TW200746970A - Process for producing printed board having cable portion - Google Patents

Process for producing printed board having cable portion

Info

Publication number
TW200746970A
TW200746970A TW095136753A TW95136753A TW200746970A TW 200746970 A TW200746970 A TW 200746970A TW 095136753 A TW095136753 A TW 095136753A TW 95136753 A TW95136753 A TW 95136753A TW 200746970 A TW200746970 A TW 200746970A
Authority
TW
Taiwan
Prior art keywords
circuit pattern
cable portion
connection pad
clad laminate
copper foil
Prior art date
Application number
TW095136753A
Other languages
Chinese (zh)
Other versions
TWI382804B (en
Inventor
Kenichi Hirahara
Masaki Takahashi
Satoshi Goto
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200746970A publication Critical patent/TW200746970A/en
Application granted granted Critical
Publication of TWI382804B publication Critical patent/TWI382804B/en

Links

Abstract

To provide a method for integrally forming a multilayer substrate having a cable portion becoming a hollow structure by leading out the cable portion from the outer layer portion of the multilayer substrate. For the copper foil of a one side copper clad laminate which is laminated on an inner layer core substrate, a flexible cable portion circuit pattern is formed and a connection pad portion is formed at the distal end on the component mounting portion side of the flexible cable portion circuit pattern. (2) A surface protection insulating film is formed excepting a part of the circuit pattern and the connection pad portion formed in the process (1). (3) On at least one side of the inner layer core substrate, a laminate is formed by laminating the one side copper clad laminate formed in the processes (1, 2) such that the copper foil is directed toward the outer surface. (4) An outer layer circuit pattern is formed by etching on the copper foil of the one side copper clad laminate formed in the process (3). (5) A surface protection insulating film having an opening at a required position is formed on the outer layer circuit pattern including the connection pad portion.
TW95136753A 2005-10-11 2006-10-03 And a method of manufacturing a printed circuit board having a cable portion TWI382804B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005296546A JP4745014B2 (en) 2005-10-11 2005-10-11 Method for manufacturing printed circuit board having cable portion

Publications (2)

Publication Number Publication Date
TW200746970A true TW200746970A (en) 2007-12-16
TWI382804B TWI382804B (en) 2013-01-11

Family

ID=38035375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95136753A TWI382804B (en) 2005-10-11 2006-10-03 And a method of manufacturing a printed circuit board having a cable portion

Country Status (3)

Country Link
JP (1) JP4745014B2 (en)
CN (1) CN1976561B (en)
TW (1) TWI382804B (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5654607Y2 (en) * 1974-11-11 1981-12-19
JPS63149561A (en) * 1986-12-12 1988-06-22 Hitachi Ltd Analysis of prostaglandin
JPH0412702Y2 (en) * 1987-03-23 1992-03-26
FR2632797B1 (en) * 1988-06-10 1990-10-05 Radiotechnique Ind & Comm DEVICE FOR CORRECTING A VIDEO SIGNAL
JP3064780B2 (en) * 1993-01-12 2000-07-12 イビデン株式会社 Manufacturing method of flex-rigid multilayer printed wiring board
JPH07312469A (en) * 1994-05-16 1995-11-28 Nippon Mektron Ltd Structure of bent part of multilayer flexible circuit board

Also Published As

Publication number Publication date
TWI382804B (en) 2013-01-11
CN1976561A (en) 2007-06-06
JP2007109716A (en) 2007-04-26
JP4745014B2 (en) 2011-08-10
CN1976561B (en) 2010-06-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees