TW200735304A - Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrate - Google Patents
Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrateInfo
- Publication number
- TW200735304A TW200735304A TW095143779A TW95143779A TW200735304A TW 200735304 A TW200735304 A TW 200735304A TW 095143779 A TW095143779 A TW 095143779A TW 95143779 A TW95143779 A TW 95143779A TW 200735304 A TW200735304 A TW 200735304A
- Authority
- TW
- Taiwan
- Prior art keywords
- composite substrate
- electronic spare
- series composite
- copper
- copper series
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
- C23C16/0281—Deposition of sub-layers, e.g. to promote the adhesion of the main coating of metallic sub-layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/42—Silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005361881A JP3984629B2 (ja) | 2005-12-15 | 2005-12-15 | 電子部品用銅系複合基材及び電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200735304A true TW200735304A (en) | 2007-09-16 |
TWI357641B TWI357641B (ja) | 2012-02-01 |
Family
ID=38162733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095143779A TW200735304A (en) | 2005-12-15 | 2006-11-27 | Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3984629B2 (ja) |
KR (1) | KR20080050518A (ja) |
CN (1) | CN101297066B (ja) |
TW (1) | TW200735304A (ja) |
WO (1) | WO2007069419A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5134343B2 (ja) * | 2007-11-20 | 2013-01-30 | 株式会社神戸製鋼所 | 薄膜形成装置及び薄膜形成方法 |
CN102544131A (zh) * | 2012-03-12 | 2012-07-04 | 谢振华 | 一种改进的太阳能电池板的电极结构 |
JP2018204054A (ja) * | 2017-05-31 | 2018-12-27 | 住友金属鉱山株式会社 | 金属部材の製造方法、プリント基板の製造方法、金属部材及びプリント基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63207158A (ja) * | 1987-02-23 | 1988-08-26 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
JP4379854B2 (ja) * | 2001-10-30 | 2009-12-09 | 日鉱金属株式会社 | 表面処理銅箔 |
CN1242092C (zh) * | 2001-11-19 | 2006-02-15 | 乐金电子(天津)电器有限公司 | 一种利用等离子体技术的金属抗腐蚀处理方法 |
JP4453443B2 (ja) * | 2004-05-27 | 2010-04-21 | パナソニック株式会社 | 錫めっき皮膜及びめっき皮膜の製造方法 |
-
2005
- 2005-12-15 JP JP2005361881A patent/JP3984629B2/ja not_active Expired - Fee Related
-
2006
- 2006-11-14 KR KR1020087009569A patent/KR20080050518A/ko not_active Application Discontinuation
- 2006-11-14 WO PCT/JP2006/322625 patent/WO2007069419A1/ja active Application Filing
- 2006-11-14 CN CN2006800370267A patent/CN101297066B/zh not_active Expired - Fee Related
- 2006-11-27 TW TW095143779A patent/TW200735304A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2007069419A1 (ja) | 2007-06-21 |
CN101297066B (zh) | 2010-06-09 |
KR20080050518A (ko) | 2008-06-05 |
JP2007162094A (ja) | 2007-06-28 |
CN101297066A (zh) | 2008-10-29 |
TWI357641B (ja) | 2012-02-01 |
JP3984629B2 (ja) | 2007-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |