TW200728427A - Adhesive composition and adhesive thin film made of the same - Google Patents
Adhesive composition and adhesive thin film made of the sameInfo
- Publication number
- TW200728427A TW200728427A TW095138567A TW95138567A TW200728427A TW 200728427 A TW200728427 A TW 200728427A TW 095138567 A TW095138567 A TW 095138567A TW 95138567 A TW95138567 A TW 95138567A TW 200728427 A TW200728427 A TW 200728427A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive composition
- adhesive
- thin film
- chips
- same
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005306238 | 2005-10-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200728427A true TW200728427A (en) | 2007-08-01 |
TWI384046B TWI384046B (zh) | 2013-02-01 |
Family
ID=38178044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095138567A TWI384046B (zh) | 2005-10-20 | 2006-10-19 | An adhesive composition and a sheet having an adhesive layer made of an adhesive |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101304798B1 (zh) |
TW (1) | TWI384046B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI394812B (zh) * | 2007-12-20 | 2013-05-01 | Cheil Ind Inc | 用於半導體總成之黏合膜組成物、黏合膜、切割晶粒接合膜、元件封裝體及相關方法 |
TWI494373B (zh) * | 2008-11-10 | 2015-08-01 | Ajinomoto Kk | Resin composition for printed circuit boards |
TWI570211B (zh) * | 2012-10-11 | 2017-02-11 | 信越化學工業股份有限公司 | Wafer processing body, wafer processing member, temporary adhesive material for wafer processing, and manufacturing method of thin wafer |
US9695345B2 (en) | 2007-12-27 | 2017-07-04 | Lg Chem, Ltd. | Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same |
TWI713753B (zh) * | 2016-06-13 | 2020-12-21 | 日商東京應化工業股份有限公司 | 層合體之製造方法、層合體,及接著劑組成物 |
CN113728252A (zh) * | 2019-04-22 | 2021-11-30 | 三星Sdi株式会社 | 聚硅氧系粘着保护膜及包括其的光学元件 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4771100B2 (ja) * | 2008-08-27 | 2011-09-14 | 信越化学工業株式会社 | 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物 |
JP5681374B2 (ja) * | 2010-04-19 | 2015-03-04 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム |
JP6528404B2 (ja) * | 2013-11-27 | 2019-06-12 | 東レ株式会社 | 半導体用樹脂組成物および半導体用樹脂フィルムならびにこれらを用いた半導体装置 |
JP6395597B2 (ja) * | 2014-12-25 | 2018-09-26 | マクセルホールディングス株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
CN108966511A (zh) * | 2018-07-30 | 2018-12-07 | 生益电子股份有限公司 | 一种降低高速pcb信号插入损耗的内层表面处理方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4748292B2 (ja) * | 2000-03-15 | 2011-08-17 | 信越化学工業株式会社 | フィルム状電子部品用接着剤及び電子部品 |
JP4019254B2 (ja) * | 2002-04-24 | 2007-12-12 | 信越化学工業株式会社 | 導電性樹脂組成物 |
JPWO2004074330A1 (ja) * | 2003-02-18 | 2006-06-01 | コニシ株式会社 | 硬化性樹脂、その製造方法及び硬化性樹脂組成物 |
JP4171898B2 (ja) * | 2003-04-25 | 2008-10-29 | 信越化学工業株式会社 | ダイシング・ダイボンド用接着テープ |
-
2006
- 2006-10-19 TW TW095138567A patent/TWI384046B/zh not_active IP Right Cessation
- 2006-10-19 KR KR1020060101694A patent/KR101304798B1/ko not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI394812B (zh) * | 2007-12-20 | 2013-05-01 | Cheil Ind Inc | 用於半導體總成之黏合膜組成物、黏合膜、切割晶粒接合膜、元件封裝體及相關方法 |
US9695345B2 (en) | 2007-12-27 | 2017-07-04 | Lg Chem, Ltd. | Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same |
TWI494373B (zh) * | 2008-11-10 | 2015-08-01 | Ajinomoto Kk | Resin composition for printed circuit boards |
TWI570211B (zh) * | 2012-10-11 | 2017-02-11 | 信越化學工業股份有限公司 | Wafer processing body, wafer processing member, temporary adhesive material for wafer processing, and manufacturing method of thin wafer |
TWI713753B (zh) * | 2016-06-13 | 2020-12-21 | 日商東京應化工業股份有限公司 | 層合體之製造方法、層合體,及接著劑組成物 |
CN113728252A (zh) * | 2019-04-22 | 2021-11-30 | 三星Sdi株式会社 | 聚硅氧系粘着保护膜及包括其的光学元件 |
Also Published As
Publication number | Publication date |
---|---|
KR20070043629A (ko) | 2007-04-25 |
TWI384046B (zh) | 2013-02-01 |
KR101304798B1 (ko) | 2013-09-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |