200819275 (1) 九、發明說明 【發明所屬之技術領域】 本發明關於藉由樹脂來模造引線框或基板等的被成型 品之樹脂模造裝置。 【先前技術】 作爲用於半導體裝置的製造之樹脂模造裝置，例如專 利文獻1所記載之樹脂模造裝置爲眾所皆知。此樹脂模造 裝置是如圖4所示，具備引線框之供給部1 〇 1、成型沖壓 部1 02、成型品收納部1 03、樹脂錠供給部1 04、熱槽之搬 入機構部105、及熱槽的供給部106。 又，在這樣的樹脂模造裝置，設有可自動地搬入引線 框等的被成型品或樹脂錠等，或自動地搬出樹脂模造後的 製品用之搬送機構。如圖4所示，專利文獻1之樹脂模造 裝置的搬送機構，藉由在引線框之供給部1 0 1與成型沖壓 部102之間往復移動而自動進行引線框的供給之裝載機 1 08、或在成型沖壓部1 02與成型品收納部1 〇3之間往復 移動而自動進行成型品的取出之卸載機1 〇 9等所構成，這 些裝載機、卸載機均受到導軌1 07所導引支承。 〔專利文獻1〕日本特開平1 1 - 1 7 9 7 4 7號公報 【發明內容】 〔發明所欲解決之課題〕 然而如圖4所示’由引線框等的被成型品的搬入到成 -4- 200819275 (2) 形後的製品之搬出爲止，是在一直線上進行的樹脂模造裝 置之情況，是將搬送對象物的姿勢穩定後的狀況下長距離 搬送。但，由於穩定地進行長距離搬送用之導軌1 0 7及被 支承於此導軌1 07之裝載機1 0 8及卸載機1 〇 9非常昂貴， 故會有裝置成本變高之問題產生。 因此，本發明是有鑑於這種情事而開發完成之發明， 其目的在於提供，藉由採用不在一直線上進行被成型品的 搬入到成形後的製品之搬出爲止的作業之配置，可抑制裝 置成本之樹脂模造裝置。 〔用以解決課題之手段〕 本發明之樹脂模造裝置，是具有供給被成型品之供給 部；進行被成型品的樹脂模造之成型部；及收納樹脂模造 後的成型品之收納部的樹脂模造裝置，其特徵爲：具有藉 由保持被成型品及成型品並加以旋轉，來進行搬送之旋轉 搬送部，供給部、成型部及收納部配置於旋轉搬送部的外 周部附近。 在本發明之樹脂模造裝置，供給部、成型部及收納部 配置於旋轉搬送部的外周部附近，當由供給部將被成型品 收授至旋轉搬送部時，旋轉搬送部藉由旋轉至，保持被成 型品並收授到成型部的位置，來進行搬送。然後，當將被 成型品收授至成型部，取得進行樹脂模造後的成型品時， 則旋轉搬送部旋轉至保持成型品並收授至收納部之位置， 將成型品收授至收納部。 -5 - 200819275 (3) 如此，在本發明之樹脂模造裝置，藉由旋轉搬送部旋 轉，能夠在供給部、成型部及收納部之間，搬送被成型品 及成型品。此時，由於旋轉搬送部與供給部、成型部及收 納部之間的被成型品或成型品的收授，以短距離的移動即 可，故不需要使用昂貴的導軌等，可抑制成低的裝置成本 〇 在此，本發明之樹脂模造裝置，理想爲由供給部朝旋 轉搬送部進行被成型品之收授的位置、在旋轉搬送部與成 型部之間進行被成型品與成型品的收授之位置、及由旋轉 搬送部朝收納部進行成型品之收授的位置是以對旋轉搬送 部的旋轉中心呈9 0 °間隔加以配置著。藉此，因能夠將供 給部、成型部及供給部集中配置於旋轉搬送部周圍，所以 能夠將裝置全體的大小予以緊緻化。 又，本發明之樹脂模造裝置，理想爲在旋轉搬送部與 成型部之間具有將樹脂錠收授至被成型品上之錠收授部。 藉此，能夠將樹脂錠配置於被成型品上，由旋轉搬送部朝 成型部進行被成型品的收授，在成型部進行樹脂模造。 又，本發明之樹脂模造裝置，理想爲具有在旋轉搬送 部上使被成型品或成型品旋轉之旋轉部。在本發明之樹脂 模造裝置，因藉由旋轉搬送部搬送被成型品或成型品，所 以被成型品或成型品的方向，在旋轉搬送部與供給部、成 型部與收納部之各自之間的被成型品或成型品之收授位置 不同。因此，利用以旋轉部使被成型品或成型品在旋轉搬 送部上旋轉，能夠變更旋轉搬送部與供給部、成型部與收 -6 - 200819275 (4) 納部之各自之間的被成型品或成型品進行收授之際的方向 ，可消除被成型品或成型品的方向之限制，可有效地配置 供給部、成型部及收納部。 〔發明效果〕 (1 )藉由作成下述結構即具有利用將被成型品及成 型品保持旋轉來進行搬送的旋轉搬送部，供給部、成型部 及收納部配置於旋轉搬送部的外周部附近，藉由旋轉搬送 部旋轉，能夠在供給部、成型部及收納部之間搬送被成型 品及成型品。此時，由於旋轉搬送部與供給部、成型部及 收納部之間的被成型品或成型品的收授是以短距離的移動 即可，故，不需要使用昂貴的導軌等，能抑制成低之裝置 成本。 (2 )藉由做成下述結構，即由供給部朝旋轉搬送部 進行被成型品之收授的位置、在旋轉搬送部與成型部之間 進行被成型品與成型品的收授之位置、及由旋轉搬送部朝 收納部進行成型品之收授的位置是以對旋轉搬送部的旋轉 中心呈90°間隔加以配置著，因能夠將供給部、成型部及 收納部集中配置於旋轉搬送部的周圍’所以可將裝置全體 的大小予以緊緻化。 (3 )藉由在旋轉搬送部與成型部之間具有將樹脂錠 收授至被成型品上的錠收授部’能夠將樹脂錠配置於被成 型品上，由旋轉搬送部對成型部進行被成型品之收授，在 成型部進行樹脂模造。藉此，能夠並設錠收授部與成型部 -7 - 200819275 (5) ，可將裝置全體的大小予以緊緻化。 (4 )具有在旋轉搬送部上使被成型品或成型品旋轉 之旋轉部，利用以旋轉部使被成型品或成型品在旋轉搬送 部上旋轉，能夠變更旋轉搬送部與供給部、成型部與收納 部之各自之間的被成型品或成型品進行收授之際的方向， 可消除被成型品或成型品的方向之限制，可有效地配置供 給部、成型部及收納部。 【實施方式】 圖1是本發明的實施形態之樹脂模造裝置的平面配置 構成圖。 在圖1中，本發明的實施形態之樹脂模造裝置，是具 有：藉由保持作爲被成型品的引線框與作爲成型品的半導 體裝置（製品）並旋轉，來進行搬送之旋轉搬送部1 ;供 給引線框的引線框供給部2 ;藉由模具3 0進行引線框的樹 脂模造之成型部3 ;收納進行樹脂模造後的製品之製品收 納部4 ;供給樹脂模造用樹脂錠的錠供給部5 ;及進行成 型部3的模具3 0之清潔之清淨部6。 旋轉搬送部1具有：中心轉盤部1 0 ;軸支承於中心轉 盤部1 0，在中心轉盤部1 0上旋轉之輸入轉盤部1 1 ;及固 定於中心轉盤部10上之下閘門斷開部（gate breaking Part )12。引線框供給部2、成型部3及製品收納部4是配置 於中心轉盤部1 0的外周部附近。 輸入轉盤部1 1是具備以旋轉軸呈對稱地保持2片引 -8 - 200819275 (6) 線框之引線框保持部1 1 a、1 1 b。輸入轉盤部1 1是爲了將 由引線框供給部2所接收的引線框引入至各自的引線框保 持部1 1 a、1 1 b而旋轉（自轉）。下閘門斷開部1 2是接收 保持由成型部3所收授之製品，取下多餘的部分，收授至 製品收納部4。 引線框供給部2具備：安裝保持複數個引線框（未圖 示）的倉匣20，以倉匣單位供給引線框的倉匣供給部2 1 ;由基礎支架台20 —片片地推出引線框之框推進部22 ; 及將以框推進部22所推出的引線框引入至輸入轉盤部11 的引線框保持部1 la、1 lb之引線框引入部23。 錠供給部5具備：將樹脂錠收授至後述的框-錠搬送 部54之錠收授部5〇 ;將樹脂錠搬送至錠收授部50，並加 以供給之供料器51、升降機52及進料器53 ;以及由錠收 授部5 0接收樹脂錠，安裝至被保持於旋轉搬送部1的輸 入轉盤部1 1之引線框上，並且將安裝有此樹脂錠的引線 框由旋轉搬送部1的輸入轉盤部1 1搬送至成型部3的模 具30之框-錠搬送部54。 其次，參照圖2及圖3，說明上述結構的樹脂模造裝 置之動作。圖2是引線框供給部2之動作說明圖，圖3是 進行製品的收授之際的旋轉搬送部1之動作說明圖。 (S 1 )首先，將安裝於倉匣供給部2 1之倉匣20移動 至引線框之分配位置（參照圖2 )，藉由框推進部22，將 引線框由倉匣20朝引線框引入部23推出。然後，引線框 藉由引線框引入部23朝輸入轉盤部1 1的其中一方之引線 -9- 200819275 (7) 框保持部1 1 a搬送。又，輸入轉盤部1 1朝箭號A方向自 轉180°，藉由同樣的方式，朝另一方的引線框保持部1 lb 保持引線框。 (S2 )安裝至輸入轉盤部1 1之2片引線框，藉由中 心轉盤部1 0朝箭號B方向徐轉9 0°，被搬送至收授於框-錠搬送部54之位置。再者，在引線框進行收授後，中心 轉盤部10朝與箭號B方向相反的方向旋轉180°。藉此， 下閘門斷開部12朝圖3實線所示的位置，準備進行成形 後製品的接收。 (S3 ) —方面，被錠供給部5的供料器5 1所供給之 樹脂錠供給至升降機52，再供給至進料器53。供給至進 料器5 3之樹脂錠朝錠收授部5 0流動並整列，收授至框-錠搬送部54。 (S4)框-錠搬送部54由此錠收授部50接收樹脂錠 ，安裝至被保持於旋轉搬送部1的輸入轉盤部11之引線 框上，並且將安裝了此樹脂錠的引線框由旋轉搬送部1的 輸入轉盤部1 1搬送至成型部3的模具3 0。然後，引線框 藉由成型部3進行成型（樹脂模造）。 (S5 )在成型結束後，製品藉由框-錠搬送部54由模 具30取出，在藉由框-錠搬送部54，收授至位於圖3的實 線所示的位置之中心轉盤部1 0上的下閘門斷開部1 2。又 ，取出製品後的模具3 0藉由清淨部6進行洗淨。 (S 6 )收授了製品之下閘門斷開部1 2，藉由使中心 轉盤部1 〇朝圖3所示的箭號C方向旋轉90°，移動至製品 -10- 200819275 (8) 朝製品收納部4進行收授之位置。然後，下閘門斷開部i 2 上的製品’取下多餘的部分，由下閘門斷開部i 2朝製品 收納部4，搬送於圖3所示的箭號D方向並被收納。又， 此時’輸入轉盤部1 1因爲於引線框之引入位置，所以同 時進行前述（S 1 )的處理。 如以上所述’在本實施形態之樹脂模造裝置，由於具 有藉由將引線框及製品保持並旋轉來進行搬送之旋轉搬送 部1，引線框供給部2、成型部3及製品收納部4配置於 旋轉搬送部1的外周部附近，故，藉由旋轉搬送部1旋轉 ，能夠將引線框及製品在引線框供給部2、成型部3及製 品收納部4之間進行搬送。此時，由於旋轉搬送部1與供 給部2、成型部3及收納部4之間的被成型品或成型品的 收授，以短距離的移動即可，故不需要使用昂貴的導軌等 ，可抑制成低的裝置成本。 又，在本實施形態之樹脂模造裝置，由引線框供給部 2朝旋轉搬送部1進行被成型品之收授的位置、在旋轉搬 送部1與成型部3之間進行被成型品與成型品的收授之位 置、及由旋轉搬送部1朝製品收納部4進行成型品之收授 的位置是以對旋轉搬送部的旋轉中心呈90°間隔加以配置 著，因能夠將引線框供給部2、成型部3及製品收納部4 集中配置於旋轉搬送部1的周圍，所以可將裝置全體的大 小予以緊緻化。 又，在本實施形態之樹脂模造裝置，因在旋轉搬送部 1與成型部3之間具有將樹脂錠收授至被成型品上的錠收 -11 - (9) 200819275 授部5 0，能夠將樹脂錠配置於被成型品上’由旋轉搬送部 1對成型部3進行被成型品之收授，在成型部3進行樹脂 模造。藉此，能夠並設錠收授部5 0與成型部3 ’可將裝置 全體的大小予以緊緻化。 又，在本實施形態之樹脂模造裝置，在旋轉搬送部1 的中心轉盤部1 〇上使輸入轉盤部1 1自轉而改變方向，可 有效地安裝2片引線框。因此，能夠以簡單的構造，一次 進行多數的引線框之成型。又，當下閘門斷開部1 2位於 由旋轉搬送部1朝製品收納部4收授製品之位置時’輸入 轉盤部1 1是位於由引線框供給部2朝旋轉搬送部1上接 收引線框之位置，所以能夠同時進行製品的收授與引線框 之接收。 再者，在本實施形態之樹脂模造裝置，下閘門斷開部 1 2是對中心轉盤部1 〇固定，但，亦可將此下閘門斷開部 1 2作成可旋轉之結構。若作成這種結構的話，能夠變更旋 轉搬送部1與引線框供給部2、成型部3與製品收納部4 之各自之間的被成型品或成型品進行收授之際的方向，可 消除被成型品或成型品的方向之限制，可有效地配置引線 框供給部2、成型部3及製品收納部4。 〔產業上之利用可能性〕 本發明之樹脂模造裝置，作爲藉由樹脂來模造引線框 或基板等的被成型品，以製造半導體裝置等的製品之裝置 爲有用的。 -12- (10) (10)200819275 【圖式簡單說明】 圖1是本發明的實施形態之樹脂模造裝置的平面配置 構成圖。 圖2是引線框供給部的動作說明圖。 圖3是製品收授之際的旋轉搬送部之動作說明圖。 圖4是以往的樹脂模造裝置之示意構成圖。 【主要元件符號說明】 1 :旋轉搬送部 2 :引線框供給部 3 :成型部 4 :製品收納部 5 :錠供給部 6 :清淨部 1 0 :中心轉盤部 1 1 :輸入轉盤部 1 la、1 lb :引線框保持部 1 2 :下閘門斷開部 20 :倉匣 2 1 :倉匣供給部 2 2 :框推進部 23 :引線框引入部 3 0 :模具 5 0 :錠收授部 -13- 200819275 (11) 5 1 :供料器 52 :升降機 5 3 :進料器 54 :框-錠搬送部[Technical Field] The present invention relates to a resin molding apparatus for molding a molded article such as a lead frame or a substrate by a resin. [Prior Art] As a resin molding apparatus for manufacturing a semiconductor device, for example, a resin molding apparatus described in Patent Document 1 is known. As shown in FIG. 4, the resin molding apparatus includes a lead frame supply unit 1 〇1, a molding press unit 102, a molded article storage unit 030, a resin ingot supply unit 104, a hot tank loading mechanism unit 105, and The supply portion 106 of the hot tub. In the resin molding apparatus, a molded article or a resin ingot which can be automatically carried into a lead frame or the like, or a transfer mechanism for automatically ejecting the resin molded product is provided. As shown in FIG. 4, the transport mechanism of the resin molding apparatus of Patent Document 1 is automatically loaded with a lead frame by a reciprocating movement between the supply unit 110 of the lead frame and the molding press unit 102, Or the unloader 1 〇 9 or the like that automatically reciprocates between the molding press portion 102 and the molded product storage portion 1 〇 3 to take out the molded product, and these loaders and unloaders are guided by the guide rail 107 Support. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. 1 -1 7 9 7 4 (Convention) [Problems to be Solved by the Invention] However, as shown in Fig. 4, the molded article such as a lead frame is carried into the product. -4- 200819275 (2) In the case of the resin molding apparatus that has been carried out in a straight line, the product after the shape is conveyed is conveyed over a long distance in a state where the posture of the object to be conveyed is stabilized. However, since the guide rail 107 for long-distance transport and the loader 108 and the unloader 1 〇 9 supported by the guide rail 107 are very expensive, there is a problem that the installation cost becomes high. Therefore, the present invention has been made in view of such circumstances, and an object of the present invention is to provide an apparatus for suppressing the cost of the apparatus by performing an operation of carrying out the loading of the molded article to the removal of the molded product. Resin molding device. [Means for Solving the Problem] The resin molding apparatus of the present invention includes a supply unit for supplying a molded article, a molded portion for performing resin molding of the molded article, and a resin molding for accommodating the molded portion of the molded article after resin molding. In the device, the rotary transport unit that transports the molded product and the molded product by rotating the sample and the molded product is disposed, and the supply unit, the molding unit, and the storage unit are disposed in the vicinity of the outer peripheral portion of the rotary transport unit. In the resin molding apparatus of the present invention, the supply unit, the molding unit, and the storage unit are disposed in the vicinity of the outer peripheral portion of the rotary conveyance unit, and when the molded product is conveyed to the rotary conveyance unit by the supply unit, the rotary conveyance unit is rotated to The molded product is held and conveyed to the position of the molding portion to be transported. Then, when the molded article is taken into the molded portion and the molded article obtained by the resin molding is obtained, the rotary transfer portion is rotated until the molded product is held and transferred to the storage portion, and the molded product is taken up to the storage portion. -5 - 200819275 (3) In the resin molding apparatus of the present invention, the molded article and the molded article can be conveyed between the supply portion, the molding portion, and the storage portion by the rotation of the rotary conveying portion. In this case, since the molded article or the molded article between the rotary conveying portion and the supply portion, the molding portion, and the accommodating portion can be moved at a short distance, it is not necessary to use an expensive guide rail or the like, and the molding can be suppressed to be low. In the resin molding apparatus of the present invention, it is preferable that the product is molded between the rotary conveying unit and the molding unit at a position where the supply unit receives the molded product from the supply unit. The position to be received and the position at which the molded article is conveyed to the accommodating portion by the rotary conveyance unit are disposed at intervals of 90° to the center of rotation of the rotary conveyance unit. Thereby, since the supply unit, the molding unit, and the supply unit can be collectively disposed around the rotary transport unit, the size of the entire apparatus can be tightened. Further, in the resin molding apparatus of the present invention, it is preferable that the ingot receiving portion that feeds the resin ingot to the molded article is provided between the rotary conveying portion and the molding portion. By this, the resin ingot can be placed on the molded article, and the molded product can be conveyed to the molded portion by the rotary transfer portion, and resin molding can be performed in the molded portion. Further, the resin molding apparatus of the present invention preferably has a rotating portion that rotates the molded article or the molded article on the rotary conveying portion. In the resin molding apparatus of the present invention, since the molded article or the molded article is conveyed by the rotary conveying unit, the direction of the molded article or the molded article is between the rotary conveying portion and the supply portion, and between the molding portion and the storage portion. The position to be molded or molded article is different. Therefore, by rotating the molded article or the molded article on the rotary conveying portion by the rotating portion, it is possible to change the molded article between the rotary conveying portion and the supply portion, the molding portion, and the respective portions of the -6 - 200819275 (4) In the direction in which the molded article is received, the direction of the molded article or the molded article can be eliminated, and the supply portion, the molding portion, and the storage portion can be efficiently disposed. [Effect of the Invention] (1) The rotary transport unit that transports the molded product and the molded product by rotating the molded product and the molded product, and the supply unit, the molding unit, and the storage unit are disposed in the vicinity of the outer peripheral portion of the rotary transport unit. By rotating the rotary conveying unit, the molded article and the molded article can be conveyed between the supply unit, the molding unit, and the storage unit. In this case, since the molded article or the molded article between the rotary conveying portion and the supply portion, the molding portion, and the accommodating portion can be moved at a short distance, it is not necessary to use an expensive guide rail or the like, and the formation can be suppressed. Low device cost. (2) The position at which the molded article is conveyed to the rotary conveyance portion by the supply portion, and the position at which the molded article and the molded article are received between the rotary transfer portion and the molded portion. And the position where the molded product is conveyed to the accommodating portion by the rotary conveying unit is disposed at an interval of 90° to the rotation center of the rotary conveying unit, and the supply unit, the molding unit, and the accommodating unit can be collectively arranged in the rotary conveyance. The circumference of the part is so 'the size of the whole device can be tightened. (3) The resin ingot can be placed on the molded article by the ingot receiving portion that allows the resin ingot to be transferred to the molded article between the rotary transfer portion and the molded portion, and the molded portion can be formed by the rotary transfer portion. The molded article is subjected to resin molding in the molding portion. Thereby, the ingot receiving section and the molding section -7 - 200819275 (5) can be provided in parallel, and the size of the entire apparatus can be tightened. (4) The rotating portion that rotates the molded article or the molded article on the rotary conveying portion, and the rotating portion and the molded article are rotated on the rotary conveying portion by the rotating portion, whereby the rotary conveying portion, the supply portion, and the molding portion can be changed. The direction in which the molded article or the molded article is received from each other in the accommodating portion can eliminate the restriction of the direction of the molded article or the molded article, and can effectively arrange the supply portion, the molding portion, and the accommodating portion. [Embodiment] FIG. 1 is a plan view showing a configuration of a resin molding apparatus according to an embodiment of the present invention. In the resin molding apparatus of the embodiment of the present invention, the rotary molding unit 1 is configured to hold a lead frame as a molded article and a semiconductor device (product) as a molded article and rotate the carrier; The lead frame supply unit 2 for supplying the lead frame, the molded portion 3 for resin molding of the lead frame by the mold 30, the product storage unit 4 for storing the resin molded product, and the ingot supply unit 5 for supplying the resin ingot for resin molding And a cleaning portion 6 for cleaning the mold 30 of the molding portion 3. The rotary transport unit 1 includes a center turntable portion 10, an input turntable portion 1 1 that is pivotally supported by the center turntable portion 10, rotates on the center turntable portion 10, and a gate disconnect portion that is fixed to the lower portion of the center turntable portion 10. (gate breaking Part) 12. The lead frame supply unit 2, the molded portion 3, and the product storage portion 4 are disposed in the vicinity of the outer peripheral portion of the center turntable portion 10. The input turntable portion 1 1 is a lead frame holding portion 1 1 a, 1 1 b having a wire frame that is symmetrically held by two rotation guide shafts -8 - 200819275 (6). The input carousel portion 1 1 is rotated (rotated) in order to introduce the lead frame received by the lead frame supply unit 2 to the respective lead frame holding portions 1 1 a and 1 1 b. The lower shutter opening portion 1 2 receives and holds the product received by the molding portion 3, removes the excess portion, and feeds it to the product storage portion 4. The lead frame supply unit 2 includes a magazine 20 that holds and holds a plurality of lead frames (not shown), and supplies the cassette supply unit 2 1 of the lead frame in a cartridge unit; the lead frame is pushed out from the base holder 20 The frame pushing portion 22 and the lead frame pushed out by the frame pushing portion 22 are introduced into the lead frame introducing portion 23 of the lead frame holding portions 1 la and 1 lb of the input disk portion 11. The ingot supply unit 5 includes an ingot receiving unit 5 that conveys the resin ingot to the frame-ingot transfer unit 54 to be described later, and a feeder 51 and an elevator 52 that transport the resin ingot to the ingot receiving unit 50 and supply the resin ingot. And the feeder 53; and the resin ingot received by the ingot receiving unit 50, attached to the lead frame held by the input carousel portion 1 of the rotary conveying unit 1, and the lead frame on which the resin ingot is mounted is rotated The input turntable portion 1 1 of the transport unit 1 is transported to the frame-ingot transfer unit 54 of the mold 30 of the molded portion 3. Next, the operation of the resin molding apparatus having the above configuration will be described with reference to Figs. 2 and 3 . FIG. 2 is an operation explanatory view of the lead frame supply unit 2, and FIG. 3 is an operation explanatory view of the rotary transfer unit 1 when the product is received. (S1) First, the magazine 20 attached to the magazine supply unit 21 is moved to the distribution position of the lead frame (refer to FIG. 2), and the lead frame is introduced from the magazine 20 toward the lead frame by the frame pushing unit 22. Department 23 launched. Then, the lead frame is transported by the lead frame lead-in portion 23 toward the lead -9-200819275 (7) frame holding portion 1 1 a of the input turntable portion 1 1 . Further, the input dial portion 1 1 is rotated by 180 in the direction of the arrow A, and in the same manner, the lead frame is held toward the other lead frame holding portion 1 lb. (S2) The two lead frames attached to the input turntable portion 1 1 are rotated by 90° in the direction of the arrow B by the center turntable portion 10, and are transported to the position received by the frame-and-ingot transfer unit 54. Further, after the lead frame is received, the center turntable portion 10 is rotated by 180 in the direction opposite to the direction of the arrow B. Thereby, the lower shutter breaking portion 12 is ready to receive the molded product at a position indicated by the solid line in Fig. 3 . (S3) On the other hand, the resin ingot supplied from the feeder 51 of the ingot supply unit 5 is supplied to the elevator 52, and is supplied to the feeder 53. The resin ingot supplied to the feeder 53 flows into the ingot receiving portion 50 and is aligned and conveyed to the frame-and-ingot transfer portion 54. (S4) The ingot transfer unit 54 receives the resin ingot from the ingot receiving unit 50, and attaches it to the lead frame held by the input turntable portion 11 of the rotary transfer unit 1, and the lead frame on which the resin ingot is mounted is The input turntable portion 1 1 of the rotary conveyance unit 1 is conveyed to the mold 30 of the molding unit 3. Then, the lead frame is molded by the molding portion 3 (resin molding). (S5) After the molding is completed, the product is taken out by the mold 30 by the frame-ingot transfer unit 54, and is taken up to the center turntable portion 1 at the position shown by the solid line in Fig. 3 by the frame-ingot transfer unit 54. The lower gate disconnection portion 1 2 on 0. Further, the mold 30 after taking out the product is washed by the cleaning unit 6. (S 6 ) The shutter opening portion 1 2 under the article is received, and the center turntable portion 1 is rotated by 90° in the direction of the arrow C shown in FIG. 3, and moved to the product-10-200819275 (8) The product storage unit 4 performs the position of the reception. Then, the product ' on the lower shutter opening portion i 2 is removed, and the lower shutter opening portion i 2 is conveyed to the product storage portion 4 in the direction of the arrow D shown in Fig. 3 and stored. Further, at this time, the input disk unit 1 1 is subjected to the above-described (S 1 ) processing because of the lead-in position of the lead frame. As described above, the resin molding apparatus of the present embodiment has the rotary transfer unit 1 that transports the lead frame and the product by rotating the lead frame and the product, and the lead frame supply unit 2, the molded portion 3, and the product storage unit 4 are disposed. In the vicinity of the outer peripheral portion of the rotary transport unit 1, the lead frame and the product can be transported between the lead frame supply unit 2, the molded portion 3, and the product storage unit 4 by the rotation of the rotary transport unit 1. In this case, since the molded article or the molded article between the rotary conveyance unit 1 and the supply unit 2, the molded portion 3, and the storage portion 4 can be moved by a short distance, it is not necessary to use an expensive guide rail or the like. It can suppress low device cost. In the resin molding apparatus of the present embodiment, the lead frame supply unit 2 performs the conveyance of the molded product toward the rotary conveyance unit 1, and the molded article and the molded article are formed between the rotary conveyance unit 1 and the molding unit 3. The position of the reception and the position at which the molded product is conveyed to the product storage unit 4 by the rotary conveyance unit 1 are disposed at intervals of 90° to the rotation center of the rotary conveyance unit, and the lead frame supply unit 2 can be disposed. Since the molded portion 3 and the product storage portion 4 are collectively disposed around the rotary transport unit 1, the size of the entire device can be tightened. In addition, in the resin molding apparatus of the present embodiment, the ingot can be transferred to the molded article between the rotary conveying unit 1 and the molding unit 3, and the ingot can be received by the ingot -11 - (9) 200819275 The resin ingot is placed on the molded article. 'The molded portion 3 is subjected to the molded product by the rotary transfer unit 1 , and the molded portion 3 is resin molded. Thereby, the size of the entire apparatus can be tightened by providing the ingot receiving unit 50 and the molding unit 3'. Further, in the resin molding apparatus of the present embodiment, the input turntable portion 1 1 is rotated and the direction is changed in the center turntable portion 1 of the rotary transfer unit 1, so that two lead frames can be efficiently mounted. Therefore, it is possible to form a plurality of lead frames at a time with a simple configuration. Further, when the lower shutter opening portion 1 2 is located at a position where the product is received by the rotary transport unit 1 toward the product storage unit 4, the input dial unit 1 1 is located at the lead frame supply unit 2 and receives the lead frame toward the rotary transport unit 1. The position is such that the product can be received and the lead frame can be received at the same time. Further, in the resin molding apparatus of the present embodiment, the lower shutter opening portion 12 is fixed to the center turntable portion 1 2, but the lower shutter opening portion 1 2 may be configured to be rotatable. With this configuration, it is possible to eliminate the direction in which the molded article or the molded article between the rotary transfer unit 1 and the lead frame supply unit 2, the molded portion 3, and the product storage portion 4 is received, thereby eliminating the The lead frame supply unit 2, the molding unit 3, and the product storage unit 4 can be efficiently disposed by restricting the direction of the molded article or the molded article. [Industrial Applicability] The resin molding apparatus of the present invention is useful as a device for manufacturing a product such as a semiconductor device by molding a molded article such as a lead frame or a substrate by a resin. -12- (10) (10) 200819275 [Brief Description of the Drawings] Fig. 1 is a plan view showing a configuration of a resin molding apparatus according to an embodiment of the present invention. FIG. 2 is an operation explanatory view of the lead frame supply unit. FIG. 3 is an operation explanatory diagram of the rotary transport unit when the product is received. 4 is a schematic configuration diagram of a conventional resin molding apparatus. [Description of main component symbols] 1 : Rotary conveyance unit 2 : Lead frame supply unit 3 : Molding part 4 : Product storage part 5 : Ingot supply part 6 : Detergent part 1 0 : Center turntable part 1 1 : Input turntable part 1 la, 1 lb : lead frame holding portion 1 2 : lower shutter opening portion 20 : magazine 2 2 : magazine supply portion 2 2 : frame pushing portion 23 : lead frame lead-in portion 3 0 : mold 5 0 : ingot receiving portion - 13- 200819275 (11) 5 1 : Feeder 52 : Lift 5 3 : Feeder 54 : Frame-ingot transfer unit