TW200733430A - Light emitting device - Google Patents

Light emitting device

Info

Publication number
TW200733430A
TW200733430A TW095147608A TW95147608A TW200733430A TW 200733430 A TW200733430 A TW 200733430A TW 095147608 A TW095147608 A TW 095147608A TW 95147608 A TW95147608 A TW 95147608A TW 200733430 A TW200733430 A TW 200733430A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
diode element
disposed
insulating layer
Prior art date
Application number
TW095147608A
Other languages
English (en)
Inventor
Mitsuru Shiozaki
Akiko Saito
Tomohiro Sanpei
Nobuhiro Tamura
Seiko Kawashima
Masami Iwamoto
Takayoshi Moriyama
Masahiro Toda
Hisayo Uetake
Akiko Nakanishi
Masahiro Izumi
Original Assignee
Toshiba Lighting & Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting & Technology filed Critical Toshiba Lighting & Technology
Publication of TW200733430A publication Critical patent/TW200733430A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW095147608A 2005-12-20 2006-12-19 Light emitting device TW200733430A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005366504 2005-12-20
JP2006023636 2006-01-31
JP2006254646 2006-09-20

Publications (1)

Publication Number Publication Date
TW200733430A true TW200733430A (en) 2007-09-01

Family

ID=38188440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147608A TW200733430A (en) 2005-12-20 2006-12-19 Light emitting device

Country Status (2)

Country Link
TW (1) TW200733430A (zh)
WO (1) WO2007072659A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477555B (zh) * 2009-06-26 2015-03-21 Asahi Rubber Inc White reflective material and its manufacturing method
KR101853598B1 (ko) 2010-03-23 2018-04-30 가부시키가이샤 아사히 러버 실리콘 수지제 반사 기재, 그 제조 방법, 및 그 반사 기재에 이용하는 원재료 조성물
DE102010024864B4 (de) * 2010-06-24 2021-01-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
DE102010064724B4 (de) 2010-06-24 2024-09-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
DE102010027253B4 (de) 2010-07-15 2022-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877071U (ja) * 1981-11-17 1983-05-24 三洋電機株式会社 発光ダイオ−ド表示器
JP2001148514A (ja) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd 照明光源
JP3989794B2 (ja) * 2001-08-09 2007-10-10 松下電器産業株式会社 Ｌｅｄ照明装置およびｌｅｄ照明光源
JP2004207655A (ja) * 2002-12-26 2004-07-22 Matsushita Electric Ind Co Ltd 金属ベース基板および発光ユニット
JP2004266168A (ja) * 2003-03-03 2004-09-24 Sanyu Rec Co Ltd 発光体を備えた電子機器及びその製造方法
JP4691955B2 (ja) * 2003-10-28 2011-06-01 日亜化学工業株式会社 蛍光物質および発光装置

Also Published As

Publication number Publication date
WO2007072659A1 (ja) 2007-06-28

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