TW200746240A - Method of processing substrate and chemical used in the same (Ⅰ) - Google Patents

Method of processing substrate and chemical used in the same (Ⅰ)

Info

Publication number
TW200746240A
TW200746240A TW096108200A TW96108200A TW200746240A TW 200746240 A TW200746240 A TW 200746240A TW 096108200 A TW096108200 A TW 096108200A TW 96108200 A TW96108200 A TW 96108200A TW 200746240 A TW200746240 A TW 200746240A
Authority
TW
Taiwan
Prior art keywords
same
processing substrate
chemical used
organic film
film pattern
Prior art date
Application number
TW096108200A
Other languages
English (en)
Other versions
TWI299514B (en
Inventor
Shusaku Kido
Original Assignee
Nec Lcd Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004321169A external-priority patent/JP2005175446A/ja
Application filed by Nec Lcd Technologies Ltd filed Critical Nec Lcd Technologies Ltd
Publication of TW200746240A publication Critical patent/TW200746240A/zh
Application granted granted Critical
Publication of TWI299514B publication Critical patent/TWI299514B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
TW096108200A 2004-11-04 2005-03-14 Method of processing substrate and chemical used in the same (1) TWI299514B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004321169A JP2005175446A (ja) 2003-11-05 2004-11-04 基板処理方法及びそれに用いる薬液

Publications (2)

Publication Number Publication Date
TW200746240A true TW200746240A (en) 2007-12-16
TWI299514B TWI299514B (en) 2008-08-01

Family

ID=36262411

Family Applications (3)

Application Number Title Priority Date Filing Date
TW094107697A TWI300580B (en) 2004-11-04 2005-03-14 Method of processing substrate and chemical used in the same (1)
TW096108200A TWI299514B (en) 2004-11-04 2005-03-14 Method of processing substrate and chemical used in the same (1)
TW095124473A TWI299513B (en) 2004-11-04 2005-03-14 Method of processing substrate and chemical used in the same (1)

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW094107697A TWI300580B (en) 2004-11-04 2005-03-14 Method of processing substrate and chemical used in the same (1)

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095124473A TWI299513B (en) 2004-11-04 2005-03-14 Method of processing substrate and chemical used in the same (1)

Country Status (4)

Country Link
US (1) US20060093968A1 (zh)
KR (1) KR100697575B1 (zh)
CN (2) CN100383913C (zh)
TW (3) TWI300580B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2836372B1 (fr) * 2002-02-28 2004-06-04 Obl Procede et dispositif pour la mise en place d'implants dentaires
JP5145654B2 (ja) * 2006-05-29 2013-02-20 日本電気株式会社 基板処理装置及び基板処理方法
US9698054B2 (en) 2010-10-19 2017-07-04 Taiwan Semiconductor Manufacturing Company, Ltd. Strained structure of a p-type field effect transistor
TWI470752B (zh) * 2011-12-09 2015-01-21 Univ Nat Taipei Technology 應用於電子元件之電容式連接結構
KR101506888B1 (ko) * 2013-10-02 2015-03-30 주식회사 에스앤에스텍 블랭크 마스크 및 포토마스크

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0414048A (ja) * 1990-05-08 1992-01-20 Nec Corp レジストパターンの形成方法
JP3611618B2 (ja) * 1995-02-08 2005-01-19 出光興産株式会社 非晶質導電膜のパターニング方法
JP3236220B2 (ja) * 1995-11-13 2001-12-10 東京応化工業株式会社 レジスト用剥離液組成物
JP3773227B2 (ja) * 1997-10-16 2006-05-10 東京応化工業株式会社 レジスト用剥離液組成物およびこれを用いたレジスト剥離方法
US6372658B1 (en) * 1998-09-21 2002-04-16 Koninklijke Philips Electronics N.V. (Kpenv) Reducing contamination induced scumming, for semiconductor device, by ashing
US6802911B2 (en) * 2001-09-19 2004-10-12 Samsung Electronics Co., Ltd. Method for cleaning damaged layers and polymer residue from semiconductor device
JP3612525B2 (ja) * 2002-06-04 2005-01-19 Ｎｅｃ液晶テクノロジー株式会社 薄膜半導体装置の製造方法及びそのレジストパターン形成方法
KR100862988B1 (ko) * 2002-09-30 2008-10-13 주식회사 동진쎄미켐 포토레지스트 리무버 조성물

Also Published As

Publication number Publication date
CN100383913C (zh) 2008-04-23
TWI300580B (en) 2008-09-01
TWI299513B (en) 2008-08-01
TW200616012A (en) 2006-05-16
CN101093790A (zh) 2007-12-26
US20060093968A1 (en) 2006-05-04
CN1770389A (zh) 2006-05-10
KR100697575B1 (ko) 2007-03-22
KR20060044449A (ko) 2006-05-16
TW200710944A (en) 2007-03-16
TWI299514B (en) 2008-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees