction of the susceptor base 792 of the heat sink 79. The outer surface of the U-shaped base 792 has a plurality of heat-dissipating heat-dissipating fins 791. The inner surface of the U-shaped base 792 has a pulsating heat pipe 75 attached thereto. The pulsating heat pipe 75 is U-shaped, and is formed into a multi-turn type pipe by continuous bending. The internal structure and working principle of the pulsating heat pipe 75 are the same as those of the pulsating heat pipe 15 shown in FIG. 2 or FIG. 5, wherein the middle portion is the heat absorbing portion 754, the two ends are the heat releasing portion 755, and the contact portion 772 of the lamp cover 77 is 772. The outer surface is intimately coupled to the endothermic section 754. In the above-mentioned light-emitting diode lamp 7 ,, the heat generated by the light-emitting diode bulb 73 is transmitted from the substrate 71 to the lamp cover 77, so that a part of the heat is radiated by the lamp cover 77, and another part of the heat is transmitted to the pulsating heat pipe through the lamp cover 77. The heat absorption section 754 of the 75 is then transferred to the heat dissipation fins 791 of the heat dissipation section 755 at both ends of the pulsating heat pipe 75, and is radiated to the surrounding air by the heat sink 79, thereby increasing the heat dissipation area and improving the heat dissipation effect. In this embodiment, the lamp cover 77 can also eliminate the contact portion 772, so that the substrate 71 on which the light-emitting diode bulb 73 is mounted is directly coupled with the heat absorption portion 754 of the pulsating heat pipe 75, thereby reducing the thermal resistance. The pulsation of the light-emitting diode lamp 70 shown in FIG. 7A to FIG. 7B can also be changed. The positional relationship between the heat pipe 75, the lampshade 7 and the heat sink 79 can also be changed, as shown in FIG. 8A to FIG. 8B. In a sixth preferred embodiment of the pole lamp 8', the pulsating heat pipe 85 is attached to the outer surface of the shank base 892 of the heat sink 89, and the lamp cover 87 is located above the heat sink 89 and is pulsating The heat pipe 85 is thermally connected to the heat sink 89, that is, the opening direction of the lamp cover 77 is opposite to the orientation of the type 1 base 892 of the heat sink 89. 9A to 9D are the seventh preferred embodiment of the light-emitting diode lamp of the present invention, wherein the pulsating heat pipe 95 has a cup-shaped shape, and the top view thereof is substantially outwardly lightly petal-like ( As shown in FIG. 1 to FIG. 9D, the center of the pulsating heat pipe 95 is a heat absorption zone, and the periphery is a heat release zone. The pulsating heat pipe 95 is attached to the inner surface of the cup-shaped lamp cover 97. The light-emitting diode lamp 93 is disposed at On the substrate 91, the substrate 91 is closely coupled with the heat absorption region of the pulsating heat pipe 95 to transfer the heat absorbed by the LED bulb 93 to the outer casing of the lamp cover 97, and then to the surrounding air, that is, the lampshade In addition to acting as a reflective function, the <<>>> when the heat sinks 19, 79 and the heat-dissipating character of the heat sink are integrated with the lampshade, the overall structure is more modular. In this embodiment, heat dissipation fins 991 (not shown in Fig. 9B) may be disposed on the outer surface of the lamp cover 97 to increase the overall heat dissipation area and heat dissipation effect of the lamp cover 97. Of course, the pulsating heat pipe 95 may be a closed circuit type as shown in Fig. 9C or an open circuit type as shown in Fig. 9D. In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention. The equivalent modifications or variations in the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1A is a cross-sectional view showing a first preferred embodiment of a light-emitting diode lamp of the present invention. 1B is a plan view showing the combination of a substrate and a pulsating heat pipe in the light-emitting diode lamp of FIG. 1A. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1C is a cross-sectional view showing a second preferred embodiment of a light-emitting diode lamp of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1D is a cross-sectional view showing a third preferred embodiment of a light-emitting diode lamp of the present invention. 2 is a schematic view showing the internal structure of a pulsating heat pipe in the illuminating diode lamp shown in FIG. 1B. Fig. 3 is an enlarged schematic view showing a portion III of the middle portion of the pulsating heat pipe shown in Fig. 2. Figure 4 is a cross-sectional view of the pulsating heat pipe of Figure 2 taken along line IV-IV. Fig. 5 is a schematic view showing the internal structure of another embodiment of the pulsating heat pipe shown in Fig. 2. Fig. 6A is a cross-sectional view showing a fourth preferred embodiment of the light-emitting diode lamp of the present invention. Fig. 6B is a plan view showing the combination of the substrate and the pulsating heat pipe in the light-emitting diode lamp shown in Fig. 6A. 7A is a front elevational view of a fifth preferred embodiment of the light-emitting diode lamp of the present invention, ϋ: 15 200823408. FIG. 7B is a top view of the light-emitting diode lamp of FIG. 7A. Fig. 8A is a front elevational view showing a sixth preferred embodiment of the light-emitting diode lamp of the present invention. FIG. 8B is a top view of the light emitting diode lamp of FIG. 8A. Fig. 9A is a front elevational view showing a seventh preferred embodiment of the light-emitting diode lamp of the present invention. FIG. 9B is a top view of the light emitting diode lamp of FIG. 9A combined with the heat sink fin φ. Figure 9C is a plan view of the light-emitting diode lamp of Figure 9A after the substrate is removed. Fig. 9D is a plan view showing another embodiment of the light-emitting diode lamp shown in Fig. 9A after the substrate is removed. [Description of main components] Light-emitting diode lamps 10, 60, 70, 80, 90 Substrate 11 ^ 71 , 81 , 91 Light-emitting diode bulbs 13 ^ 73, 83, 93 Pulsating heat pipes 15, 75, 85 > 95 Capillary 151 Vessel 152 Working fluid 153 Endothermic section 154, 754 Heat release section 155, 755 Liquid column 156 Steam column 157 Filling tube 158 Check valve 159 Thin line 160 Hollow channel 161 Clearance 162 16 200823408
燈罩 17、 ΊΊ、 87、97 開口 172 、771 收容空間 173 接觸部 772 散熱器 19 > Ί9、 89 散熱鰭片 191 、791 > 991 基座 192 、792 、892 吸熱區 Μ、 Η 放熱區 Ν、C 17Lampshade 17, ΊΊ, 87, 97 Opening 172, 771 accommodating space 173 Contact portion 772 Radiator 19 > Ί 9, 89 Heat sink fins 191, 791 > 991 Base 192, 792, 892 Heat absorbing area Μ, Η Heat release area Ν , C 17