TW200729311A - Liquid processing method and liquid processing apparatus - Google Patents
Liquid processing method and liquid processing apparatusInfo
- Publication number
- TW200729311A TW200729311A TW095143394A TW95143394A TW200729311A TW 200729311 A TW200729311 A TW 200729311A TW 095143394 A TW095143394 A TW 095143394A TW 95143394 A TW95143394 A TW 95143394A TW 200729311 A TW200729311 A TW 200729311A
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid processing
- liquid
- processing method
- processing apparatus
- target substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005339133A JP4680044B2 (ja) | 2005-11-24 | 2005-11-24 | 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
JP2005362809A JP4675772B2 (ja) | 2005-12-16 | 2005-12-16 | 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200729311A true TW200729311A (en) | 2007-08-01 |
TWI343599B TWI343599B (zh) | 2011-06-11 |
Family
ID=37607432
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099112696A TWI460774B (zh) | 2005-11-24 | 2006-11-23 | Liquid treatment method and liquid treatment device |
TW095143394A TW200729311A (en) | 2005-11-24 | 2006-11-23 | Liquid processing method and liquid processing apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099112696A TWI460774B (zh) | 2005-11-24 | 2006-11-23 | Liquid treatment method and liquid treatment device |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1791161B1 (zh) |
KR (1) | KR101061945B1 (zh) |
TW (2) | TWI460774B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108172493A (zh) * | 2016-12-07 | 2018-06-15 | 东京毅力科创株式会社 | 等离子体处理装置和等离子体处理方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7964040B2 (en) | 2007-11-08 | 2011-06-21 | Applied Materials, Inc. | Multi-port pumping system for substrate processing chambers |
US20090120368A1 (en) * | 2007-11-08 | 2009-05-14 | Applied Materials, Inc. | Rotating temperature controlled substrate pedestal for film uniformity |
US20120180954A1 (en) | 2011-01-18 | 2012-07-19 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US9355883B2 (en) | 2011-09-09 | 2016-05-31 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
US9316443B2 (en) * | 2012-08-23 | 2016-04-19 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
US8889566B2 (en) | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
US9093482B2 (en) * | 2012-10-12 | 2015-07-28 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
US9245777B2 (en) | 2013-05-15 | 2016-01-26 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus |
JP6231328B2 (ja) * | 2013-08-20 | 2017-11-15 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
US9412581B2 (en) | 2014-07-16 | 2016-08-09 | Applied Materials, Inc. | Low-K dielectric gapfill by flowable deposition |
KR20170132952A (ko) * | 2016-05-24 | 2017-12-05 | 삼성디스플레이 주식회사 | 전자 장치 및 이의 제조 장치, 및 전자 장치의 제조 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6951221B2 (en) * | 2000-09-22 | 2005-10-04 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
US20020096196A1 (en) * | 2001-01-23 | 2002-07-25 | Takayuki Toshima | Substrate processing apparatus and substrate processing method |
JP2002343759A (ja) * | 2001-05-21 | 2002-11-29 | Tokyo Electron Ltd | 液処理装置および液処理方法 |
TWI261875B (en) * | 2002-01-30 | 2006-09-11 | Tokyo Electron Ltd | Processing apparatus and substrate processing method |
JP3993048B2 (ja) * | 2002-08-30 | 2007-10-17 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4333866B2 (ja) * | 2002-09-26 | 2009-09-16 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
-
2006
- 2006-11-20 KR KR1020060114492A patent/KR101061945B1/ko active IP Right Grant
- 2006-11-23 TW TW099112696A patent/TWI460774B/zh active
- 2006-11-23 EP EP06024286.4A patent/EP1791161B1/en not_active Expired - Fee Related
- 2006-11-23 TW TW095143394A patent/TW200729311A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108172493A (zh) * | 2016-12-07 | 2018-06-15 | 东京毅力科创株式会社 | 等离子体处理装置和等离子体处理方法 |
CN108172493B (zh) * | 2016-12-07 | 2020-06-26 | 东京毅力科创株式会社 | 等离子体处理装置和等离子体处理方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101061945B1 (ko) | 2011-09-05 |
KR20070055346A (ko) | 2007-05-30 |
TWI343599B (zh) | 2011-06-11 |
EP1791161A2 (en) | 2007-05-30 |
EP1791161B1 (en) | 2013-08-14 |
TW201032268A (en) | 2010-09-01 |
TWI460774B (zh) | 2014-11-11 |
EP1791161A3 (en) | 2011-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200729311A (en) | Liquid processing method and liquid processing apparatus | |
TW200731357A (en) | Plasma processing apparatus and controlling method for plasma processing apparatus | |
TW200706184A (en) | Monitoring of cleaning process | |
TW200605209A (en) | Substrate processing apparatus and method | |
TWI256139B (en) | Method and apparatus for fabricating flat panel display | |
TW200710253A (en) | Integrated metrology tools for monitoring and controlling large area substrate processing chambers | |
WO2011068768A3 (en) | Apparatus and method for transferring particulate material | |
TW200739673A (en) | Substrate treatment apparatus and substrate treatment method | |
TW200943454A (en) | Apparatus for treating substrate | |
WO2009114281A3 (en) | Smoothing a metallic substrate for a solar cell | |
TW200739211A (en) | Method for manufacture of liquid crystal cell substrates, liquid crystal cell substrates, and liquid crystal device | |
TW200721357A (en) | Movable transfer chamber and substrate-treating apparatus including the same | |
TW200730454A (en) | Apparatus for breaking a glass substrate | |
TW200725739A (en) | Method for using film formation apparatus | |
TW200604022A (en) | A method of manufacturing a nozzle plate | |
TW200943398A (en) | Novel treatment and system for mask surface chemical reduction | |
TW200746265A (en) | Methods and apparatus for epitaxial film formation | |
BRPI0616730A2 (pt) | fabricação de rolos e placas com superfície dura | |
ATE483353T1 (de) | Druckschablone eines smt-prozesses und verfahren zu ihrer beschichtung | |
TW200640318A (en) | Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus | |
DE60128712D1 (de) | Vorrichtung zur verarbeitung von substraten mit aufeinandergepressten vorratsrollen | |
TW200612153A (en) | Functional film for display picture and method for producing the same | |
WO2010051266A3 (en) | Improving the conformal doping in p3i chamber | |
SG162751A1 (en) | Process for making a metal seed layer | |
MY152144A (en) | System and method for deposition of a material on a substrate |