TW200746875A - Thermal chuck and processes for manufacturing the thermal chuck - Google Patents
Thermal chuck and processes for manufacturing the thermal chuckInfo
- Publication number
- TW200746875A TW200746875A TW096108895A TW96108895A TW200746875A TW 200746875 A TW200746875 A TW 200746875A TW 096108895 A TW096108895 A TW 096108895A TW 96108895 A TW96108895 A TW 96108895A TW 200746875 A TW200746875 A TW 200746875A
- Authority
- TW
- Taiwan
- Prior art keywords
- thermal chuck
- cooling passage
- thermal
- support surface
- planar support
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49904—Assembling a subassembly, then assembling with a second subassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49988—Metal casting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53704—Means to assemble or disassemble tool chuck and tool
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/377,841 US20070214631A1 (en) | 2006-03-15 | 2006-03-15 | Thermal chuck and processes for manufacturing the thermal chuck |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200746875A true TW200746875A (en) | 2007-12-16 |
Family
ID=38353012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096108895A TW200746875A (en) | 2006-03-15 | 2007-03-15 | Thermal chuck and processes for manufacturing the thermal chuck |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070214631A1 (zh) |
EP (1) | EP1996362A2 (zh) |
JP (1) | JP2009530814A (zh) |
KR (1) | KR20080102431A (zh) |
CN (1) | CN101400470B (zh) |
TW (1) | TW200746875A (zh) |
WO (1) | WO2007108961A2 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10216786C5 (de) * | 2002-04-15 | 2009-10-15 | Ers Electronic Gmbh | Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden |
GB0919059D0 (en) * | 2009-10-30 | 2009-12-16 | Sencon Europ Ltd | Application and inspection system |
JP2016083699A (ja) * | 2014-10-28 | 2016-05-19 | 株式会社Uacj | ろう付炉及びアルミニウム材のろう付方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4771230A (en) * | 1986-10-02 | 1988-09-13 | Testamatic Corporation | Electro-luminescent method and testing system for unpopulated printed circuit boards, ceramic substrates, and the like having both electrical and electro-optical read-out |
US6147334A (en) * | 1998-06-30 | 2000-11-14 | Marchi Associates, Inc. | Laminated paddle heater and brazing process |
US6511759B1 (en) * | 2000-02-07 | 2003-01-28 | Carl Schalansky | Means and method for producing multi-element laminar structures |
JP2001274641A (ja) * | 2000-03-27 | 2001-10-05 | Toshiba Corp | 差動増幅器及びこれを用いたフィルタ回路 |
US7152474B2 (en) * | 2002-09-18 | 2006-12-26 | Carnegie Mellon University | Built-in self test of MEMS |
US7458397B2 (en) * | 2004-07-09 | 2008-12-02 | Michael Doyle | Modular fluid distribution system |
JP4133958B2 (ja) * | 2004-08-04 | 2008-08-13 | 日本発条株式会社 | ワークを加熱または冷却するための装置と、その製造方法 |
-
2006
- 2006-03-15 US US11/377,841 patent/US20070214631A1/en not_active Abandoned
-
2007
- 2007-03-09 KR KR1020087025059A patent/KR20080102431A/ko not_active Application Discontinuation
- 2007-03-09 JP JP2009500394A patent/JP2009530814A/ja not_active Abandoned
- 2007-03-09 EP EP07752745A patent/EP1996362A2/en not_active Withdrawn
- 2007-03-09 WO PCT/US2007/006067 patent/WO2007108961A2/en active Application Filing
- 2007-03-09 CN CN2007800090330A patent/CN101400470B/zh not_active Expired - Fee Related
- 2007-03-15 TW TW096108895A patent/TW200746875A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2009530814A (ja) | 2009-08-27 |
WO2007108961A2 (en) | 2007-09-27 |
US20070214631A1 (en) | 2007-09-20 |
WO2007108961A3 (en) | 2007-11-15 |
CN101400470B (zh) | 2011-12-28 |
KR20080102431A (ko) | 2008-11-25 |
CN101400470A (zh) | 2009-04-01 |
EP1996362A2 (en) | 2008-12-03 |
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