200804820 (1) 九、發明說明 【發明所屬之技術領域】 本發明是有關具備探針的檢查夾具及使用該檢查夾具 的檢查裝置及檢查方法，該探針是接觸於設定在被檢查基 ' 板的配線圖案上的所定焊錫凸塊，使用於從該焊錫凸塊往 ^ 被檢查對象的上述配線圖案之電流施加用，或該配線圖案 的電壓測定用。 Φ 又，本發明並非限於印刷配線基板，例如還可適用於 可撓性基板、多層配線基板、液晶顯示器或電漿顯示器用 的電極板、及半導體封裝用的封裝基板或膠片載板等各種 的基板之電氣配線的檢查，在此明細書中是將該等各種的 配線基板總稱爲「基板」。 【先前技術】 以往，爲了必須根據電路基板上的配線圖案來對搭載 Φ 於該電路基板的1C等半導體或電阻器等的電氣·電子零件 正確地傳達電氣信號，而測定安裝電氣·電子零件之前的 印刷配線基板、液晶面板或電漿顯示器面板中形成有配線 圖案的電路配線基板、或形成於半導體晶圓等基板的配線 圖案中設置的所定檢查點間的電阻値，而來進行其良否的 判定。 具體而言，其良否的判定，是使電流供給用端子及/ 或電壓測定用端子抵接於各檢查點，從電流供給用端子來 對檢查點供給測定用電流的同時，測定抵接於檢查點的電 -4- 200804820 (2) 壓測定用端子間所產生的電壓，而進行者。又，有爲了抑 止測定端子與檢查點之間的接觸電阻的影響，高精度地測 定電阻値’而使一對的電流供給用端子及電壓測定用端子 抵接於各檢查點，在使該抵接的電流供給用端子間供給測 ^ 定用電流的同時，測定使抵接的電壓測定用端子間所產生 * 的電壓’藉此進行配線圖案的良否判定之方法（所謂4端子 測定法或開耳芬（Kelvin)法）爲人所知。 φ 在使用焊錫凸塊的「覆晶·接合法」中，一般是在半 導體積體電路（LSI)的裸晶片（Bare Chip)的電極（接合焊墊） 上形成球形狀的焊錫突起，亦即焊錫凸塊，且將該等的焊 錫凸塊接合於安裝基板所對應的電極，藉此將裸晶片的接 合焊墊電性連接至安裝基板所對應的電極，且將裸晶片固 定於安裝基板。如此的技術亦被使用於裸晶片以外的其他 電子元件或電子零件的安裝或接合等，該情況，焊錫凸塊 是被形成於安裝基板的焊接區（land)或電子零件的電極等 鲁 之上。 [專利文獻1 ]日本特開2 0 0 2 - 5 0 8 7 6號公報 以如此的焊錫凸塊作爲被檢查點時，使用前端尖的探 針（專利文獻1)。此情況，在焊錫凸塊的表面形成有凹部 〇 但，焊錫凸塊必須接觸於半導體積體電路上的所定電 極，而與彼電性連接，且爲了判定焊錫凸塊本身的良否， 而必須對其測定表面照射光，藉由該反射光來測定其高度 ，因此較理想是不傷及焊錫凸塊的測定表面。若在焊錫凸 -5- 200804820 (3) 塊的表面有如凹部那樣的缺陷，則爲了將電子零件固定於 其表面，在使焊錫凸塊溶融時，有可能在焊錫凸塊内發生 空孔（void)。 於是，例如在專利文獻1中，是藉由外觀檢查等來使 ' 形成凹部者的數量減少。 - 並且，如圖6所示，使用與形成於被檢查基板6 0上的 焊錫凸塊6 1接觸的端部面爲形成比較平坦之探針6 7。 【發明內容】 (發明所欲解決的課題） 在圖6所示那樣的平坦接觸面，僅按壓焊錫凸塊61的 表面，將無法弄破形成於其表面上的氧化膜，因此探針67 與凸塊6 1的導通接觸狀態不良。 於是，必須不傷及焊錫凸塊的測定表面，弄破除此以 外表面上的氧化膜，藉此使探針與凸塊的導通接觸狀態形 φ 成良好。 (用以解決課題的手段） 本發明之檢查夾具的特徵係具備： 探針，其係一方的端部會接觸於被檢查基板中所被設 置的焊錫凸塊，另一方的端部會接觸於檢查被檢查基板的 檢查裝置的電極部；及 保持手段，其係保持該探針， 且，探針的一方端部具有角部，探針的角部會抵接於 -6 - 200804820 (4) 焊錫凸塊的表面曲面。 本發明之檢查夾具的特徵係具備： 探針，其係一方的端部會接觸於被檢查基板中所被設 置的焊錫凸塊，另一方的端部會接觸於檢查被檢查基板的 ^ 檢查裝置的電極部；及 W 保持手段，其係保持該探針， 且，探針具有側面部及底面部，該探針的側面部及底 φ 面部會同時抵接於焊錫凸塊的表面曲面。 又，本發明之檢查夾具的特徵係具備： 探針’其係一方的端部會接觸於被檢查基板中所被設 置的焊錫凸塊，另一方的端部會接觸於檢查被檢查基板的 檢查裝置的電極部；及 保持手段，其係保持該探針， 且，爲了藉由光學性測定裝置來測定上述焊錫凸塊高 度’上述探針會抵接於必要的測定表面以外的表面（表面 φ 曲面）。 此外，探針可爲形成圓柱狀，保持手段具有引導孔， 探針會被引導於該引導孔内而移動，藉此，探針的角.部會 抵接於焊錫凸塊的表面曲面。 又，本發明之檢查夾具的特徵係具備：接觸於設定在 被檢查基板的配線圖案上的所定焊錫凸塊，使用於從該焊 錫凸塊往被檢查對象的配線圖案之電流施加用或該配線圖 案的電壓測定用之探針， 且，更具備保持探針的保持手段， 200804820 (5) 該保持手段係使探針保持於：探針之焊錫凸塊的抵接 部會從通過焊錫凸塊的頭頂部的鉛直方向軸線來錯開於短 軸方向之位置。 又，探針可形成圓柱狀，保持手段係使探針從通過焊 ^ 錫凸塊的頭頂部的鉛直方向軸線至少錯開探針的半徑距離 ' 而保持。 又，本發明之檢查裝置的特徵係具備：接觸於設定在 φ 被檢查基板的配線圖案上的所定焊錫凸塊，使用於從該焊 錫凸塊往被檢查對象的配線圖案之電流施加用或該配線圖 案的電壓測定用之探針， 且，更具備： 保持手段，其係使探針保持於：探針的長度方向軸線 會從通過焊錫凸塊的頭頂部的鉛直方向軸線來錯開於短軸 方向之位置；及 引導手段，其係以保持於該保持手段的探針能夠接觸 φ 於焊錫凸塊的表面之方式來引導。 又，本發明之檢查方法的特徵係由電性檢查階段及光 學性檢查階段所構成之檢查方法， 該電性檢查階段，係利用具備探針的檢查夾具來檢查 被檢查基板的配線圖案的導通或短路，該探針係接觸於設 定在被檢查基板的配線圖案上的所定焊錫凸塊，使用於從 該焊錫凸塊往被檢查對象的配線圖案之電流施加用或該配 線圖案的電壓測定用；及 光學性檢查階段，其係利用光學測定裝置來對焊錫凸 -8- 200804820 (6) 塊的測定表面照射光，根據來自該測定表面的反射光來測 定焊錫凸塊的高度，而判定該焊錫凸塊的良否， 且，電性檢查階段係使探針在焊錫凸塊的測定表面以 外的表面曲面的位置令該探針接觸。 * [發明的效果] 若利用本發明，則因爲是使探針接觸於焊錫凸塊的頭 φ 頂部或測定表面以外的面，藉由探針的前端角部來進行該 接觸，所以可提供一種不在傷及探針的前端角部下藉由探 針的前端角部來弄破焊錫凸塊的其他表面的氧化膜，藉此 良好地保持探針與焊錫凸塊的導通接觸狀態之檢查夾具。 由於不傷及焊錫凸塊的頭頂部、測定表面，因此可提 供一種爲了將電子零件固定於其頭頂部或測定表面，而使 焊錫凸塊溶融時，不會有在焊錫凸塊内產生空孔（void)的 情況之檢查夾具。 φ 並且，可提供一種利用如此的檢查夾具之檢查裝置及 檢查方法。 【實施方式】 [檢查夾具的構造] 圖1 ( a)是表示本發明之一實施例的檢查夾具1 〇的側面 圖。檢查夾具1 0是具備平板1 2、座板1 4及基台1 6。平板1 2 、座板14及基台16是由樹脂材料等的絶緣材料所構成的板 狀構件。座板1 4是被安裝於基台1 6下方的面，平板1 2是被 200804820 (7) 固定於支持棒1 5的一方端部，該支持棒1 5的另一端會被固 定於座板1 4。並且，導板1 3會在平板1 2與座板1 4之間貫通 支持棒15而被固定著。 在平板12中，對應於被檢查基板2〇(圖1(b))的配線圖 * 案上的被檢查點之位置設有貫通孔12a。探針17會被插通 ' 於該貫通孔12a，探針的前端部17a會從平板12突出。對應 於該貫通孔12a，在導板13及座板14分別形成有貫通孔13a φ 及14a，探針17會插通於該等中。導板13是使相通於貫通 孔1 3 a的探針1 7之測定時的彎曲方向一致。 在基台16中，對應於座板14中所設置的貫通孔14a之 位置埋入電極16 a，且探針17的前端部17a的相反側的端部 會被固定於此。 探針1 7，例如可使用由不繡鋼所構成之具有彈性的鋼 琴線等。 在被檢查基板2 0的檢查時，檢查夾具1 0是被安裝於所 φ 定的基板檢查裝置的保持部（未圖示）。基板檢查裝置是以 使探針能夠適當地接觸於被檢查基板的配線圖案上的被檢 查點之方式，移動被檢查基板，或將檢查用的電流供給至 探針，或計測在所定的探針間發生的電位差，而來進行被 檢查基板的配線圖案的狀態之判定。 圖1(b)是表示進行基板的檢查時之檢查夾具10與被檢 查基板20的位置關係。如該圖所示，在檢查夾具10的平板 12下方配置有被檢查基板20。被檢查基板20在對向於平板 1 2的一側形成有配線圖案的被檢查點。 -10- 200804820 (8) 圖2是表示在圖1(b)中，對向之平板12與被檢查基板 20的部份擴大圖。如圖2所示，從平板12的貫通孔12a突出 有探針1 7的前端部1 7 a，在其對向的位置配置有焊錫凸塊 21。焊錫凸塊21是經由焊墊2〇來電性連接至被檢查基板20 ’ 的配線圖案。 ' 在檢查時，詳細如後述般，在形成於被檢查基板2 0的 配線圖案上之焊錫凸塊2 1的表面上的所定位置，使從平板 φ 12的貫通孔12a(圖1)突出的探針17的前端部17a接觸。其 次，在該狀態下，從基板檢查裝置（未圖示）經由基台16内 的電極1 6a來供給電流至接觸於焊錫凸塊2〗的探針〗7。然 後，測定接觸於測定用的其他兩個焊錫凸塊之其他兩個探 針1 7的兩者間的電位差。將該測定後的電位差的資料傳送 至基板檢查裝置，在此，由該電位差的資料來求取所定的 焊錫凸塊間的配線圖案的電阻値，而來判定配線圖案的導 通良否或短路的有無。 [焊錫凸塊的形成槪要] 焊錫凸塊2 1的形成方法有各式各樣的方法。例如有利 用以電鍍法或蒸著法來形成的焊錫膜之方法、將焊錫球搭 載於電極上之方法、利用印刷後的糊焊錫（焊錫膏）之方法 、利用金屬噴射之方法等。藉由該等方法的其中之一來設 於電極上的焊錫層或焊錫球是被加熱於回流爐而暫時溶融 。由於如此形成的焊錫流動體會藉由表面張力而形成大略 球狀，因此就那樣使冷却凝固，可取得大略球狀的焊錫凸 -11- 200804820 (9) 塊。焊錫凸塊21 —般是由Sn、Pb等所作成。 [探針與焊錫凸塊的位置關係] 圖3是表示在測定被檢查基板時，探針1 7接觸於焊錫 ' 凸塊2 1的狀態。在此，探針1 7爲大略圓柱狀者，焊錫凸塊 ' 2 1爲非印壓的大略球形狀。該等的接觸是藉由使檢查夾具 1〇(圖1)接近於被檢查基板20(圖1)、或相反的使被檢查基 φ 板20接近於檢查夾具10，在圖3中是使探針17下降，藉此 使其前端部1 7a衝突於焊錫凸塊2 1來達成。 爲了那樣地使探針1 7下降，而以探針1 7的長度方向軸 線1 7 m能夠通過離開通過焊錫凸塊的頭頂部2 1 a的錯直方 向的軸線2 1 η只距離p的位置之方式，利用未圖示的引導裝 置來使探針17移動。藉此，可避免探針17的前端部17a衝 突於焊錫凸塊的頭頂部2 1 a。換言之，使探針1 7的前端部 1 7a與焊錫凸塊2 1的頭頂部以外的面接觸。 φ 另外，此情況，最好距離P是比探針1 7的短軸方向的 半徑更大。但，該距離P必須比焊錫凸塊2 1的半徑大小加 上探針1 7的短軸方向的半徑大小的値更小。 並且，探針1 7在此實施例中爲圓柱形狀，具有側面 17d及位於前端部17a的底面17c。探針17係其底面17c爲形 成平坦的圓形狀，在周圍具有角部17b。因此，其角部17b 的一部份會少許陷入焊錫凸塊2 1的面，而側面及底面會同 時接觸於焊錫凸塊2 1的曲面。之所以如此地角部1 7b陷入 ，如上述般，是因爲焊錫凸塊21—般由Sn、Pb等所作成， -12- 200804820 (10) 因此比起探針1 7的不繡鋼較爲柔軟。 探針17的前端部17a的角部17b的一部份在衝突於焊錫 凸塊2 1的曲面而陷入時，該角部1 7b是碰撞於焊錫凸塊的 曲面一部份，一邊摩擦該曲面，一邊少許切削焊錫凸塊21 。因此，可藉由角部1 7b與焊錫凸塊的曲面之間的剪斷應 力來確實地弄破形成於焊錫凸塊2 1表面的氧化膜。 開始檢查之前，改變檢查裝置（未圖示）的設定内容’ 錯開被檢查基板20的位置或錯開檢查夾具10的位置，藉此 可錯開被檢查基板20與檢查夾具10的相對水平方向的位置 關係，若由此使探針1 7下降，則可改變探針1 7的前端部 17 a與焊錫凸塊21的衝突位置。藉此，可改變探針17的前 端部17a的角部17b陷入焊錫凸塊21的曲面時所形成的缺陷 位置或形狀或大小。 其結果，探針17與焊錫凸塊21的接觸面積會改變，氧 化膜的破決大小會改變，因此探針1 7與焊錫凸塊2 1之間的 接觸電阻値會改變。藉由利用此接觸電阻値的大小不同， 可事先特定探針1 7與焊錫凸塊2 1的接觸預定位置。 又，圖3是表示位於由焊錫凸塊2 1的中心以一點鎖線 所包圍的一定角度内之測定表面3 0。該測定表面3 0是相當 於爲了判定焊錫凸塊2 1的良否，而藉由光學顯微鏡（未圖 示）來測定的部位。此測定是利用探針1 7來對被檢查基板 20進行電性檢查之後，進行光學性檢查。 必須光學性檢查的理由如其次所述。焊錫凸塊2 1必須 接觸於半導體積體電路上的所定電極，而與電性連接。因 -13- 200804820 (11) 此，例如若焊錫凸塊2 1的高度高於或低於所定的高度’則 會導致半導體積體電路上的所定電極中有幾個無法與焊錫 凸塊適當地接觸。又，若與半導體積體電路上的所定電極 接觸的預定焊錫凸塊的所定表面有缺陷，則其表面也會無 ^ 法與半導體積體電路上的所定電極適當地接觸。如此，焊 • 錫凸塊2 1的測定表面3 0爲形成接觸於半導體積體電路上的 所定電極的表面。因此，必須判定該表面的良否’藉由光 φ 學性檢查來進行。例如，焊錫凸塊2 1的半徑約爲40μηι ’ 利用短軸方向的距離（剖面方向的直徑）約爲5μηι的光射束 來進行光學檢查時，大多是以焊錫凸塊21之約7度〜8度的 角度範圍的表面曲面作爲測定表面30來進行測定，較理想 是以最大約30度的角度範圍的表面曲面作爲測定表面30來 進行測定。 若利用圖3所示的實施例，則可使探針17前端部17a與 該焊錫凸塊2 1的測定表面30以外的表面接觸，因此可不傷 φ 及其測定表面3 0，該探針前端的角部1 7b所接觸的表面的 氧化膜可藉由其角部17b來弄破。 [其他的實施例] 圖4(a)是表示在對被檢查基板20的配線圖案進行例如 四端子測定法時，使一對的電流供給用探針4 7及電壓測定 用探針4 8接觸於焊錫凸塊2 1的狀態之槪略側面圖。另外， 電流供給用探針47及電壓測定用探針48的位置爲便於説明 者’亦可爲相反。並且，圖4(a)是表示電流供給用探針47 -14 - 200804820 (12) 及電壓測定用探針48分別少許陷入焊錫凸塊2 1的一部份表 面中的狀態。 圖4(b)是由正面來看檢查夾具（未圖示）時所能見的平 板42。平板42是相當於圖3的實施例之檢查夾具1 0的平板 ^ 12。如圖4(b)所示，電流供給用探針47及電壓測定用探針 * 48會在成對的狀態下從平板42突出。各對的電流供給用探 針47及電壓測定用探針48所被設置的位置是對應於被檢查 ^ 基板的配線圖案上的焊錫凸塊所被形成的位置。 圖5(a)是表示如圖4(a)所示那樣電流供給用探針47及 電壓測定用探針48分別少許陷入焊錫凸塊2 1的一部份表面 的狀態之立體圖。 圖5(b)是表示如圖4(a)所示那樣電流供給用探針47及 電壓測定用探針48分別少許陷入焊錫凸塊2 1的一部份表面 之後，除掉該等的探針47、48，從該等的探針側所見焊錫 凸塊2 1的狀態。如該圖所示，電流供給用探針47及電壓測 φ 定用探針48的各前端部47a及48a的各角部47b及48b的一部 份會在焊錫凸塊2 1的表面一部份殘留缺陷5 7及5 8。 探針47及48爲大略圓柱狀者，該等的前端部47a及48a 與焊錫凸塊2 1的接觸是與圖3的情況同樣，使未圖示的檢 查夾具接近被檢查基板，或相反地使被檢查基板接近檢查 夾具，藉此於圖4中，使探針47及48下降，而令其前端部 47a及48a衝突於焊錫凸塊21來達成。 在圖4(a)所示的情況中，使探針47及48下降時，是令 探針47的長度方向軸線47m及探針48的長度方向軸線48m -15- 200804820 (13) 偏離通過焊錫凸塊的頭頂部21a的鉛直方向的軸線21η —*距 離s及r。藉此，可迴避探針47及48的前端部47a及48a與焊 錫凸塊的頭頂部21 a衝突。換言之，藉由未圖示的引導裝 置等來引導探針47及48的前端部47a及48a，而使能夠與焊 • 錫凸塊2 1的頭頂部以外的面接觸。 * 另外，此實施例的情況，是距離s及r可相同或相異， 無論那個距離皆是比探針47及48的各個短軸方向的半徑更 φ 大，另一方面，必須比焊錫凸塊2 1的半徑大小加上探針47 及4 8的各個短軸方向的半徑大小的値更小。 在圖4及圖5所示之實施例的檢查開始前，亦與圖3的 實施例同樣，改變檢查裝置（未圖示）的設定内容，錯開被 檢查基板20的位置或錯開檢查夾具的位置，藉此可錯開被 檢查基板2 0與檢查夾具的相對水平方向的位置關係。若在 該狀態下使探針47及48下降，則探針47及48的前端部47a 及4 8a與焊錫凸塊21的衝突位置會被變更，而使得能夠改 φ 變探針47及48的前端部47a及48 a的角部47b及4 8b衝突於焊 錫凸塊2 1的曲面時所被形成的缺陷5 7及5 8的位置或大小或 形狀。 其結果，在此實施例中，也是探針47及48與焊錫凸塊 2 1的接觸面積會改變，氧化膜的破缺大小會改變，因此探 針47及48與焊錫凸塊21之間的接觸電阻値會改變。藉由利 用此接觸電阻値的大小不同，可事先特定探針47及48與焊 錫凸塊2 1的衝突預定的位置。 又，如圖4(a)、圖5(a)及圖5(b)所示，在此實施例中 -16- 200804820 (14) ，焊錫凸塊21上的測定表面30是位於探針47的前端部47a 與探針48的前端部48a所接觸的位置之間’藉由探針47及 48的前端部47a及48a，可不傷及測定表面30° 以上是說明有關本發明的檢查夾具、檢查裝置及方法 ^ ，但本發明並非限於該等的實施形態。該當業者所容易思 * 及的追加·削除·變更·改良等爲本發明所包含。本發明的 技術範圍是根據申請專利範圍的記載而定。 [各實施例的特徴] [往表面曲面的抵接] 如圖1乃至圖3所示，本發明的檢查夾具1 0是具備： 探針17，其係一方的端部17a接觸於被檢查基板20中 所被設置的焊錫凸塊2 1，另一方的端部接觸於檢查被檢查 基板20的檢查裝置的電極部16a ;及 保持手段1 2，1 3，1 4，其係保持該探針。 φ 如圖3所示，探針17的一方端部17a具有角部17b，探 針1 7是其角部1 7b會抵接於焊錫凸塊2 1的表面曲面。 在圖4及圖5所示的實施例時，本發明的檢查夾具10是 具備：一方的端部47a，48a會接觸於被檢查基板20中所被 設置的焊錫凸塊2 1，另一方的端部會接觸於檢查被檢查基 板20的檢查裝置的電極部16a之2根的探針47，48、及保持 該等的探針47，48之保持手段42，且探針47，48的一方端 邰47a’ 48a具有角部47b，48b，如圖4a所示，探針47，48 是該等的角部47b，4 8b會同時（或分別）抵接於焊錫凸塊21 -17- 200804820 (15) 的表面曲面。 [側面部及底面部的同時抵接] 如圖1乃至圖3所示，本發明的檢查夾具丨〇是具備：一 方的端部17a會接觸於被檢查基板20中所被設置的焊錫凸 塊2 1 ’另一方的端部會接觸於檢查被檢查基板2 〇的檢查裝 置的電極部16a之探針17、及保持該探針17之保持手段12 。探針1 7具有側面部1 7 d及底面部1 7 c，如圖3所示，該探 針1 7在接觸於焊錫凸塊2 1時，其側面部1 7 d及底面部1 7 c會 同時抵接於焊錫凸塊2 1的表面曲面。 在圖4及圖5所不的實施例時，本發明的檢查夾具1〇是 具備··一方的端部47a，4 8a會接觸於被檢查基板20中所設 置的焊錫凸塊2 1，另一方的端部會接觸於檢查被檢查基板 20的檢查裝置的電極部16a之2根的探針47，48、及保持該 等的探針47，48之保持手段42。探針47，48是具有側面部 及底面部，如圖4 a所示，當該等的探針接觸於焊錫凸塊2 j 時，各探針47，48的側面部與底面部會同時抵接於焊錫凸 塊2 1的表面曲面。 [往測定表面以外的表面曲面之抵接] 如圖1乃至圖3所示，本發明的檢查夾具10是具備：一 方的端部1 7 a會接觸於被檢查基板2 0中所被設置的焊錫凸 塊2 1，另一方的端部會接觸於檢查被檢查基板2 0的檢查裝 置的電極部16a之探針17、及保持該探針17之保持手段12 -18- 200804820 (16) 。如圖3所示，當探針1 7接觸於焊錫凸塊2 1的表面時，爲 •了藉由光學性測定裝置來測定焊錫凸塊2 1高度’探針1 7是 抵接於必要的測定表面3 0以外的表面（表面曲面）。 在圖4及圖5所示的實施例時，本發明的檢查夾具1〇是 . 具備：一方的端部47a，48a會接觸於被檢查基板20中所設 • 置的焊錫凸塊2 1，另一方的端部會接觸於檢查被檢查基板 20的檢查裝置的電極部16a之2根的探針47，48、及保持該 φ 等的探針之保持手段42。如圖4a所示，當探針47，48接觸 於焊錫凸塊2 1的表面時，爲了藉由光學性測定裝置來測定 焊錫凸塊21高度，探針47，4 8是抵接於必要的測定表面30 以外的表面（表面曲面）。 探針17(47，4 8)可形成圓柱狀，保持手段12(13，14) 具有引導孔13a，探針17(47，48)會被引導移動於該引導 孔内，藉此，探針17(47，48)的角部17b(47b，48b)會抵接 於焊錫凸塊2 1的表面曲面。 [往短軸方向的錯開保持] 如圖1乃至圖3所示，本發明的檢查夾具1 〇是具備：接 觸於設定在被檢查基板20的配線圖案上的所定焊錫凸塊21 ，使用於從焊錫凸塊2 1往被檢查對象2 0的配線圖案之電流 施加用或配線圖案的電壓測定用之探針1 7、及保持該探針 1 7之保持手段1 2。該保持手段是使探針1 7保持於：探針1 7 之焊錫凸塊2 1的抵接部會從通過焊錫凸塊2 1的頭頂部2 1 a 的鉛直方向軸線2 1 η來錯開於短軸方向之位置，因此如圖3 -19- 200804820 (17) 所示，當探針17接觸於焊錫凸塊時，探針17的端部17a的 角部1 7b會抵接於焊錫凸塊2 1的表面曲面。 在圖4及圖5所示的實施例時，本發明的檢查夾具10是 具備：接觸於設定在被檢查基板20的配線圖案上的所定焊 ' 錫凸塊2 1，使用於從焊齒凸塊2 1往被檢查對象20的配線圖 • 案之電流施加用或配線圖案的電壓測定用之一對的探針47 ，48、及保持該等的探針之保持手段42。由於該保持手段 ^ 是使探針47，48保持於：探針47，48之焊錫凸塊21的抵接 部會從通過焊錫凸塊2 1的頭頂部2 1 a的鉛直方向軸線2 1 η來 錯開於短軸方向之位置，因此如圖4a所示，當探針47，48 接觸於焊錫凸塊21時，探針47，48的端部47a、4 8a的角部 47b、4 8b可抵接於焊錫凸塊21的表面曲面。 探針17(47，48)可形成圓柱狀，或保持手段12(13， 14)可使探針17(47，4 8)從通過焊錫凸塊21的頭頂部21a的 鉛直方向軸線2 In至少錯開探針1 7(47，48)的半徑距離而 塵 保持。 [檢查裝置] 本發明的檢查裝置是具備：接觸於設定在被檢查基板 20的配線圖案上的所定焊錫凸塊21，使用於從該焊錫凸塊 往被檢查對象的配線圖案之電流施加用或配線圖案的電壓 測定用之探針17(47，48)。又，另外本發明的檢查裝置是 具備：使探針1 7 (4 7 ’ 4 8 )從通過焊錫凸塊2 1的頭頂部2 1 a 的鉛直方向軸線21η來錯開探針17(47，48)的長度方向軸 -20- 200804820 (18) 線17m(47m，48m)於短軸方向的位置之保持手段12(13， 14)、及以使保持於該保持手段的探針17(47，4 8)能夠接 觸於焊錫凸塊21的表面之方式來引導的引導手段，該引導 手段，如圖3及圖4 a所示，當探針1 7 (4 7，4 8 )接觸於焊錫 凸塊21時，是以探針17(47，48)的端部17a(47a、48a)的角 部17b(4 7b、4 8b)能夠抵接於焊錫凸塊21的表面曲面之方 式來引導該等的探針。 [檢查方法] 本發明的檢查方法是使用具備探針17(47，48)的檢查 夾具10，該探針17 (47，48)是接觸於設定在被檢查基板20 的配線圖案上的所定焊錫凸塊2 1，使用於從該焊錫凸塊往 被檢查對象的配線圖案之電流施加用或配線圖案的電壓測 定用。利用該檢查夾具來進行檢查被檢查基板2 0的配線圖 案的導通或短路之電性檢查階段。並且，本發明的檢查方 法是包含利用光學測定裝置來對焊錫凸塊2 1的測定表面3 0 照射光，根據來自該測定表面的反射光來測定焊錫凸塊2 1 的高度，而判定該焊錫凸塊的良否之光學性檢查階段。例 如，焊錫凸塊2 1的半徑約爲40 μηι，利用短軸方向的距離（ 剖面方向的直徑）約爲5 μιη的光射束來進行光學性檢查時， 大多是以焊錫凸塊21之約7度〜8度的角度範圍的表面曲面 作爲測定表面30來進行測定，較理想是以最大約30度的角 度範圍的表面曲面作爲測定表面30來進行測定。因此，在 電性檢查階段，如圖3及圖4a所示，是使探針17(47，48) -21- 200804820 (19) 在焊錫凸塊2 1的測定表面3 0以外的表面曲面的位置令該探 針接觸。 【圖式簡單說明】 ' 圖1(a)及圖1(b)是表示本發明的第一實施形態的檢查 夾具的槪略側面圖。 圖2是表示圖1所示之本發明的第一實施形態的部份擴 大圖。 圖3是表示利用本發明的第一實施形態的檢查夾具來 進行被檢查基板的配線圖案之檢查時，其檢查夾具的探針 與被檢查基板的配線圖案上的焊錫凸塊的關係之槪略側面 圖。 圖4(a)是表示利用本發明的其他實施例的檢查夾具來 進行被檢查基板的配線圖案之檢查時，其檢查夾具的探針 與被檢查基板的配線圖案上的焊錫凸塊的關係之槪略側面 • 圖。 圖4(b)是表示該檢查夾具的平板之部份正面圖。 圖5(a)是表示利用圖4(a)所示之本發明的其他實施例 * 的檢查夾具來進行被檢查基板的配線圖案之檢查時，其檢 ' 查夾具的探針與被檢查基板的配線圖案上的焊錫凸塊的關 係之槪略側立體圖。 圖5(b)是表示利用圖4(a)所示之本發明的其他實施例 的檢查夾具來進行被檢查基板的配線圖案之檢查時，其檢 查夾具的探針與被檢查基板的配線圖案上的焊錫凸塊的關 -22- (20) (20)200804820 係之槪略側正面圖。 圖6是表示利用以往的檢查夾具來進行被檢查基板的 配線圖案之檢查時，其檢查夾具的探針與被檢查基板的配 線圖案上的焊錫凸塊的關係之槪略側面圖。 【主要元件符號說明】 10 :檢查夾具 1 2 :平板 12a，13a，14a ：貫通孑L 1 3 :導板 1 4 :座板 1 5 :支持棒 1 6 :基台 17， 47， 48:探針 20 :被檢查基板 2 1 :焊錫凸塊 3 0 :測定表面 17m，47m，48m:軸線 17b， 47b， 48b ：角部 -23 -[Technical Field] The present invention relates to an inspection jig having a probe and an inspection apparatus and an inspection method using the same, the probe being in contact with a substrate set to be inspected The predetermined solder bumps on the wiring pattern are used for current application from the solder bumps to the wiring pattern to be inspected, or for voltage measurement of the wiring patterns. Φ Further, the present invention is not limited to a printed wiring board, and can be applied to, for example, a flexible substrate, a multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a package substrate for a semiconductor package, or a film carrier. In the inspection of the electrical wiring of the substrate, in the detailed description, the various wiring substrates are collectively referred to as "substrate". [Prior Art] In order to accurately transmit electrical signals to electrical and electronic components such as semiconductors or resistors such as 1C mounted on the circuit board, it is necessary to measure the electrical and electronic components before mounting the electrical and electronic components. In a printed wiring board, a circuit board in which a wiring pattern is formed in a liquid crystal panel or a plasma display panel, or a resistor 値 between predetermined check points provided in a wiring pattern of a substrate such as a semiconductor wafer, the quality is improved. determination. Specifically, it is determined whether the current supply terminal and/or the voltage measurement terminal are in contact with each of the inspection points, and the measurement current is supplied to the inspection point from the current supply terminal, and the measurement is in contact with the inspection. Point of electricity -4- 200804820 (2) The voltage generated between the terminals for measurement is performed. In addition, in order to suppress the influence of the contact resistance between the measurement terminal and the inspection point, the resistance 値' is measured with high precision, and the pair of current supply terminals and the voltage measurement terminal are brought into contact with each inspection point. A method of determining the quality of the wiring generated between the terminals for voltage measurement that are abutted between the current supply terminals, and measuring the quality of the wiring pattern (so-called 4-terminal measurement method or opening) The Kelvin method is known. φ In the " flip chip bonding method" using solder bumps, generally, a spherical solder bump is formed on an electrode (bond pad) of a bare chip (LSI) of a semiconductor integrated circuit (LSI), that is, Solder bumps are bonded to the electrodes corresponding to the mounting substrate, thereby electrically connecting the bonding pads of the bare wafer to the electrodes corresponding to the mounting substrate, and fixing the bare wafer to the mounting substrate. Such a technique is also used for mounting or bonding of other electronic components or electronic components other than bare wafers. In this case, the solder bumps are formed on the land of the mounting substrate or the electrode of the electronic component. . [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-2005 No. JP-A No. 2000-2005 No. JP-A---------- In this case, a recess is formed on the surface of the solder bump. However, the solder bump must be in contact with the predetermined electrode on the semiconductor integrated circuit, and is electrically connected to it, and in order to determine whether the solder bump itself is good or not, it must be Since the surface irradiation light is measured and the height is measured by the reflected light, it is preferable that the measurement surface of the solder bump is not damaged. If there is a defect such as a concave portion on the surface of the solder bump-5-200804820 (3), in order to fix the electronic component to the surface, when the solder bump is melted, voids may occur in the solder bump (void ). Then, for example, in Patent Document 1, the number of persons forming the concave portion is reduced by visual inspection or the like. Further, as shown in Fig. 6, the end face which is in contact with the solder bumps 61 formed on the substrate to be inspected 60 is used to form a relatively flat probe 61. SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) In the flat contact surface as shown in FIG. 6, only the surface of the solder bump 61 is pressed, and the oxide film formed on the surface thereof cannot be broken, so the probe 67 and The conduction contact state of the bumps 61 is poor. Therefore, it is necessary to break the measurement surface of the solder bump and break the oxide film on the outer surface, whereby the conductive contact state of the probe and the bump is good. (Means for Solving the Problem) The inspection jig of the present invention is characterized in that the probe has one end portion that is in contact with the solder bump provided in the substrate to be inspected, and the other end portion is in contact with An electrode portion of the inspection device for inspecting the substrate to be inspected; and a holding means for holding the probe, and one end portion of the probe has a corner portion, and the corner portion of the probe abuts on -6 - 200804820 (4) The surface curvature of the solder bump. The inspection jig of the present invention is characterized in that: the probe has one end that comes into contact with the solder bump provided in the substrate to be inspected, and the other end portion is in contact with the inspection device for inspecting the substrate to be inspected. And the W holding means for holding the probe, wherein the probe has a side surface portion and a bottom surface portion, and the side surface portion and the bottom surface portion of the probe are simultaneously abutted against the surface curved surface of the solder bump. Further, the inspection jig of the present invention is characterized in that: the probe's one end portion is in contact with the solder bump provided in the substrate to be inspected, and the other end portion is in contact with the inspection of the inspected substrate. An electrode portion of the device; and a holding means for holding the probe and measuring the height of the solder bump by the optical measuring device. The probe abuts on a surface other than the required measurement surface (surface φ Surface). Further, the probe may be formed in a cylindrical shape, and the holding means has a guiding hole, and the probe is guided to move in the guiding hole, whereby the corner portion of the probe abuts against the surface curved surface of the solder bump. Moreover, the inspection jig of the present invention is characterized in that it is provided with a predetermined solder bump that is in contact with a wiring pattern set on the substrate to be inspected, and is used for current application or wiring for the wiring pattern to be inspected from the solder bump. The probe for voltage measurement of the pattern, and the holding means for holding the probe, 200804820 (5) The holding means holds the probe: the abutment portion of the solder bump of the probe passes through the solder bump The vertical axis of the top of the head is staggered in the direction of the short axis. Further, the probe may be formed in a cylindrical shape, and the holding means is such that the probe is held at least by the radial distance of the probe from the vertical axis of the tip of the solder bump. Moreover, the inspection apparatus of the present invention is characterized in that it is provided with a predetermined solder bump that is in contact with a wiring pattern set on the φ substrate to be inspected, and is used for current application from the solder bump to the wiring pattern of the object to be inspected. The probe for measuring the voltage of the wiring pattern further includes: a holding means for holding the probe such that the longitudinal axis of the probe is shifted from the vertical axis passing through the top of the solder bump to the short axis a position of the direction; and a guiding means for guiding the probe held by the holding means so as to be in contact with the surface of the solder bump. Further, the inspection method of the present invention is characterized in that it is an inspection method including an electrical inspection stage and an optical inspection stage, and the inspection of the wiring pattern of the substrate to be inspected is performed by an inspection jig provided with a probe. Or a short circuit, the probe is in contact with a predetermined solder bump set on the wiring pattern of the substrate to be inspected, and is used for current application from the solder bump to the wiring pattern to be inspected or for voltage measurement of the wiring pattern. And an optical inspection step of irradiating the measurement surface of the solder bump-8-200804820 (6) block with an optical measuring device, and measuring the height of the solder bump based on the reflected light from the measurement surface, and determining the height Whether the solder bumps are good or not, and the electrical inspection stage is such that the probe contacts the probe at a position of a surface curved surface other than the measurement surface of the solder bump. [Effects of the Invention] According to the present invention, since the probe is brought into contact with the top of the head φ of the solder bump or the surface other than the measurement surface, the contact is made by the tip end corner of the probe, so that a contact can be provided. The inspection jig of the other surface of the solder bump is broken by the tip end corner of the probe without hurting the tip end corner of the probe, thereby maintaining the inspection jig in which the probe and the solder bump are in conduction contact. Since the top of the solder bump and the measuring surface are not damaged, it is possible to provide a hole in the solder bump when the solder bump is melted in order to fix the electronic component to the top of the head or the measuring surface. Check fixture for the case of (void). φ Also, an inspection apparatus and an inspection method using such an inspection jig can be provided. [Embodiment] [Configuration of inspection jig] Fig. 1 (a) is a side view showing an inspection jig 1 of an embodiment of the present invention. The inspection jig 10 is provided with a flat plate 1 2, a seat plate 14 and a base 16 . The flat plate 12, the seat plate 14, and the base 16 are plate-like members made of an insulating material such as a resin material. The seat plate 14 is a surface that is mounted below the base 16 , and the flat plate 12 is fixed to one end of the support bar 15 by the second end of the support bar 15 , and the other end of the support bar 15 is fixed to the seat plate 1 4. Further, the guide plate 13 is fixed to the support rod 15 between the flat plate 12 and the seat plate 14 and is fixed. In the flat plate 12, a through hole 12a is provided at a position on the inspection point corresponding to the wiring pattern of the substrate 2 to be inspected (Fig. 1(b)). The probe 17 is inserted into the through hole 12a, and the distal end portion 17a of the probe protrudes from the flat plate 12. Corresponding to the through hole 12a, through holes 13a and φ and 14a are formed in the guide plate 13 and the seat plate 14, respectively, and the probe 17 is inserted therein. The guide plate 13 is aligned in the direction in which the probes 17 that pass through the through holes 13 3 are measured. In the base 16, the electrode 16a is embedded at a position corresponding to the through hole 14a provided in the seat plate 14, and the end on the opposite side of the front end portion 17a of the probe 17 is fixed thereto. For the probe 17, for example, a flexible steel wire composed of stainless steel or the like can be used. At the time of inspection of the substrate 20 to be inspected, the inspection jig 10 is a holding portion (not shown) attached to the substrate inspection device of the φ. The substrate inspection device moves the substrate to be inspected, or supplies a current for inspection to the probe, or measures the probe at a predetermined point so that the probe can appropriately contact the inspection point on the wiring pattern of the substrate to be inspected. The potential difference generated between the two determines the state of the wiring pattern of the substrate to be inspected. Fig. 1(b) shows the positional relationship between the inspection jig 10 and the substrate to be inspected 20 when the substrate is inspected. As shown in the figure, the substrate to be inspected 20 is disposed under the flat plate 12 of the inspection jig 10. The inspected substrate 20 is formed with a checkpoint of a wiring pattern on the side opposite to the flat plate 12. -10- 200804820 (8) Fig. 2 is a partially enlarged view showing the opposing flat plate 12 and the substrate to be inspected 20 in Fig. 1(b). As shown in Fig. 2, the tip end portion 17a of the probe 17 protrudes from the through hole 12a of the flat plate 12, and the solder bump 21 is disposed at a position opposite thereto. The solder bumps 21 are wiring patterns that are electrically connected to the substrate under inspection 20' via the pads 2'. At the time of inspection, as will be described later, the predetermined position on the surface of the solder bump 2 1 formed on the wiring pattern of the substrate to be inspected 20 is protruded from the through hole 12a (FIG. 1) of the flat plate φ12. The front end portion 17a of the probe 17 is in contact. Next, in this state, a current is supplied from the substrate inspection device (not shown) via the electrode 16a in the base 16 to the probe 7 which is in contact with the solder bump 2. Then, the potential difference between the two other probes 17 contacting the other two solder bumps for measurement was measured. The data of the potential difference after the measurement is transmitted to the substrate inspection device, and the resistance 値 of the wiring pattern between the predetermined solder bumps is obtained from the data of the potential difference, thereby determining whether the wiring pattern is conductive or not, or whether the short circuit is present. . [Formation of Solder Bumps] There are various methods for forming the solder bumps 2 1 . For example, a method of using a solder film formed by an electroplating method or a vapor deposition method, a method of mounting a solder ball on an electrode, a method of using a paste solder after soldering (solder paste), a method of spraying by metal, or the like. The solder layer or the solder ball provided on the electrode by one of the methods is temporarily heated by being heated in a reflow furnace. Since the solder flow body thus formed is formed into a substantially spherical shape by the surface tension, the cooling is solidified in this manner, and a substantially spherical solder bump -11-200804820 (9) block can be obtained. The solder bumps 21 are generally made of Sn, Pb, or the like. [Positional Relationship between Probe and Solder Bump] FIG. 3 shows a state in which the probe 17 is in contact with the solder bump 2 when measuring the substrate to be inspected. Here, the probe 17 is a substantially cylindrical shape, and the solder bump '21 is a substantially spherical shape that is not printed. The contact is made by bringing the inspection jig 1 (Fig. 1) close to the substrate 20 to be inspected (Fig. 1), or vice versa, to bring the inspected substrate φ plate 20 close to the inspection jig 10, which is shown in Fig. 3. The needle 17 is lowered, whereby the front end portion 17a is caused to collide with the solder bump 21. In order to lower the probe 17 in such a manner, the axis 1 7 m in the longitudinal direction of the probe 17 can pass the position of the distance 2 1 η away from the axis 2 1 η in the direction of the straight line passing through the tip 2 1 a of the solder bump. In this manner, the probe 17 is moved by a guiding device (not shown). Thereby, the front end portion 17a of the probe 17 can be prevented from protruding against the top portion 2 1 a of the solder bump. In other words, the front end portion 17a of the probe 17 is brought into contact with a surface other than the top of the solder bump 2 1. φ Further, in this case, it is preferable that the distance P is larger than the radius of the short-axis direction of the probe 17. However, the distance P must be smaller than the radius of the solder bump 2 1 plus the radius of the short axis direction of the probe 17. Further, the probe 17 is cylindrical in this embodiment, and has a side surface 17d and a bottom surface 17c at the front end portion 17a. The probe 17 has a bottom surface 17c formed into a flat circular shape and has a corner portion 17b at its periphery. Therefore, a portion of the corner portion 17b is slightly caught in the surface of the solder bump 21, and the side surface and the bottom surface are simultaneously in contact with the curved surface of the solder bump 21. The reason why the corner portion 17b is trapped is as described above, because the solder bump 21 is generally made of Sn, Pb, etc., -12-200804820 (10), therefore, compared with the stainless steel of the probe 17. soft. When a portion of the corner portion 17b of the front end portion 17a of the probe 17 is caught in conflict with the curved surface of the solder bump 21, the corner portion 17b is a part of the curved surface that collides with the solder bump, and rubs the curved surface while rubbing the curved surface. , a little bit of solder bump 21 is cut. Therefore, the oxide film formed on the surface of the solder bump 21 can be surely broken by the shear stress between the corner portion 17b and the curved surface of the solder bump. Before the start of the inspection, the setting content of the inspection device (not shown) is changed. The position of the inspection substrate 20 is shifted or the position of the inspection jig 10 is shifted, whereby the positional relationship between the inspection substrate 20 and the inspection jig 10 in the horizontal direction can be shifted. If the probe 17 is lowered by this, the collision position of the front end portion 17a of the probe 17 and the solder bump 21 can be changed. Thereby, the position or shape or size of the defect formed when the corner portion 17b of the front end portion 17a of the probe 17 is caught in the curved surface of the solder bump 21 can be changed. As a result, the contact area of the probe 17 with the solder bump 21 changes, and the size of the oxide film is changed, so that the contact resistance 探针 between the probe 17 and the solder bump 2 1 changes. By using the magnitude of the contact resistance 値, the predetermined contact position of the probe 17 with the solder bump 2 1 can be specified in advance. Further, Fig. 3 shows the measurement surface 30 located at a certain angle surrounded by a dot lock line by the center of the solder bump 2 1 . The measurement surface 30 is a portion which is measured by an optical microscope (not shown) in order to determine the quality of the solder bumps 2 1 . In this measurement, the optical inspection of the substrate under test 20 is performed by the probe 17 and optical inspection is performed. The reasons why the optical inspection must be performed are as follows. Solder bump 2 1 must be in electrical contact with a predetermined electrode on the semiconductor integrated circuit. Because -13-200804820 (11), for example, if the height of the solder bumps 2 1 is higher or lower than the predetermined height', several of the predetermined electrodes on the semiconductor integrated circuit cannot be properly soldered with the solder bumps. contact. Further, if the predetermined surface of the predetermined solder bump that is in contact with the predetermined electrode on the semiconductor integrated circuit is defective, the surface thereof is not properly contacted with the predetermined electrode on the semiconductor integrated circuit. Thus, the measuring surface 30 of the solder bump 2 1 is a surface which is formed to contact a predetermined electrode on the semiconductor integrated circuit. Therefore, it is necessary to judge whether the surface is good or not 'by the optical φ examination. For example, when the solder bump 2 1 has a radius of about 40 μm, and the optical inspection is performed by a light beam having a distance in the short-axis direction (diameter in the cross-sectional direction) of about 5 μm, most of the solder bumps 21 are about 7 degrees. The surface curved surface of the angular range of 8 degrees is measured as the measurement surface 30, and it is preferable to measure the surface curved surface of the angular range of up to about 30 degrees as the measurement surface 30. According to the embodiment shown in FIG. 3, the tip end portion 17a of the probe 17 can be brought into contact with a surface other than the measuring surface 30 of the solder bump 21, so that the probe front end can be prevented without damaging φ and its measuring surface 30. The oxide film of the surface contacted by the corner portion 17b can be broken by the corner portion 17b. [Other Embodiments] FIG. 4(a) shows a case where a pair of current supply probes 47 and voltage measuring probes 48 are brought into contact when a wiring pattern of the substrate 20 to be inspected is subjected to, for example, a four-terminal measurement method. A schematic side view of the state of the solder bump 2 1 . Further, the positions of the current supply probe 47 and the voltage measuring probe 48 are for convenience of explanation. Further, Fig. 4 (a) shows a state in which the current supply probes 47 - 14 - 200804820 (12) and the voltage measuring probes 48 are slightly caught in a part of the surface of the solder bump 2 1 . Fig. 4 (b) is a flat plate 42 which can be seen when the inspection jig (not shown) is viewed from the front. The flat plate 42 is a flat plate ^ 12 corresponding to the inspection jig 10 of the embodiment of Fig. 3 . As shown in Fig. 4 (b), the current supply probe 47 and the voltage measuring probe * 48 protrude from the flat plate 42 in a paired state. The position at which the current supply probe 47 and the voltage measurement probe 48 are provided is a position corresponding to the solder bump formed on the wiring pattern of the substrate to be inspected. Fig. 5 (a) is a perspective view showing a state in which the current supply probe 47 and the voltage measuring probe 48 are slightly caught in a part of the surface of the solder bump 2 1 as shown in Fig. 4 (a). (b) of FIG. 5 is a view showing that after the current supply probe 47 and the voltage measurement probe 48 are slightly caught in a part of the surface of the solder bump 2 1 as shown in FIG. 4( a ), the probes are removed. The needles 47, 48 have the state of the solder bumps 2 1 seen from the probe side. As shown in the figure, a part of each of the corner portions 47b and 48b of each of the tip end portions 47a and 48a of the current supply probe 47 and the voltage measurement φ stator probe 48 is on the surface of the solder bump 2 1 . Residual defects 5 7 and 5 8 . The probes 47 and 48 are substantially cylindrical, and the contact between the distal end portions 47a and 48a and the solder bumps 2 is similar to that of the case of FIG. 3, and an inspection jig (not shown) is brought close to the substrate to be inspected, or vice versa. By bringing the substrate to be inspected close to the inspection jig, the probes 47 and 48 are lowered in FIG. 4, and the front end portions 47a and 48a are caused to collide with the solder bumps 21. In the case shown in Fig. 4 (a), when the probes 47 and 48 are lowered, the longitudinal axis 47m of the probe 47 and the longitudinal axis 48m -15 - 200804820 (13) of the probe 48 are deflected by the solder. The axis 21n of the vertical direction of the top portion 21a of the bump is the distance s and r. Thereby, the distal end portions 47a and 48a of the probes 47 and 48 can be avoided from colliding with the crown portion 21a of the solder bump. In other words, the distal end portions 47a and 48a of the probes 47 and 48 are guided by a guide device or the like (not shown) so as to be in contact with a surface other than the top of the solder bump 2 1 . * In addition, in the case of this embodiment, the distances s and r may be the same or different, regardless of the distance which is larger than the radius of each of the short-axis directions of the probes 47 and 48, and on the other hand, must be stronger than the solder bump The radius of the block 2 1 plus the radius of the radius of each of the short axes of the probes 47 and 48 is smaller. Before the start of the inspection of the embodiment shown in Figs. 4 and 5, similarly to the embodiment of Fig. 3, the setting contents of the inspection device (not shown) are changed, and the position of the substrate to be inspected is shifted or the position of the inspection jig is shifted. Thereby, the positional relationship of the inspected substrate 20 and the inspection jig in the horizontal direction can be shifted. When the probes 47 and 48 are lowered in this state, the collision positions of the distal end portions 47a and 48a of the probes 47 and 48 and the solder bumps 21 are changed, so that the probes 47 and 48 can be changed. The positions, sizes, or shapes of the defects 57 and 58 formed when the corner portions 47b and 48b of the front end portions 47a and 48a collide with the curved surface of the solder bump 2 1 . As a result, in this embodiment, the contact area between the probes 47 and 48 and the solder bumps 2 1 is changed, and the size of the breakage of the oxide film is changed, so that the probes 47 and 48 and the solder bumps 21 are Contact resistance 値 will change. By using the size of the contact resistance 値, the predetermined positions where the probes 47 and 48 collide with the solder bumps 2 can be specified in advance. Further, as shown in FIG. 4(a), FIG. 5(a) and FIG. 5(b), in this embodiment, -16-200804820 (14), the measuring surface 30 on the solder bump 21 is located on the probe 47. Between the positions where the distal end portion 47a and the distal end portion 48a of the probe 48 are in contact with each other, the distal end portions 47a and 48a of the probes 47 and 48 can be used to explain the inspection jig according to the present invention without damaging the measurement surface by 30 or more. Inspection apparatus and method ^, but the invention is not limited to the embodiments. Addition, deletion, alteration, improvement, etc., which are easy for the practitioner to understand, are included in the present invention. The technical scope of the present invention is determined in accordance with the description of the scope of the patent application. [Features of the Embodiments] [Abutment to the Surface Curved Surface] As shown in FIG. 1 to FIG. 3, the inspection jig 10 of the present invention includes a probe 17 whose one end portion 17a is in contact with the substrate to be inspected. The solder bumps 2 1 provided in 20 are in contact with the electrode portion 16a of the inspection device for inspecting the substrate 20 to be inspected; and the holding means 1 2, 1 3, 1 4 are held to hold the probe . φ As shown in Fig. 3, one end portion 17a of the probe 17 has a corner portion 17b, and the probe 17 is a surface curved surface whose corner portion 17b abuts against the solder bump 21. In the embodiment shown in Figs. 4 and 5, the inspection jig 10 of the present invention includes one end portion 47a, 48a which is in contact with the solder bump 2 1 provided in the substrate to be inspected 20, and the other side. The ends are in contact with the probes 47, 48 for inspecting the electrode portions 16a of the inspection device of the substrate 20 to be inspected, and the holding means 42 for holding the probes 47, 48, and one of the probes 47, 48. The end turns 47a' 48a have corner portions 47b, 48b. As shown in Fig. 4a, the probes 47, 48 are the corner portions 47b, and the portions 48b are simultaneously (or separately) abutted against the solder bumps 21 -17 - 200804820 Surface surface of (15). [Abutting the side surface portion and the bottom surface portion simultaneously] As shown in FIG. 1 to FIG. 3, the inspection jig 本 of the present invention includes one end portion 17a that is in contact with the solder bump provided in the substrate under inspection 20 2 1 'The other end is in contact with the probe 17 of the electrode portion 16a of the inspection device for inspecting the substrate 2 to be inspected, and the holding means 12 for holding the probe 17. The probe 17 has a side portion 17 d and a bottom portion 1 7 c. As shown in FIG. 3, when the probe 17 is in contact with the solder bump 2 1 , the side portion 1 7 d and the bottom portion 1 7 c It will simultaneously abut the surface curved surface of the solder bump 2 1 . In the embodiment shown in Figs. 4 and 5, the inspection jig 1 of the present invention is provided with one end portion 47a, which contacts the solder bump 2 provided in the substrate under inspection 20, and One end portion is in contact with the probes 47, 48 for inspecting the electrode portions 16a of the inspection device of the substrate 20 to be inspected, and the holding means 42 for holding the probes 47, 48. The probes 47, 48 have a side portion and a bottom portion. As shown in FIG. 4a, when the probes are in contact with the solder bumps 2j, the side portions and the bottom portions of the probes 47, 48 are simultaneously abutted. The surface curved surface of the solder bump 2 1 is connected. [Abutment of the surface curved surface other than the measurement surface] As shown in FIG. 1 to FIG. 3, the inspection jig 10 of the present invention includes one end portion 17a that is in contact with the inspection substrate 20. The other end of the solder bump 2 1 is in contact with the probe 17 of the electrode portion 16a of the inspection device for inspecting the substrate 20 to be inspected, and the holding means 12 -18-200804820 (16) for holding the probe 17. As shown in FIG. 3, when the probe 17 is in contact with the surface of the solder bump 21, the height of the solder bump 2 1 is measured by an optical measuring device. A surface other than the surface 30 (surface curved surface) was measured. In the embodiment shown in Figs. 4 and 5, the inspection jig 1 of the present invention is provided. One end portion 47a, 48a is in contact with the solder bump 2 1 provided in the substrate to be inspected 20. The other end portion is in contact with the probes 47, 48 for inspecting the electrode portions 16a of the inspection device of the substrate 20 to be inspected, and the holding means 42 for holding the probes such as φ. As shown in FIG. 4a, when the probes 47, 48 are in contact with the surface of the solder bumps 21, in order to measure the height of the solder bumps 21 by the optical measuring device, the probes 47, 48 are abutted as necessary. The surface (surface curved surface) other than the surface 30 was measured. The probe 17 (47, 48) may be formed in a cylindrical shape, and the holding means 12 (13, 14) has a guiding hole 13a into which the probe 17 (47, 48) is guided to be guided, whereby the probe The corner portions 17b (47b, 48b) of 17 (47, 48) abut against the surface curved surface of the solder bumps 2 1 . [Shift-holding in the short-axis direction] As shown in FIG. 1 to FIG. 3, the inspection jig 1 of the present invention includes a predetermined solder bump 21 that is in contact with a wiring pattern set on the substrate 20 to be inspected, and is used for The solder bump 2 1 has a probe for measuring a voltage for applying a current pattern or a wiring pattern to the wiring pattern of the object to be inspected 20, and a holding means 1 2 for holding the probe 17. The holding means is such that the probe 17 is held such that the abutting portion of the solder bump 2 1 of the probe 17 is staggered from the vertical axis 2 1 η passing through the top portion 2 1 a of the solder bump 2 1 The position in the short axis direction, therefore, as shown in Fig. 3 -19- 200804820 (17), when the probe 17 is in contact with the solder bump, the corner portion 17b of the end portion 17a of the probe 17 abuts against the solder bump 2 1 surface surface. In the embodiment shown in FIGS. 4 and 5, the inspection jig 10 of the present invention is provided with a predetermined soldered tin bump 2 1 that is in contact with a wiring pattern set on the substrate to be inspected 20, and is used for bumping from the soldering teeth. The block 2 1 is a pair of probes 47 and 48 for voltage measurement of the current application or wiring pattern of the wiring to be inspected, and a holding means 42 for holding the probes. Since the holding means ^ is such that the probes 47, 48 are held: the abutting portions of the solder bumps 21 of the probes 47, 48 are from the vertical axis 2 1 η passing through the top portion 2 1 a of the solder bumps 2 1 Staggered in the direction of the short axis, so as shown in FIG. 4a, when the probes 47, 48 are in contact with the solder bumps 21, the corners 47b, 48b of the ends 47a, 48a of the probes 47, 48 can be Abutting against the surface curved surface of the solder bump 21. The probes 17 (47, 48) may be formed in a cylindrical shape, or the holding means 12 (13, 14) may cause the probes 17 (47, 48) to pass at least from the vertical axis 2 In through the head top portion 21a of the solder bumps 21 Stagger the distance of the probe 17 (47, 48) and keep the dust. [Inspection Apparatus] The inspection apparatus of the present invention includes a predetermined solder bump 21 that is in contact with a wiring pattern set on the substrate to be inspected, and is used for current application from the solder bump to the wiring pattern of the object to be inspected or Probe 17 (47, 48) for voltage measurement of the wiring pattern. Further, in addition, the inspection apparatus of the present invention is provided with the probe 17 (4 7 ' 4 8 ) staggered from the vertical axis 21 n passing through the crown portion 2 1 a of the solder bump 2 1 (47, 48). Longitudinal axis -20- 200804820 (18) The holding means 12 (13, 14) of the line 17m (47m, 48m) in the short axis direction, and the probe 17 (47, held by the holding means) 4 8) A guiding means capable of being guided in contact with the surface of the solder bump 21, as shown in FIGS. 3 and 4a, when the probe 1 7 (4 7, 4 8 ) is in contact with the solder bump In the case of the block 21, the corner portions 17b (47b, 48b) of the end portions 17a (47a, 48a) of the probes 17 (47, 48) are capable of abutting against the surface curved surface of the solder bumps 21 to guide the surface. Wait for the probe. [Inspection Method] The inspection method of the present invention uses an inspection jig 10 provided with a probe 17 (47, 48) which is in contact with a predetermined solder set on a wiring pattern of the substrate 20 to be inspected. The bump 2 1 is used for voltage measurement of a current application or wiring pattern from the solder bump to the wiring pattern to be inspected. The inspection jig is used to perform an electrical inspection phase of inspecting the conduction or short-circuit of the wiring pattern of the substrate 20 to be inspected. Further, in the inspection method of the present invention, the measurement surface 30 of the solder bump 2 1 is irradiated with light by an optical measuring device, and the height of the solder bump 2 1 is measured based on the reflected light from the measurement surface, and the solder is determined. The optical inspection stage of the bumps. For example, when the solder bump 2 1 has a radius of about 40 μm, and the optical inspection is performed by a light beam having a short-axis direction distance (diameter in the cross-sectional direction) of about 5 μm, most of the solder bumps 21 are used. The surface curved surface of the angular range of 7 degrees to 8 degrees is measured as the measurement surface 30, and it is preferable to measure the surface curved surface of the angular range of up to about 30 degrees as the measurement surface 30. Therefore, in the electrical inspection stage, as shown in FIG. 3 and FIG. 4a, the probe 17 (47, 48) -21 - 200804820 (19) is curved on the surface other than the measurement surface 30 of the solder bump 2 1 . The position is in contact with the probe. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) and Fig. 1 (b) are schematic side views showing an inspection jig according to a first embodiment of the present invention. Fig. 2 is a partial enlarged view showing the first embodiment of the present invention shown in Fig. 1; 3 is a schematic diagram showing the relationship between the probe of the inspection jig and the solder bump on the wiring pattern of the substrate to be inspected when the inspection pattern of the substrate to be inspected is performed by the inspection jig according to the first embodiment of the present invention. side view. (a) of FIG. 4 is a view showing the relationship between the probe of the inspection jig and the solder bump on the wiring pattern of the substrate to be inspected when the inspection pattern of the substrate to be inspected is inspected by the inspection jig according to another embodiment of the present invention.侧面 侧面 • • Figure. Fig. 4 (b) is a front elevational view showing a portion of the flat plate of the inspection jig. Fig. 5 (a) is a view showing the probe of the inspection jig and the substrate to be inspected when the inspection pattern of the substrate to be inspected is inspected by the inspection jig according to another embodiment of the present invention shown in Fig. 4 (a). A side perspective view of the relationship of solder bumps on the wiring pattern. (b) of FIG. 5 is a view showing a wiring pattern of the probe of the inspection jig and the substrate to be inspected when the inspection pattern of the substrate to be inspected is inspected by the inspection jig according to another embodiment of the present invention shown in FIG. 4(a). The upper side of the solder bump on the -22- (20) (20)200804820 system. Fig. 6 is a schematic side view showing the relationship between the probe of the inspection jig and the solder bump on the wiring pattern of the substrate to be inspected when the inspection pattern of the substrate to be inspected is inspected by a conventional inspection jig. [Description of main component symbols] 10: Inspection jig 1 2 : Plate 12a, 13a, 14a: Through 孑 L 1 3 : Guide plate 1 4: Seat plate 1 5: Support bar 16: Abutment 17, 47, 48: Exploration Needle 20: Inspected substrate 2 1 : Solder bump 3 0 : Measurement surface 17 m, 47 m, 48 m: Axis 17b, 47b, 48b: Corner -23 -