TW200726578A - Tool trimmer for polishing pad and method of the same - Google Patents

Tool trimmer for polishing pad and method of the same

Info

Publication number
TW200726578A
TW200726578A TW095136014A TW95136014A TW200726578A TW 200726578 A TW200726578 A TW 200726578A TW 095136014 A TW095136014 A TW 095136014A TW 95136014 A TW95136014 A TW 95136014A TW 200726578 A TW200726578 A TW 200726578A
Authority
TW
Taiwan
Prior art keywords
polishing pad
same
tool trimmer
trimmer
tool
Prior art date
Application number
TW095136014A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Kubo
Hiroshi Kimura
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW200726578A publication Critical patent/TW200726578A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW095136014A 2005-10-14 2006-09-28 Tool trimmer for polishing pad and method of the same TW200726578A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300287 2005-10-14

Publications (1)

Publication Number Publication Date
TW200726578A true TW200726578A (en) 2007-07-16

Family

ID=37942519

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136014A TW200726578A (en) 2005-10-14 2006-09-28 Tool trimmer for polishing pad and method of the same

Country Status (3)

Country Link
JP (1) JP5013202B2 (ja)
TW (1) TW200726578A (ja)
WO (1) WO2007043263A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102267095B (zh) * 2011-08-26 2013-04-03 宇环数控机床股份有限公司 一种砂轮在线监控与修整方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217062A (ja) * 1985-02-28 1985-10-30 Kanebo Ltd 平面研磨装置
JPH031172Y2 (ja) * 1985-05-16 1991-01-16
JPH0639054B2 (ja) * 1988-11-25 1994-05-25 富士産機株式会社 平行平面ホーニング研削盤及び立型両面研削盤における砥石ドレッシング装置
JP3533046B2 (ja) * 1996-07-18 2004-05-31 新日本製鐵株式会社 半導体基板用研磨布のドレッサー
JP2000135675A (ja) * 1998-10-28 2000-05-16 Okamoto Machine Tool Works Ltd 研削装置
JP4057176B2 (ja) * 1998-12-15 2008-03-05 株式会社トプコン 光学部材の研磨用工具とこれに用いられるピッチセグメント、及びそのピッチセグメントの成形型
JP2000326235A (ja) * 1999-05-17 2000-11-28 Inst Of Physical & Chemical Res Ｅｌｉｄ用砥石とこれを用いたｅｌｉｄ平面研削装置
JP4239129B2 (ja) * 2000-04-17 2009-03-18 旭硝子株式会社 板状体の研磨装置及び研磨パッドのツルーイング方法
JP2003094330A (ja) * 2001-09-20 2003-04-03 Micron Seimitsu Kk ドレッシング方法、および同装置
JP4207153B2 (ja) * 2002-07-31 2009-01-14 旭硝子株式会社 基板の研磨方法及びその装置
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same

Also Published As

Publication number Publication date
JPWO2007043263A1 (ja) 2009-04-16
JP5013202B2 (ja) 2012-08-29
WO2007043263A1 (ja) 2007-04-19

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