TW200801833A - Exposure apparatus, exposure method and device manufacturing method - Google Patents
Exposure apparatus, exposure method and device manufacturing methodInfo
- Publication number
- TW200801833A TW200801833A TW096106024A TW96106024A TW200801833A TW 200801833 A TW200801833 A TW 200801833A TW 096106024 A TW096106024 A TW 096106024A TW 96106024 A TW96106024 A TW 96106024A TW 200801833 A TW200801833 A TW 200801833A
- Authority
- TW
- Taiwan
- Prior art keywords
- exposure
- exposure light
- device manufacturing
- exposure apparatus
- optical system
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006039927 | 2006-02-16 | ||
JP2006039833 | 2006-02-16 | ||
JP2006039229 | 2006-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200801833A true TW200801833A (en) | 2008-01-01 |
Family
ID=38371646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096106024A TW200801833A (en) | 2006-02-16 | 2007-02-16 | Exposure apparatus, exposure method and device manufacturing method |
Country Status (6)
Country | Link |
---|---|
US (2) | US7714982B2 (zh) |
EP (1) | EP1990828A4 (zh) |
JP (1) | JPWO2007094470A1 (zh) |
KR (1) | KR20080102390A (zh) |
TW (1) | TW200801833A (zh) |
WO (1) | WO2007094470A1 (zh) |
Families Citing this family (22)
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---|---|---|---|---|
KR20080102390A (ko) * | 2006-02-16 | 2008-11-25 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
WO2007119514A1 (ja) * | 2006-04-17 | 2007-10-25 | Nikon Corporation | 照明光学装置、露光装置、およびデバイス製造方法 |
US8665418B2 (en) * | 2007-04-18 | 2014-03-04 | Nikon Corporation | Projection optical system, exposure apparatus, and device manufacturing method |
US8137898B2 (en) * | 2007-07-23 | 2012-03-20 | Renesas Electronics Corporation | Method for manufacturing semiconductor device |
US7791723B2 (en) * | 2008-01-21 | 2010-09-07 | International Business Machines Corporation | Optical measurement using fixed polarizer |
US8736813B2 (en) * | 2008-08-26 | 2014-05-27 | Nikon Corporation | Exposure apparatus with an illumination system generating multiple illumination beams |
US8705170B2 (en) * | 2008-08-29 | 2014-04-22 | Nikon Corporation | High NA catadioptric imaging optics for imaging A reticle to a pair of imaging locations |
US8390786B2 (en) * | 2008-09-23 | 2013-03-05 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
US20100091257A1 (en) * | 2008-10-10 | 2010-04-15 | Nikon Corporation | Optical Imaging System and Method for Imaging Up to Four Reticles to a Single Imaging Location |
US20100123883A1 (en) * | 2008-11-17 | 2010-05-20 | Nikon Corporation | Projection optical system, exposure apparatus, and device manufacturing method |
JP2011049400A (ja) * | 2009-08-27 | 2011-03-10 | Canon Inc | 位置検出装置、露光装置及びデバイスの製造方法 |
NL2008157A (en) * | 2011-02-22 | 2012-08-24 | Asml Netherlands Bv | Lithographic apparatus and lithographic projection method. |
US9219866B2 (en) * | 2013-01-07 | 2015-12-22 | Ricoh Co., Ltd. | Dynamic adjustment of multimode lightfield imaging system using exposure condition and filter position |
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US9891529B2 (en) * | 2014-03-28 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Light transmission device and method for semiconductor manufacturing process |
WO2017130304A1 (ja) * | 2016-01-27 | 2017-08-03 | 株式会社日立ハイテクノロジーズ | 計測装置、方法および表示装置 |
EP3702092A4 (en) * | 2017-10-25 | 2021-09-08 | Nikon Corporation | MACHINING DEVICE AND METHOD FOR MANUFACTURING A MOVABLE BODY |
US10757340B2 (en) | 2018-03-09 | 2020-08-25 | Pony Ai Inc. | Adaptive filter system for self-driving vehicle |
CN112204707A (zh) * | 2018-05-31 | 2021-01-08 | 应用材料公司 | 数字光刻系统的多基板处理 |
JP7208728B2 (ja) * | 2018-07-23 | 2023-01-19 | キヤノン株式会社 | 露光装置、および物品の製造方法 |
CN110095948A (zh) * | 2019-05-03 | 2019-08-06 | 南昌航空大学 | 一种基于组合dmd的光纤器件数字光刻方法 |
CN114641730A (zh) * | 2019-11-19 | 2022-06-17 | 应用材料公司 | 图案化层状结构的光刻设备、图案化系统与方法 |
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WO2003065428A1 (fr) | 2002-01-29 | 2003-08-07 | Nikon Corporation | Systeme de reglage d'etat de formation d'images, procede d'insolation, appareil d'exposition, programme, et support d'enregistrement d'information |
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JP4546019B2 (ja) * | 2002-07-03 | 2010-09-15 | 株式会社日立製作所 | 露光装置 |
KR20050035890A (ko) | 2002-08-23 | 2005-04-19 | 가부시키가이샤 니콘 | 투영 광학계, 포토리소그래피 방법, 노광 장치 및 그 이용방법 |
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EP1420298B1 (en) | 2002-11-12 | 2013-02-20 | ASML Netherlands B.V. | Lithographic apparatus |
CN100470367C (zh) | 2002-11-12 | 2009-03-18 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
JP4184346B2 (ja) | 2002-12-13 | 2008-11-19 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 層上のスポットを照射するための方法及び装置における液体除去 |
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CN104678715B (zh) | 2003-02-26 | 2017-05-17 | 株式会社尼康 | 曝光方法以及器件制造方法 |
JP2004304135A (ja) | 2003-04-01 | 2004-10-28 | Nikon Corp | 露光装置、露光方法及びマイクロデバイスの製造方法 |
US7348575B2 (en) * | 2003-05-06 | 2008-03-25 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
EP2672307A3 (en) | 2003-05-06 | 2014-07-23 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
EP1491956B1 (en) * | 2003-06-27 | 2006-09-06 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2005029559A1 (ja) * | 2003-09-19 | 2005-03-31 | Nikon Corporation | 露光装置及びデバイス製造方法 |
EP1697798A2 (en) | 2003-12-15 | 2006-09-06 | Carl Zeiss SMT AG | Projection objective having a high aperture and a planar end surface |
JP5102492B2 (ja) | 2003-12-19 | 2012-12-19 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 結晶素子を有するマイクロリソグラフィー投影用対物レンズ |
US7158208B2 (en) * | 2004-06-30 | 2007-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7394080B2 (en) * | 2004-12-23 | 2008-07-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask superposition for multiple exposures |
US7209217B2 (en) * | 2005-04-08 | 2007-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing plural patterning devices |
US7924406B2 (en) * | 2005-07-13 | 2011-04-12 | Asml Netherlands B.V. | Stage apparatus, lithographic apparatus and device manufacturing method having switch device for two illumination channels |
KR20080102390A (ko) * | 2006-02-16 | 2008-11-25 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
-
2007
- 2007-02-16 KR KR1020087022497A patent/KR20080102390A/ko not_active Application Discontinuation
- 2007-02-16 WO PCT/JP2007/052885 patent/WO2007094470A1/ja active Application Filing
- 2007-02-16 TW TW096106024A patent/TW200801833A/zh unknown
- 2007-02-16 EP EP07714415A patent/EP1990828A4/en not_active Withdrawn
- 2007-02-16 US US11/707,075 patent/US7714982B2/en not_active Expired - Fee Related
- 2007-02-16 JP JP2008500572A patent/JPWO2007094470A1/ja active Pending
-
2010
- 2010-03-23 US US12/659,845 patent/US20100231879A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JPWO2007094470A1 (ja) | 2009-07-09 |
KR20080102390A (ko) | 2008-11-25 |
WO2007094470A1 (ja) | 2007-08-23 |
US20100231879A1 (en) | 2010-09-16 |
EP1990828A1 (en) | 2008-11-12 |
EP1990828A4 (en) | 2010-09-15 |
US7714982B2 (en) | 2010-05-11 |
US20070273858A1 (en) | 2007-11-29 |
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