TW200746970A - Process for producing printed board having cable portion - Google Patents
Process for producing printed board having cable portionInfo
- Publication number
- TW200746970A TW200746970A TW095136753A TW95136753A TW200746970A TW 200746970 A TW200746970 A TW 200746970A TW 095136753 A TW095136753 A TW 095136753A TW 95136753 A TW95136753 A TW 95136753A TW 200746970 A TW200746970 A TW 200746970A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit pattern
- cable portion
- connection pad
- clad laminate
- copper foil
- Prior art date
Links
Abstract
To provide a method for integrally forming a multilayer substrate having a cable portion becoming a hollow structure by leading out the cable portion from the outer layer portion of the multilayer substrate. For the copper foil of a one side copper clad laminate which is laminated on an inner layer core substrate, a flexible cable portion circuit pattern is formed and a connection pad portion is formed at the distal end on the component mounting portion side of the flexible cable portion circuit pattern. (2) A surface protection insulating film is formed excepting a part of the circuit pattern and the connection pad portion formed in the process (1). (3) On at least one side of the inner layer core substrate, a laminate is formed by laminating the one side copper clad laminate formed in the processes (1, 2) such that the copper foil is directed toward the outer surface. (4) An outer layer circuit pattern is formed by etching on the copper foil of the one side copper clad laminate formed in the process (3). (5) A surface protection insulating film having an opening at a required position is formed on the outer layer circuit pattern including the connection pad portion.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005296546A JP4745014B2 (en) | 2005-10-11 | 2005-10-11 | Method for manufacturing printed circuit board having cable portion |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200746970A true TW200746970A (en) | 2007-12-16 |
TWI382804B TWI382804B (en) | 2013-01-11 |
Family
ID=38035375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95136753A TWI382804B (en) | 2005-10-11 | 2006-10-03 | And a method of manufacturing a printed circuit board having a cable portion |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4745014B2 (en) |
CN (1) | CN1976561B (en) |
TW (1) | TWI382804B (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5654607Y2 (en) * | 1974-11-11 | 1981-12-19 | ||
JPS63149561A (en) * | 1986-12-12 | 1988-06-22 | Hitachi Ltd | Analysis of prostaglandin |
JPH0412702Y2 (en) * | 1987-03-23 | 1992-03-26 | ||
FR2632797B1 (en) * | 1988-06-10 | 1990-10-05 | Radiotechnique Ind & Comm | DEVICE FOR CORRECTING A VIDEO SIGNAL |
JP3064780B2 (en) * | 1993-01-12 | 2000-07-12 | イビデン株式会社 | Manufacturing method of flex-rigid multilayer printed wiring board |
JPH07312469A (en) * | 1994-05-16 | 1995-11-28 | Nippon Mektron Ltd | Structure of bent part of multilayer flexible circuit board |
-
2005
- 2005-10-11 JP JP2005296546A patent/JP4745014B2/en active Active
-
2006
- 2006-10-03 TW TW95136753A patent/TWI382804B/en not_active IP Right Cessation
- 2006-10-11 CN CN2006101729546A patent/CN1976561B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI382804B (en) | 2013-01-11 |
CN1976561A (en) | 2007-06-06 |
JP2007109716A (en) | 2007-04-26 |
JP4745014B2 (en) | 2011-08-10 |
CN1976561B (en) | 2010-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |