TW200746461A - Light emitting device and manufacturing method thereof - Google Patents

Light emitting device and manufacturing method thereof

Info

Publication number
TW200746461A
TW200746461A TW095148775A TW95148775A TW200746461A TW 200746461 A TW200746461 A TW 200746461A TW 095148775 A TW095148775 A TW 095148775A TW 95148775 A TW95148775 A TW 95148775A TW 200746461 A TW200746461 A TW 200746461A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting device
manufacturing
conductive paste
emitting element
Prior art date
Application number
TW095148775A
Other languages
English (en)
Chinese (zh)
Inventor
Yuichi Taguchi
Hideaki Sakaguchi
Naoyuki Koizumi
Mitsutoshi Higashi
Akinori Shiraishi
Sunohara Masahiro
Murayama Kei
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200746461A publication Critical patent/TW200746461A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
TW095148775A 2006-01-06 2006-12-25 Light emitting device and manufacturing method thereof TW200746461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006001801A JP4996096B2 (ja) 2006-01-06 2006-01-06 発光装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW200746461A true TW200746461A (en) 2007-12-16

Family

ID=37873115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148775A TW200746461A (en) 2006-01-06 2006-12-25 Light emitting device and manufacturing method thereof

Country Status (5)

Country Link
US (1) US7622747B2 (https=)
EP (1) EP1806792B1 (https=)
JP (1) JP4996096B2 (https=)
KR (1) KR20070074466A (https=)
TW (1) TW200746461A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730951B (zh) * 2015-02-03 2021-06-21 晶元光電股份有限公司 發光裝置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7719021B2 (en) * 2005-06-28 2010-05-18 Lighting Science Group Corporation Light efficient LED assembly including a shaped reflective cavity and method for making same
WO2007002476A2 (en) * 2005-06-28 2007-01-04 Lamina Ceramics, Inc. Backlight module display with optical coupler and lightguide
US9263651B2 (en) * 2007-09-20 2016-02-16 Koninklijke Philips N.V. Collimator
KR100902357B1 (ko) 2007-11-05 2009-06-12 아로 주식회사 발광 다이오드 패키지 및 그 제조방법
JP2009182083A (ja) * 2008-01-30 2009-08-13 Kyocera Corp 発光装置
DE102009019412A1 (de) * 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
KR101130137B1 (ko) * 2010-07-02 2012-03-28 연세대학교 산학협력단 발광다이오드 모듈
JP5242641B2 (ja) 2010-08-25 2013-07-24 シャープ株式会社 発光装置の製造方法
JP2016086191A (ja) * 2010-11-05 2016-05-19 ローム株式会社 半導体発光装置
JP5566268B2 (ja) * 2010-11-19 2014-08-06 新光電気工業株式会社 発光装置及びパッケージ部品
JP5887638B2 (ja) 2011-05-30 2016-03-16 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオード
JP6097084B2 (ja) * 2013-01-24 2017-03-15 スタンレー電気株式会社 半導体発光装置
CN104103734B (zh) * 2013-04-02 2017-03-01 展晶科技(深圳)有限公司 发光二极管封装结构
JP2014216588A (ja) * 2013-04-30 2014-11-17 株式会社沖データ 発光装置、その製造方法、画像表示装置、及び画像形成装置
US9831407B2 (en) 2013-11-21 2017-11-28 Lumens Co., Ltd. Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
KR101524046B1 (ko) * 2013-11-21 2015-06-01 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제작 방법
JP2019017734A (ja) * 2017-07-18 2019-02-07 新日本無線株式会社 発光装置及びその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664484A (en) * 1979-10-30 1981-06-01 Toshiba Corp Led device
JPS60261181A (ja) * 1984-06-07 1985-12-24 Toshiba Corp 光半導体装置
JPS6216584A (ja) * 1985-07-16 1987-01-24 Toshiba Corp 光半導体素子
JP3329716B2 (ja) 1997-12-15 2002-09-30 日亜化学工業株式会社 チップタイプｌｅｄ
CN100346488C (zh) * 2002-02-28 2007-10-31 罗姆股份有限公司 发光二极管灯
DE10229067B4 (de) * 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
JP3655267B2 (ja) * 2002-07-17 2005-06-02 株式会社東芝 半導体発光装置
JP4352687B2 (ja) * 2002-11-26 2009-10-28 パナソニック電工株式会社 発光装置の製造方法
JP2004247701A (ja) * 2002-12-19 2004-09-02 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP3904210B2 (ja) * 2003-04-28 2007-04-11 株式会社リコー 光学電子デバイスの接合方法及び接合構造
KR100740634B1 (ko) * 2003-09-12 2007-07-18 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 미세한 액적(液滴)의 형상으로 분사해, 적층 도포 가능한금속 나노 입자 분산액
JP4774201B2 (ja) * 2003-10-08 2011-09-14 日亜化学工業株式会社 パッケージ成形体及び半導体装置
JP2005159082A (ja) * 2003-11-27 2005-06-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに発光素子収納用パッケージの製造方法。
JP4572312B2 (ja) * 2004-02-23 2010-11-04 スタンレー電気株式会社 Ｌｅｄ及びその製造方法
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
JP4659421B2 (ja) * 2004-09-30 2011-03-30 株式会社トクヤマ 発光素子収納用パッケージの製造方法
KR101154801B1 (ko) * 2004-12-03 2012-07-03 엔지케이 스파크 플러그 캄파니 리미티드 세라믹 기판 및 발광 소자 수납용 세라믹 패키지

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730951B (zh) * 2015-02-03 2021-06-21 晶元光電股份有限公司 發光裝置

Also Published As

Publication number Publication date
US20070158674A1 (en) 2007-07-12
EP1806792A2 (en) 2007-07-11
EP1806792B1 (en) 2013-07-24
EP1806792A3 (en) 2010-05-19
JP4996096B2 (ja) 2012-08-08
JP2007184425A (ja) 2007-07-19
US7622747B2 (en) 2009-11-24
KR20070074466A (ko) 2007-07-12

Similar Documents

Publication Publication Date Title
TW200746461A (en) Light emitting device and manufacturing method thereof
TW200737555A (en) Light-emitting device and method for manufacturing the same
TW200512948A (en) Light-emitting device capable of increasing light-emitting active region
WO2008115191A3 (en) Nanowire on non-single crystal substrate for optoelectronic applications
EP2197051A3 (en) Light emitting device and method for manufacturing the same
TWI365679B (en) Highly efficient organic light-emitting device using substrate or electrode having nanosized half-spherical convex and method for preparing the same
EP1876653A3 (en) Sub-mount for mounting light emitting device and light emitting device package
EP2257141A3 (en) Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
WO2006138491A3 (en) Back-to-front via process
MY158939A (en) Method to form solder deposits on substrates
WO2007094476A8 (en) Light-emitting diode
EP1403908A3 (en) Oled lamp
WO2008146885A1 (ja) 電気電子部品用金属材料
EP2779806A3 (en) Flexible lighting device including a heat-spreading layer
TW200739962A (en) Semiconductor device and method of manufacturing semiconductor device
TW200744204A (en) Light emitting device and method for fabricating the same
TW200717864A (en) Semiconductor light emitting device and apparatus
EP2346103A3 (en) Light emitting device and backlight unit
TW200634980A (en) Interconnect structures with encasing caps and methods of making thereof
TW200631059A (en) Semiconducor device and manufacturing method thereof
EP2221889A3 (en) Light emitting device package
TW200628008A (en) Organic electroluminescent light source
WO2010062132A3 (ko) 부분 발열체
EP2228842A3 (en) Light emitting device package
WO2006132795A3 (en) A light-emitting device module with a substrate and methods of forming it