TW200741898A - Component mounting apparatus and component mounting method - Google Patents
Component mounting apparatus and component mounting methodInfo
- Publication number
- TW200741898A TW200741898A TW095124618A TW95124618A TW200741898A TW 200741898 A TW200741898 A TW 200741898A TW 095124618 A TW095124618 A TW 095124618A TW 95124618 A TW95124618 A TW 95124618A TW 200741898 A TW200741898 A TW 200741898A
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- mounting
- head
- component mounting
- chips
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005198332A JP4386007B2 (ja) | 2005-07-07 | 2005-07-07 | 部品実装装置および部品実装方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200741898A true TW200741898A (en) | 2007-11-01 |
Family
ID=37597704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095124618A TW200741898A (en) | 2005-07-07 | 2006-07-06 | Component mounting apparatus and component mounting method |
Country Status (5)
Country | Link |
---|---|
US (1) | US7290331B2 (zh) |
JP (1) | JP4386007B2 (zh) |
KR (1) | KR101228472B1 (zh) |
CN (1) | CN100511616C (zh) |
TW (1) | TW200741898A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI664693B (zh) * | 2016-09-29 | 2019-07-01 | 日商新川股份有限公司 | 半導體裝置的製造方法以及封裝裝置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4508016B2 (ja) * | 2005-07-07 | 2010-07-21 | パナソニック株式会社 | 部品実装方法 |
US8689512B2 (en) | 2006-11-15 | 2014-04-08 | Valinge Innovation Ab | Mechanical locking of floor panels with vertical folding |
CH698718B1 (de) * | 2007-01-31 | 2009-10-15 | Oerlikon Assembly Equipment Ag | Vorrichtung für die Montage eines Flipchips auf einem Substrat. |
WO2008120461A1 (ja) * | 2007-04-03 | 2008-10-09 | Panasonic Corporation | 部品実装方法 |
JP5078424B2 (ja) * | 2007-05-09 | 2012-11-21 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
KR101214737B1 (ko) * | 2011-08-18 | 2012-12-21 | 삼성전기주식회사 | 칩 실장 장치 및 칩 실장 방법 |
JP5774968B2 (ja) * | 2011-11-15 | 2015-09-09 | ヤマハ発動機株式会社 | 部品移載装置および部品移載装置における吸着位置調整方法 |
US9776270B2 (en) | 2013-10-01 | 2017-10-03 | Globalfoundries Inc. | Chip joining by induction heating |
CN108942138B (zh) * | 2018-08-01 | 2023-10-31 | 德清国能过滤器材有限公司 | 过滤芯自动加盖系统及其方法 |
JP7417371B2 (ja) * | 2019-07-12 | 2024-01-18 | 芝浦メカトロニクス株式会社 | 実装装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4617708A (en) * | 1982-12-23 | 1986-10-21 | At&T Technologies, Inc. | Component module for piggyback mounting on a circuit package having dual-in-line leads, and methods of fabricating same |
US4521828A (en) * | 1982-12-23 | 1985-06-04 | At&T Technologies, Inc. | Component module for piggyback mounting on a circuit package having dual-in-line leads |
KR890004820B1 (ko) * | 1984-03-28 | 1989-11-27 | 인터내셔널 비지네스 머신즈 코포레이션 | 배저장밀도의 메모리 모듈 및 보드와 그 형성방법 |
US6205654B1 (en) * | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
JP3132353B2 (ja) | 1995-08-24 | 2001-02-05 | 松下電器産業株式会社 | チップの搭載装置および搭載方法 |
KR100295774B1 (ko) * | 1999-04-08 | 2001-07-12 | 정문술 | 번인테스터용 소팅 핸들러 |
US6572387B2 (en) * | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
US6608763B1 (en) * | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
US6462408B1 (en) * | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
CN1461484A (zh) * | 2001-04-17 | 2003-12-10 | 皇家菲利浦电子有限公司 | 选择图像序列中的位置的方法和装置 |
KR100497574B1 (ko) * | 2003-03-13 | 2005-07-01 | 한미반도체 주식회사 | 반도체 제조장비의 픽앤플레이스 장치 |
US7098073B1 (en) * | 2005-04-18 | 2006-08-29 | Freescale Semiconductor, Inc. | Method for stacking an integrated circuit on another integrated circuit |
-
2005
- 2005-07-07 JP JP2005198332A patent/JP4386007B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-27 US US11/426,719 patent/US7290331B2/en active Active
- 2006-07-06 TW TW095124618A patent/TW200741898A/zh unknown
- 2006-07-07 CN CNB2006101031801A patent/CN100511616C/zh not_active Expired - Fee Related
- 2006-07-07 KR KR1020060064117A patent/KR101228472B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI664693B (zh) * | 2016-09-29 | 2019-07-01 | 日商新川股份有限公司 | 半導體裝置的製造方法以及封裝裝置 |
Also Published As
Publication number | Publication date |
---|---|
US20070006453A1 (en) | 2007-01-11 |
CN100511616C (zh) | 2009-07-08 |
KR20070006619A (ko) | 2007-01-11 |
CN1893010A (zh) | 2007-01-10 |
JP2007019208A (ja) | 2007-01-25 |
KR101228472B1 (ko) | 2013-01-31 |
JP4386007B2 (ja) | 2009-12-16 |
US7290331B2 (en) | 2007-11-06 |
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