200816565 九、發明說明 【發明所屬之技術領域】 本發明係例如，有關作爲晶圓，1C基板等之電路元件 相互間之電性連接或在基板之檢查裝置的連接器而理想所 使用之向異導電性連接器及使用此之向異導電性連接器之 被檢查體之檢查方法。 【先前技術】 作爲向異導電性薄片，例如知道有只對厚度方向表示 導電性之構成，或具有在加壓於厚度方向時，只對厚度方 向表示導電性之加壓導電性導電部的構成，而此等係具有 未使用附凸塊或機械性崁合等之手段而可達成連接器之電 性連接情況，薄片材料爲橡膠等之彈性體之情況係吸收機 械性之衝擊或偏移而可軟性連接之情況等特長。 因此，利用如此的特長，例如，針對在電子計算機， 電子式數位錶，電子相機，電腦鍵盤等之領域，作爲爲了 達成電路元件，例如印刷電路與無引線晶片，液晶面板等 之相互間的電性連接之連接器而被廣泛使用。 另外，針對在印刷電路等之電路基板的電性檢查，係 爲了達成形成於爲檢查對象之電路基板的一面之被檢查電 極，和形成於檢查用電路基板的表面之連接用電極之電性 連接，進行於電路基板之被檢查電極範圍與檢查用電路基 板之連接用電極範圍之間，作爲連接器而介入存在向異導 電性薄片之情況。 -5 - 200816565 例如，如圖9所示，於檢查對象之晶圓，IC基 被檢查體1與檢查用電路基板5之間，配置向異導 接器’並經由將被檢查體1進行加壓之情況，將其 體1接合於向異導電性連接器1 0之同時，從其狀 給電性信號至檢查用電路基板5，並從檢查用電路 之被檢查電極6傳送至向異導電性連接器10及被杨 之後’經由其電性信號再次通過向異導電性連接器 至檢查用電路基板5之情況，檢查被檢查電極1之， 以往，作爲使用於如此之電性檢查之向異導電 係了解到有各種構造，例如，對於專利文獻1 (日本 5 1 -93 3 93號公報）等，係揭示有將金屬粒子均一地 彈性體中所得到之向異導電性薄片（以下將此稱作 型向異導電性薄片」），另外，對於專利文獻2 (日 昭5 3 - 1 4 7 7 7 2號公報）等，係揭示有由形成經由不均 導電性磁性體粒子分佈於彈性體中之情況，延伸於 向之多數的導電路形成部，和將此等作爲相互絕緣 部而成之向異導電性薄片（以下將此稱作「偏在型 電性薄片」），更加地，對於專利文獻3 (日本特開 2 5 0906號公報）等，係揭示有於導電路形成部的表 緣部之間，係形成有段差之偏在型向異導電性薄片 並且，偏在型向異導電性薄片係因經由與電路 之電極圖案對稱之圖案而形成導電路形成部，故比 散型向異導電性薄片，對於以小的間距而配置欲連 極之電路基板等而言，亦可有利於以高信賴性而達 板等之 電性連 被檢查 態，供 基板5 ί查體1 而返回 載路。 性薄片 特開昭 分散於 「分散 本特開 一地使 厚度方 之絕緣 向異導 昭 6 1 _ 面與絕 〇 基板等 較於分 接之電 成電極 -6 - 200816565 間的電性連接之情況。 但，近年來，針對在表面安裝LSI或電子電路基板， 電極尺寸或電極間尺寸之更加細微化，高密度化之進展， 對應於此，向異導電性薄片亦要求導電部的形成等之細微 化，而經由如此之細微化之進展情況，針對在向異導電性 薄片，細彈性體的面積與導通部之面積變小，相當於對於 偏移之彈性體支撐的面積之負載負荷變大，而彈力產生下 降。 另外，與向異導電性薄片接觸之被檢查體1之被檢查 電極2的凸塊形狀亦對於高度方向而言，有某種程度之不 均，因此，經由凸塊形狀係有部分受到高偏移之部分，對 於向異導電性薄片係具有可充分吸收該凸塊形狀之高度的 不均之彈性情況則爲理想。 另外，以往之偏在型向異導電性薄片係爲將矽橡膠等 作爲基材之構成，但，與其連接之電路基板或半導體元件 等係爲含有玻璃纖維環氧樹脂或銅等之金屬板或矽等，並 因兩者之熱膨脹係數不同，故經由溫度變化而對於兩者之 電極位置’產生偏移’特別是對於按壓力小的情況，係有 無法得到電性導通之情況，而如此的問題係在電極間隙變 小，成爲細微之電極圖案之情況則越顯著。 另一方面，爲了解決如此問題，根據本申請人，例如 提供對於專利文獻4(日本特開2001_93599號公報），而在 專利文獻4中，如圖1 0所示，於被檢查體3與向異導電 性薄片7之間’介入安裝形成有貫通孔之絕緣性的薄片狀 200816565 間隔件9，並對於薄片狀間隔件9之貫通孔1 1而言，插入 從一方側突出形成於被檢查體3之突起電極3 a，並插入從 另一方側突出形成於向異導電性薄片7之導電路形成部7a ，在貫通孔內接合相互之前端部。 [專利文獻1]日本特開昭51-93393號公報 [專利文獻2]日本特開昭53-147772號公報 [專利文獻3]日本特開昭61-250906號公報 [專利文獻4]日本特開2001-93599號公報 【發明內容】 [欲解決發明之課題] 但，如專利文獻4，將突起電極3 a及導電路形成部 7a，直接插入於間隔件9之貫通孔1 1內之情況，係因突 起電極3a與導電路形成部7a之位置配合變爲困難，故無 法將向異導電性薄片的厚度設定爲充分厚度，另外，當將 尺寸精確度提高設定時，調整經由間隔件9之加壓時之變 形量情況則爲困難，而對於從被檢查體3側所加壓之情況 ，導電路形成部7 a則負載於行方向，而有直接使永久變 形產生之虞。 本發明係有鑑於如此之以往情事，將提供針對在檢查 檢查對象之電性特性，而電極間尺寸之微細化進展，相當 於彈性體所支撐的面積之負載負荷即使變大，亦不會有彈 力下降之情況，另外，可充分吸收被檢查體之凸塊形狀之 高度的不均，更加地，可正確地位置配合微細化進展之被 -8 - 200816565 檢查體的電極位置與向異導電性薄片的電極位置，加上對 於按壓力小的情況，亦可得到電性導通，更加地，亦不會 有對於向異導電性薄片之彈性導電路，使永久變形之負載 產生，而耐久性良好之向異導電性連接器，作爲目的。 另外，本發明之目的係提供使用其向異導電性連接器 之被檢查體之檢查方法。 [爲了解決課題之手段] 有關本發明之向異導電性連接器係屬於爲了檢查被檢 查體之電性特性之向異導電性連接器，其特徵乃由配置於 成爲檢查對象之被檢查體側的第1向異導電性薄片層，和 配置於檢查用電路基板側之第2向異導電性薄片層，和配 置於前述第1向異導電性薄片層與前述第2向異導電性薄 片間之絕緣性的薄片狀間隔件所構成，而前述第1向異導 電性薄片層，和前述第2向異導電性薄片層係各自於厚度 方向，突出形成有彈性導電路，並此等各彈性導電路之突 出部分則以插入於前述薄片狀之間隔件之貫通孔內的狀態 ，一體地組裝前述第1向異導電性薄片層，和前述第2向 異導電性薄片層，和前述薄片狀間隔件者。 如根據如此之向異導電性連接器’因可適當選擇間隔 件的厚度，故可確保充分之厚度。 另外，爲了檢查有關本發明之被檢查體之電性特性之 向異導電性連接器屬於爲了檢查被檢查體之電性特性之向 異導電性連接器，其特徵乃由配置於成爲檢查對象之被檢 -9 - 200816565 查體側的第1向異導電性薄片層，和配置於檢查用電路基 板側之第2向異導電性薄片層，和配置於前述第1向異導 電性薄片層與前述第2向異導電性薄片間之絕緣性的薄片 狀間隔件，和固定設置於前述薄片狀間隔件之內面側的導 電性接點構件所構成，而前述第1向異導電性薄片層，和 前述第2向異導電性薄片層係各自於厚度方向，突出形成 有彈性導電路之同時，針對在前述第1向異導電性薄片層 之彈性導電路或針對在前述第2向異導電性薄片層之彈性 導電路之任一方的彈性導電路之突出部分，在插入於前述 薄片狀間隔件之貫通孔內時，前述第1向異導電性薄片層 之前述突出部分，和前述第2向異導電性薄片層之前述突 出部分則藉由前述導電性接點構件而加以對向配置者。 如根據如此構成之向異導電性連接器，可適當選擇間 隔件的厚度的同時，對於從被檢查體之按壓負荷爲小之情 況，亦可藉由導電性接點構件，可實現從第1向異導電性 薄片層所突出形成之彈性導電路，和從第2向異導電性薄 片層所突出形成之彈性導電路之安定之電性連接，並由此 ，彈性導電路與彈性導電路之間的接觸安定性則充分地變 高，可防止彈性導電路之負載，損傷，塌陷，或變爲永久 變形之小變形等，進而可得到高耐久性者。 更加地，本發明係固定設置於前述薄片狀間隔件之內 面之前述導電性接點構件，由金屬板而成者。 如爲如此構成，可防止向異導電性連接器之彈性導電 路之例如偏移等之異常變形之發生者。 -10- 200816565 另外，本發明係支撐前述導電性接點構件之前述薄片 狀間隔件之支撐範圍部分，則理想爲可變位形成於該薄片 狀間隔件之厚度方向者。 如爲如此構成，可確實進行導電性接點構件與彈性導 電路之接觸者。 在此，於在前述薄片狀間隔件之前述支撐範圍部分， 經由形成有縫隙之情況，其縫隙之周圍則形成於可變位形 成於該薄片狀間隔件之厚度方向之情況則爲理想。 如爲如此構成，可容易地實現支撐範圍部分之變形者 〇 另外，在本發明之中，係亦可前述薄片狀間隔件則由 2片的板材所構成，並於其第1板材與第2板材之間，配 置前述導電性接點構件。 如爲如此構成，因可將第1向異導電性薄片側之彈性 導電路，和第2向異導電性薄片側之彈性導電路，配置於 2片之板材的中央位置者，故可正確進行決定位置者。 另外，使用有關本發明之向異導電性連接器之被檢查 體之檢查方法係其特徵乃在於配置於被檢查體側之彈性導 電路突出形成於厚度方向之第1向異導電性薄片層，和配 置於被檢查體側之彈性導電路突出形成於厚度方向之第2 向異導電性薄片層之間，配置形成有貫通孔之絕緣性的薄 片狀間隔件時，於前述薄片狀間隔件之前述貫通孔內，呈 從兩側對向地插入從前述第1向異導電性薄片層所突出之 彈性導電路，並經由適當調整前述薄片狀間隔件之厚度及 -11 - 200816565 前述彈性導電路的長度情況，調整前述彈性導電路之變形 量者。 如根據如此之檢查方法，因可適當地設定彈性導電路 之變形量，故在進行正確的檢查之同時，可貢獻於耐久性 的提升者。 如根據有關本發明之向異導電性連接器，經由介入存 在間隔件，可將全體的厚度設定爲充分之厚度，另外，經 由調整間隔件的厚度之情況，可調整加壓時之變形量，更 加地，經由間隔件之貫通孔的內壁面，可規定彈性導電路 之變形量，由此，可使重複使用之情況的耐久性提升，更 加地，於薄片狀間隔件之貫通孔的內面，固定設置導電性 接點構件之情況係即使以小的加壓力，進行檢查，因電性 連接成爲容易，故亦可進行正確的檢查者。 更加地，如根據使用有關本發明之向異導電性連接器 之檢查方法，因可將向異導電性連接器設定爲最佳之厚度 ’故當然可實施正確的檢查，從可規定彈性導電路之變形 量情況，提升重複使用之情況的耐久性。 【實施方式】 [爲了實施發明之最佳型態] 以下，關於有關本發明之向異導電性連接器及使用其 向異導電性連接器之被檢查體之檢查方法’參照圖面之同 時，進行說明。 圖1係爲有關本發明之一實施例的向異導電性連接器 -12- 200816565 2 0之平面圖，圖2係爲圖1之A - A線方向之部分擴大剖 面圖。 本實施例之向異導電性連接器20係如圖2所示’由 第1向異導電性薄片層20A，和第2向異導電性薄片層 20B，和配至於此等第1，第2向異導電性薄片之間的絕 緣性之薄片狀間隔件20C所構成。 因同樣地形成第1向異導電性薄片層20A，和第2向 異導電性薄片層2 0B，故於以下，以例說明第1向異導電 性薄片層20A。 其第1向異導電性薄片層20A係如圖1所示，由延伸 於厚度方向之複數之圓柱狀的彈性導電路2 1，和相互絕緣 此等彈性導電路2 1之絕緣部1 5，和支撐絕緣部1 5之板狀 的支撐體1 7所構成，而全體則形成爲矩形薄片狀，而對 於彈性導電路2 1係含有表示詞性之導電性粒子P，並其 彈性導電路2 1係在加壓於厚度方向時，表示有導通性， 另外，在圖1所示的例中，複數之彈性導電路21之中， 例如，電性連接於檢查對象之晶圓，1C基板等之被檢查電 極之範圍則作爲有效導電路1 2，並未連接於連接對向電極 之部分則作爲無效導電路1 3，並且，有效導電路1 2係如 圖2所示，於厚度方向兩側，各自形成有突出部分2 1 a。 絕緣部1 5係成圍著各彈性導電路2 1之周圍，形成爲 一體，並由此，所有的彈性導電路2 1係成爲經由絕緣部 1 5而相互絕緣之狀態。 作爲含有導電性粒子P之基材及絕緣部1 5的形成材 -13- 200816565 料，係可使用各種構成，並作爲其具體例係可舉出，聚丁 二烯橡膠，天然橡膠，聚異戊二烯橡膠，苯乙烯-丁二烯 共聚物橡膠，丙烯腈-丁二烯共聚物橡膠等之共軛二烯橡 膠及，這些之氫添加物，苯乙烯-丁二烯-二烯烴異分子聚 合物橡膠，苯乙烯-異戊二烯異分子聚合物等之異分子聚 合物橡膠及這些之氫添加物，氯丁二烯’聚氨酯橡膠，聚 酯橡膠，環氧氯丙烷橡膠，矽橡膠，乙烯-丙烯共聚物橡 膠，乙烯-丙烯-二烯烴共聚物橡膠等，而針對在以上，對 於要求耐候性於所得到向異導電性薄片之情況係理想爲採 用共軛二烯橡膠以外之構成，特別是從成形加工性及電性 特性的觀點來看，採用矽橡膠之情況則爲理想。 作爲導電性粒子p之具體例係可舉出，表示鐵，鈷， 鎳等磁性之金屬之粒子或此等合金的粒子，或者含有這些 金屬之粒子，另外將這些粒子作爲芯粒子，並於該芯粒子 表面施以金，銀，鈀，铑等之導電性良好之金屬的電鍍之 構成，或者將非磁性金屬粒或玻璃珠等之無機物質粒子或 聚合物粒子作爲芯粒子，並於該芯粒子表面施以鎳，鈷等 之導電性磁性粒子的電鍍之構成等，或者於芯粒子，被覆 導電性磁性體及導電性加之金屬雙方的構成等，而在此等 之中係理想爲，使用將鎳粒子作爲芯粒子，並於其表面施 以金或銀等之導電性良好之金屬的電鍍構成之情況，特別 示被覆金及銀雙方之構成則爲理想，作爲覆蓋導電性金屬 於芯粒子表面之手段係並無特別限定，但例如可經由化學 電鍍或無電解電鍍而進行。 -14- 200816565 第1向異導電性薄片層20A，第2向異導電性薄片層 20B係如上述所形成。 於以下，關於薄片狀間隔件2 0 C，進行說明。 薄片狀間隔件2 0 C係與圖9所示之情況相同地，於對 應於被檢查體1之被檢查電極2的圖案之位置，即，對應 於向異導電性薄片2 0 A，2 0 B之彈性導電路2 1，2 1之位置 ’形成有貫通孔2 3，對於各貫通孔2 3內，係從兩方向插 入有作爲對應之向異導電性薄片20A，20B之突出部分 2 1a，21 a ° 薄片狀間隔件2 0 C之貫通孔2 3的形狀並無特別限定 ，但在考量彈性導電路2 1之形狀及向異導電性薄片20A ，20B之突出部分21a的形狀，例如，形成爲圓柱狀。 貫通孔23之內徑係成插入向異導電性薄片20a，20B 之哭出部分21a地’如爲較此等突出部分21a爲大尺寸即 可’但對於其口徑而言，理想爲有充裕之情況，具體而言 ，貫通孔2 3的內徑係對於突出部分2 1 a之口徑之比率， 例如成爲1 · 〇 5〜2倍，理想爲1 · 1〜1 . 8倍之大小情況，而作 爲薄片狀間隔件20C，係理想爲從各兩方向所插入之突出 部分2 1 a的前端則未置於相互接近於該貫通孔31之中間 部的程度者。 薄片狀間隔件20C之材質係理想爲由尺寸安定性高之 耐熱性絕緣材料而成之構成者，具體而言係可使用玻璃纖 維補強型環氧樹脂，聚醯亞胺樹脂等之熱硬化樹脂，聚對 苯二甲酸乙二醇酯樹脂，氯乙烯樹脂，聚苯乙烯樹脂，聚 -15- 200816565 丙烯腈樹脂，聚乙烯樹脂，丙烯酸樹脂，聚丁二烯樹脂等 之熱可塑性樹脂，其他各種絕緣性樹脂，但最適合使用玻 璃纖維補強型環氧樹脂。 對於如此之絕緣材料，經由使用例如根據數値控制方 式之鑽孔裝置或雷射加工裝置等而形成貫通孔23之情況 ，得到薄片狀間隔件20C。 薄片狀間隔件20C之厚度d係較一方之突出部分21a 的突出高度Η，和另一方之突出部分21a的突出高度Η之 合計爲小，並且，經由控制薄片狀間隔件20C之厚度d與 突出部分2 1 a之大小及高度情況，再按壓圖9所示之被檢 查體1的情況，以適當的力量，使一方之突出部分2 1 a與 另一方之突出部分21a接觸而確實進行兩者之電性連接， 另外，經由適當調整薄片狀間隔件2 0 C之厚度與彈性導電 路2 1之突出部分2 1 a的高度情況，可迴避產生過大的變 形於包含向異導電性薄片20A，20B之突出部分21a的導 電路形成部21之情況，隨之，在得到信賴性高的作用同 時，可將使用壽命加長。 有關本實施例之第1向異導電性薄片層20A，和第2 向異導電性薄片層2 0 B，和薄片狀間隔件2 0 C係各自如上 述所構成，但，此等係如圖3所示而組裝，並第1向異導 電性薄片層2 0 A與薄片狀間隔件2 0 C之間，以及第2向異 導電性薄片層20B與薄片狀間隔件20C之間係針對在絕緣 部1 5，經由矽製等之黏著劑而一體地加以固定。 如此作爲所形成之向異導電性連接器2 0係與圖9所 -16- 200816565 示之情況同樣地，配置於1 C基板等之被檢查體1，和檢查 用電路基板5之間，並使用於被檢查體1之電性檢查，然 而，針對在圖1，符號1 9係表示插入有引導銷之導孔的構 成。 使用如圖3所示之向異導電性連接器2 0的情況係因 可適當調整彈性導電路2 1之突出部分2丨a及薄片狀間隔 件20C之厚度，故可進行1C基板，晶圓等之被檢查體1 的正確檢查，另外，因高度低之突出部分2 1 a，2 1 a則從 貫通孔2 3的兩側插入，並在其貫通孔2 3之中央部相互對 向，故於電極位置，不易產生偏移，隨之，即使以小的壓 力進行檢查，或以若干大的壓力進行檢查，亦可得到電性 導通，另外，經由根據突出部分2 1 a之按壓的變形，可吸 收被檢查電極2之高度方向的不均。 如此在本發明中，對於檢查電極間隔狹窄，而形成有 細微之電極圖案之被檢查體1的情況，可進行良好之電性 檢查。 另外，在使用有關本發明之向異導電性薄片之1C基 板等之被檢查體的檢查方法中，從可適當地設定彈性導電 路2 1之變形量情況，可進行正確的檢查，並耐久性良好 〇 以上，關於本發明之一實施例，已進行過說明，但本 發明並不侷限於任何上述實施例。 例如，在上述實施例中，薄片狀間隔件20C係由一片 的板材所構成，但亦可取代此而由2片板材來構成，另外 -17- 200816565 ，作爲薄片狀間隔件，在使用2片板材之情況，於此等之 間，亦可介入存在由較彈性導電路2 1硬質的材料而成之 導電性接點構件。 以下，關於由2片板材來構成薄片狀間隔件2 0 C，並 於此等之間’使導電性接點構件介入存在之本發明的其他 實施例’進行說明，但對於與上述實施例同一要素係附上 相同符號，而詳細說明則省略。 圖4〜圖7係爲表示有本發明之其他實施例的向異導電 性連接器3 0之構成。 其向異導電性連接器3 0係具備第1向異導電性薄片 20A，和第2向異導電性薄片20B，和由2片板材而成之 薄片狀間隔件20C。 在其向異導電性連接器30中，第1向異導電性薄片 20A ’和第2向異導電性薄片20B係與上述實施例同樣地 形成’即’於絕緣部的兩端，各自形成有突出部分2 1 a， 另外，薄片狀間隔件2 〇 C係具有略一半厚度之第1板材 25與第2板材27，而於此等板材25，27，形成有特定之 貫通孔23，23之情況係與上述實施例相同。 更加地，在本實施例之向異導電性連接器3 〇中， Μ 6 E . 4 T / 6薄片狀間隔件2 0 C之第1板材2 5的內面側（第2 板材27側），呈被覆其貫通孔23地，〜體地固定設置導 電性接點構件29。 導電性接點構件2 9之材料係如爲導電性，並無特別 限定’而使用各種金屬，導電性無機材料，導電性有機材 -18- 200816565 料，其中理想爲金屬，可舉出銅，金，銀，鈀，鍺，鎳， 鐵，SUS，鋁，鈷，錫，鋅，鉛或此等層積體，或者含有 此等之合金等，在這些之中，作爲理想之構成而可舉出銅 ，金，銀，銷，錯，錬，鐵，或此等層積體，或者含有此 等之合金等，而作爲特別理想的構成，可舉出銅或金的層 積體’或者含有此等之合金等。 其導電性接點構件2 9係例如，平面形狀爲正方形或 圓形’另外，導電性接點構件29係理想爲呈特別可耐得 住在爲了得到電性導通所加壓時之壓力，較第1，第2向 異導電性薄片層20A，20B之彈性導電路21的材料爲剛體 之情況。 導電性接點構件29之厚度係例如爲0.1〜1〇〇〇⑽，而 理想爲1〜5 0炯，更理想爲1 〇〜2 〇 〇 //m。 圖6係爲表示第1板材25之一部分的平面圖，而針 對在第1板材25，係在對應於1C基板等之被檢查體之突 起電極（相當於在圖10之被檢查體3之突起電極3a)之 各位置’貫通孔23則排列於縱橫而排列爲格子狀之狀態 而加以形成，並且，於圍住各貫通孔23之範圍，連續形 成有延伸於〕狀之縫隙22a，另外，於Π狀縫隙22a之U 的開口部分，各自形成有直線狀之縫隙22b，由此，貫通 孔2 3的週邊範圍係針對在圖6的紙面，可變位形成於前 後方向，β卩’薄片狀間隔件20C之厚度方向。 即，呈閉塞貫通孔23地加以配置之導電性接點構件 2 9之支撐範圍部分2 8係可經由此等縫隙2 2 a，2 3 b，變位 -19- 200816565 形成於厚度方向，而經由此，將容易作爲導電性接點構件 29之變形，導電性接點構件29之支撐範圍部分28係如可 變位於厚度方向即可，而其形狀並無特別限定，例如，直 線狀之縫隙22b係爲減少對於支撐範圍部分28之變位的 阻抗之構成，並非必須之構成，如此，容易作爲變位之縫 隙形狀係無限定任何於實施例，然而，針對在圖6，符號 1 9係爲表示爲了揷通位置決定銷的孔1 9之構成（參照圖 1 )。 針對在本實施形態，係爲如如此經由2片的板材2 5， 27而構成薄片狀間隔件20C，更加地設置導電性接點構件 2 9之構成，但，此等係如圖7所示，相互組裝，如將第1 向異導電性薄片層20A與第1板材25之間及第2向異導 電性薄片層2 0 B與第2板材2 7之間，經由絕緣性適宜之 黏著劑黏著即可。 在本實施例中，對於將形成於第1向異導電性薄片層 20A之彈性導電路21的突出部分21a，插入至第1板材 25之貫通孔23內的情況，呈接近於導電性接點構件29之 程度，若干偏離配置其突出部分21a之前端地，預先各自 調整第1板材25與第2板材27與突出部分21a之高度， 而與此同樣地，亦呈接近於導電性接點構件29之程度， 若干偏離配置第2向異導電性薄片層20B之彈性導電路 2 1的突出部分2 1 a，隨之，對於爲了進行電性檢查而從被 檢查體1側按押之情況，經由比較柔軟之彈性導電路2 1 各自接合於比較硬質之導電性接點構件2 9之情況，可得 -20 - 200816565 到接觸狀態，並針對在與圖9同樣的使用狀態，即使以小 的加壓力進行檢查，亦可進行電性檢查者。 如此，在本發明中，亦可經由2片板材而構成薄片狀 間隔件，並由如此的板材調整加厚或薄化全體厚度情況。 更加地，本發明係可作各種變形。 例如，在圖4〜圖7所示之本發明其他實施例之中，係 使導電性接點構件29介入存在於2片的板材25，27之間 ，但，其導電性接點構件2 9係亦可並非設置在2片的板 材2 5，2 7之間，而如圖8所示之情況，設置於由一片板 材而成之薄片狀間隔件20C之情況，而對於其情況，例如 如去除對應於導電性接點構件2 9之第2向異導電性薄片 20B’之一方的突出部分21a，並將端面全體形成爲略平坦 即可。 即使爲如此之向異導電性連接器5 0，亦可得到與上述 各實施例略同樣的作用效果。 【圖式簡單說明】 [圖1 ]係爲有關本發明之一實施例的向異導電性連接 器之平面圖。 [圖2 ]係爲圖1所不之向異導電性連接器之A - A線方 向之一部分擴大剖面圖。 [圖3 ]係爲相互組裝圖2所示之擴大部分時之剖面圖 〇 [圖4]係爲表示本發明之其他實施例的構成，其中薄 • 21 * 200816565 片狀 性接 間隔 圖。 性連 之被 往檢 【主 20 ： 20A 20B 20B’ 20C 21 ： 22a， 2 1a： 間隔件則由2片板材所構成，並於其板材，設置導電 點構件的例之擴大剖面圖。 [圖5]係爲表示將圖4所示之2片板材而成之薄片狀 件’與導電性接點構件同時組裝之狀態的擴大剖面圖 [圖6]係爲圖5所示之第1板材之平面圖。 [圖7]係爲圖5所示之薄片狀間隔件構件之組裝剖面 [圖8]係爲經由本發明之另外其他實施例之向異導電 接器之剖面圖。 [圖9]係爲利用向異導電性連接器而檢查電路基板等 檢查體的以往檢查裝置之槪略剖面圖。 [圖10]係爲揭示於日本特開2001_93599號公報之以 查裝置之剖面圖。 要元件符號說明】 向異導電性連接器 :第1向異導電性薄片 :第2向異導電性薄片 :第2向異導電性薄板 :薄片狀間隔件 彈性導電路 22b :縫隙 突出部分 -22- 200816565 23 :貫通孔 25 :第1板材 27 :第2板材 28 :支撐範圍部分 3 〇 :向異導電性連接器 50 :向異導電性連接器。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 A conductive connector and a method of inspecting an object to be inspected using the above-described electrically conductive connector. [Prior Art] As the conductive conductive sheet, for example, it is known that the conductive property is expressed only in the thickness direction, or the pressurized conductive conductive portion is formed only in the thickness direction when the thickness is in the thickness direction. And such an electrical connection can be achieved without using a bump or a mechanical twist, and the elastic material of the sheet material is rubber or the like absorbs mechanical impact or offset. It can be a soft connection. Therefore, the use of such a feature, for example, in the field of electronic computers, electronic digital meters, electronic cameras, computer keyboards, etc., as a circuit element, such as printed circuits and leadless wafers, liquid crystal panels, etc. It is widely used as a connector for sexual connection. In addition, in order to achieve electrical inspection of a circuit board such as a printed circuit, an electrode to be inspected formed on one surface of the circuit board to be inspected is electrically connected to a connection electrode formed on the surface of the circuit board for inspection. Between the range of the electrode to be inspected of the circuit board and the range of the electrode for connection of the circuit board for inspection, a case where the conductive sheet is interposed is interposed as a connector. -5 - 200816565 For example, as shown in FIG. 9, the wafer to be inspected is placed between the IC-based test object 1 and the test circuit substrate 5, and the transfer to the test object 1 is performed. In the case of pressing, the body 1 is bonded to the counter conductive connector 10, and the electrical signal is supplied from the shape to the inspection circuit substrate 5, and is transmitted from the inspection electrode 6 of the inspection circuit to the opposite conductivity. In the case where the connector 10 and the yang are again passed through the electrical signal to the inspection circuit board 5 through the electrical signal, the electrode 1 to be inspected is inspected, and conventionally used as a divergence for use in such electrical inspection. The conductive system is known to have various structures. For example, Patent Document 1 (Japanese Laid-Open Patent Publication No. Hei No. Hei No. Hei. No. Hei. No. Hei. No. 5-93 3 93) discloses a conductive sheet obtained by uniformly dispersing metal particles. In the case of the patent document 2 (Japanese Unexamined Patent Publication No. Hei No. Hei. In the body, extending to The number of the conductive circuit forming portions and the conductive conductive sheets (hereinafter referred to as "biased electrical sheets") which are formed as mutually insulating portions, and further, Patent Document 3 (Japanese Patent Laid-Open No. 2) Japanese Unexamined Patent Publication No. Publication No. No. No. Publication No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. 5906 Since the pattern of the pattern is symmetrical and the conductive circuit forming portion is formed, it is possible to facilitate the board with a high reliability and the like for the circuit board or the like which is disposed at a small pitch. The electrical connection is checked for the substrate 5 to check the body 1 and return to the path. The thin film is widely dispersed in the electrical connection between the thickness of the insulating layer and the insulating substrate -6 - 200816565. In the case of the surface mount LSI or the electronic circuit board, the electrode size or the inter-electrode size is further miniaturized and the density is increased. In response to this, the conductive portion is required to be formed into the conductive sheet. With such miniaturization, the area of the fine elastic body and the area of the conductive portion become smaller for the conductive sheet, and the load load corresponding to the area of the elastic support for the offset becomes variable. In addition, the shape of the bump of the inspected electrode 2 of the test object 1 that is in contact with the electrically conductive sheet is also uneven to some extent in the height direction, and therefore, via the bump. It is preferable that the shape is partially offset by a high degree, and it is preferable for the isoconductive sheet to have an uneven elasticity that can sufficiently absorb the height of the bump shape. The profile-oriented conductive sheet is made of a ruthenium rubber or the like as a base material, but the circuit board or the semiconductor element to be connected thereto is a metal plate or a ruthenium containing glass fiber epoxy resin or copper, and the like. Since the thermal expansion coefficients of the two are different, the electrode position of the two is shifted by the temperature change, especially when the pressing force is small, the electrical conduction cannot be obtained, and the problem is that the electrode is In the case of the above-mentioned applicant, for example, the patent document 4 (Japanese Laid-Open Patent Publication No. 2001-93599), and the patent document 4 As shown in FIG. 10, an insulating sheet-like 200816565 spacer 9 in which a through hole is formed is interposed between the test object 3 and the opposite-conductive sheet 7, and the through-hole of the sheet-like spacer 9 is provided. In the case of the first embodiment, the projection electrode 3a which is formed on the inspection object 3 from one side is inserted, and the projection electrode 3a which is formed to protrude from the other side and formed on the conductive film 7 is formed. In the case of the through-holes, the front end portions are joined to each other. [Patent Document 1] Japanese Laid-Open Patent Publication No. SHO-53-153772 (Patent Document 3) [Patent Document 4] JP-A-2001-93599 SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] However, as disclosed in Patent Document 4, the protruding electrode 3a and the conductive circuit forming portion 7a are directly inserted. In the case of the through hole 1 1 of the spacer 9, it is difficult to match the position of the protruding electrode 3a and the conductive circuit forming portion 7a, so that the thickness of the opposite conductive sheet cannot be set to a sufficient thickness, and when the size is set When the accuracy is increased, it is difficult to adjust the amount of deformation when the spacer 9 is pressurized, and when the pressure is applied from the side of the subject 3, the conductive circuit forming portion 7a is loaded in the row direction. There is a direct cause of permanent deformation. In view of such a conventional situation, the present invention provides an improvement in the electrical characteristics of the inspection object and the progress of the miniaturization between the electrodes, and the load load corresponding to the area supported by the elastic body does not become large. In the case where the elastic force is lowered, the unevenness of the height of the shape of the bump of the object to be inspected can be sufficiently absorbed, and the electrode position and the cross-conductivity of the inspection body can be accurately aligned with the progress of the -8 - 200816565 The position of the electrode of the sheet, as well as the case where the pressing force is small, can also be electrically conductive, and further, there is no elastic conductive circuit for the conductive sheet, and the load of permanent deformation is generated, and the durability is good. A different conductivity connector for the purpose. Further, it is an object of the present invention to provide an inspection method using an object to be inspected to a different conductivity connector. [Means for Solving the Problem] The transconductivity connector according to the present invention is a dissimilar conductive connector for inspecting the electrical characteristics of the object to be inspected, and is characterized in that it is disposed on the side of the object to be inspected to be inspected. a first directionally different conductive sheet layer and a second directionally different conductive sheet layer disposed on the inspection circuit board side, and between the first directionally different conductive sheet layer and the second directionally different conductive sheet The insulating sheet-like spacer is formed, and each of the first-oriented and different-conductive sheet layers and the second-direction different-conductive sheet layer are formed with an elastic conductive circuit in a thickness direction, and each of the elastic layers The protruding portion of the conductive circuit is integrally assembled with the first paraconductive sheet layer, the second epitaxial conductive sheet layer, and the sheet shape in a state of being inserted into the through hole of the sheet-shaped spacer. Spacer. According to the thickness of the spacer, the thickness of the spacer can be appropriately selected. Further, the dissimilar conductive connector for inspecting the electrical characteristics of the test object of the present invention belongs to a dissimilar conductive connector for inspecting the electrical characteristics of the test object, and is characterized in that it is disposed on the object to be inspected. Detected -9 - 200816565 The first conductive layer of the first conductive layer on the side of the inspection, the second conductive layer on the side of the circuit board for inspection, and the first conductive layer on the first conductive layer The insulating sheet-like spacer between the second-oriented conductive sheets and the conductive contact member fixed to the inner surface side of the sheet-shaped spacer, and the first-oriented conductive sheet layer And the second conductive sheet layer and the elastic conductive circuit are protruded in the thickness direction, and the elastic conductive circuit in the first conductive sheet layer or the second conductive conductive layer is formed on the first conductive layer. a protruding portion of the elastic guiding circuit of one of the elastic guiding circuits of the sheet layer, the protruding portion of the first dissimilar conductive sheet layer when inserted into the through hole of the sheet-like spacer And the protruding portion of the second epitaxial conductive sheet layer is disposed opposite to the conductive contact member. According to the conductive conductive connector configured as described above, the thickness of the spacer can be appropriately selected, and when the pressing load from the test object is small, the conductive contact member can be used to realize the first The elastic conductive circuit formed to protrude from the electrically conductive sheet layer is electrically connected to the stability of the elastic conductive circuit formed by the second electrically conductive sheet layer, and thereby the elastic conductive circuit and the elastic conductive circuit The contact stability between the two is sufficiently high, and it is possible to prevent the load, damage, collapse, or small deformation of the permanent deformation of the elastic conductive circuit, and to obtain high durability. Further, in the present invention, the conductive contact member fixed to the inner surface of the sheet-like spacer is formed of a metal plate. According to this configuration, it is possible to prevent the occurrence of abnormal deformation such as shifting of the elastic conductive path to the different-conductive connector. Further, in the present invention, the support portion of the sheet-like spacer supporting the conductive contact member is preferably formed such that the variable position is formed in the thickness direction of the sheet-like spacer. According to this configuration, the contact between the conductive contact member and the elastic conductive circuit can be surely performed. Here, in the case where the slit portion is formed in the support portion of the sheet-like spacer, it is preferable that the gap is formed around the slit in the thickness direction of the sheet-like spacer. According to this configuration, it is possible to easily realize the deformation of the support range portion. Further, in the present invention, the sheet-like spacer may be composed of two sheets, and the first sheet and the second sheet. The aforementioned conductive contact members are disposed between the sheets. According to this configuration, the elastic conductive circuit on the side of the first-oriented conductive sheet and the elastic conductive circuit on the side of the second-oriented conductive sheet can be disposed at the center of the two sheets, so that the correct operation can be performed. Determine the location. In addition, the inspection method of the test object according to the present invention is characterized in that the elastic conductive circuit disposed on the side of the test object protrudes from the first conductive layer of the first conductive layer in the thickness direction. When the elastic guide circuit disposed on the side of the object to be inspected is formed between the second directionally different conductive sheet layers in the thickness direction and the insulating sheet-like spacer having the through holes is formed, the sheet-like spacer is formed. In the through-hole, the elastic conductive circuit protruding from the first-oriented conductive sheet layer is inserted oppositely from both sides, and the thickness of the sheet-like spacer is appropriately adjusted, and the elastic conductive circuit is used as described in -11 - 200816565 In the case of the length, the amount of deformation of the aforementioned elastic conducting circuit is adjusted. According to such an inspection method, since the amount of deformation of the elastic conductive circuit can be appropriately set, it is possible to contribute to the improvement of durability while performing accurate inspection. According to the polarization-conducting connector according to the present invention, the thickness of the entire thickness can be set to a sufficient thickness by interposing the spacer, and the amount of deformation during pressurization can be adjusted by adjusting the thickness of the spacer. Further, the amount of deformation of the elastic conductive circuit can be specified via the inner wall surface of the through hole of the spacer, whereby the durability in the case of repeated use can be improved, and the inner surface of the through hole of the sheet-like spacer can be further improved. In the case where the conductive contact member is fixedly provided, even if the inspection is performed with a small pressing force, it is easy to electrically connect, so that it is possible to perform an accurate inspection. Further, according to the inspection method using the dissimilar conductive connector according to the present invention, since the thickness of the dissimilar conductive connector can be set to an optimum thickness, it is of course possible to carry out a correct inspection, from which the elastic conductive circuit can be specified. The amount of deformation increases the durability of the case of repeated use. [Embodiment] [Best Mode for Carrying Out the Invention] The following is a description of the method for inspecting the isotropic conductive connector of the present invention and the test object using the same to the isoconductive connector. Be explained. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a paraconductive connector -12-200816565 20 in accordance with an embodiment of the present invention, and Fig. 2 is a partially enlarged cross-sectional view taken along line A - A of Fig. 1. The polarization-conducting connector 20 of the present embodiment is composed of a first-dipole conductive sheet layer 20A and a second-direction different-conductive sheet layer 20B as shown in FIG. 2, and is assigned to the first and second sides. The insulating sheet-like spacer 20C is formed between the electrically conductive sheets. Since the first epitaxial conductive sheet layer 20A and the second epitaxial conductive sheet layer 20B are formed in the same manner, the first epitaxial conductive sheet layer 20A will be described below by way of example. The first isotropic conductive sheet layer 20A is composed of a plurality of cylindrical elastic conductive circuits 2 1 extending in the thickness direction and insulating portions 15 of the elastic conductive circuits 2 1 from each other as shown in FIG. And the plate-shaped support body 17 supporting the insulating portion 15 is formed, and the whole is formed into a rectangular sheet shape, and the elastic conductive circuit 2 1 is provided with the conductive particles P indicating the part, and the elastic conductive circuit 2 1 In the example shown in FIG. 1, in the example shown in FIG. 1, the plurality of elastic conductive circuits 21 are electrically connected to, for example, a wafer to be inspected, a 1C substrate, or the like. The range of the electrode to be inspected is taken as the effective guiding circuit 12, and the portion not connected to the opposite electrode is used as the ineffective guiding circuit 13, and the effective guiding circuit 12 is shown in Fig. 2 on both sides in the thickness direction. Each is formed with a protruding portion 2 1 a. The insulating portion 15 is formed integrally around the periphery of each of the elastic conductive circuits 2, and thus all of the elastic conductive circuits 21 are insulated from each other via the insulating portion 15. Various materials can be used as the material for forming the base material of the conductive particles P and the insulating material 15-13-200816565, and specific examples thereof include polybutadiene rubber, natural rubber, and polyisometry. a conjugated diene rubber such as a pentadiene rubber, a styrene-butadiene copolymer rubber, an acrylonitrile-butadiene copolymer rubber, and the like, and a hydrogen additive, a styrene-butadiene-diene heteropolymer polymerization Hetero-molecular polymer rubber such as rubber, styrene-isoprene heteropolymer, and hydrogen additives thereof, chloroprene 'polyurethane rubber, polyester rubber, epichlorohydrin rubber, ruthenium rubber, ethylene-propylene In the case of a copolymer rubber, an ethylene-propylene-diene copolymer rubber, or the like, it is preferable to use a conjugated diene rubber in the case where weather resistance is required to be obtained in the case of the above-mentioned conductive diene sheet, in particular, From the viewpoint of moldability and electrical properties, it is preferable to use a ruthenium rubber. Specific examples of the conductive particles p include particles of a magnetic metal such as iron, cobalt, or nickel, particles of these alloys, or particles containing these metals, and these particles are used as core particles. The surface of the core particle is coated with a metal having good conductivity such as gold, silver, palladium or rhodium, or inorganic particles or polymer particles such as non-magnetic metal particles or glass beads are used as core particles, and the core is The surface of the particles is formed by plating a conductive magnetic particle such as nickel or cobalt, or a structure in which the core particle is coated with a conductive magnetic material and a conductive metal, and the like, and it is preferable to use it. In the case where nickel particles are used as the core particles and a plating composition of a metal having good conductivity such as gold or silver is applied to the surface thereof, it is particularly preferable to cover both the gold and the silver, and it is preferable to cover the conductive metal in the core particles. The means for the surface is not particularly limited, but can be carried out, for example, by electroless plating or electroless plating. -14- 200816565 The first off-conductivity sheet layer 20A and the second off-conductivity sheet layer 20B are formed as described above. Hereinafter, the sheet-like spacer 20 C will be described. The sheet-like spacer 20 C is the same as the case shown in FIG. 9 at a position corresponding to the pattern of the electrode 2 to be inspected of the object 1 to be inspected, that is, corresponding to the opposite-conducting sheet 2 0 A, 2 0 The position of the elastic conducting circuit 2 1, 2 1 of B is formed with the through hole 23, and the protruding portion 2 1a of the corresponding conductive sheet 20A, 20B is inserted into the through hole 2 3 from both directions. 21 a ° The shape of the through hole 2 3 of the sheet-like spacer 20C is not particularly limited, but the shape of the elastic conductive circuit 21 and the shape of the protruding portion 21a of the opposite conductive sheets 20A, 20B are considered, for example. , formed into a cylindrical shape. The inner diameter of the through hole 23 is inserted into the crying portion 21a of the counter conductive sheets 20a, 20B, which is a larger size than the protruding portion 21a, but it is desirable for the diameter thereof. Specifically, the ratio of the inner diameter of the through hole 23 to the diameter of the protruding portion 2 1 a is, for example, 1 to 5 times, preferably 1 to 1 to 1. 8 times. As the sheet-like spacer 20C, it is preferable that the tip end of the protruding portion 2 1 a inserted from each of the two directions is not placed close to the intermediate portion of the through hole 31. The material of the sheet-like spacer 20C is preferably a heat-resistant insulating material having a high dimensional stability. Specifically, a glass fiber-reinforced epoxy resin or a thermosetting resin such as a polyimide resin can be used. , polyethylene terephthalate resin, vinyl chloride resin, polystyrene resin, poly-15- 200816565 acrylonitrile resin, polyethylene resin, acrylic resin, polybutadiene resin, etc., thermoplastic resin, various other Insulating resin, but glass fiber reinforced epoxy resin is most suitable. For such an insulating material, the through-holes 23 are formed by using, for example, a drilling apparatus or a laser processing apparatus according to a number-turn control method, and a sheet-like spacer 20C is obtained. The thickness d of the sheet-like spacer 20C is smaller than the protruding height Η of one of the protruding portions 21a, and the protruding height Η of the other protruding portion 21a is small, and the thickness d and the protrusion of the sheet-like spacer 20C are controlled. In the case of the size and height of the portion 2 1 a, when the object 1 to be inspected as shown in Fig. 9 is pressed, the protruding portion 21a of one side is brought into contact with the protruding portion 21a of the other side with an appropriate force to surely perform both Electrical connection, and by appropriately adjusting the thickness of the sheet-like spacer 20 C and the height of the protruding portion 2 1 a of the elastic conductive circuit 2 1 , excessive deformation can be avoided in the inclusion of the opposite-conducting sheet 20A. In the case of the conductive circuit forming portion 21 of the protruding portion 21a of 20B, the life can be increased and the service life can be lengthened. The first off-conductivity sheet layer 20A and the second-direction different-conductive sheet layer 20B in the present embodiment and the sheet-like spacer 20C are each configured as described above, but these are as shown in the figure. As shown in Fig. 3, between the first-direction heterogeneous sheet layer 20A and the sheet-like spacer 20C, and between the second-direction electroconductive sheet layer 20B and the sheet-like spacer 20C, The insulating portion 15 is integrally fixed by an adhesive such as tantalum. In the same manner as the case shown in FIG. 9-16 to 200816565, the conductive-oriented connector 20 is disposed between the test object 1 such as a 1 C substrate and the circuit board 5 for inspection, and It is used for the electrical inspection of the object 1 to be inspected. However, with reference to Fig. 1, reference numeral 19 denotes a configuration in which a guide hole into which a guide pin is inserted. In the case where the para-conducting connector 20 shown in FIG. 3 is used, since the thickness of the protruding portion 2a of the elastic conducting circuit 2 and the thickness of the sheet-like spacer 20C can be appropriately adjusted, the 1C substrate and the wafer can be performed. The correct inspection of the object 1 to be inspected, and the protruding portions 2 1 a and 2 1 a having a low height are inserted from both sides of the through hole 2 3 and opposed to each other at the central portion of the through hole 2 3 . Therefore, at the position of the electrode, it is less likely to cause an offset, and accordingly, even if the inspection is performed with a small pressure or the inspection is performed with a large pressure, electrical conduction can be obtained, and further, deformation by pressing according to the protruding portion 21a can be obtained. It can absorb the unevenness in the height direction of the electrode 2 to be inspected. As described above, in the case of the test object 1 in which the electrode spacing is narrow and the fine electrode pattern is formed, a good electrical inspection can be performed. Further, in the inspection method of the test object using the 1C substrate or the like of the conductive sheet of the present invention, the amount of deformation of the elastic conductive circuit 2 can be appropriately set, and accurate inspection and durability can be performed. Although it has been described above, an embodiment of the present invention has been described, but the present invention is not limited to any of the above embodiments. For example, in the above embodiment, the sheet-like spacer 20C is composed of one sheet of sheet material, but may be composed of two sheets instead of -17-200816565, as a sheet-like spacer, and two sheets are used. In the case of a sheet material, a conductive contact member formed of a material harder than the elastic guide circuit 2 1 may be interposed therebetween. Hereinafter, the sheet-like spacer 20 C is formed of two sheets, and another embodiment of the present invention in which the conductive contact member is interposed is described. However, the same as the above embodiment. The elements are attached with the same symbols, and the detailed description is omitted. 4 to 7 are views showing the configuration of the polarization-conducting connector 30 of another embodiment of the present invention. The isotropic conductive connector 30 is provided with a first paraconductive sheet 20A, a second epitaxial sheet 20B, and a sheet-like spacer 20C made of two sheets. In the non-conductive conductive member 30, the first-to-dipole conductive sheet 20A' and the second-direction different-conductive sheet 20B are formed in the same manner as in the above-described embodiment, that is, both ends of the insulating portion are formed. The protruding portion 2 1 a, and the sheet-like spacer 2 〇 C has a first plate member 25 and a second plate member 27 having a thickness of a half, and the plate members 25 and 27 are formed with specific through holes 23, 23 The situation is the same as in the above embodiment. Further, in the isotropic conductive connector 3 of the present embodiment, the inner surface side (the second plate 27 side) of the first plate member 25 of the Μ 6 E . 4 T / 6 sheet-like spacer 20 C The conductive contact member 29 is fixedly disposed to cover the through hole 23. The material of the conductive contact member 29 is electrically conductive, and is not particularly limited to use various metals, conductive inorganic materials, and conductive organic materials -18-200816565. Among them, copper is preferably used. Gold, silver, palladium, rhodium, nickel, iron, SUS, aluminum, cobalt, tin, zinc, lead or such a laminate, or an alloy containing the same, among these, as an ideal configuration Copper, gold, silver, pin, erroneous, bismuth, iron, or such a laminate, or an alloy containing the same, and as a particularly preferable constitution, a laminate of copper or gold 'or Such alloys, etc. The conductive contact member 29 is, for example, a square or circular planar shape. In addition, the conductive contact member 29 is desirably particularly resistant to the pressure applied to obtain electrical conduction. The material of the elastic conductive circuit 21 of the first and second epitaxial conductive sheet layers 20A and 20B is a rigid body. The thickness of the conductive contact member 29 is, for example, 0.1 to 1 Torr (10), and is preferably 1 to 50 Å, more preferably 1 〇 to 2 〇 〇 //m. 6 is a plan view showing a portion of the first plate member 25, and is a protruding electrode corresponding to the object to be inspected such as the 1C substrate in the first plate member 25 (corresponding to the protruding electrode of the object to be inspected 3 in FIG. In each of the positions 3a), the through-holes 23 are formed in a state in which they are arranged in a lattice shape in a vertical and horizontal direction, and a slit 22a extending in a shape is continuously formed in a range surrounding each of the through holes 23, and The opening portion of the U of the meandering slit 22a is formed with a linear slit 22b. Thus, the peripheral range of the through hole 23 is formed on the paper surface of Fig. 6, and the variable position is formed in the front-rear direction, β?' The thickness direction of the spacer 20C. In other words, the support range portion 28 of the conductive contact member 29 disposed to close the through hole 23 can be formed in the thickness direction via the slits 2 2 a, 2 3 b, and the displacement -19-200816565. Thereby, it is easy to be deformed as the conductive contact member 29, and the support range portion 28 of the conductive contact member 29 may be changed in the thickness direction, and the shape thereof is not particularly limited, for example, a linear slit. 22b is a configuration for reducing the impedance of the displacement of the support range portion 28, and is not necessarily a configuration. Therefore, the slit shape which is easy to be displaced is not limited to the embodiment, however, for FIG. 6, the symbol 19 is The configuration of the hole 1 9 for determining the pin position is referred to (see Fig. 1). In the present embodiment, the sheet-like spacer 20C is formed via the two sheets 2, 27, and the conductive contact member 29 is further provided. However, as shown in FIG. And mutually assembled, between the first conductive sheet layer 20A and the first sheet material 25, and between the second conductive sheet layer 20B and the second sheet material 27, via an insulating adhesive. Stick it. In the present embodiment, the protruding portion 21a of the elastic conductive circuit 21 formed on the first conductive sheet layer 20A is inserted into the through hole 23 of the first plate member 25, and is close to the conductive contact. The degree of the member 29 is slightly offset from the front end of the protruding portion 21a, and the heights of the first plate member 25 and the second plate member 27 and the protruding portion 21a are adjusted in advance, and similarly, the conductive contact member is also disposed. In the case of 29, a certain amount of the protruding portion 2 1 a of the elastic conducting circuit 2 1 on which the second-direction electrically conductive sheet layer 20B is disposed is deviated from the side of the object to be inspected 1 for electrical inspection. By the fact that the relatively soft elastic conductive circuits 2 1 are respectively bonded to the relatively hard conductive contact members 29, -20 - 200816565 can be obtained in a contact state, and for the same use state as in Fig. 9, even small Check with pressure, or perform electrical inspection. As described above, in the present invention, the sheet-like spacer can be formed by two sheets of sheets, and the thickness of the sheet can be adjusted to be thickened or thinned. Further, the present invention is susceptible to various modifications. For example, in the other embodiment of the present invention shown in Figs. 4 to 7, the conductive contact member 29 is interposed between the two sheets 25, 27, but the conductive contact member 29 It is also possible not to be disposed between the two sheets 2, 2, and 7 and as shown in Fig. 8, in the case of the sheet-like spacer 20C made of one sheet, and for the case, for example, The protruding portion 21a corresponding to one of the second epitaxial conductive sheets 20B' of the conductive contact member 29 may be removed, and the entire end faces may be formed to be slightly flat. Even in the case of such a different-conductivity connector 50, the same operational effects as those of the above-described respective embodiments can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] is a plan view showing a paraconductive connector according to an embodiment of the present invention. Fig. 2 is a partially enlarged cross-sectional view showing the direction of the A-A line of the non-conductive connector of Fig. 1. Fig. 3 is a cross-sectional view showing the enlarged portion shown in Fig. 2, and Fig. 4 is a view showing a configuration of another embodiment of the present invention, in which a thin 21 * 200816565 sheet-like spacer is shown. The inspection is carried out. [Main 20: 20A 20B 20B' 20C 21 : 22a, 2 1a: The spacer is composed of two sheets, and an enlarged cross-sectional view of an example of a conductive member is provided on the sheet. FIG. 5 is an enlarged cross-sectional view showing a state in which a sheet-like member made of two sheets of the sheet material shown in FIG. 4 is simultaneously assembled with a conductive contact member. FIG. 6 is the first example shown in FIG. Plan view of the sheet. Fig. 7 is a sectional view showing the assembly of the sheet-like spacer member shown in Fig. 5 [Fig. 8] which is a cross-sectional view of a different-conducting connector according to still another embodiment of the present invention. Fig. 9 is a schematic cross-sectional view showing a conventional inspection apparatus for inspecting a test substrate such as a circuit board by using a different-conductive connector. Fig. 10 is a cross-sectional view showing the apparatus for inspection in Japanese Laid-Open Patent Publication No. 2001-93599. Description of the elements to be used: a different-conductivity connector: a first-direction electrically conductive sheet: a second-direction electrically conductive sheet: a second-direction heteroconductive thin plate: a sheet-like spacer elastic conductive circuit 22b: a slit protruding portion-22 - 200816565 23 : Through hole 25 : 1st plate 27 : 2nd plate 28 : Support range part 3 〇 : Directional conductive connector 50 : Directional conductive connector