TW200815774A - Electronic component transfer and testing apparatus - Google Patents

Electronic component transfer and testing apparatus Download PDF

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Publication number
TW200815774A
TW200815774A TW096117227A TW96117227A TW200815774A TW 200815774 A TW200815774 A TW 200815774A TW 096117227 A TW096117227 A TW 096117227A TW 96117227 A TW96117227 A TW 96117227A TW 200815774 A TW200815774 A TW 200815774A
Authority
TW
Taiwan
Prior art keywords
test
carrier
arm
component
electronic component
Prior art date
Application number
TW096117227A
Other languages
English (en)
Chinese (zh)
Other versions
TWI352815B (enrdf_load_stackoverflow
Inventor
Koya Karino
Akihiko Ito
Kazuyuki Yamashita
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200815774A publication Critical patent/TW200815774A/zh
Application granted granted Critical
Publication of TWI352815B publication Critical patent/TWI352815B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096117227A 2006-05-18 2007-05-15 Electronic component transfer and testing apparatus TW200815774A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/309954 WO2007135709A1 (ja) 2006-05-18 2006-05-18 部品搬送装置及び電子部品試験装置

Publications (2)

Publication Number Publication Date
TW200815774A true TW200815774A (en) 2008-04-01
TWI352815B TWI352815B (enrdf_load_stackoverflow) 2011-11-21

Family

ID=38723024

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117227A TW200815774A (en) 2006-05-18 2007-05-15 Electronic component transfer and testing apparatus

Country Status (2)

Country Link
TW (1) TW200815774A (enrdf_load_stackoverflow)
WO (1) WO2007135709A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI736454B (zh) * 2020-10-23 2021-08-11 美商第一檢測有限公司 晶片測試系統

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4082807B2 (ja) * 1998-11-27 2008-04-30 株式会社アドバンテスト 電子部品の温度印加方法および電子部品試験装置
JP4401616B2 (ja) * 2002-03-14 2010-01-20 ヤマハ発動機株式会社 電子部品検査装置
JP4415807B2 (ja) * 2004-09-21 2010-02-17 ヤマハ株式会社 Icハンドラ

Also Published As

Publication number Publication date
TWI352815B (enrdf_load_stackoverflow) 2011-11-21
WO2007135709A1 (ja) 2007-11-29

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MM4A Annulment or lapse of patent due to non-payment of fees