TW200806160A - High heat conductive substrate and manufacturing method thereof - Google Patents

High heat conductive substrate and manufacturing method thereof Download PDF

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Publication number
TW200806160A
TW200806160A TW095124823A TW95124823A TW200806160A TW 200806160 A TW200806160 A TW 200806160A TW 095124823 A TW095124823 A TW 095124823A TW 95124823 A TW95124823 A TW 95124823A TW 200806160 A TW200806160 A TW 200806160A
Authority
TW
Taiwan
Prior art keywords
substrate
layer
layers
substrate layer
thermally conductive
Prior art date
Application number
TW095124823A
Other languages
English (en)
Chinese (zh)
Other versions
TWI303972B (enExample
Inventor
Rung-Feng Huang
xu-yuan Zhang
Guo-Da Wu
Yu-Lin Jiang
Original Assignee
Integrated Module Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Module Technology Inc filed Critical Integrated Module Technology Inc
Priority to TW095124823A priority Critical patent/TW200806160A/zh
Priority to US11/822,772 priority patent/US20080017402A1/en
Publication of TW200806160A publication Critical patent/TW200806160A/zh
Application granted granted Critical
Publication of TWI303972B publication Critical patent/TWI303972B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095124823A 2006-07-07 2006-07-07 High heat conductive substrate and manufacturing method thereof TW200806160A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095124823A TW200806160A (en) 2006-07-07 2006-07-07 High heat conductive substrate and manufacturing method thereof
US11/822,772 US20080017402A1 (en) 2006-07-07 2007-07-10 Substrate module with high thermal conductivity and its fabrication method of same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095124823A TW200806160A (en) 2006-07-07 2006-07-07 High heat conductive substrate and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200806160A true TW200806160A (en) 2008-01-16
TWI303972B TWI303972B (enExample) 2008-12-01

Family

ID=38970359

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124823A TW200806160A (en) 2006-07-07 2006-07-07 High heat conductive substrate and manufacturing method thereof

Country Status (2)

Country Link
US (1) US20080017402A1 (enExample)
TW (1) TW200806160A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401017B (zh) * 2010-05-25 2013-07-01 建準電機工業股份有限公司 散熱模組之結合方法
CN116235297A (zh) * 2020-09-24 2023-06-06 株式会社自动网络技术研究所 基板单元

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171157A (ja) * 2009-01-22 2010-08-05 Sanyo Electric Co Ltd 電子素子用パッケージ及び電子部品
DE102011121808A1 (de) * 2011-12-21 2013-06-27 Conti Temic Microelectronic Gmbh Mehrlagenleiterplatte mit integriertem Bauelement
DE102014224732B4 (de) * 2014-12-03 2022-02-10 Automotive Lighting Reutlingen Gmbh Leiterplatte für eine Kraftfahrzeugbeleuchtungseinrichtung mit optimierter Entwärmung
KR102411999B1 (ko) * 2015-04-08 2022-06-22 삼성전기주식회사 회로기판
US10135310B2 (en) 2017-01-11 2018-11-20 Infinitum Electric Inc. System and apparatus for modular axial field rotary energy device
WO2019190959A1 (en) 2018-03-26 2019-10-03 Infinitum Electric Inc. System and apparatus for axial field rotary energy device
DE102019204871A1 (de) * 2019-04-05 2020-10-08 Robert Bosch Gmbh Elektronische Schaltungseinheit
US11283319B2 (en) 2019-11-11 2022-03-22 Infinitum Electric, Inc. Axial field rotary energy device with PCB stator having interleaved PCBS
US20210218304A1 (en) 2020-01-14 2021-07-15 Infinitum Electric, Inc. Axial field rotary energy device having pcb stator and variable frequency drive
US11482908B1 (en) 2021-04-12 2022-10-25 Infinitum Electric, Inc. System, method and apparatus for direct liquid-cooled axial flux electric machine with PCB stator
CN117750617A (zh) * 2023-11-30 2024-03-22 京东方科技集团股份有限公司 电路板及显示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5604673A (en) * 1995-06-07 1997-02-18 Hughes Electronics Low temperature co-fired ceramic substrates for power converters
US6373348B1 (en) * 2000-08-11 2002-04-16 Tektronix, Inc. High speed differential attenuator using a low temperature co-fired ceramic substrate
US7321098B2 (en) * 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401017B (zh) * 2010-05-25 2013-07-01 建準電機工業股份有限公司 散熱模組之結合方法
CN116235297A (zh) * 2020-09-24 2023-06-06 株式会社自动网络技术研究所 基板单元

Also Published As

Publication number Publication date
US20080017402A1 (en) 2008-01-24
TWI303972B (enExample) 2008-12-01

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