TW200818549A - Light-emitting device - Google Patents
Light-emitting device Download PDFInfo
- Publication number
- TW200818549A TW200818549A TW096124291A TW96124291A TW200818549A TW 200818549 A TW200818549 A TW 200818549A TW 096124291 A TW096124291 A TW 096124291A TW 96124291 A TW96124291 A TW 96124291A TW 200818549 A TW200818549 A TW 200818549A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- mounting surface
- electrode
- electrode pad
- emitting element
- Prior art date
Links
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 13
- 239000000057 synthetic resin Substances 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims description 8
- 239000002689 soil Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 9
- 238000000465 moulding Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
200818549 九、發明說明: 本申請案係以2006年7月10日本專利申請案第2〇〇6_189493 號為優先權日基準,其所揭露的内容在此全部合併作為參考。 【發明所屬之技術領域】 本發明係關於包含安裝於陶瓷封裝中的發光元件的發光裝 置。 X 、 【先前技術】 壯署ϊίί裝於封裝中的發光紐(亦稱為「LED晶片」)的發光 所熟知。該封裝是由合成樹脂或是陶t所製造的。陶 咖低於合成綱輯阻,並可瓣地釋放出 使用陶瓷封裝的發光裝置構造大致上是 =空^咖晶片被包在合伽旨巾。為了== U =二大片、或是要在陶£封裝中安裝盡可能 裝表安裝表面。制矩形安 =5:^=^彡或是_形安裝表面,如此則會在ί 面積。中I大面積的無用空間,並減少_封裝中的有效安衷 面上在:之矩形的安裝表 要形成單一電極塾 ^ LED曰曰片於電極墊上。若 數個電極墊,則如_圖?θ ^成在整個安裝表面上。鲜形成複 要的最小空隙的電極塾設置於電極墊之間需 中選出的電極墊上。訊罢认+文衣LED曰日片51於從電極墊50其 緣。在任-纽巾,是絲作為電絕 &圖2中看出,矩形安裝表面具有四個 5 200818549 以電極墊50所覆蓋的角落。 ιϊ而,ί安裝表面(安裝空間)的形狀為矩形,那麼當填充 ^衣=間的板造合成樹脂隨著加熱及冷卻LED晶片而 ^收 呀,模造合成樹脂中成長的應力會集中在安、'’ 則易於導致模造合成樹脂脫落。^在女衣工間的角洛’如此 杳广立1 ΐί利申請案第2〇〇4_111937號揭露一種發光褒置,盆中陶 光反射器的周圍會露出’以防止填充陶瓷封裝中的】隙 空隙的内壁表面上的光反射器脫落。在這種ί 揭路的$絲置巾,歧能及喊底部皆以模造 隙』ίΓ本專利中請案第綱_111937號中的陶絲 作為安裝空間,具有非矩形的底面作為安裝 ^面。廷疋因為揭I於日本專利申請案第2004_111937號 ΐί=ί模造合成樹脂在安裝空間中的““ ===^模造合成樹脂祕的問題峨術。因此, ϋί 彡狀且f健在絲郎上形絲可能寬的 模造合成^蝴=^=^111937瞻輸防止 量取:此若樹脂的脫落娜 於脫落· 裳面積的尺寸,則模造合成樹脂變得易 的雜’ 成翻旨*麟,則安絲面必有無稜角 的形狀,例如圓形或是橢圓形。 夂月 【發明内容】 光元ίίϊΐ—目的為提供一種發光裝置,其具有即使在設有發 脫茨的構裝表面是矩形,還是能賴造合成樹脂較不易 脫1構造’因此能增加安裝面積的尺寸。 场 裝的上的’設置一種與本發明一致的包含陶曼封 豎“Ϊ定包括以矩形安裝表面及從安裝表面各邊 所疋義的女裝空間、安裝於安裝表面上之一電極墊、 200818549 •^裝=極墊上之一發光元件、及填充安裝空間的模造 角曰落二表面的㈣未以電極鍾蓋,且陶钱裝_1底i在 ,根據本㈣之發光裝置巾,模造合 喊底部。因此,模造合成樹脂接 ,洛t言強度大於模造合成樹脂在安裝表面其他區二 安裝雜的鑄模樹脂擴張或是收縮i, «從力集+在安裝空_角落’模造合成樹脂“ 實施方式】 置 以下將參照圖认到lc來描述根據本發明之實施例的發光裝 安裝:it】^ £ 發出綠光、發二。4 ===、發光元件G 光裝置會以純相加混合發^光簡本發日稽施例之發 ^ίϊϊ 3 3 元件R、G、Β是I裝4。發光 内’且底部表面3作為安裝表面 —衣工間2於側壁4之 七個電極墊形成在安裝表面3 性連接。明確而言,發光元件反安執才對的發光元件電 ^膠,電性連接於位在發光元件G 劑’例如 墊13g猎由連接電線電性連接於發光元…(未頒不)。電 件B安裳於雷搞埶牛G的上電極。發光元 女衣於电極墊14b之上,電極墊14b藉由電傳導黏著= 200818549 如Ag膠’電性連接於位在於 電極塾说藉由連接電線連i於發光元Cm極(未顯示)。 明確示於圖1A,安裝表面3星右 的上电極。如大部分 具有平坦的上表面。_,模造 1 模造合成樹脂30 成為殼形。根據所示之實施例的;表面可能會突出 同顏色光以制自光的發光元件數細來發出不 成樹脂3。中散佈-,讓單—發光树:光U模造合 鱗於模造合成樹脂3G中,藉由發光元件Β5=於散佈 發出綠光和紅光。發光元件Β 二f,發,可 的綠光還有紅絲製造出白光。』的▲歧所放佈_所發出 露出表=ir角落的喊底部是 H 的電極塾接觸’模造合成樹脂30在安裝表面3 =角洛直接接觸陶甍底部。比起電極塾(金屬),陶曼底& ΐίϊίίίϊ,安裝表面3的四個角落賴造合成樹脂的連^ ίϋΐ造合成樹脂在安絲面3其域中的連接強度ΐ 扠迈合成樹脂30在安裝空間2之中擴張及收縮,且1中 難•以ί 空間2的四個角落,模造合成樹脂30;然 為了要在安裝表面的四個角落露出陶瓷底部,電極,llr、 避開安裝表面的 又在所不的實施例中,發光元件B、G在上下表面皆具有電極, 且發光元件R在上表面具有兩個電極。無論如何,本發明亦適用 於包括複數個相同構造的發光元件被安裝在適合地方的發光裳 置’或是包括單一發光元件被安裝在適合地方的發光裝置。這也 2U0818549 =較佳的包圍發匕牛二以脂碎然而’ _ 波長,波照射時’销脂更不易才U匕為以温度變化及以短 為說日==殊===本發明較佳實施例時,此描述只作 神或是範_,^彰改請專植圍的精 【圖式簡單說明】 Ξ mi根?本發明之實施例之平面圖。 Ξ 3=;,,直線所得之_ 1:陶瓷封裝 2 :安裝空間 3 ·底部表面 4 =侧壁 10r :電極塾 llr :電極塾 12§ ·電極 13g ·電極塾 14b ··電極墊 15b :電極墊 20 :角落 3〇 :模造合成樹脂 50 ·電極塾 51 : LED晶片 9 200818549 R:發光元件 G:發光元件 B:發光元件
Claims (1)
- 200818549 十、申請專利範圍: i. 一種發光裝置,包含: 封裝,包括以—矩形安裝表面及從該安裝表面各邊欧 立之側土所形成的一安裝空間; 江 安裝於該安裝表面上之一電極墊·, 安裝於該電極墊上之一發光元件;及 ΐΐ該巧:空間之—模造合成樹脂; 该安裝表面包括未以該電極墊覆蓋的角落,以便使該陶 究魏之—_底部在該驗露出。 似於圍第1項之發光裝置,其中該安裝表面為類 尤兀件的平面形狀的矩形。 十一、圖式: 11
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006189493A JP2008021670A (ja) | 2006-07-10 | 2006-07-10 | 発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200818549A true TW200818549A (en) | 2008-04-16 |
Family
ID=38918355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096124291A TW200818549A (en) | 2006-07-10 | 2007-07-04 | Light-emitting device |
Country Status (5)
Country | Link |
---|---|
US (1) | US7508008B2 (zh) |
JP (1) | JP2008021670A (zh) |
KR (1) | KR20080005851A (zh) |
CN (1) | CN101106847A (zh) |
TW (1) | TW200818549A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008003971A1 (de) * | 2008-01-11 | 2009-07-16 | Ledon Lighting Jennersdorf Gmbh | Leuchtdiodenanordnung mit Schutzrahmen |
US8907482B2 (en) * | 2012-11-08 | 2014-12-09 | Honeywell International Inc. | Integrated circuit package including wire bond and electrically conductive adhesive electrical connections |
CN107331751A (zh) * | 2017-07-06 | 2017-11-07 | 庞绮琪 | 能够延长led使用寿命的封装结构 |
CN107195757A (zh) * | 2017-07-06 | 2017-09-22 | 庞绮琪 | 一种led封装结构 |
US11552220B2 (en) * | 2018-02-26 | 2023-01-10 | Kyocera Corporation | Electronic component mounting package for mounting a light-emitting element, electronic device, and electronic module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152046A (ja) | 1984-12-26 | 1986-07-10 | Fujitsu Ltd | 半導体装置 |
JP3034814B2 (ja) | 1997-02-27 | 2000-04-17 | 沖電気工業株式会社 | リードフレーム構造及び半導体装置の製造方法 |
JP4407204B2 (ja) | 2002-08-30 | 2010-02-03 | 日亜化学工業株式会社 | 発光装置 |
JP3878579B2 (ja) * | 2003-06-11 | 2007-02-07 | ローム株式会社 | 光半導体装置 |
-
2006
- 2006-07-10 JP JP2006189493A patent/JP2008021670A/ja active Pending
-
2007
- 2007-06-15 US US11/764,088 patent/US7508008B2/en active Active
- 2007-06-28 KR KR1020070064182A patent/KR20080005851A/ko not_active Application Discontinuation
- 2007-07-04 TW TW096124291A patent/TW200818549A/zh unknown
- 2007-07-10 CN CN200710128361.4A patent/CN101106847A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US7508008B2 (en) | 2009-03-24 |
CN101106847A (zh) | 2008-01-16 |
US20080006841A1 (en) | 2008-01-10 |
KR20080005851A (ko) | 2008-01-15 |
JP2008021670A (ja) | 2008-01-31 |
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