TW200746983A - Temperature control method of electronic component, and the system thereof component - Google Patents
Temperature control method of electronic component, and the system thereof componentInfo
- Publication number
- TW200746983A TW200746983A TW095120718A TW95120718A TW200746983A TW 200746983 A TW200746983 A TW 200746983A TW 095120718 A TW095120718 A TW 095120718A TW 95120718 A TW95120718 A TW 95120718A TW 200746983 A TW200746983 A TW 200746983A
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- control
- electronic component
- component
- temperature control
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1931—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of one space
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095120718A TW200746983A (en) | 2006-06-09 | 2006-06-09 | Temperature control method of electronic component, and the system thereof component |
US11/609,239 US7836717B2 (en) | 2006-06-09 | 2006-12-11 | Method and system of temperature-control for electronic component |
JP2006335853A JP2007328761A (ja) | 2006-06-09 | 2006-12-13 | 電子コンポーネントのための温度制御方法及び温度制御システム |
US12/786,038 US8201416B2 (en) | 2006-06-09 | 2010-05-24 | Method and system of temperature-control for electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095120718A TW200746983A (en) | 2006-06-09 | 2006-06-09 | Temperature control method of electronic component, and the system thereof component |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200746983A true TW200746983A (en) | 2007-12-16 |
TWI301045B TWI301045B (zh) | 2008-09-11 |
Family
ID=38872943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095120718A TW200746983A (en) | 2006-06-09 | 2006-06-09 | Temperature control method of electronic component, and the system thereof component |
Country Status (3)
Country | Link |
---|---|
US (2) | US7836717B2 (zh) |
JP (1) | JP2007328761A (zh) |
TW (1) | TW200746983A (zh) |
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CN102900688A (zh) * | 2011-07-26 | 2013-01-30 | 技嘉科技股份有限公司 | 风扇的转速控制方法及其装置 |
TWI398756B (zh) * | 2008-05-29 | 2013-06-11 | Asus Technology Suzhou Co Ltd | 管理功率消耗的電腦系統及其相關方法 |
CN104881064A (zh) * | 2014-02-28 | 2015-09-02 | 鸿富锦精密工业(武汉)有限公司 | 温度控制系统 |
CN106021059B (zh) * | 2015-03-30 | 2019-05-03 | 联发科技股份有限公司 | 芯片内控制多个电路模块的方法以及芯片上系统 |
US10488873B2 (en) | 2013-09-22 | 2019-11-26 | Microsoft Technology Licensing, Llc | Monitoring surface temperature of devices |
CN111381643A (zh) * | 2018-12-28 | 2020-07-07 | 技嘉科技股份有限公司 | 元件功耗切换电路及其主机板 |
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TW200746983A (en) * | 2006-06-09 | 2007-12-16 | Giga Byte Tech Co Ltd | Temperature control method of electronic component, and the system thereof component |
US8549912B2 (en) | 2007-12-18 | 2013-10-08 | Teradyne, Inc. | Disk drive transport, clamping and testing |
US7996174B2 (en) | 2007-12-18 | 2011-08-09 | Teradyne, Inc. | Disk drive testing |
JP4655100B2 (ja) * | 2008-03-27 | 2011-03-23 | ソニー株式会社 | 情報処理装置、及び冷却ファンの制御方法 |
US7945424B2 (en) | 2008-04-17 | 2011-05-17 | Teradyne, Inc. | Disk drive emulator and method of use thereof |
US8041449B2 (en) | 2008-04-17 | 2011-10-18 | Teradyne, Inc. | Bulk feeding disk drives to disk drive testing systems |
US8238099B2 (en) | 2008-04-17 | 2012-08-07 | Teradyne, Inc. | Enclosed operating area for disk drive testing systems |
US8305751B2 (en) | 2008-04-17 | 2012-11-06 | Teradyne, Inc. | Vibration isolation within disk drive testing systems |
US8095234B2 (en) | 2008-04-17 | 2012-01-10 | Teradyne, Inc. | Transferring disk drives within disk drive testing systems |
US8160739B2 (en) | 2008-04-17 | 2012-04-17 | Teradyne, Inc. | Transferring storage devices within storage device testing systems |
US8117480B2 (en) * | 2008-04-17 | 2012-02-14 | Teradyne, Inc. | Dependent temperature control within disk drive testing systems |
US8102173B2 (en) * | 2008-04-17 | 2012-01-24 | Teradyne, Inc. | Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit |
US20090262455A1 (en) | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US7848106B2 (en) | 2008-04-17 | 2010-12-07 | Teradyne, Inc. | Temperature control within disk drive testing systems |
MY149779A (en) | 2008-06-03 | 2013-10-14 | Teradyne Inc | Processing storage devices |
FR2932946A1 (fr) * | 2008-06-23 | 2009-12-25 | Thomson Licensing | Procede de commande d'un ventilateur en fonction de la position d'un appareil, et appareil mettant en oeuvre le procede. |
US8628239B2 (en) | 2009-07-15 | 2014-01-14 | Teradyne, Inc. | Storage device temperature sensing |
US8116079B2 (en) | 2009-07-15 | 2012-02-14 | Teradyne, Inc. | Storage device testing system cooling |
US8466699B2 (en) | 2009-07-15 | 2013-06-18 | Teradyne, Inc. | Heating storage devices in a testing system |
US7920380B2 (en) | 2009-07-15 | 2011-04-05 | Teradyne, Inc. | Test slot cooling system for a storage device testing system |
US7995349B2 (en) | 2009-07-15 | 2011-08-09 | Teradyne, Inc. | Storage device temperature sensing |
US8687356B2 (en) | 2010-02-02 | 2014-04-01 | Teradyne, Inc. | Storage device testing system cooling |
US8547123B2 (en) | 2009-07-15 | 2013-10-01 | Teradyne, Inc. | Storage device testing system with a conductive heating assembly |
CN102253700A (zh) * | 2010-05-20 | 2011-11-23 | 英业达科技有限公司 | 风扇控制系统 |
US9779780B2 (en) | 2010-06-17 | 2017-10-03 | Teradyne, Inc. | Damping vibrations within storage device testing systems |
JP5569179B2 (ja) * | 2010-06-24 | 2014-08-13 | 富士ゼロックス株式会社 | 画像形成装置 |
US8687349B2 (en) | 2010-07-21 | 2014-04-01 | Teradyne, Inc. | Bulk transfer of storage devices using manual loading |
US9001456B2 (en) | 2010-08-31 | 2015-04-07 | Teradyne, Inc. | Engaging test slots |
JP5562192B2 (ja) * | 2010-09-28 | 2014-07-30 | Necパーソナルコンピュータ株式会社 | 情報処理装置、異常温度検出方法及びプログラム |
US8594856B2 (en) | 2011-02-15 | 2013-11-26 | Nuvoton Technology Corporation | Processor cooling by temperature range and multiple algorithm fan speed control |
US20140196491A1 (en) * | 2011-08-29 | 2014-07-17 | Powerquest Llc | Compact Computer Cooling Methods and Apparatus |
US9274805B2 (en) * | 2012-02-24 | 2016-03-01 | Qualcomm Incorporated | System and method for thermally aware device booting |
US9823990B2 (en) * | 2012-09-05 | 2017-11-21 | Nvidia Corporation | System and process for accounting for aging effects in a computing device |
US9436497B2 (en) * | 2012-09-10 | 2016-09-06 | Apple Inc. | Linking multiple independent control systems to distribute response |
TW201426262A (zh) * | 2012-12-26 | 2014-07-01 | Giga Byte Tech Co Ltd | 電子裝置及其控制方法 |
US9459312B2 (en) | 2013-04-10 | 2016-10-04 | Teradyne, Inc. | Electronic assembly test system |
US9541971B2 (en) | 2013-06-28 | 2017-01-10 | International Business Machines Corporation | Multiple level computer system temperature management for cooling fan control |
US20150148981A1 (en) * | 2013-11-24 | 2015-05-28 | Qualcomm Incorporated | System and method for multi-correlative learning thermal management of a system on a chip in a portable computing device |
US9625890B2 (en) | 2014-03-28 | 2017-04-18 | Intel Corporation | Coordinating control loops for temperature control |
US9829867B2 (en) * | 2014-09-12 | 2017-11-28 | Celestica Technology Consultancy (Shanghai) Co., Ltd. | Fan control system and method thereof |
CN104486126A (zh) * | 2014-12-22 | 2015-04-01 | 山东超越数控电子有限公司 | 一种基于ast2400芯片的系统管理方法 |
JP2017201442A (ja) * | 2016-05-02 | 2017-11-09 | 株式会社明電舎 | コンピュータ機器の温度監視方法およびコンピュータ機器 |
CN106227259A (zh) * | 2016-08-04 | 2016-12-14 | 深圳市华讯星通讯有限公司 | 一种温度控制系统与方法 |
CN106647995A (zh) * | 2016-12-14 | 2017-05-10 | 英业达科技有限公司 | 风扇监控系统 |
US10289179B2 (en) * | 2017-04-21 | 2019-05-14 | Intel Corporation | Dynamic control of liquid cooling pumps to provide thermal cooling uniformity |
TWI638258B (zh) * | 2017-05-12 | 2018-10-11 | 瑞昱半導體股份有限公司 | 散熱裝置控制方法及電子裝置 |
JP2019009913A (ja) * | 2017-06-26 | 2019-01-17 | オムロン株式会社 | 電源装置 |
US10845410B2 (en) | 2017-08-28 | 2020-11-24 | Teradyne, Inc. | Automated test system having orthogonal robots |
US10948534B2 (en) | 2017-08-28 | 2021-03-16 | Teradyne, Inc. | Automated test system employing robotics |
US11226390B2 (en) | 2017-08-28 | 2022-01-18 | Teradyne, Inc. | Calibration process for an automated test system |
US10725091B2 (en) | 2017-08-28 | 2020-07-28 | Teradyne, Inc. | Automated test system having multiple stages |
TWI652567B (zh) | 2017-12-26 | 2019-03-01 | 技嘉科技股份有限公司 | 可分區散熱的散熱裝置及具散熱裝置之主機板 |
CN110196608A (zh) * | 2018-02-26 | 2019-09-03 | 北京视联动力国际信息技术有限公司 | 一种终端散热装置和基于终端散热装置的散热控制方法 |
US10983145B2 (en) | 2018-04-24 | 2021-04-20 | Teradyne, Inc. | System for testing devices inside of carriers |
US10775408B2 (en) | 2018-08-20 | 2020-09-15 | Teradyne, Inc. | System for testing devices inside of carriers |
US10488901B1 (en) * | 2018-09-20 | 2019-11-26 | Dell Products L.P. | Dynamic thermal responses for computing components |
CN109708425A (zh) * | 2018-12-07 | 2019-05-03 | 青岛海尔股份有限公司 | 一种冰箱的控制方法 |
US11714469B2 (en) | 2018-12-14 | 2023-08-01 | Samsung Electronics Co., Ltd. | Temperature control management of electronic device based on number of heat-emitting components in compartment |
US11127106B2 (en) | 2019-06-28 | 2021-09-21 | Intel Corporation | Runtime flip stability characterization |
US11409341B2 (en) | 2019-10-01 | 2022-08-09 | Intel Corporation | Repeating graphics render pattern detection |
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US11754622B2 (en) | 2020-10-22 | 2023-09-12 | Teradyne, Inc. | Thermal control system for an automated test system |
CN116737488A (zh) * | 2022-10-26 | 2023-09-12 | 荣耀终端有限公司 | 一种参数监控方法及电子设备 |
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JP4078248B2 (ja) * | 2003-05-09 | 2008-04-23 | シャープ株式会社 | 録画再生装置 |
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US6880345B1 (en) * | 2003-11-04 | 2005-04-19 | Intel Corporation | Cooling system for an electronic component |
US7401644B2 (en) * | 2004-03-26 | 2008-07-22 | Hewlett-Packard Development Company, L.P. | Computer systems and related methods for cooling such systems |
US20060161375A1 (en) * | 2004-12-30 | 2006-07-20 | Allen Duberstein | Optimizing processing speed based on measured temperatures |
TW200746983A (en) * | 2006-06-09 | 2007-12-16 | Giga Byte Tech Co Ltd | Temperature control method of electronic component, and the system thereof component |
-
2006
- 2006-06-09 TW TW095120718A patent/TW200746983A/zh unknown
- 2006-12-11 US US11/609,239 patent/US7836717B2/en active Active
- 2006-12-13 JP JP2006335853A patent/JP2007328761A/ja active Pending
-
2010
- 2010-05-24 US US12/786,038 patent/US8201416B2/en active Active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI398756B (zh) * | 2008-05-29 | 2013-06-11 | Asus Technology Suzhou Co Ltd | 管理功率消耗的電腦系統及其相關方法 |
CN102900688A (zh) * | 2011-07-26 | 2013-01-30 | 技嘉科技股份有限公司 | 风扇的转速控制方法及其装置 |
US10488873B2 (en) | 2013-09-22 | 2019-11-26 | Microsoft Technology Licensing, Llc | Monitoring surface temperature of devices |
CN104881064A (zh) * | 2014-02-28 | 2015-09-02 | 鸿富锦精密工业(武汉)有限公司 | 温度控制系统 |
CN106021059B (zh) * | 2015-03-30 | 2019-05-03 | 联发科技股份有限公司 | 芯片内控制多个电路模块的方法以及芯片上系统 |
CN111381643A (zh) * | 2018-12-28 | 2020-07-07 | 技嘉科技股份有限公司 | 元件功耗切换电路及其主机板 |
TWI703432B (zh) * | 2018-12-28 | 2020-09-01 | 技嘉科技股份有限公司 | 元件功耗切換電路及其主機板 |
Also Published As
Publication number | Publication date |
---|---|
US8201416B2 (en) | 2012-06-19 |
TWI301045B (zh) | 2008-09-11 |
JP2007328761A (ja) | 2007-12-20 |
US20070296408A1 (en) | 2007-12-27 |
US7836717B2 (en) | 2010-11-23 |
US20100235014A1 (en) | 2010-09-16 |
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