200819696 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種熱管散熱裝置及其製造方法，特別 係一種可有效冷卻電子元件之熱管散熱裝置及其製造方 法。 【先前技術】 隨著電子資訊業不斷發展，電子元件（尤其中央處理 _器)曰運行速度不斷提升，，高頻高速使電子轉産生之 熱量隨之增多’使得其溫度不斷升高，嚴重威脅著電子元 件運行時性能，爲確保電子元件能正常運行，必須及 出電子元件所産生之大量熱。 爲此，業界通常使用一種散熱裝置進行散熱，該散熱 裝置包括一底座和設於底座之複數散熱鰭片，該底座爲底 $平/月之實體金屬，用來供貼設於中央處理器表面。而隨 鲁著中央處理器體積越來越小，其發熱功率也更高，因局限 於金屬之傳熱性能，底座中心處熱量往往過於集中，熱量 在正個散熱裝置中擴散較慢，從而影響整體散熱效果，也 影響中央處理器之性能，難以保持長時間有效工作。 2爲^服上述問題，業界採用熱管傳導熱量之散熱裝置 曰1增多，熱管係於金屬管體内設置毛細結構物（如粉末 坎、、、"物、溝槽結構、絲網結構等），並密封裝入工作液體 (如水/酉精等），然後抽至真空狀態，依賴工作液體受 熱後進行液氣兩相變化而吸收、釋放熱量，由於熱管傳熱 7 200819696 不定向且傳熱距離長，而對散熱裝置性能有較大提升。通 常情況下，該熱管式散熱器包括一u形熱管、散熱鰭片及基 座。該u形熱管之蒸發段焊接於基座上，其冷凝段穿設於散 熱鰭片之間。電子元件産生之熱量傳遞到基座，然後通過 該熱管將熱量傳遞到上部之散熱鰭片上，最後通過散熱鰭 片將熱量散發到周圍空氣中，達到冷卻電子元件之目的。 該熱管式散熱器之傳熱方向單一，仍不能最大量地將熱量 快速均勻地分佈到散熱鰭片上，因此性能仍待提升。 _ 【發明内容】 本發明旨在提供一種散熱效率高之熱管散熱裝置及其 製造方法。 一種熱管散熱裝置，包括一散熱器及至少一熱管，該 散熱器包括一基座及設置於該基座之複數散熱鰭片，該熱 管包括一吸熱段及由該吸熱段一端延伸出之一對放熱段， 該熱管之吸熱段穿設於該散熱器基座内，該熱管之放熱段 _圍設於該散熱器之基座外侧。 一種該熱管散熱裝置之製造方法，包括以下步驟：提 供一散熱器，該散熱器包括一基座及設置於該基座上之複 數散熱鰭片；提供至少一熱管；穿設該熱管於該基座内並 將其固定其中；彎折該熱管兩端將其貼設於該基座外侧。 與習知技術相比，該熱管分佈於基座中部及外圍，將 集中於基座中部熱量有效傳至其四周，以便均勻分佈於整 個基座，從而能快速傳至散熱鰭片並向外散發，固而具有 8 200819696 較佳性能。 【實施方式】 請參閱圖1，本發明第一實施例之熱管散熱裝置係用來 安裝於中央處理器（圖未示）等發熱電子元件對其進行散 熱。該熱管散熱裝置包括與電子元件接觸之一散熱器10及 圍設於該散熱器10底部外侧之二根熱管20。該散熱器10 包括一基座12及沿基座12垂直向上延伸之複數平行排列 p 之散熱鰭片14。 請同時參閱圖1至圖4，該基座12由銅、鋁等導熱性 能良好之金屬材料製成。該基座12大致呈長方體，其底部 直接與中央處理器貼設以吸收其熱量。該基座12中部横向 設置一對平行通道120，該基座12之外圍凹設一容納部分 熱管20之環槽140,該環槽140之開口由基座12水平向外 張開。 每一熱管20包括一吸熱段22及由該吸熱段22兩端部 肇相對彎折延伸之一對放熱段24，其中每一放熱段24呈L 形彎曲，包括第一放熱段240及連接該吸熱段22與第一放 熱段240之第二放熱段242。該二熱管20沿基座12之中線 對稱分佈，二熱管20之吸熱段22相互平行焊接固定於基 座12之通道120内。該放熱段24環繞於該基座12外侧， 其第一放熱段240緊貼於環槽140内。二熱管20之吸熱段 22吸收集中於基座12中部之熱量並通過放熱段24傳至基 座12外圍，將熱量均勻分佈於基座12上。 200819696 二熱管20設置於基座12中部及其外圍，將集中於基 座12中部之熱量有效傳至其四周，從而均勻分佈於整個基 座12上，使熱量快速向散熱鰭片14傳遞，從而提高了熱 管散熱裝置之散熱效率。 圖3至圖4爲該熱管散熱裝置製造步驟之結構示意 圖。本發明熱管散熱裝置之製造方法包括如下步驟：提供 一散熱器10，該散熱器10包括一基座12及垂直設置於基 座12上之複數平行間隔排列之散熱鰭片14，該基座12中 部橫設一對相互平行之通道120，該基座12之外侧環設一 環槽140 ;提供一對平直熱管40 ;將熱管40插入基座12 之通道120内，使其中部焊接固定於通道120内；然後向 兩側彎折熱管40兩端部將其分別貼設於基座12之環槽140 内。 圖5爲本發明熱管散熱裝置之第二實施例之剖面圖。 該實施例與第一實施例主要區別於用一根S形熱管50代替 鲁二根熱管20圍設於基座12外側。該熱管50包括一穿設於 基座12中部之吸熱段52及由該吸熱段52兩端反向延伸之 一對放熱段54,每一放熱段54包括第一放熱段540及連接 吸熱段52與第一放熱段540之第二放熱段542，該第一放 熱段540緊貼於基座12之兩侧邊。該吸熱段52吸收熱量 經二放熱段54由基座12中部傳向其四周，使熱量均勻分 佈於基座12上。 本發明第二實施例中熱管散熱裝置之製造方法包括如 下步驟：提供一散熱器10，該散熱器10包括一基座12及垂 200819696 ^ 直設置於基座12上之複數平行間隔排列之散熱鰭片14，該 基座12中部橫設一通道120，該基座12之外侧環設一環槽 140 ;提供一平直熱管50 ;使熱管50穿入基座12之通道120 内，並將其中部焊接固定於通道120内；然後向兩侧彎折熱 管50兩端部將其反向貼設於基座12相對兩側之環槽140内。 综上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 ® 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明熱管散熱裝置第一實施例之立體分解圖。 圖2係圖1中沿II-II線之剖面圖。 圖3至圖4係本發明熱管散熱裝置之製造過程示意圖。 圖5係本發明熱管散熱裝置第二實施例之剖面圖。 【主要元件符號說明】 散熱器 10 基座 12 散熱鰭片 14 熱管 20、40、50 通道 120 環槽 140 吸熱段 22 > 52 放熱段 24、54 第一放熱段 240 > 540 第二放熱段 242 > 542 11BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe heat sink and a method of manufacturing the same, and more particularly to a heat pipe heat sink capable of effectively cooling electronic components and a method of manufacturing the same. [Prior Art] With the continuous development of the electronic information industry, the operating speed of electronic components (especially the central processing unit) continues to increase, and the high-frequency high-speed causes the heat generated by the electrons to increase, which makes the temperature rise and poses a serious threat. The performance of the electronic components during operation, in order to ensure the normal operation of the electronic components, must produce a large amount of heat generated by the electronic components. To this end, the industry generally uses a heat sink for heat dissipation. The heat sink includes a base and a plurality of heat sink fins disposed on the base. The base is a solid metal of $ flat/month for attaching to the surface of the central processor. . With the smaller and smaller central processor, the heating power is higher. Due to the heat transfer performance of the metal, the heat at the center of the base is often too concentrated, and the heat spreads slowly in the positive heat sink, thus affecting The overall heat dissipation effect also affects the performance of the central processing unit, making it difficult to maintain effective operation for a long time. 2 is to meet the above problems, the industry uses heat pipes to conduct heat to reduce the number of heat sinks ,1, the heat pipe is set in the metal pipe body to set up capillary structures (such as powder kan,, " objects, trench structure, wire mesh structure, etc.) And sealed into a working liquid (such as water / sputum, etc.), and then pumped to a vacuum state, depending on the working liquid is heated, the liquid and gas two-phase change to absorb and release heat, due to heat pipe heat transfer 7 200819696 non-orientation and heat transfer distance Long, and the performance of the heat sink is greatly improved. Typically, the heat pipe heat sink includes a U-shaped heat pipe, heat sink fins, and a base. The evaporating section of the u-shaped heat pipe is welded to the susceptor, and the condensing section is disposed between the fins. The heat generated by the electronic components is transferred to the susceptor, and then the heat is transferred to the upper fins through the heat pipe, and finally the heat is radiated to the surrounding air through the fins to cool the electronic components. The heat pipe type heat sink has a single heat transfer direction, and the heat cannot be quickly and evenly distributed to the heat radiating fins at the maximum amount, so the performance still needs to be improved. SUMMARY OF THE INVENTION The present invention is directed to a heat pipe heat dissipating device having high heat dissipation efficiency and a method of manufacturing the same. A heat pipe heat dissipating device includes a heat sink and at least one heat pipe, the heat sink includes a base and a plurality of heat dissipation fins disposed on the base, the heat pipe includes a heat absorption section and a pair of one end extending from the heat absorption section In the heat release section, the heat absorption section of the heat pipe is disposed in the heat sink base, and the heat release section of the heat pipe is disposed outside the base of the heat sink. A method for manufacturing the heat pipe heat dissipating device includes the following steps: providing a heat sink, the heat sink comprising a base and a plurality of heat dissipating fins disposed on the base; providing at least one heat pipe; and the heat pipe is disposed on the base The inside of the seat is fixed therein; the two ends of the heat pipe are bent and attached to the outside of the base. Compared with the prior art, the heat pipe is distributed in the middle and the periphery of the base, and the heat concentrated in the middle of the base is effectively transmitted to the periphery thereof so as to be evenly distributed throughout the base, so that it can be quickly transmitted to the heat radiating fins and radiated outward. , solid with 8 200819696 better performance. [Embodiment] Referring to Fig. 1, a heat pipe heat dissipating device according to a first embodiment of the present invention is used for heat dissipation by a heat generating electronic component such as a central processing unit (not shown). The heat pipe heat sink includes a heat sink 10 in contact with the electronic component and two heat pipes 20 surrounding the bottom of the heat sink 10. The heat sink 10 includes a base 12 and a plurality of fins 14 arranged in parallel along the base 12 and extending in parallel. Referring to Figs. 1 to 4, the susceptor 12 is made of a metal material having good thermal conductivity such as copper or aluminum. The base 12 is generally rectangular parallelepiped and its bottom is directly attached to the central processor to absorb its heat. A pair of parallel passages 120 are laterally disposed in the middle of the base 12. The periphery of the base 12 is recessed with a ring groove 140 for receiving a portion of the heat pipe 20. The opening of the ring groove 140 is horizontally outwardly opened by the base 12. Each of the heat pipes 20 includes a heat absorbing section 22 and a pair of opposite ends of the heat absorbing section 22 extending relative to each other to form a heat releasing section 24, wherein each heat releasing section 24 is bent in an L shape, including a first heat releasing section 240 and connecting the same The heat absorption section 22 and the second heat release section 242 of the first heat release section 240. The two heat pipes 20 are symmetrically distributed along the line of the susceptor 12, and the heat absorbing sections 22 of the two heat pipes 20 are welded and fixed in parallel with each other in the channel 120 of the base 12. The heat releasing section 24 surrounds the outside of the base 12, and the first heat releasing section 240 is in close contact with the ring groove 140. The heat absorbing section 22 of the second heat pipe 20 absorbs heat concentrated in the middle of the susceptor 12 and passes through the heat releasing section 24 to the periphery of the base 12 to uniformly distribute heat on the susceptor 12. 200819696 The two heat pipes 20 are disposed in the middle of the base 12 and the periphery thereof, and the heat concentrated in the middle of the base 12 is effectively transmitted to the periphery thereof, thereby being evenly distributed on the entire base 12, so that heat is quickly transmitted to the heat radiating fins 14, thereby The heat dissipation efficiency of the heat pipe heat sink is improved. 3 to 4 are schematic structural views showing the manufacturing steps of the heat pipe heat sink. The method for manufacturing the heat pipe heat dissipating device of the present invention comprises the following steps: providing a heat sink 10 comprising a base 12 and a plurality of parallel spaced fins 14 vertically disposed on the base 12, the base 12 A pair of mutually parallel passages 120 are disposed in the middle portion, and a ring groove 140 is disposed on the outer side of the base 12; a pair of flat heat pipes 40 are provided; the heat pipe 40 is inserted into the passage 120 of the base 12, and the middle portion thereof is welded and fixed to the passage 120; then, the two ends of the heat pipe 40 are bent to the two sides to be respectively attached to the ring groove 140 of the base 12. Figure 5 is a cross-sectional view showing a second embodiment of the heat pipe heat dissipating device of the present invention. This embodiment is mainly different from the first embodiment in that an S-shaped heat pipe 50 is used instead of the Lu heat pipe 20 to be disposed outside the susceptor 12. The heat pipe 50 includes a heat absorbing section 52 disposed in the middle of the susceptor 12 and a pair of heat releasing sections 54 extending from opposite ends of the heat absorbing section 52. Each heat releasing section 54 includes a first heat releasing section 540 and a connecting heat absorbing section 52. And the second heat release section 542 of the first heat release section 540, the first heat release section 540 is in close contact with the two sides of the base 12. The heat absorbing section 52 absorbs heat from the central portion of the susceptor 12 to the periphery thereof through the two heat releasing sections 54, so that heat is evenly distributed on the susceptor 12. The manufacturing method of the heat pipe heat dissipating device in the second embodiment of the present invention comprises the following steps: providing a heat sink 10 comprising a base 12 and a plurality of parallel spaced heat dissipations disposed directly on the base 12 a fins 14 , a channel 120 is disposed in the middle of the base 12 , and a ring groove 140 is disposed on the outer side of the base 12 ; a flat heat pipe 50 is provided; the heat pipe 50 is inserted into the channel 120 of the base 12 and The portion is welded and fixed in the channel 120; then the two ends of the heat pipe 50 are bent toward both sides to be reversely attached to the ring grooves 140 on opposite sides of the base 12. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalent modifications or variations of the present invention in the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view showing a first embodiment of a heat pipe heat dissipating device of the present invention. Figure 2 is a cross-sectional view taken along line II-II of Figure 1. 3 to 4 are schematic views showing the manufacturing process of the heat pipe heat dissipating device of the present invention. Figure 5 is a cross-sectional view showing a second embodiment of the heat pipe heat dissipating device of the present invention. [Main component symbol description] Heatsink 10 Base 12 Heat sink fins 14 Heat pipe 20, 40, 50 Channel 120 Ring groove 140 Heat absorption section 22 > 52 Heat release section 24, 54 First heat release section 240 > 540 Second heat release section 242 > 542 11