TW200802118A - RFID tag manufacturing method and RFID tag - Google Patents
RFID tag manufacturing method and RFID tagInfo
- Publication number
- TW200802118A TW200802118A TW095149854A TW95149854A TW200802118A TW 200802118 A TW200802118 A TW 200802118A TW 095149854 A TW095149854 A TW 095149854A TW 95149854 A TW95149854 A TW 95149854A TW 200802118 A TW200802118 A TW 200802118A
- Authority
- TW
- Taiwan
- Prior art keywords
- rfid tag
- manufacturing
- base plate
- circuit chip
- antenna pattern
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006181814A JP2008009881A (ja) | 2006-06-30 | 2006-06-30 | Rfidタグ製造方法およびrfidタグ |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200802118A true TW200802118A (en) | 2008-01-01 |
Family
ID=38265510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095149854A TW200802118A (en) | 2006-06-30 | 2006-12-29 | RFID tag manufacturing method and RFID tag |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080001759A1 (zh) |
EP (1) | EP1873694A1 (zh) |
JP (1) | JP2008009881A (zh) |
KR (1) | KR20080003192A (zh) |
CN (1) | CN101097611A (zh) |
TW (1) | TW200802118A (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101625729B (zh) * | 2008-07-11 | 2011-09-07 | 中国钢铁股份有限公司 | 贴附于金属上的立体式无线识别标签 |
FR2940486B1 (fr) * | 2008-12-22 | 2011-02-11 | Commissariat Energie Atomique | Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage |
KR101123200B1 (ko) * | 2009-07-03 | 2012-03-19 | 주식회사 손텍 | 착,탈 가능한 인쇄패턴을 갖는 알에프아이디 태그 |
WO2012014005A1 (en) * | 2010-07-26 | 2012-02-02 | Fci | Rfid tag and method for manufacturing such a rfid tag |
KR101026257B1 (ko) * | 2010-08-23 | 2011-03-31 | 주식회사 손텍 | 금속시트 태그 |
US9325053B2 (en) * | 2010-11-08 | 2016-04-26 | Smartrac Ip B.V. | Method for producing a radio frequency identification (RFID) transponder |
CN102819761B (zh) * | 2011-06-09 | 2016-04-06 | 北京同方微电子有限公司 | 一种具有防拆功能的超高频抗金属电子标签结构 |
TWI550522B (zh) * | 2014-06-13 | 2016-09-21 | 欣泉光印股份有限公司 | Rfid標籤製造方法 |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11267172B2 (en) | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
JP7223748B2 (ja) | 2017-09-07 | 2023-02-16 | コンポセキュア,リミティド ライアビリティ カンパニー | 電子部品が埋め込まれた取引カード及び製造プロセス |
CA3079539A1 (en) | 2017-10-18 | 2019-04-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
CN108382719B (zh) * | 2018-01-31 | 2019-11-12 | 成都优印佳科技有限公司 | 一体式rfid防伪瓶盖生产方法及系统 |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
US11895777B2 (en) | 2021-09-24 | 2024-02-06 | Idex Biometrics Asa | Flexible inlay and manufacturing method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2724477B1 (fr) | 1994-09-13 | 1997-01-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
WO1998059317A1 (fr) * | 1997-06-23 | 1998-12-30 | Rohm Co., Ltd. | Module pour carte a circuit integre, carte a circuit integre, et procede de fabrication d'un tel module |
DE19758057C1 (de) * | 1997-12-29 | 1999-05-12 | Meinen Ziegel & Co Gmbh | Verfahren zum Herstellen eines Moduls mit einer Leiterbahnanordnung, insbesondere Antennenanordnung, für eine kontaktlose oder kontaktlos- und kontaktbehaftete IC-Karte |
EP1498842A4 (en) | 2002-04-01 | 2006-02-15 | Ubique Id Corp K | COMMUNICATION DEVICE AND ITS HOUSING |
JP4653440B2 (ja) | 2004-08-13 | 2011-03-16 | 富士通株式会社 | Rfidタグおよびその製造方法 |
-
2006
- 2006-06-30 JP JP2006181814A patent/JP2008009881A/ja not_active Withdrawn
- 2006-12-29 TW TW095149854A patent/TW200802118A/zh unknown
-
2007
- 2007-01-02 EP EP07100034A patent/EP1873694A1/en not_active Withdrawn
- 2007-01-18 KR KR1020070005585A patent/KR20080003192A/ko not_active Application Discontinuation
- 2007-01-23 US US11/656,519 patent/US20080001759A1/en not_active Abandoned
- 2007-01-29 CN CNA2007100083362A patent/CN101097611A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20080003192A (ko) | 2008-01-07 |
EP1873694A1 (en) | 2008-01-02 |
US20080001759A1 (en) | 2008-01-03 |
CN101097611A (zh) | 2008-01-02 |
JP2008009881A (ja) | 2008-01-17 |
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